CN102664176A - Carrier tape - Google Patents
Carrier tape Download PDFInfo
- Publication number
- CN102664176A CN102664176A CN 201210080380 CN201210080380A CN102664176A CN 102664176 A CN102664176 A CN 102664176A CN 201210080380 CN201210080380 CN 201210080380 CN 201210080380 A CN201210080380 A CN 201210080380A CN 102664176 A CN102664176 A CN 102664176A
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- Prior art keywords
- contact
- conductive layer
- carrier band
- insulating substrate
- conducting layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Credit Cards Or The Like (AREA)
Abstract
The invention discloses a carrier tape. The carrier tape is formed by a part surface conducting layer (1), an insulation base material (2) and a contact surface conducting layer (3). The part surface conducting layer is provided with multiple-circle rounding coils (11), pads (12) suitable for chip surface mounting and pads (13) for matching circuit surface mounting. The pads and a corresponding contact surface carry out electrical connection through blind holes (14). The insulation base material is an epoxy resin insulating material and is arranged between the part surface conducting layer and the contact surface conducting layer. The contact surface conducting layer is arranged on one surface of the insulation base material and the surface which is far from the insulation base material is formed by eight mutually electrical independent conductive contacts (31-38). The size of the contact accords with a size requirement ruled by ISO7816. An intelligent card produced by using the carrier tape of the invention is directly used in a contact environment and a non-contact environment. Product performance can be increased and simultaneously most of production equipment and technology can be still used so that production cost can be reduced and a production period can be shortened.
Description
Technical field
The present invention relates to a kind of carrier band, particularly the carrier band of double-interface smart card encapsulation usefulness is fit to be applied in the smart card encapsulation field.
Background technology
In the smart card encapsulation field, the encapsulation amount of smart card is very big.At present; Just towards the route development of technological innovation, new technology continues to bring out smart card industry, and new function is also more and more; Many old functions are also updated and are strengthened; Novel smart card service is from now on used and will constantly be enlarged, and in these development, the function of smart card and the lifting of performance are also inevitable.
Invent the stage that the fiscard safe shifts, the two interfaces fiscard that the contact fiscard of CPU form occurred and had contact and contactless function simultaneously energetically in China.But existing pair of interface fiscard production technology more complicated need be carried out smart card module production earlier, adds coil again, and be the most complicated and influence the welding sequence of properties of product, and both time-consuming, reliability is poor again, and production cost and material cost are higher.
Therefore, need a kind of new type double interface fiscard of low production cost especially, satisfy current user's consumer need.
Based on the demand, press for a kind of novel demand that brings the realization new product.
Summary of the invention
The present invention is directed to the existing various deficiencies of carrier band that above-mentioned existing two boundaries fiscard production is used; A kind of carrier band of integrated form coil is provided; This carrier band can be realized fiscard integrated touch function and contactless function, and can greatly reduce cost of material, production cost and production cycle.
In order to achieve the above object, the present invention adopts following technical scheme:
A kind of carrier band is made up of part surface conductive layer, insulating substrate and contact face conductive layer:
Described part surface conductive layer be provided with many circles around coil, be fit to chip surface and mount pad and the surface-pasted pad of match circuit, pad is electrically connected through blind hole with corresponding contact face;
Described insulating substrate is an epoxy resin insulation material, and it is arranged on the centre of part surface conductive layer and contact face conductive layer;
Said contact face conductive layer is arranged on a surface of insulating substrate; Wherein away from the face of insulating substrate by 8 electric mutually independently conductive contact form; The dimensional requirement of the size conforms ISO7816 regulation of contact; Middle large tracts of land conductive region is connected with the contact, is defined as the system earth utmost point, is independently isolating with the hollow out figure between the conductive contact.
Further, said many circles around the operating frequency of coil be 13.56MHz.
Further again, the surface-pasted pad of said match circuit is connected with said coils from parallel connection of coils.
Further again; Said part surface is provided with corresponding blind hole and is connected with corresponding contact-making surface conductive layer; Begin from the part surface porose disc, form conductive layer along hole wall and be electrically connected up to contact face conductive layer and the formation of insulating substrate faying face, observing blind hole from contact face is closed conductive layer.
Further again, said insulating substrate adopts epoxide resin material, and its thickness is between 0.05-0.15mm.
Further again, the hollow out figure of said contact face conductive layer has electric insulation, discharges mechanical stress, reduces electromagnetic-field-shielded and beautifies the effect of visual effect.
Further again, the regularly arranged strip structure in flakes that is interconnected to form of some carrier bands.
