CN216354122U - Paster diode frame sintering positioning jig - Google Patents
Paster diode frame sintering positioning jig Download PDFInfo
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- CN216354122U CN216354122U CN202122772485.4U CN202122772485U CN216354122U CN 216354122 U CN216354122 U CN 216354122U CN 202122772485 U CN202122772485 U CN 202122772485U CN 216354122 U CN216354122 U CN 216354122U
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- sintering
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Abstract
The utility model discloses a sintering positioning jig for a chip diode frame, which comprises a carrying disc, wherein an object placing through groove is arranged on the upper end surface of the carrying disc, a positioning pin and a guide pin are vertically arranged at the bottom of the object placing through groove, the carrying disc is provided with a plurality of cover plate support column avoiding holes, at least two mutually independent cover plates are separately arranged above the object placing through groove, each cover plate is provided with a cover plate positioning pin protruding out of the lower end surface of each cover plate, each cover plate is provided with a cover plate support column protruding out of the lower end surface of each cover plate, the cover plate support columns are matched with the cover plate support column avoiding holes, each cover plate is provided with guide pin avoiding through holes matched with the guide pins, through the separately arranged cover plates, the cover plates can transversely move along with the expansion of the chip diode frame when the chip diode frame expands due to high-temperature sintering, and the problem that the qualified rate of a chip diode is seriously influenced by the inconsistent thermal expansion rate of the sintering positioning jig and the chip diode frame is avoided To give a title.
Description
Technical Field
The utility model belongs to the field of manufacturing of surface mount diodes, and particularly relates to a sintering positioning jig for a surface mount diode frame.
Background
The chip diode is widely applied to important fields such as vehicle-mounted electronic equipment and safe driving systems of fuel vehicles and new energy vehicles due to simple and convenient structure and high reliability. In order to meet the development requirements of continuously improving the quality and the safety of the automobile, each automobile factory provides higher requirements for the size precision and the reliability of the chip diode for the automobile.
At present, the technological process of sintering the chip diode frame for the automobile is as follows:
the method comprises the steps of firstly, placing a diode frame on a carrying disc for positioning, placing a positioning cover plate on a lead frame, dispensing soldering paste on a lead frame substrate, assembling a chip, dispensing soldering paste on the chip, dispensing soldering paste on a pin, assembling a connecting sheet, and welding the frame substrate and the diode chip, the diode chip and the connecting sheet and the frame pin and the connecting sheet together through high-temperature sintering.
And secondly, putting the welded frame assembly body into a jig of a cleaning machine, and cleaning with alkali liquor.
And thirdly, putting the cleaned frame assembly into a compression mold, and carrying out high-temperature epoxy resin plastic package to finish the packaging process of the product.
And fourthly, putting the packaged product into a stamping die, cutting off the pin connecting ribs and bending the pins to form a final chip diode finished product.
The process has the following problems:
because the diode frame is rectangular red copper material, and the main material of carrying dish, locating cover plate is the carbon plate, because of red copper's expansion coefficient is greater than the carbon plate, when frame and carrying dish, apron etc. get into high temperature sintering furnace together, the frame both ends are restricted by the locating pin, and the thermal deformation arches locating cover plate, easily leads to chip rosin joint, seriously influences the qualification rate of paster diode.
Because the positioning cover plate and the carrying disc are positioned by adopting the pins, the diode frame clamped in the middle cannot be synchronous with the expansion of the cover plate when subjected to thermal expansion, so that the chips and the connecting sheets in the positioning cover plate are not concentric with the welding surface on the frame, the subsequent production processes such as packaging are influenced, and the chips are easily stressed and damaged due to the obstruction of the positioning cover plate during cooling shrinkage. Therefore, a chip diode frame sintering positioning jig needs to be designed.
Disclosure of Invention
The utility model aims to provide a chip diode frame sintering positioning jig to solve the problem that the yield of a chip diode is seriously influenced by thermal expansion of the positioning jig in the prior art.
In order to achieve the purpose, the specific technical scheme of the chip diode frame sintering positioning jig is as follows:
the utility model provides a paster diode frame sintering positioning jig, is including carrying the dish, it is equipped with puts the thing logical groove to carry the dish up end, puts the tank bottom that the thing leads to the groove and is equipped with the locating pin perpendicularly and leads positive round pin, carries the dish and is equipped with several apron support column and keeps away a hole, puts the thing and leads the separation of logical groove top and be equipped with two at least mutually independent apron, the apron is equipped with the apron locating pin of terminal surface under outstanding apron, the apron is equipped with the apron support column of terminal surface under outstanding apron, the apron support column keeps away a hole adapted with the apron support column, the apron is equipped with and leads positive round pin of joining in marriage and keep away a through-hole. Through the apron that the separation was equipped with, can make the apron under the effect of apron locating pin, when the paster diode frame inflation that the sintering caused, the apron is along with paster diode frame's inflation lateral shifting, and then has avoided positioning jig can be because of the problem that the thermal expansion seriously influences the paster diode qualification rate.
Further, put the thing and lead to the groove and constitute by the standing groove and the constant head tank that paste closely side by side, the standing groove degree of depth is greater than the constant head tank degree of depth, can make paster diode frame can stably place after the shaping of bending.
Furthermore, the positioning pin is arranged in the positioning groove, so that the positioning pin is convenient to be matched with the position of the circular positioning hole in the surface mount diode frame.
Further, lead the round pin and set up in the constant head tank, lead the round pin and be equipped with two at least, all lead the center connecting wire of round pin and be parallel with the constant head tank and do not pass the center of locating pin, be favorable to guaranteeing the stability of paster diode frame orientation, lateral shifting when the paster diode frame of being convenient for is heated and expands.
Further, the constant head tank is equipped with the hole of stepping down with the apron locating pin adapted, and the hole aperture of stepping down is not less than the twice of apron locating pin diameter, can ensure that positioning jig and paster diode frame when sintering inflation, the hole of stepping down can not produce spacing interference to the apron locating pin.
Further, apron locating pin diameter is 1.5 ~ 2mm, easily purchases, and light in weight can not cause the burden of extra removal.
Furthermore, the diameter of the hole of stepping down is 5-7 mm, so that interference between the hole and the cover plate positioning pin in the sintering process can be prevented.
Furthermore, the length of the cover plate positioning pin protruding out of the lower end face of the cover plate is not less than one third of the length of the abdicating hole and not more than the thickness of the carrying disc, the cover plate positioning pin is better in functionality, and the arrangement of the carrying disc cannot be interfered.
Furthermore, two sides of the cover plate are provided with avoiding grooves for avoiding the positioning pins, so that the integrity of the positioning device is facilitated.
Furthermore, the carrying disc and the cover plate are both made of graphite carbon plates, are refined through high-pressure forming, vacuum impregnation and high-temperature heat treatment processes, and have remarkable acid resistance and temperature resistance.
Compared with the prior art, the utility model has the following beneficial effects:
1. the cover plate is arranged through separation, the cover plate can be arranged under the action of the cover plate positioning pin, when a paster diode frame caused by sintering expands, the cover plate moves transversely along with the expansion of the paster diode frame, the problem that the qualified rate of the paster diode is seriously influenced by thermal expansion of the positioning jig is avoided, the limitation that the two ends of the paster diode frame are limited by the positioning pin when the cover plate and the carrying disc are connected in a sintering mode is overcome, the cover plate is arched through thermal deformation, chip insufficient welding is easily caused, and the qualified rate of the paster diode is seriously influenced.
2. Through lead the round pin and set up in the constant head tank, lead the round pin and be equipped with two at least, all lead the center connecting wire of round pin and be parallel with the constant head tank and do not pass the center of locating pin, be favorable to guaranteeing the stability of paster diode frame direction, lateral shifting when the paster diode frame of being convenient for is heated the inflation.
Through the locating groove is equipped with the hole of stepping down with the apron locating pin adapted, and the hole aperture of stepping down is not less than the twice of apron locating pin diameter, can ensure that positioning jig and paster diode frame when sintering inflation, the hole of stepping down can not produce spacing interference to the apron locating pin.
3. The length of the cover plate positioning pin protruding out of the lower end face of the cover plate is not less than one third of the length of the abdicating hole and not more than the thickness of the carrying disc, so that the cover plate positioning pin has better functionality, does not interfere with the arrangement of the carrying disc, and is favorable for the integrity of the utility model.
Drawings
FIG. 1 is a schematic structural view of a diode frame sintering positioning fixture of the present invention after being placed on a frame;
FIG. 2 is an enlarged view of a partial positioning pin D of the diode frame sintering positioning jig of the utility model after being placed on a frame;
FIG. 3 is an enlarged view of a partial E guide pin after the diode frame sintering positioning jig of the utility model is placed on a frame;
FIG. 4 is a schematic structural view of the diode frame sintering positioning fixture after the upper cover plate, the solder, the chip and the connecting sheet are placed thereon;
fig. 5 is a cross-sectional view taken along line C-C of fig. 4.
The reference numbers in the figures illustrate: 1. the LED chip mounting structure comprises a carrying disc, 11 storage through grooves, 111 positioning pins, 112 guiding pins, 113 placing grooves, 114 positioning grooves, 1141 yielding holes, 12 cover plate support column avoiding holes, 2 cover plates, 21 cover plate positioning pins, 22 cover plate support columns, 23 avoiding grooves, 24 guiding pin avoiding through holes and 3 chip diode frames.
The specific implementation mode is as follows:
for a better understanding of the objects, structure and function of the utility model, reference should be made to the following detailed description taken in conjunction with the accompanying drawings.
As shown in fig. 1 to 5, a sintering positioning fixture for a chip diode frame is designed, which comprises a carrying disc 1, wherein the upper end surface of the carrying disc 1 is provided with a storage through groove 11, the bottom of the storage through groove 11 is vertically provided with a positioning pin 111 and a guide pin 112, the carrying disc 1 is provided with a plurality of cover plate support post clearance holes 12, at least two mutually independent cover plates 2 are separately arranged above the storage through groove 11, the cover plates 2 can be abutted against each other, the cover plates 2 are provided with cover plate positioning pins 21 protruding out of the lower end surfaces of the cover plates 2, the cover plates 2 are provided with cover plate support posts 22 protruding out of the lower end surfaces of the cover plates, the cover plate support posts 22 are matched with the cover plate support post clearance holes 12, the cover plates 2 are provided with guide pin clearance through holes 24 matched with the guide pin 112, and the cover plates 2 are arranged separately, so that when the chip diode frame 3 expands due to high-temperature sintering, the cover plate 2 moves transversely along with the expansion of the surface mounted diode frame 3, so that the problem that the qualified rate of the surface mounted diode is seriously influenced by the inconsistent thermal expansion rate of the sintering positioning jig and the surface mounted diode frame 3 is solved, the problem that the qualified rate of the surface mounted diode is seriously influenced by the limitation of the positioning pins 111 at the two ends of the surface mounted diode frame 3 during sintering in the production mode of the integrated surface mounted diode frame 2 and the carrier disc 1 is overcome, the cover plate 2 is arched by thermal deformation, the chip is easily caused to be in a false welding state, and the qualified rate of the surface mounted diode is seriously influenced.
The process of the utility model when in use is as follows:
firstly, put paster diode frame 3 to the logical groove 11 of putting of carrying dish 1, make the locating pin 111 that carries dish 1 insert the central circular hole of paster diode frame 3 and carry out the accurate positioning, make simultaneously and carry the guiding pin 112 that dish 1 both sides insert the elliptical hole of paster diode frame 3, guiding pin 112 is located the central point of elliptical hole and puts, when paster diode frame 3 thermal expansion, just can expand to the direction of extension along guiding pin 112, when the product cools off, paster diode frame 3 contracts to opposite direction along guiding pin 112 and moves, the problem of the deformation of being hindered of paster diode frame 3 thermal expansion has thoroughly been solved.
And secondly, placing a plurality of identical cover plates 2 on the surface mount diode frame 3, inserting the cover plate positioning pins 21 into the round holes of the surface mount diode frame 3 for precise positioning, arranging larger yielding holes 1141 on the carrying disc 1 corresponding to the positions of the cover plate positioning pins 21, and enabling the cover plate positioning pins 21 and the carrying disc 1 not to be in contact with each other. After the welding flux, the chip and the connecting sheet are placed in the cover plate 2, the whole jig is placed in a high-temperature sintering furnace. When the chip diode frame 3 expands due to heat, the cover plate 2 moves to the extending direction together with the chip diode frame 3 under the driving of the cover plate positioning pin 21. When the product cooling, apron 2 removes to opposite direction along with paster diode frame 3 together under the drive of apron locating pin 21, has guaranteed the accuracy of chip in apron 2 and connection piece welding position promptly like this, can avoid again because of the asynchronous stress that produces of inflation destroys the chip. In the above embodiment, 2 examples are listed to achieve the above technical solution:
example 1
The embodiment provides a chip diode frame sintering positioning jig, which comprises a carrying disc 1, wherein the carrying disc 1 is rectangular, an object placing through groove 11 is formed in the upper end face of the carrying disc 1, the object placing through groove 11 is matched with a chip diode frame 3, a positioning pin 111 and a guide pin 112 are vertically arranged at the bottom of the object placing through groove 11, the object placing through groove 11 is composed of a placing groove 113 and a positioning groove 114 which are attached tightly in parallel, the depth of the placing groove 113 is greater than that of the positioning groove 114, and the chip diode frame 3 can be stably placed after being bent and formed; the positioning groove 114 is provided with a yielding hole 1141 matched with the cover plate positioning pin 21, the aperture of the yielding hole 1141 is not less than twice the diameter of the cover plate positioning pin 21, and when the positioning jig and the surface mount diode frame 3 are sintered and expanded, the yielding hole 1141 cannot limit the cover plate positioning pin 21 or generate limiting interference on the movement of the cover plate 2; the diameter of the cover plate positioning pin 21 is 1.5mm, the purchase and assembly are easy, the weight is light, the burden of extra movement cannot be caused during the process step, the diameter of the abdicating hole 1141 is 5mm, the abdicating hole can be better matched with the cover plate positioning pin 21, and the movement of the cover plate positioning pin 21 is not limited; the length of the cover plate positioning pin 21 protruding out of the lower end face of the cover plate 2 is half of the length of the abdicating hole 1141, the cover plate positioning pin 21 is precisely matched with the positioning hole of the patch diode frame 3, the expansion linkage is realized, the functionality is good, and the arrangement of the carrying disc 1 cannot be interfered by overlong; the carrying disc 1 is provided with 8 cover plate supporting column avoiding holes 12 which are uniformly distributed at two sides of the carrying disc 1, two mutually independent cover plates 2 are separately arranged above the object placing through groove 11, the cover plates 2 can be closely attached, the cover plates 2 are provided with cover plate positioning pins 21 which protrude out of the lower end surfaces of the cover plates 2, the cover plates 2 are provided with cover plate supporting columns 22 which protrude out of the lower end surfaces of the cover plates, the cover plate supporting columns 22 are matched with the cover plate supporting column avoiding holes 12, the cover plates 2 are provided with guiding pin avoiding through holes 24 which are matched with guiding pins 112, through the separately arranged cover plates 2, the cover plates 2 can move transversely along with the expansion of the surface mount diode frame 3 when the surface mount diode frame 3 expands due to high-temperature sintering, thereby avoiding the problem that the sintering positioning jig and the surface mount diode frame 3 seriously affect the qualified rate of the surface mount diode due to inconsistent thermal expansion rate, the problem that in the production mode of the cover plate 2 and the carrying disc 1 which are connected, the two ends of the surface mount diode frame 3 are limited by the positioning pins 111 during sintering, the cover plate 2 is arched by thermal deformation, so that chip cold welding is easily caused, and the qualification rate of the surface mount diode is seriously influenced is solved; the two sides of the cover plate 2 are provided with the avoidance grooves 23 for avoiding the positioning pins 111, the integrity of the utility model is facilitated, the avoidance grooves do not interfere with the height and the diameter of the positioning pins 111, the carrying disc and the cover plate are made of carbon plates, the temperature resistance is good, and the requirements of the chip diode frame sintering positioning jig are met.
Example 2
The embodiment provides a sintering positioning jig for a chip diode frame, which comprises a carrying disc 1, wherein the carrying disc 1 is rectangular, the upper end surface of the carrying disc 1 is provided with a storage through groove 11, the storage through groove 11 is composed of a placing groove 113 and a positioning groove 114 which are attached side by side, the depth of the placing groove 113 is greater than that of the positioning groove 114, so that the chip diode frame 3 can be stably placed after being bent and molded, the bottom of the storage through groove 11 is vertically provided with a positioning pin 111 and a guide pin 112, the positioning pin 111 is arranged in the positioning groove 114 and is convenient to be matched with the position of a circular positioning hole on the chip diode frame, the guide pin 112 is arranged in the positioning groove 114, the guide pins 112 are provided with two guide pins 112 which are respectively matched with oval guide holes on the chip diode frame 3, the central connecting line of the two guide pins 112 is parallel to the positioning groove 114 and does not pass through the center of the positioning pin 111, so as to be beneficial to ensuring the stability of the chip diode frame 3 in direction, the patch diode frame 3 can move transversely when being heated and expanded; the positioning groove 114 is provided with a yielding hole 1141 matched with the cover plate positioning pin 21, the aperture of the yielding hole 1141 is not less than twice the diameter of the cover plate positioning pin 21, and the yielding hole 1141 can ensure that the cover plate positioning pin 21 is not subjected to limited interference when the positioning jig and the surface mount diode frame 3 are sintered and expanded; preferably, the diameter of the cover plate positioning pin 21 is 2mm, the cover plate positioning pin is easy to purchase and light in weight, no extra movement burden is caused during the process, the diameter of the abdicating hole 1141 is 7mm, the abdicating hole can be better matched with the cover plate positioning pin 21, and the interference with the cover plate positioning pin 21 in the sintering process can be prevented; the length of the cover plate positioning pin 21 protruding out of the lower end face of the cover plate 2 is not less than one third of the length of the abdicating hole 1141 and not more than the thickness of the carrying disc 1, the cover plate positioning pin 21 has better functionality and does not interfere with the arrangement of the carrying disc 1; the carrying disc 1 is provided with 16 cover plate supporting column avoiding holes 12 which are arranged at two sides of the carrying disc 1 in a mirror image manner, four mutually independent cover plates 2 are separately arranged above the object placing through groove 11, the cover plates 2 can be closely attached, the cover plates 2 are provided with cover plate positioning pins 21 protruding out of the lower end surfaces of the cover plates 2, the cover plate supporting columns 22 protruding out of the lower end surfaces of the cover plates are matched with the cover plate supporting column avoiding holes 12, the cover plates 2 are provided with guiding pin avoiding through holes 24 matched with guiding pins 112, the cover plates 2 can be enabled to move transversely along with the expansion of the surface mount diode frame 3 under the precise matching of the cover plate positioning pins 21 and the circular positioning holes of the surface mount diode frame 3 through the separately arranged cover plates 2 when the surface mount diode frame 3 expands due to high-temperature sintering, and further the problem that the qualified rate of the surface mount diode is seriously influenced by the inconsistent thermal expansion rates of a sintering positioning jig and the surface mount diode frame 3 is avoided, the problem that in the production mode of the integrated cover plate 2 and the carrying disc 1, two ends of a chip diode frame 3 are limited by positioning pins 111 during sintering, the cover plate 2 is arched due to thermal deformation, chip insufficient soldering is easily caused, and the qualification rate of the chip diode is seriously affected is solved, and the avoidance grooves 23 for avoiding the positioning pins 111 are arranged on two sides of the cover plate 2, so that the integrity of the utility model is facilitated, and the interference with the height and the diameter of the positioning pins 111 is avoided; the carrying disc 1 and the cover plate 2 are both made of graphite carbon plates, are refined through high-pressure forming, vacuum impregnation and high-temperature heat treatment processes, and have remarkable acid resistance and temperature resistance.
It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes in the features and embodiments, or equivalent substitutions may be made therein by those skilled in the art without departing from the spirit and scope of the utility model. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the utility model without departing from the essential scope thereof. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. The utility model provides a paster diode frame sintering positioning jig, includes year dish (1), its characterized in that: carry dish (1) up end to be equipped with and put thing through groove (11), the tank bottom of putting thing through groove (11) is equipped with locating pin (111) perpendicularly and leads positive round pin (112), carry dish (1) to be equipped with several apron support column and keep away a hole (12), it is equipped with two at least mutually independent apron (2) to put thing through groove (11) top separation, apron (2) are equipped with and stick out apron locating pin (21) of terminal surface under apron (2), apron (2) are equipped with and stick out apron support column (22) of terminal surface under the apron, apron support column (22) keep away a hole (12) adapted with the apron support column, apron (2) are equipped with and lead positive round pin that positive round pin (112) adapted and keep away a through-hole (24).
2. The jig for sintering and positioning a chip diode frame as claimed in claim 1, wherein the through placement groove (11) is composed of a placement groove (113) and a positioning groove (114) which are attached in parallel, and the depth of the placement groove (113) is greater than that of the positioning groove (114).
3. The frame sintering positioning fixture for chip diodes according to claim 2, characterized in that the positioning pins (111) are disposed in the positioning grooves (114).
4. The chip diode frame sintering positioning jig is characterized in that the guide pins (112) are arranged in the positioning grooves (114), at least two guide pins (112) are arranged, and the central connecting lines of all the guide pins (112) are parallel to the positioning grooves (114) and do not pass through the centers of the positioning pins (111).
5. The chip diode frame sintering positioning jig according to claim 4, characterized in that the positioning groove (114) is provided with a relief hole (1141) matched with the cover plate positioning pin (21), and the diameter of the relief hole (1141) is not less than twice the diameter of the cover plate positioning pin (21).
6. The jig for sintering and positioning a chip diode frame as claimed in claim 5, wherein the diameter of the cover plate positioning pin (21) is 1.5-2 mm.
7. The SMD diode frame sintering positioning jig according to claim 6, characterized in that said abdicating hole (1141) diameter is 5-7 mm.
8. The chip diode frame sintering positioning jig is characterized in that the length of the cover plate positioning pin (21) protruding out of the lower end face of the cover plate (2) is not less than one third of the length of the abdicating hole (1141) and not more than the thickness of the carrier disc (1).
9. The chip diode frame sintering positioning jig according to claim 1, wherein two sides of the cover plate (2) are provided with avoiding grooves (23) for avoiding the positioning pins (111).
10. The jig for sintering and positioning a chip diode frame as claimed in claim 1, wherein the carrier disc (1) and the cover plate (2) are made of graphite carbon plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122772485.4U CN216354122U (en) | 2021-11-12 | 2021-11-12 | Paster diode frame sintering positioning jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122772485.4U CN216354122U (en) | 2021-11-12 | 2021-11-12 | Paster diode frame sintering positioning jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216354122U true CN216354122U (en) | 2022-04-19 |
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ID=81148625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122772485.4U Active CN216354122U (en) | 2021-11-12 | 2021-11-12 | Paster diode frame sintering positioning jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216354122U (en) |
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2021
- 2021-11-12 CN CN202122772485.4U patent/CN216354122U/en active Active
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