CN102842565A - Intelligent card module with coil as well as realization method thereof - Google Patents
Intelligent card module with coil as well as realization method thereof Download PDFInfo
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- CN102842565A CN102842565A CN2011101688759A CN201110168875A CN102842565A CN 102842565 A CN102842565 A CN 102842565A CN 2011101688759 A CN2011101688759 A CN 2011101688759A CN 201110168875 A CN201110168875 A CN 201110168875A CN 102842565 A CN102842565 A CN 102842565A
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- smart card
- carrier band
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- Credit Cards Or The Like (AREA)
Abstract
The invention discloses an intelligent card module with a coil as well as the realization method thereof. The intelligent card module comprises the coil, wherein the coil is arranged in a carrier tape; a chip is a dual-interface chip, and is mounted on the carrier tape and matched with the coil; and the chip and the carrier tape are packaged into the module by a molding body. In the realization method, the intelligent card module is formed in a way of molding and packaging, flip chip bonding or surface mounting. The intelligent card can be directly used in a contact environment and a non-contact environment.
Description
Technical field
The present invention relates to a kind of semiconductor microelectronics encapsulation technology and integrated circuit encapsulation technology, particularly a kind of double-interface smart card module and corresponding implementation mode.
Background technology
Along with the continuous progress of integrated circuit encapsulation technology, the integrated level of integrated circuit improves day by day, and function is more and more abundanter, for the new application demand of continuous appearance, requires integrated circuit encapsulation enterprise can design novel bringing and cooperates new demand.
For example in the smart card encapsulation field, especially the use amount of double-interface smart card is very big.At present; Just towards the route development of technological innovation, new technology continues to bring out smart card industry, and new function is also more and more; Many old functions are also updated and are strengthened; Payment platform is from now on used and will constantly be enlarged, and in these development, the function of smart card and the lifting of performance are also inevitable.
Existing double-interface smart card procedure for producing more complicated need be carried out smart card module production earlier, adds coil again, and production cost and material cost are higher.
Therefore, need a kind of high reliability, the integrated touch of low production cost and the novel smart card of contactless function especially, satisfy current user's consumer need.
Based on the demand, be badly in need of a kind ofly having the smart card module that carries coil and reaching above requirement.
Summary of the invention
The present invention is directed to the existing various deficiencies of production of above-mentioned existing double-interface smart card; And a kind of smart card module of belt coil is provided; It can realize direct integrated touch function of smart card and contactless function, and can greatly reduce carrier band cost of material, production cost, production time.
To the smart card module of belt coil, the present invention also provides the corresponding implementation mode simultaneously.
In order to achieve the above object, the present invention adopts following technical scheme:
A kind of smart card module of belt coil, said smart card module comprises chip, is used for the carrier band of carries chips and the moulding bodies that is used to encapsulate; Said smart card module also comprises coil; Said coil is arranged in the carrier band, and said chip has contact function and contactless function, is placed on the said carrier band; And match with said coil, said chip and carrier band are packaged into module by moulding bodies.
In an instance of the present invention, said chip is two interface chips or packaged semiconductor device.
In another instance of the present invention, also comprise the capacitor that is used for the frequency adjustment in the said smart card module, said capacitor is arranged on the said carrier band.
Further, said capacitor is electrically connected with contactless pad on the carrier band.
As second invention of the present invention, a kind of implementation of smart card module of belt coil, said implementation forms smart card module through molded packages mode, flip chip bonding mode or surface mount mode.
In an embodiment of this scheme, said molded packages mode comprises the steps:
(1) with the chip charging appliance chip is installed on the carrier band;
(2) with bonding wire equipment the function pads of chip being carried out electrical property securely with the respective pad on the carrier band is connected;
(3) encapsulate with the module of sealed in unit completing steps (2).
Further, in the said step (1) through binding agent with chip placing on carrier band.
Further again, said step (3) is through encapsulation of UV glue or moulding compound encapsulation.
In another instance of this scheme, said flip chip method comprises the steps:
(2.1) on corresponding contact function pads and the contactless function pads solder bump is being set on the chip;
The chip back-off that (2.2) will set solder bump again makes scolder carry out electrical property with the corresponding contact formula function pads on the carrier band with contactless function pads and is connected on carrier band.
