CN202103041U - Intelligent card carrier tape having coil - Google Patents
Intelligent card carrier tape having coil Download PDFInfo
- Publication number
- CN202103041U CN202103041U CN2011202121286U CN201120212128U CN202103041U CN 202103041 U CN202103041 U CN 202103041U CN 2011202121286 U CN2011202121286 U CN 2011202121286U CN 201120212128 U CN201120212128 U CN 201120212128U CN 202103041 U CN202103041 U CN 202103041U
- Authority
- CN
- China
- Prior art keywords
- coil
- belt
- bonding wire
- smart card
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
Disclosed is an intelligent card carrier tape having a coil. The carrier tape is provided with a chip bearing region, a bonding wire region, and a coil region, wherein a coil is arranged in the coil region; and the coil is communicated with the bonding wire region. The intelligent card carrier tape of the utility model allows the intelligent card to be directly used in contact environment and non-contact environment. Moreover, most production devices and technologies can still be employed, without purchasing or designing production devices. In addition, the intelligent card carrier tape substantially cuts carrier tape raw material cost, production cost, and the overall production time.
Description
Technical field
The utility model relates to a kind of semiconductor microelectronics encapsulation technology, integrated circuit encapsulation technology, particularly a kind of carrier band of double-interface smart card.
Background technology
Along with the continuous progress of integrated circuit encapsulation technology, the integrated level of integrated circuit improves day by day, and function is more and more abundanter, for the new application demand of continuous appearance, requires integrated circuit encapsulation enterprise can design novel bringing and cooperates new demand.
For example in the smart card encapsulation field, especially the use amount of smart card is very big.At present; Just towards the route development of technological innovation, new technology continues to bring out the mobile communication industry, and new function is also more and more; Many old functions are also updated and are strengthened; Cellular service is from now on used and will constantly be enlarged, and in these development, the function of smart card and the lifting of performance are also inevitable.
Existing double-interface smart card procedure for producing more complicated need be carried out smart card module production earlier, adds coil again, and production cost and material cost are higher.
Therefore, need a kind of integrated touch of low production cost and the novel smart card of contactless function especially, satisfy current user's consumer need.
Based on the demand, be badly in need of a kind of belt for smart card that carries coil that has.
The utility model content
The existing various deficiencies of carrier band that the utility model uses to above-mentioned existing double-interface smart card production; A kind of belt for smart card that carries coil that has is provided; This carrier band can be realized direct integrated touch function of smart card and contactless function, and can greatly reduce carrier band cost of material, production cost, production time.
In order to achieve the above object, the utility model adopts following technical scheme:
A kind of belt for smart card of belt coil, said carrier band is provided with chip bearing zone, bonding wire zone and coil region, is provided with coil in the said coil region, said coil and bonding wire regional connectivity.
In an embodiment of the utility model, said bonding wire zone comprises contact bonding wire zone, contactless bonding wire zone or two interfaces chip bonding wire zone.
Further, said contactless bonding wire is regional is communicated with said coil.
In another embodiment of the utility model, the one or more chips of said chip bearing regions carry.
In the another embodiment of the utility model, also comprise the electric capacity installation region that electric capacity is installed in the said coil region, said electric capacity installation region and said coil also connect.
In the another embodiment of the utility model, the composite construction that said carrier band is made up of substrate layer and copper-clad, said substrate layer tow sides are provided with copper-clad, form contact-making surface and pad face.
Further, offer corresponding through hole on the said pad face and expose corresponding contact-making surface copper-clad, form contact bonding wire zone, said pad face is provided with respective coil, contactless bonding wire zone and electric capacity installation region.
Above-mentioned some carrier bands are interconnected to form structure in flakes.
The following advantage that the utlity model has according to such scheme formation:
(1) can realize direct integrated touch function of smart card and contactless function through this carrier band;
(2) when the production of intelligent card, avoid adding coil, effectively practice thrift and produce material and reduce production costs;
(3) can continue to use most of production equipment and technology, need not to buy or the design production equipment;
(4) reduce production costs greatly and enhance productivity;
(5) effectively satisfy the demand of this area, have fabulous practicality.
