CN214753823U - Dam-free COB LED substrate - Google Patents

Abstract

The utility model provides an exempt from box dam COB LED base plate. Exempt from box dam COB LED base plate is including the first basic unit, insulating glue film, copper foil layer, printing ink layer, pure glue film and the second basic unit that stack gradually. Traditional COB light source's box dam process flow is got rid of through bilayer or multilayer substrate pressfitting technology to the COB LED base plate, has increased the horizontal heat conduction of COB light source and heat-sinking capability to provide the life-span of COB light source, directly carry out the secondary grading to the COB light source through the appearance design to upper substrate simultaneously, guarantee the light-emitting light type.

Description

Dam-free COB LED substrate

Technical Field

The utility model belongs to the LED shows the field, concretely relates to exempt from box dam COB LED base plate and preparation method and application thereof.

Background

At present, most of COB structure products on the market are the following two schemes: 1) the silicone jelly-shaped box dam glue is used, a specific box dam machine is used for carrying out box dam operation according to required parameters such as specific shape, height and the like, and an oven is used for carrying out long-time curing after the completion. The defects of long process flow and cycle and large equipment requirement; 2) when the substrate is manufactured, plastic is used for carrying out dam plasticity, and dam operation is not needed. The defects that the plastic model is fixed, the cost of the mould is high, and the mould period of the plastic dam is long.

CN111463198A discloses a COB packaging structure of a UVC-LED and a manufacturing method thereof, wherein the COB packaging structure comprises a ceramic circuit board, a ceramic dam, a transparent cover plate, a UVC-LED chip, a ceramic insulating plate and a reflection laminate, the light emitted by the UVC-LED chip is provided to be reflected out of the transparent cover plate through a reflection coating of an flared hole, the directivity of the light is effectively improved, and the light-emitting efficiency of a COB light source is greatly improved; compared with the insulating glue, the ceramic insulating plate has stable performance, avoids the risk of short circuit caused by aging, and has high safety; transparent cover's viscose department has plated the metal protection layer, however this COB packaging structure need set up the ceramic box dam, leads to the COB light source transversely to lead to heat conduction, heat-sinking capability and COB light source's life-span relatively poor.

CN206490058U discloses a dam-free COB light source packaging structure, which comprises a substrate, wherein a specular reflection area is arranged on the substrate, LED light-emitting chips are further uniformly distributed on the specular reflection area, and fluorescent glue is filled among the LED light-emitting chips; the periphery of the mirror reflection area is provided with a BT resin surrounding ring, and the thickness of the BT resin surrounding ring is the same as that of the fluorescent glue. The BT resin surrounding ring is characterized in that the surface of the BT resin surrounding ring is irregular in gong shape, the LED light-emitting chip is packaged with a lens, the LED light-emitting chip further packaged with the lens can be integrated with a light-reflecting cup, and although the traditional COB light source is removed, the COB light source still has the problems of transverse heat conduction, heat dissipation capacity and poor service life of the COB light source due to the fact that silica gel, resin and other chemical materials are utilized to form the dam process flow.

Therefore, there is a need to provide a new structure of a light source module of COB LED to overcome the above drawbacks.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model aims to provide an exempt from box dam COB LED base plate. Exempt from box dam COB LED base plate and increased horizontal heat conduction of COB light source and heat-sinking capability to provide the life-span of COB light source.

In a first aspect, the utility model provides an exempt from box dam COB LED base plate, exempt from box dam COB LED base plate including first basic unit, insulating glue film, copper foil layer, printing ink layer, pure glue film and the second basic unit that stacks gradually.

COB is a Chip On Board, namely, a bare Chip is adhered On an interconnection substrate by conductive or non-conductive adhesive, and then the electrical connection of the bare Chip is realized by wire bonding, wherein the COB LED is called COB LED source and COB LED module. The packaging method has various shapes of packaging forms such as long strip type, square type, round type, annular type, triangular type, fan type and the like.

The utility model discloses a traditional COB light source utilization silica gel is got rid of to substrate pressfitting technology, chemical material box dam process flow such as resin, on traditional COB base plate, increase pressfitting metal or inorganic non-metallic material substrate again, reach the effect of double-deck or multilayer metal base or combination base pressfitting, when appearance design through upper substrate replaces traditional COB light source box dam operation, the horizontal heat conduction of COB light source and heat-sinking capability have been increased, thereby the life-span of COB light source is provided, and directly carry out the secondary grading to the COB light source through the appearance design of upper substrate, guarantee the light-emitting light type.