In the another instance of this scheme, said surface mount mode comprises the steps:
(3.1) printing with tin cream on the corresponding pad on the carrier band earlier;
(3.2) function pads with packaged semiconductor device is attached on the tin cream, carries out electrical property with corresponding pad on the carrier band and is connected.
The present invention who obtains according to such scheme has the following advantages:
(1) the present invention can realize that smart card directly is used in contact environment and contactless environment;
(2) stable performance of the present invention, good reliability;
(3) production the present invention can continue to use most of production equipment and technology, need not to buy or the design production equipment:
(4) greatly reduce the cost of raw material, production cost, production time.
Description of drawings
Further specify the present invention below in conjunction with accompanying drawing and embodiment.
Fig. 1 is a module package schematic internal view of the present invention.
Fig. 2 is module pad face UV glue encapsulation sketch map of the present invention.
Fig. 3 is a module pad face mould Plastic Package sketch map of the present invention.
Fig. 4 is a module contact-making surface sketch map of the present invention.
Fig. 5 is module UV glue encapsulation cross sectional representation of the present invention.
Fig. 6 is module moulding compound encapsulation cross sectional representation of the present invention.
Fig. 7 is a module flip chip bonding mode cross sectional representation of the present invention.
Fig. 8 is module of the present invention surface mounting method cross sectional representation.
Fig. 9 schemes for the present invention in flakes.
Embodiment
For technological means, creation characteristic that the present invention is realized, reach purpose and effect and be easy to understand and understand, below in conjunction with concrete diagram, further set forth the present invention.
Problems such as the present invention is directed to existing smart card production technology commonly used, existing not only energy consumption is high, and manufacturing process is loaded down with trivial details, and reliability is relatively poor relatively in the use, and the enforcement of the technical solution scheme that provides is specific as follows:
Referring to Fig. 1 and Fig. 4, the smart card module of belt coil provided by the invention is comprising chip 1, carrier band 2 and corresponding moulding bodies 10,11 (like Fig. 5 and 6).
In order to make module not only have the contact function but also have contactless function, the present invention can select two interface chips or packaged semiconductor device for use when selecting chip for use.
Further, for making smart card module after completion, directly have contactless function, the present invention is equipped with the coil 3 that carries out inductance coupling high in carrier band 2 inside, and this coil 3 is connected with noncontact pad 7 on the carrier band 2.
The present invention lets module when finally using, have electromagnetic induction through coil 3, and can carry out inductance coupling high with card reader in use.
Conventional high-frequency coupling frequency is 13.56MHz; But only be coupled and do not reach the frequency of utilization of 13.56MHz through the electromagnetic induction on this coil 3; Therefore the present invention also cooperates this coil 3 through increasing corresponding capacitor 6, and reaches the frequency of utilization of 13.56MHz.
In order to realize that smart card module has contact function and contactless function simultaneously after completion; The present invention needs that also the contact function pads 4 on the chip 1 is carried out electrical property with the contact function pads 5 on the carrier band 2 and is connected, and the contactless function pads 16 on the chip 1 is carried out electrical property with the contactless function pads 7 on the carrier band be connected.
In addition, for the inductance coupling high that makes coil 3 reaches optimum state, the capacitor 6 of corresponding appearance value can be installed as required.For capacitor 6, the selection of its appearance value is through the frequency computation part formula, and frequency and inductance substitution formula are drawn, and also can measure through sweep generator and network analyzer.Generally can select optimal one or two capacitor 6 to cooperate needed frequency of utilization, make the coupling of coil reach optimum state thereby carry out the frequency adjustment through capacitor through calculating.
Further, the present invention is placed in corresponding supporting region on the carrier band with it when capacitor 6 is installed, and is in parallel and is connected with contactless pad 7 on the carrier band 2.As shown in Figure 1, chip 1, coil 3, capacitor 6 threes form a parallel circuits, and through circuit on the carrier band and spun gold the three are electrically connected, thereby make module reach the inductance coupling high effect in use.
The carrier that installs chip is packaged into the corresponding intelligent card module by moulding bodies 10,11 again.
According to the smart card module that such scheme forms, its concrete application process is following:
Contact transmission of Information process is following: smart card inserted the contact card reader, the contact on the smart card contacted with the interior contact of card reader draw-in groove, read the card internal information through card reader, as: supermarket consumption card etc.
Contactless transmission of Information process is following: with smart card near contactless card reader; Make smart card and card reader carry out the electromagnetic induction coupling; Reach the effect of exchanges data, as: mass transit card, China second-generation identity card etc. (prerequisite is that the operating frequency of operating frequency and card reader of smart card is consistent).
For realizing such scheme, the present invention also provides a kind of implementation of smart card module of belt coil, and its concrete implementation procedure is (referring to Fig. 2,3,5,6) as follows:
(1) the relevant chip supporting region is provided with corresponding binding agent 8 (referring to Fig. 5 or 8) on carrier band, with the chip charging appliance chip is installed to corresponding supporting region on the carrier band again, connects fixing through binding agent 8.Wherein employed binding agent 8 is conductive adhesive or non-conductive binding agent.
(2) carry out routing through gold thread 9; Utilize gold thread to connect the contact function pads 5 on the contact function pads 4 and carrier band 2 on the chip 1 by routing device; And the contactless function pads 7 on contactless function pads on the chip 1 16 and the carrier band; Function corresponding pad on the function pads of chip and the carrier band is linked together securely through the ultrasonic wave mode with bonding wire equipment, reach best in order to make electric conductivity, the present invention uses spun gold 9 as connection line.
(3) after connection finishes, with sealed in unit the chip of being accomplished the electrical property connection by step 2 is encapsulated, can use 10 encapsulation of UV glue or moulding compound 11 encapsulation.
On the basis of the scheme of above-mentioned smart card module implementation, the present invention provides further this scheme:
First kind of scheme: as shown in Figure 7, the smart card module of the belt coil shown in this figure adopts the face-down bonding technique mode to realize.Compare with such scheme, the flip chip bonding scheme is diverse encapsulation scheme, and the chip attach of no step 1, the routing of no step 2 connect, the UV or the molded packages of no step 3.
The flip chip bonding step that adopts is following:
Step 1 on corresponding contact function pads and the contactless function pads solder bump being set on the silicon, promptly is provided with corresponding gold goal 12;
Second kind of scheme, as shown in Figure 8, the smart card module of the belt coil shown in this figure adopts the surface mounting technology mode to realize.
What surface mounting technology mounted is semiconductor device, and it mainly refers to have encapsulated CFN module and electric capacity of completion etc.Such scheme mounts is silicon, and surface mounting technology is all different with above two kinds of scheme production processes, and its detailed process is following:
Step 1 is put into surface-mounting equipment with carrier band 2;
Step 3 utilizes the manipulator of surface stick-mounting machine that semiconductor device 14 is picked up, and the function pads on the device is attached on the carrier band pad of print solder paste, through tin cream device and carrier band is carried out electrical property and is connected.
Referring to Fig. 9, such scheme is in actual production, and in order to increase production efficiency, carrier band adopts mode in flakes to carry out the connection of each unit, and adopts the pan feeding and the discharge method production of web-like.After generation finishes, through cutter sweep will be in flakes shape get module and cut into independent module.
Each unit end product size can be standard intelligent card module size 11.4mm * 12.6mm, and the smart card module of this size can be applicable in any type of smart card.
With the method intelligent card manufactured module, after completion, need not to add again antenna, can directly use contactless function.
More than show and described basic principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various changes and modifications, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection range to be defined by appending claims and equivalent thereof.
Claims (10)
1. the smart card module of a belt coil, said smart card module comprises chip, is used for the carrier band of carries chips and the moulding bodies that is used to encapsulate; It is characterized in that said smart card module also comprises coil, said coil is arranged in the carrier band; Said chip has contact function and contactless function; Be placed on the said carrier band, and match with said coil, said chip and carrier band are packaged into module by moulding bodies.
2. the smart card module of a kind of belt coil according to claim 1 is characterized in that, said chip is two interface chips or packaged semiconductor device.
3. the smart card module of a kind of belt coil according to claim 1 is characterized in that, also comprises the capacitor that is used for the frequency adjustment in the said smart card module, and said capacitor is arranged on the said carrier band.
4. the smart card module of a kind of belt coil according to claim 3 is characterized in that, said capacitor is electrically connected with contactless pad on the carrier band.
5. the implementation of the smart card module of a belt coil is characterized in that, said implementation forms smart card module through molded packages mode, flip chip bonding mode or surface mount mode.
6. the implementation of the smart card module of a kind of belt coil according to claim 5 is characterized in that, said molded packages mode comprises the steps:
(1) with the chip charging appliance chip is installed on the carrier band;
(2) with bonding wire equipment the function pads of chip being carried out electrical property securely with the respective pad on the carrier band is connected;
(3) encapsulate with the module of sealed in unit completing steps (2).
7. the implementation of the smart card module of a kind of belt coil according to claim 6 is characterized in that, in the said step (1) through binding agent with chip placing on carrier band.
8. the implementation of the smart card module of a kind of belt coil according to claim 6 is characterized in that, said step (3) is through encapsulation of UV glue or moulding compound encapsulation.
9. the implementation of the smart card module of a kind of belt coil according to claim 5 is characterized in that, said flip chip method comprises the steps:
(2.1) on corresponding contact function pads and the contactless function pads solder bump is being set on the chip;
The chip back-off that (2.2) will set solder bump again makes scolder carry out electrical property with the corresponding contact formula function pads on the carrier band with contactless function pads and is connected on carrier band.
10. the implementation of the smart card module of a kind of belt coil according to claim 5 is characterized in that, said surface mount mode comprises the steps:
(3.1) printing with tin cream on the corresponding pad on the carrier band earlier;
(3.2) function pads with packaged semiconductor device is attached on the tin cream, carries out electrical property with corresponding pad on the carrier band and is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101688759A CN102842565A (en) | 2011-06-21 | 2011-06-21 | Intelligent card module with coil as well as realization method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101688759A CN102842565A (en) | 2011-06-21 | 2011-06-21 | Intelligent card module with coil as well as realization method thereof |
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| Publication Number | Publication Date |
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| CN102842565A true CN102842565A (en) | 2012-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011101688759A Pending CN102842565A (en) | 2011-06-21 | 2011-06-21 | Intelligent card module with coil as well as realization method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106599979A (en) * | 2017-01-16 | 2017-04-26 | 中电智能卡有限责任公司 | Support plate-type CSP mounted-inversed dual-interface module and intelligent card comprising the same |
| CN111223837A (en) * | 2019-12-18 | 2020-06-02 | 江西安缔诺科技有限公司 | Double-interface smart card module and preparation method thereof |
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| WO2004000965A1 (en) * | 2002-06-24 | 2003-12-31 | Loctite (R & D) Limited | Photocurable adhesive compositions, reaction products of which have low halide ion content |
| CN101527005A (en) * | 2008-03-07 | 2009-09-09 | 上海长丰智能卡有限公司 | Novel mobile phone function expansion card and method for achieving same |
| CN102014570A (en) * | 2009-09-08 | 2011-04-13 | 上海长丰智能卡有限公司 | PCB (printed circuit board) carried tape for phone card with non-contact function |
| CN202102466U (en) * | 2011-06-21 | 2012-01-04 | 上海长丰智能卡有限公司 | Smart card module with coil |
-
2011
- 2011-06-21 CN CN2011101688759A patent/CN102842565A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004000965A1 (en) * | 2002-06-24 | 2003-12-31 | Loctite (R & D) Limited | Photocurable adhesive compositions, reaction products of which have low halide ion content |
| CN101527005A (en) * | 2008-03-07 | 2009-09-09 | 上海长丰智能卡有限公司 | Novel mobile phone function expansion card and method for achieving same |
| CN102014570A (en) * | 2009-09-08 | 2011-04-13 | 上海长丰智能卡有限公司 | PCB (printed circuit board) carried tape for phone card with non-contact function |
| CN202102466U (en) * | 2011-06-21 | 2012-01-04 | 上海长丰智能卡有限公司 | Smart card module with coil |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106599979A (en) * | 2017-01-16 | 2017-04-26 | 中电智能卡有限责任公司 | Support plate-type CSP mounted-inversed dual-interface module and intelligent card comprising the same |
| CN111223837A (en) * | 2019-12-18 | 2020-06-02 | 江西安缔诺科技有限公司 | Double-interface smart card module and preparation method thereof |
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Application publication date: 20121226 |
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| RJ01 | Rejection of invention patent application after publication |