Description of drawings
Further specify the utility model below in conjunction with accompanying drawing and embodiment.
Fig. 1 is the cutaway view of the utility model.
Fig. 2 is the utility model contact-making surface sketch map.
Fig. 3 is the utility model pad face sketch map.
Fig. 4 schemes for the utility model in flakes.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and be easy to understand understanding with effect, below in conjunction with concrete diagram, further set forth the utility model.
Problems such as the utility model is to existing smart card production technology commonly used, and existing not only energy consumption is high, and manufacturing process is loaded down with trivial details, and reliability is relatively poor relatively in the use, and the enforcement of the technical solution scheme that provides is specific as follows:
Referring to Fig. 3, the belt for smart card of a kind of belt coil that the utility model provides, carrier band are provided with chip bearing zone 1, and this bearing area is arranged on the centre position of carrier band, and it can attach one or more chips according to actual needs.
According to the function of smart card, contact chip, contactless chip or two interfaces chip can be carried in carrier band chip bearing zone 1.
For the ease of connecting the chip in the chip bearing area 1, around chip bearing zone 1, be provided with corresponding bonding wire zone.
Further; In order can contact function and contactless function to be combined; The bonding wire zone is respectively arranged with contact pad 2 (being contact bonding wire zone) and contactless pad 3 (being contactless bonding wire zone); Be respectively applied for connection and be placed in the contact pin and the contactless pin of the chip in the chip bearing zone 1, so that realize function corresponding.
In order to make the smart card module that is made as behind the finished product directly have contactless function, carrier band is provided with coil region, and this zone is arranged on the periphery in chip bearing zone 1 and bonding wire zone.
Mainly comprise radio-frequency coil 4 in the whole zone, this radio-frequency coil 4 is connected with contactless pad 3, to realize the non-contact function of chip.
In order to reach the optimum efficiency of inductance coupling high in use, the carrier band coil region also comprises the pad 6 (being the electric capacity installation region) that capacitor can be installed, and itself and coil 4 are connected in parallel, thereby realizes that the capacitor in the pad 6 carries out parallelly connected with coil 4.Can be in practical application according to chip actual needs operating frequency adjustment capacitance size.
Based on such scheme, the practical implementation of the utility model is following:
Referring to Fig. 1, in the specific implementation, the composite construction that the carrier band that the utility model provides is made up of substrate layer 8 and two-layer copper-clad 9.
Be coated with copper-clad 9,10 respectively at substrate layer 8 tow sides, thereby form the contact-making surface (as shown in Figure 2) and the pad face (as shown in Figure 3) of carrier band.
On pad face and contact-making surface, carry out etching, form corresponding circuit.
Referring to Fig. 3; In the bonding wire zone of pad face, offer corresponding through hole 11 (as shown in Figure 1) and expose corresponding contact-making surface copper-clad 9A; And with this contact-making surface copper-clad 9A as contact pad 2, road lead-in wire bonding process chips function pads can be directly and the electric connection of contact-making surface respective pad in the back to make it.
For the etched mode of other zone passages on the pad face pad face copper-clad 10 is etched into respective coil 4, contactless bonding wire zone 3 and electric capacity installation region 6.
Referring to Fig. 3, on the pad face, form in the circuit, electric capacity installation region 6 is positioned at the centre of whole pad face; Contactless pad 3 and contact pad 2 are distributed in the both sides of electric capacity installation region 6, and simultaneously contactless pad 3 all adopts with contact pad 2 and is symmetrical set, and contactless bonding wire zone 3 and the 2 alternate settings of contact pad on each symmetrical limit; 4 of coils center on contactless pad 3 and are provided with contact pad 2.But the present invention is not limited to this general layout, can carry out other general layout setting according to actual needs.
In order to realize joining of coil 4 and contactless bonding wire zone 3; The end 4A that coil 4 is positioned at inner ring directly joins with contactless bonding wire zone 3 through circuit 5, and the other end 4B that coil 4 is positioned at the outer ring realizes joining with contactless bonding wire zone 3 through via 7A and 7B.