In the present invention, the thickness of the first base layer is 800-2000 μm, such as 800 μm, 820 μm, 840 μm, 860 μm, 880 μm, 900 μm, 920 μm, 940 μm, 960 μm, 980 μm, 1000 μm, 1200 μm, 1400 μm, 1600 μm, 2000 μm, etc.

In the present invention, the thickness of the second base layer is 700-2000 μm, and may be 700 μm, 720 μm, 740 μm, 760 μm, 780 μm, 800 μm, 820 μm, 840 μm, 860 μm, 880 μm, 900 μm, 1000 μm, 1200 μm, 1400 μm, 1600 μm, 1800 μm, 2000 μm, for example.

The present invention is directed to a liquid crystal display device, wherein the first base layer and the second base layer are independently selected from any one of a copper substrate, a ceramic substrate, a mirror aluminum substrate, and plastic.

In the present invention, the thickness of the insulating adhesive layer is 50 to 150 μm, and may be, for example, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, or the like.

The utility model discloses in, the insulating glue film is polyester insulating glue film and/or epoxy insulating glue film.

The above-mentioned insulating glue all can be bought by market, for example the utility model discloses a: polyester insulating glue (manufacturer: Niubaoli, brand 450A 80); epoxy insulating glue (manufacturer: Hongchang), etc.

In the present invention, the thickness of the copper foil layer is 20 to 50 μm, and may be, for example, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, or the like.

In the present invention, the thickness of the ink layer is 10 to 30 μm, and may be, for example, 10 μm, 12 μm, 14 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, 26 μm, 28 μm, 30 μm, or the like.

In the present invention, the ink layer is commercially available, and may be any one or a combination of at least two of WT05, LEW7S, and LB-1900W, for example.

In the present invention, the thickness of the pure glue layer is 10-30 μm, for example, 10 μm, 12 μm, 14 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, 26 μm, 28 μm, 30 μm, etc.

The pure glue layer is selected from any one of epoxy pure glue layer, organic silicon pure glue layer or polyurethane pure glue layer or the combination of at least two of the epoxy pure glue layer, the organic silicon pure glue layer and the polyurethane pure glue layer.

All of the above pure gums are commercially available, for example: epoxy (such as manufacturer: Langbowan, brand: NO. 1-6120; manufacturer: Shilin, brand: SL3029, etc.); silicones (e.g. Flori photoelectric materials, trade marks)

A05-01H、

A05-01M、

A05-01L, etc.); polyurethane (manufacturer: Niubaoli, brand 450A80, etc.).

In a second aspect, the present invention provides a method for manufacturing a dam-free COB LED substrate according to the first aspect, the method for manufacturing a dam-free COB LED substrate includes the following steps:

(1) coating the insulating glue on the first base layer, and then pressing at high temperature to form an insulating glue layer;

(2) after the copper foil is fixed on the insulating adhesive layer, forming a copper foil layer through high-temperature pressing;

(3) printing or spraying the printing ink on the copper foil layer, and then curing to form a printing ink layer;

(4) coating the pure glue on the ink layer, and then pressing at high temperature to form a pure glue layer;

(5) and fixing the second base layer on the pure glue layer, and then pressing at high temperature to form the second base layer.

Preferably, in the step (1), the step (2), the step (3) and the step (4), the temperature of the high-temperature pressing is 100-150 ℃, for example, 100 ℃, 110 ℃, 120 ℃, 130 ℃, 140 ℃, 150 ℃ and the like, and the time of the high-temperature pressing is 1.5-2h, for example, 1.5h, 1.6h, 1.7h, 1.8h, 1.9h, 2h and the like.

Preferably, the curing in step (3) is natural curing and/or baking curing.

Preferably, the temperature of the natural curing is 20-30 ℃, for example, 20 ℃, 22 ℃, 24 ℃, 26 ℃, 28 ℃, 30 ℃ and the like, and the time of the natural curing is 2-3h, for example, 2h, 2.2h, 2.4h, 2.6h, 2.8h, 3h and the like.

Preferably, the temperature of the baking curing is 100-110 ℃, such as 100 ℃, 102 ℃, 104 ℃, 106 ℃, 108 ℃, 110 ℃ and the like, and the time of the baking curing is 0.1-1h, such as 0.1h, 0.2h, 0.4h, 0.6h, 0.8h, 1h and the like.

In a third aspect, the present invention provides a dam-free COB LED substrate for use in manufacturing LED light sources according to the first aspect.

The utility model discloses the appearance design that utilizes the pressfitting substrate reserves the coating encapsulation area of COB processing procedure rear end to reach the preparation scheme who replaces traditional box dam technology. By utilizing different materials of the press-fit base material, the purpose of assisting transverse heat dissipation of the mixture of the fluorescent powder and the silica gel in the COB light-emitting area can be achieved. The shape and the thickness of the press-fit substrate also achieve the effect of carrying out secondary light distribution on the COB light emitting area, and the setting of the light emitting light type of the final COB LED is met.

Compared with the prior art, the utility model discloses following beneficial effect has:

(1) the utility model discloses a COB base plate's design and reach, get rid of traditional COB light source and need the process of box dam, the heat-conduction route of reinforcing COB light source and improve the light source life-span to and utilize the substrate to reach secondary grading effect.

(2) The transverse heat conduction capability of the dam-free COB LED substrate is expressed by a thermal imaging test, and is 60-65 ℃; the heat dissipation capacity is expressed by a thermal imaging test, and is 70-75 ℃; the service life of the light source is 10000-10200H; the light output pattern is represented by a remote device test, which is 100-110 degrees.

Drawings

Fig. 1 is a schematic structural view of a dam-free COB LED substrate according to the present invention;

the adhesive comprises a first base layer 1, an insulating adhesive layer 2, a copper foil layer 3, an ink layer 4, a pure adhesive layer 5 and a second base layer 6.

Detailed Description

The technical solution of the present invention will be further explained by the following embodiments. It should be understood by those skilled in the art that the described embodiments are merely provided to assist in understanding the present invention and should not be construed as specifically limiting the present invention.

Fig. 1 is the structural schematic diagram of exempting from box dam COB LED base plate, as shown in fig. 1, exempt from box dam COB LED base plate including range upon range of first basic unit 1, insulating glue film 2, copper foil layer 3, printing ink layer 4, pure glue film 5 and second basic unit 6 in proper order.

The sources of the components in the following examples are as follows: polyester insulating glue (manufacturer: Niubaoli, brand 450A80), epoxy insulating glue (manufacturer: Hongchang), epoxy pure glue (manufacturer: Shilin, brand: SL3029), silicone pure glue (Flori photoelectric material, brand)

A05-01H), polyurethane pure rubber (manufacturer: nebivorangii, designation 450a80, etc.).

Example 1

The embodiment provides a dam-free COB LED substrate, which comprises a first base layer, an insulating glue layer, a copper foil layer, an ink layer, a pure glue layer and a second base layer which are sequentially stacked;

the first base layer is a mirror aluminum substrate with the thickness of 1 layer 900 mu m; the insulating glue layer is 120 mu m thick (the insulating glue is polyester insulating glue); the thickness of the copper foil layer is 35 mu m; the ink layer was a 20 μm thick ink layer (the ink was WT 05); the pure glue layer is a pure glue layer with the thickness of 20 mu m (the pure glue is epoxy pure glue); the second base layer is a 1-layer mirror aluminum substrate with the thickness of 800 mu m.

Example 2

The embodiment provides a dam-free COB LED substrate, which comprises a first base layer, an insulating glue layer, a copper foil layer, an ink layer, a pure glue layer and a second base layer which are sequentially stacked;

the first base layer is a ceramic substrate with the thickness of 1 layer 900 mu m; the insulating glue layer is a 120-micron-thick insulating glue layer (the insulating glue is epoxy insulating glue); the thickness of the copper foil layer is 35 mu m; the ink layer was a 20 μm thick ink layer (the ink was LEW 7S); the pure glue layer is a pure glue layer with the thickness of 20 mu m (the pure glue is organic silicon pure glue); the second base layer is a 1-layer ceramic substrate with the thickness of 800 mu m.

Example 3

The embodiment provides a dam-free COB LED substrate, which comprises a first base layer, an insulating glue layer, a copper foil layer, an ink layer, a pure glue layer and a second base layer which are sequentially stacked;

the first base layer is a 1-layer 900 μm thick copper substrate; the insulating glue layer is a 120-micron-thick insulating glue layer (the insulating glue is organic silicon insulating glue); the thickness of the copper foil layer is 35 mu m; the ink layer is an ink layer with the thickness of 20 mu m (the ink is LB-1900W); the pure glue layer is a pure glue layer with the thickness of 20 mu m (the pure glue is polyurethane pure glue); the second base layer is a 1-layer 800-micron-thick copper substrate.

Example 4

The embodiment provides a dam-free COB LED substrate, which comprises a first base layer, an insulating glue layer, a copper foil layer, an ink layer, a pure glue layer and a second base layer which are sequentially stacked;

the first base layer is a 1-layer mirror aluminum substrate with the thickness of 1000 mu m; the insulating glue layer is a 100-micron thick insulating glue layer (the insulating glue is polyester insulating glue); the thickness of the copper foil layer is 30 μm; the ink layer was a 15 μm thick ink layer (the ink was WT 05); the pure glue layer is a pure glue layer with the thickness of 30 mu m (the pure glue is epoxy pure glue); the second base layer is a 1-layer mirror aluminum substrate with the thickness of 700 mu m.

Example 5

The embodiment provides a dam-free COB LED substrate, which comprises a first base layer, an insulating glue layer, a copper foil layer, an ink layer, a pure glue layer and a second base layer which are sequentially stacked;

the first base layer is a 1-layer mirror aluminum substrate with the thickness of 800 mu m; the insulating glue layer is 150 mu m thick (the insulating glue is polyester insulating glue); the thickness of the copper foil layer is 20 μm; the ink layer was a 25 μm thick ink layer (the ink was WT 05); the pure glue layer is a pure glue layer with the thickness of 10 mu m (the pure glue is epoxy pure glue); the second base layer is a 1-layer mirror aluminum substrate with the thickness of 900 mu m.

The preparation method of the dam-free COB LED substrate is the same as that of the embodiment 1.

Comparative example 1

This comparative example provides a COB LED base plate, and the difference with embodiment 1 lies in, does not contain first basic unit, contains the box dam, specifically is: aluminum base layer + insulating layer + copper foil layer + printing ink layer + silica gel dam layer.

Comparative example 2

This comparative example provides a COB LED base plate, and the difference with embodiment 1 lies in, does not contain the second basic unit, contains the box dam, specifically is aluminium base layer + insulating layer + copper foil layer + printing ink layer + the box dam layer of moulding plastics.

Performance testing

Each performance test was performed on the dam-free COB LED substrates provided in examples 1 to 5 and the COB LED substrates provided in comparative examples 1 to 2, and the specific test methods were as follows:

(1) transverse heat conductivity: performance in thermographic testing, reference UTi 220A;

(2) heat dissipation capacity: performance in thermographic testing, reference UTi 220A;

(3) light source life: performance in thermographic testing, reference UTi 220A;

(4) light-emitting type: the performance was tested at the remote facility, see HAAS-1200.

The specific test results are shown in table 1:

TABLE 1

Item	Transverse heat conducting capacity	Heat dissipating capability	Life of light source	Light emission pattern
					Example 1	112％	112％	10190	110
Example 2	109％	109％	10080	110
					Example 3	115％	115％	10200	110
Example 4	109％	109％	10180	110
					Example 5	110％	110％	10185	110
Comparative example 1	100％	100％	9505	120
					Comparative example 2	98％	98％	9820	120

As can be seen from the test data in Table 1, the transverse heat conduction capability of the dam-free COB LED substrate of the utility model is expressed by thermal imaging test, which is 60-65 ℃; the heat dissipation capacity is expressed by a thermal imaging test, and is 70-75 ℃; the service life of the light source is 10000-10200H; the light output pattern is represented by a remote device test, which is 100-110 degrees. This fully explains the utility model discloses a traditional COB light source is got rid of to substrate pressfitting technology utilizes silica gel, chemical material box dam process flow such as resin, on traditional COB base plate, increase pressfitting metal or inorganic non-metallic material substrate again, reach the effect of double-deck or multilayer metal base or combination base pressfitting, when the appearance design through upper substrate replaces traditional COB light source box dam operation, the horizontal heat conduction of COB light source and heat-sinking capability have been increased, thereby provide the life-span of COB light source, and directly carry out the secondary grading to the COB light source through the appearance design of upper substrate, guarantee the light type light-emitting.

The applicant states that the above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and those skilled in the art should understand that any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present invention are within the protection scope and the disclosure scope of the present invention.

Claims (8)

1. The utility model provides an exempt from box dam COB LED base plate, its characterized in that, exempt from box dam COB LED base plate including first basic unit, insulating glue film, copper foil layer, printing ink layer, pure glue film and the second basic unit that stacks gradually.

2. The dam-free COB LED substrate according to claim 1, wherein the thickness of the first base layer is 800-2000 μm.

3. The dam-free COB LED substrate according to claim 1, wherein the thickness of the second base layer is 700-2000 μm.

4. The dam-free COB LED substrate according to claim 1, wherein the first base layer and the second base layer are independently selected from any one of a copper substrate, a ceramic substrate, a mirror aluminum substrate and plastic.

5. The dam-free COB LED substrate according to claim 1, wherein the thickness of the adhesive insulating layer is 50-150 μm.

6. The dam-free COB LED substrate according to claim 1, wherein the copper foil layer has a thickness of 20-50 μm.

7. The dam-free COB LED substrate according to claim 1, wherein the ink layer has a thickness of 10-30 μm.

8. The dam-free COB LED substrate according to claim 1, wherein the thickness of the clear glue layer is 10-30 μm.

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