The present invention who forms according to such scheme has the following advantages:
(1) the two interfaces fiscard through this carrier band processing has contact function and contactless function;
(2) cancellation adds coil when producing two interfaces fiscard, has also cancelled the welding process of antenna, practices thrift effectively and produces material and reduce production costs;
(3) can continue to use most of production equipment and technology, need not to buy or the design production equipment;
(4) reduce production costs greatly and enhance productivity;
(5) effectively satisfy the demand of this area, have fabulous practicality.
Description of drawings
Further specify the present invention below in conjunction with accompanying drawing and embodiment.
Fig. 1 is a contact face sketch map of the present invention.
Fig. 2 is an extension product contact face sketch map of the present invention.
Fig. 3 is a part surface sketch map of the present invention.
Fig. 4 is an extension product part surface sketch map of the present invention.
Fig. 5 is a cutaway view of the present invention.
Fig. 6 schemes for contact face of the present invention in flakes.
Fig. 7 schemes for solder side of the present invention in flakes.
Embodiment
For technological means, creation characteristic that the present invention is realized, reach purpose and effect and be easy to understand and understand, below in conjunction with concrete diagram, further set forth the present invention.
Problems such as the present invention is directed to existing two interfaces fiscard production technology commonly used, existing not only energy consumption is high, and manufacturing process is loaded down with trivial details, and reliability is relatively poor relatively in the use, and the enforcement of the technical solution scheme that provides is specific as follows:
Referring to Fig. 3, a kind of carrier band provided by the invention, carrier band are provided with chips welding zone 12, and this welding region is arranged on the centre position of carrier band, and it can install a chip according to actual needs.
According to the function of fiscard, contact chip, contactless chip or two interfaces chip can be welded in carrier band chips welding zone 12.
In order can contact function and contactless function to be combined; The pad that the bonding wire zone is provided with has comprised contact pad and contactless pad; Be respectively applied for connection and be placed in the contact pin and the contactless pin of the chip in the chips welding zone 12, so that realize function corresponding.
In order to make the fiscard module that is made as behind the finished product directly have contactless function, carrier band is provided with coil region 11, and this zone is arranged on the periphery in chips welding zone 12.
Mainly comprise radio-frequency coil 11 in the whole zone, this radio-frequency coil 11 is connected with the contactless pad in chips welding zone 12, to realize the non-contact function of chip.
The effect of coil 11 here is to let fiscard have electromagnetic induction in use, and can carry out inductance coupling high with card reader in use and communicate by letter.
By present service condition; Meet the communication frequency that fiscard uses and be 13.56MHz; But only the frequency of the input capacitance resonance through this coil 11 and chip possibly not reach 13.56MHz; The present invention cooperates this coil 11 through increasing the corresponding compensation capacitor, and adjusts to the frequency of optimum traffic of 13.56MHz, and compensation condenser is installed in 13 position.Matching capacitance 13 is connected in parallel with coil 11, thereby realizes effectively coupling.Because the value of normal capacitance device is fixed, and 2 installation sites can be set, the coupling that adopts two electric capacity is to reach optimum efficiency.
The corresponding pad in chips welding zone 12 is connected with corresponding contact-making surface conductive layer through corresponding blind hole; Begin from the part surface porose disc; Form conductive layer along hole wall and be electrically connected up to contact face conductive layer and the formation of insulating substrate faying face, observing blind hole from contact face is closed conductive layer.
Referring to Fig. 1, Fig. 3 and Fig. 5, in the specific implementation, the composite construction that carrier band provided by the invention is made up of substrate layer 2 and two-layer copper-clad 3.
Be coated with copper-clad respectively at substrate layer 2 tow sides, thereby form the contact-making surface and the solder side of carrier band.
On pad face and contact-making surface, carry out etching, form corresponding circuit.Fig. 2 and Fig. 4 are that the product that in above-mentioned basic design, carries out extends; With regard to contact face, with performance and attractive in appearance be design principle, in non-contact application; The application of hollow slots is even more important; Reduce the area of conductive layer at the module edge as far as possible, can effectively improve the transmitance of magnetic flux, thereby improve non-contacting communication efficiency.
Referring to Fig. 5, in the bonding wire of solder side zone 12, be provided with corresponding blind hole 14, be connected to 8 corresponding contact-making surface contact 31-38, make the function pads after the chips welding can be directly and the electric connection of contact-making surface respective pad.
Adopted blind hole technology, extended to the inboard of contact face from the hole of solder side, the pad in contact pad and chips welding district is effectively coupled together, therefore can't see via, made product more attractive in appearance from contact face.
For the etched mode of other zone passages on the pad face pad face copper-clad is etched into respective coil 11, chip bonding wire zone 12 and match circuit installation region 13 and connection line.
Further, the substrate layer among the present invention 2 adopts epoxide resin material, polyester material or polyimide material.
In order to make product more attractive and durable, the carrier band copper foil layer adopts the mode of surperficial first electronickelling re-plating gold to handle.
In actual production, in order to increase production efficiency, carrier band adopts mode in flakes to carry out the connection of each unit, and adopts the pan feeding and the discharge method production of web-like.
Like Fig. 6 and Fig. 7, be a unit with above-mentioned carrier band, according to actual needs several carrier band unit are interconnected composition one shape in flakes, thereby realize adopting the pan feeding and the discharge method of web-like to produce.
Each carrier band unit end product can be applicable in any type of smart card.
Basic principle of the present invention, principal character and advantage of the present invention have more than been described.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various changes and modifications, and these variations and improvement all fall in the scope of the invention that requires protection.
Claims (7)
1. a carrier band is characterized in that, said carrier band is made up of part surface conductive layer (1), insulating substrate (2) and contact face conductive layer (3):
Described part surface conductive layer (1) be provided with many circles around coil (11), be fit to chip surface and mount pad (12) and the surface-pasted pad of match circuit (13), pad is electrically connected through blind hole (14) with the contact face of correspondence;
Described insulating substrate (2) is an epoxy resin insulation material, and it is arranged on the centre of part surface conductive layer (1) and contact face conductive layer (3);
Said contact face conductive layer (3) is arranged on a surface of insulating substrate (2); Wherein away from the face of insulating substrate by 8 electric mutually independently conductive contact (31 ~ 38) form; The dimensional requirement of the size conforms ISO7816 regulation of contact; Middle large tracts of land conductive region (39) is connected with contact (38), is defined as the system earth utmost point, is independently isolating with hollow out figure (310 and 311) between the conductive contact (31 ~ 38).
2. carrier band according to claim 1 is characterized in that, said many circles around the operating frequency of coil (11) be 13.56MHz.
3. carrier band according to claim 1 is characterized in that, the surface-pasted pad of said match circuit (13) is connected in parallel with said coil (11).
4. carrier band according to claim 1; It is characterized in that; Said part surface is provided with corresponding blind hole and is connected with corresponding contact-making surface conductive layer (3); From part surface porose disc (14) beginning, form conductive layer along hole wall and be electrically connected up to contact face conductive layer and the formation of insulating substrate faying face, observing blind hole from contact face is closed conductive layer.
5. carrier band according to claim 1 is characterized in that, said insulating substrate (2) adopts epoxide resin material, and its thickness is between 0.05-0.15mm.
6. carrier band according to claim 1 is characterized in that, the hollow out figure of said contact face conductive layer (3) (310 and 311) has electric insulation, discharges mechanical stress, reduces electromagnetic-field-shielded and beautifies the effect of visual effect.
7. carrier band according to claim 1 is characterized in that, the regularly arranged strip structure in flakes that is interconnected to form of some carrier bands.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210080380 CN102664176A (en) | 2012-03-24 | 2012-03-24 | Carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210080380 CN102664176A (en) | 2012-03-24 | 2012-03-24 | Carrier tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102664176A true CN102664176A (en) | 2012-09-12 |
Family
ID=46773633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210080380 Pending CN102664176A (en) | 2012-03-24 | 2012-03-24 | Carrier tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102664176A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103020694A (en) * | 2012-12-03 | 2013-04-03 | 山东恒汇电子科技有限公司 | Copper-ring-free double-interface smart card packaging framework |
| CN110739225A (en) * | 2019-09-10 | 2020-01-31 | 黄石市星光电子有限公司 | Production process of conduction type double-interface IC (integrated circuit) intelligent card carrier tape |
-
2012
- 2012-03-24 CN CN 201210080380 patent/CN102664176A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103020694A (en) * | 2012-12-03 | 2013-04-03 | 山东恒汇电子科技有限公司 | Copper-ring-free double-interface smart card packaging framework |
| CN103020694B (en) * | 2012-12-03 | 2015-08-26 | 恒汇电子科技有限公司 | Without copper ring double-interface smart card packaging frame |
| CN110739225A (en) * | 2019-09-10 | 2020-01-31 | 黄石市星光电子有限公司 | Production process of conduction type double-interface IC (integrated circuit) intelligent card carrier tape |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120912 |