Wherein via is electroplated and can be realized the connection of two-layer copper-clad up and down.Via 7A realizes the conducting of joining of other end 4B and contact-making surface copper-clad 9 that coil 4 is positioned at the outer ring; Via 7B realizes the conducting of joining of contactless bonding wire zone 3 and contact-making surface copper-clad 9, thereby realizes joining of coil 4 and contactless bonding wire regional 3 through two via 7A and 7B.
Further, the substrate layer in the utility model 8 adopts epoxide resin material, polyester material or polyimide material.
Moreover, back for ease road lead-in wire bonding, the carrier band copper foil layer adopts the mode of surperficial first electronickelling re-plating gold to handle.
In actual production, in order to increase production efficiency, carrier band adopts mode in flakes to carry out the connection of each unit, and adopts the pan feeding and the discharge method production of web-like.
Referring to Fig. 4, be a unit with above-mentioned carrier band, according to actual needs several carrier band unit are interconnected composition one shape in flakes, thereby realize adopting the pan feeding and the discharge method of web-like to produce.
Each carrier band unit end product size can be standard intelligent card module size 11.4mm*12.6mm, and the smart card module of this size can be applicable in any type of smart card.
More than show and described the advantage of basic principle, principal character and the utility model of the utility model.The technical staff of the industry should understand; The utility model is not restricted to the described embodiments; The principle of describing in the foregoing description and the specification that the utility model just is described; Under the prerequisite that does not break away from the utility model spirit and scope, the utility model also has various changes and modifications, and these variations and improvement all fall in the utility model scope that requires protection.The utility model requires protection range to be defined by appending claims and equivalent thereof.
Claims (8)
1. it is regional with bonding wire that the belt for smart card of a belt coil, said carrier band are provided with the chip bearing zone, it is characterized in that, also is provided with coil region on the said carrier band, is provided with coil in the said coil region, said coil and bonding wire regional connectivity.
2. the belt for smart card of a kind of belt coil according to claim 1 is characterized in that, said bonding wire zone comprises contact bonding wire zone, contactless bonding wire zone or two interfaces chip bonding wire zone.
3. the belt for smart card of a kind of belt coil according to claim 2 is characterized in that, said contactless bonding wire zone is communicated with said coil.
4. the belt for smart card of a kind of belt coil according to claim 1 is characterized in that, the one or more chips of said chip bearing regions carry.
5. the belt for smart card of a kind of belt coil according to claim 1 is characterized in that, also comprises the electric capacity installation region that electric capacity is installed in the said coil region, and said electric capacity installation region and said coil also connect.
6. the belt for smart card of a kind of belt coil according to claim 1 is characterized in that, the composite construction that said carrier band is made up of substrate layer and copper-clad, and said substrate layer tow sides are provided with copper-clad, form contact-making surface and pad face.
7. the belt for smart card of a kind of belt coil according to claim 6; It is characterized in that; Offer corresponding through hole on the said pad face and expose corresponding contact-making surface copper-clad; Form contact bonding wire zone, said pad face is provided with respective coil, contactless bonding wire zone and electric capacity installation region.
8. the belt for smart card of a kind of belt coil according to claim 1 is characterized in that, some carrier bands are interconnected to form structure in flakes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202121286U CN202103041U (en) | 2011-06-21 | 2011-06-21 | Intelligent card carrier tape having coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202121286U CN202103041U (en) | 2011-06-21 | 2011-06-21 | Intelligent card carrier tape having coil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202103041U true CN202103041U (en) | 2012-01-04 |
Family
ID=45389042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202121286U Expired - Fee Related CN202103041U (en) | 2011-06-21 | 2011-06-21 | Intelligent card carrier tape having coil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202103041U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102842566A (en) * | 2011-06-21 | 2012-12-26 | 上海长丰智能卡有限公司 | Intelligent card carrying strap with coil |
-
2011
- 2011-06-21 CN CN2011202121286U patent/CN202103041U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102842566A (en) * | 2011-06-21 | 2012-12-26 | 上海长丰智能卡有限公司 | Intelligent card carrying strap with coil |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120104 Termination date: 20170621 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |