CN111933780A - Novel LED lamp bead six-pin support and internal circuit arrangement method thereof - Google Patents
Novel LED lamp bead six-pin support and internal circuit arrangement method thereof Download PDFInfo
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- CN111933780A CN111933780A CN202010955783.4A CN202010955783A CN111933780A CN 111933780 A CN111933780 A CN 111933780A CN 202010955783 A CN202010955783 A CN 202010955783A CN 111933780 A CN111933780 A CN 111933780A
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- 239000011324 bead Substances 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000003466 welding Methods 0.000 claims abstract description 65
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000011049 pearl Substances 0.000 description 8
- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a novel LED lamp bead six-pin support and an internal circuit arrangement method thereof, wherein the novel LED lamp bead six-pin support comprises the following steps: the middle part of the lamp holder body is hollowed to form a placing cavity with a cup-shaped structure; the lamp holder body is provided with a conducting plate at the lower end, the upper end surface of the conducting plate is coated with a conducting layer, and the conducting plate is provided with a separating section which separates the conducting layer so as to divide the conducting plate into six independent conducting areas; three conductive pins are respectively arranged on two sides of the conductive plate; a conductive pin is correspondingly and electrically connected with a conductive layer of an independent conductive area, the interior of the LED six-pin support is divided into modular areas in an area dividing mode, and in actual processing work, the LED control chip can be connected with the corresponding conductive pin only by being connected with the corresponding independent conductive area, so that wiring difficulty and welding stroke are effectively reduced, and the size of the LED support can be further reduced.
Description
Technical Field
The invention belongs to the technical field of LED lamp beads, and relates to a novel six-pin support of an LED lamp bead and an internal circuit arrangement method thereof.
Background
The LED lamp bead (Light Emitting Diode) is a solid semiconductor device, and can directly convert electric energy into Light energy; because the LED lamp beads are easy to damage under the action of external extrusion force, the LED lamp beads are generally placed on an LED support, and are protected by the LED support so as to meet the requirement of installation and protection of the LED lamp beads;
at present, when some polychrome LED lamp pearls are placed on the LED support, every chip all needs the bonding wire to be connected with the electrically conductive foot that corresponds on the LED support, consequently when polychrome LED lamp pearl installation, the circuit in the LED support distributes more, consequently for this user demand of adaptation, the volume of the polychrome LED support on the market all is on the large side at present, is difficult to realize the adaptation in the use of the less service environment in some spaces.
Disclosure of Invention
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a novel six foot supports of LED lamp pearl, includes: the middle part of the lamp holder body is hollowed to form a placing cavity with a cup-shaped structure;
the lamp holder body is provided with a conducting plate at the lower end, the upper end surface of the conducting plate is coated with a conducting layer, and the conducting plate is provided with a separating section which separates the conducting layer so as to divide the conducting plate into six independent conducting areas;
three conductive pins are respectively arranged on two sides of the conductive plate;
one conductive pin is electrically connected to the conductive layer of one independent conductive area.
As a further scheme of the invention: the six independent conductive areas are: the chip packaging structure comprises a first welding line area, a second welding line area, a third welding line area, a fourth welding line area, a fifth welding line area and a chip placing area;
the two conductive pins are respectively: the first positive electrode conductive pin, the second positive electrode conductive pin, the first input conductive pin, the second input conductive pin, the negative electrode conductive pin and the output conductive pin;
the first welding line area is connected with the first positive electrode conductive pin, the second welding line area is connected with the second input conductive pin, the third welding line area is connected with the output conductive pin, the fourth welding line area is connected with the negative electrode conductive pin, the fifth welding line area is connected with the first input conductive pin, and the chip placing area is connected with the second positive electrode conductive pin.
As a further scheme of the invention: the conductive layer is a silver layer.
As a further scheme of the invention: the lamp holder body is made of PCT plastic insulating materials.
The utility model provides a novel LED lamp pearl six-legged support internal line arranges method, this LED lamp pearl six-legged support includes: the method comprises the following steps: the lamp holder body, the middle part fretwork of lamp holder body forms the chamber of placing of cup type structure, and the lower extreme of lamp holder body is provided with the current conducting plate, and the upper end coating of current conducting plate has the conducting layer, is provided with on the current conducting plate to cut off the conducting layer thereby divide the current conducting plate into independent first bonding wire district, second bonding wire district, third bonding wire district, fourth bonding wire district, fifth bonding wire district, chip place the district, and the both sides side of current conducting plate is provided with respectively: the chip packaging structure comprises a first positive conductive pin, a second positive conductive pin, a first input conductive pin, a second input conductive pin, a negative conductive pin and an output conductive pin, wherein a first welding wire area is connected with the first positive conductive pin, a second welding wire area is connected with the second input conductive pin, a third welding wire area is connected with the output conductive pin, a fourth welding wire area is connected with the negative conductive pin, a fifth welding wire area is connected with the first input conductive pin, and a chip placing area is connected with the second positive conductive pin, and the internal circuit arrangement method comprises the following steps:
the method comprises the following steps: selecting and matching a lamp bead chip and an LED control chip for controlling the lamp bead chip according to use requirements, and then installing the LED control chip on a chip placing area;
step two: the control lamp bead chip is respectively connected with the first welding line area, the second welding line area, the third welding line area, the fourth welding line area, the fifth welding line area and the chip placement area through welding wires, so that the control lamp bead chip is respectively connected with the first positive conductive pin, the second positive conductive pin, the first input conductive pin, the second input conductive pin, the negative conductive pin and the output conductive pin, and meanwhile, the lamp bead chip is connected with the first welding line area, the second welding line area, the third welding line area, the fourth welding line area, the fifth welding line area and the chip placement area through wires according to actual processing requirements to complete chip placement and circuit arrangement on the LED lamp bead six-pin support.
The invention has the beneficial effects that: the LED six-pin support is internally divided into modularized areas in an area dividing mode, and in actual processing work, the LED control chip can be connected with the corresponding conductive pins only by being connected with the corresponding independent conductive areas, so that wiring difficulty and welding stroke are effectively reduced, and the size of the LED support can be further reduced.
Drawings
FIG. 1 is a schematic diagram of the present invention.
Fig. 2 is a schematic structural view of the placing chamber in the present invention.
Fig. 3 is a schematic view of an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it should be understood that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments, and it should be understood that the present application is not limited to the example embodiments disclosed and described herein. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The invention provides a novel LED lamp bead six-pin support, which comprises the following components in an embodiment of the invention, with reference to fig. 1-2: the lamp holder body 1 is characterized in that the middle part of the lamp holder body 1 is hollowed to form a placing cavity 5 with a cup-shaped structure;
the lamp holder body 1 is provided with a conductive plate 6 at the lower end thereof, a conductive layer (not shown) is coated on the upper end surface of the conductive plate 6, and the conductive plate 6 is provided with a separation section 4 for separating the conductive layer so as to divide the conductive plate 6 into six independent conductive areas 2;
three conductive pins 3 are respectively arranged on two sides of the conductive plate 6;
one conductive pin 3 is electrically connected to a conductive layer of one independent conductive area 2, respectively.
Further, the six independent conductive areas 2 are divided into: a first bonding wire area 25, a second bonding wire area 21, a third bonding wire area 24, a fourth bonding wire area 23, a fifth bonding wire area 22 and a chip placement area 26;
the two conductive pins 3 are respectively: a first positive electrode conductive pin 31, a second positive electrode conductive pin 32, a first input conductive pin 34, a second input conductive pin 33, a negative electrode conductive pin 35, and an output conductive pin 36;
the first bonding wire area 25 is connected with the first positive electrode conductive pin 31, the second bonding wire area 21 is connected with the second input conductive pin 33, the third bonding wire area 24 is connected with the output conductive pin 36, the fourth bonding wire area 23 is connected with the negative electrode conductive pin 35, the fifth bonding wire area 22 is connected with the first input conductive pin 34, and the chip placement area 26 is connected with the second positive electrode conductive pin 32;
as shown in fig. 3, in the actual production process, the LED control chip 7 and the optional bead chip 8 are disposed on the chip placement area 26; the LED control chip 7 is connected with the lamp bead chip 8 through a bonding wire;
the LED control chip 7 is connected to the first bonding wire area 25, the second bonding wire area 21, the third bonding wire area 24, the fourth bonding wire area 23, the fifth bonding wire area 22, and the chip placement area 26 through bonding wires, so as to connect to each conductive pin 3;
then the lamp bead chip 8 is connected with the independent conductive area 2 corresponding to the conductive pin 3 which needs to be connected with the lamp bead chip through a bonding wire according to the actual production requirement;
need not in the setting of the polychrome LED lamp pearl support of six feet and need all connect electrically conductive foot 3 with every bonding wire on the chip like traditional LED support to the degree of difficulty of effectual reduction wiring makes the volume of LED support can further reduce.
Furthermore, the conducting layer is a silver layer, and the conducting layer with the silver layer structure has better conducting efficiency and better heat conducting and radiating effects.
Further, the lamp holder body 1 is made of PCT plastic insulating materials, so that a good insulating effect is achieved, and meanwhile, the lamp holder body 11 made of the materials is lighter in weight and stronger in adaptability.
The utility model provides a novel LED lamp pearl six-legged support internal line arranges method, this LED lamp pearl six-legged support includes: the method comprises the following steps: the lamp holder body 1, the middle part fretwork of lamp holder body 1 forms the chamber 5 of placing of cup type structure, and the lower extreme of lamp holder body 1 is provided with current conducting plate 6, and the up end coating of current conducting plate 6 has the conducting layer, thereby is provided with on the current conducting plate 6 and cuts off the conducting layer and divide current conducting plate 6 into independent first bonding wire district 25, second bonding wire district 21, third bonding wire district 24, fourth bonding wire district 23, fifth bonding wire district 22, chip place the district 26, and the both sides side of current conducting plate 6 is provided with respectively: a first positive electrode conductive pin 31, a second positive electrode conductive pin 32, a first input conductive pin 34, a second input conductive pin 33, a negative electrode conductive pin 35, and an output conductive pin 36, wherein the first bonding wire area 25 is connected to the first positive electrode conductive pin 31, the second bonding wire area 21 is connected to the second input conductive pin 33, the third bonding wire area 24 is connected to the output conductive pin 36, the fourth bonding wire area 23 is connected to the negative electrode conductive pin 35, the fifth bonding wire area 22 is connected to the first input conductive pin 34, and the chip placement area 26 is connected to the second positive electrode conductive pin 32, and the internal circuit arrangement method thereof includes the steps of:
the method comprises the following steps: selecting and matching the lamp bead chip 8 and the LED control chip 7 for controlling the lamp bead chip 8 according to the use requirement, and then installing the LED control chip on the chip placing area 26;
step two: the control lamp bead chip 8 is respectively connected with the first welding line area 25, the second welding line area 21, the third welding line area 24, the fourth welding line area 23, the fifth welding line area 22 and the chip placement area 26 through welding wires, so that the control lamp bead chip 8 is respectively connected with the first positive conductive pin 31, the second positive conductive pin 32, the first input conductive pin 34, the second input conductive pin 33, the negative conductive pin 35 and the output conductive pin 36, and meanwhile, the lamp bead chip 8 is connected with the first welding line area 25, the second welding line area 21, the third welding line area 24, the fourth welding line area 23, the fifth welding line area 22 and the chip placement area 26 through wires according to actual processing requirements to complete chip placement and circuit arrangement on the LED lamp bead six-pin support.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (5)
1. The utility model provides a novel six foot supports of LED lamp pearl which characterized in that includes: the middle part of the lamp holder body is hollowed to form a placing cavity with a cup-shaped structure;
the lamp holder body is provided with a conducting plate at the lower end, the upper end surface of the conducting plate is coated with a conducting layer, and the conducting plate is provided with a separating section which separates the conducting layer so as to divide the conducting plate into six independent conducting areas;
three conductive pins are respectively arranged on two sides of the conductive plate;
one conductive pin is electrically connected to the conductive layer of one independent conductive area.
2. The novel LED lamp bead six-pin support is characterized in that the six independent conductive areas are as follows: the chip packaging structure comprises a first welding line area, a second welding line area, a third welding line area, a fourth welding line area, a fifth welding line area and a chip placing area;
the two conductive pins are respectively: the first positive electrode conductive pin, the second positive electrode conductive pin, the first input conductive pin, the second input conductive pin, the negative electrode conductive pin and the output conductive pin;
the first welding line area is connected with the first positive electrode conductive pin, the second welding line area is connected with the second input conductive pin, the third welding line area is connected with the output conductive pin, the fourth welding line area is connected with the negative electrode conductive pin, the fifth welding line area is connected with the first input conductive pin, and the chip placing area is connected with the second positive electrode conductive pin.
3. The novel LED lamp bead six-leg support is characterized in that the conducting layer is a silver layer.
4. The novel LED lamp bead six-leg support as claimed in claim 1, wherein the lamp holder body is made of PCT plastic insulating material.
5. The utility model provides a novel LED lamp pearl six-legged support internal line arranges method, this LED lamp pearl six-legged support includes: the method comprises the following steps: the lamp holder body, the middle part fretwork of lamp holder body forms the chamber of placing of cup type structure, and the lower extreme of lamp holder body is provided with the current conducting plate, and the upper end coating of current conducting plate has the conducting layer, is provided with on the current conducting plate to cut off the conducting layer thereby divide the current conducting plate into independent first bonding wire district, second bonding wire district, third bonding wire district, fourth bonding wire district, fifth bonding wire district, chip place the district, and the both sides side of current conducting plate is provided with respectively: the chip packaging structure comprises a first positive conductive pin, a second positive conductive pin, a first input conductive pin, a second input conductive pin, a negative conductive pin and an output conductive pin, wherein a first welding wire area is connected with the first positive conductive pin, a second welding wire area is connected with the second input conductive pin, a third welding wire area is connected with the output conductive pin, a fourth welding wire area is connected with the negative conductive pin, a fifth welding wire area is connected with the first input conductive pin, and a chip placing area is connected with the second positive conductive pin, and the internal circuit arrangement method is characterized by comprising the following steps:
the method comprises the following steps: selecting and matching a lamp bead chip and an LED control chip for controlling the lamp bead chip according to use requirements, and then installing the LED control chip on a chip placing area;
step two: the control lamp bead chip is respectively connected with the first welding line area, the second welding line area, the third welding line area, the fourth welding line area, the fifth welding line area and the chip placement area through welding wires, so that the control lamp bead chip is respectively connected with the first positive conductive pin, the second positive conductive pin, the first input conductive pin, the second input conductive pin, the negative conductive pin and the output conductive pin, and meanwhile, the lamp bead chip is connected with the first welding line area, the second welding line area, the third welding line area, the fourth welding line area, the fifth welding line area and the chip placement area through wires according to actual processing requirements to complete chip placement and circuit arrangement on the LED lamp bead six-pin support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010955783.4A CN111933780A (en) | 2020-09-11 | 2020-09-11 | Novel LED lamp bead six-pin support and internal circuit arrangement method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010955783.4A CN111933780A (en) | 2020-09-11 | 2020-09-11 | Novel LED lamp bead six-pin support and internal circuit arrangement method thereof |
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|---|---|
| CN111933780A true CN111933780A (en) | 2020-11-13 |
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| CN202010955783.4A Pending CN111933780A (en) | 2020-09-11 | 2020-09-11 | Novel LED lamp bead six-pin support and internal circuit arrangement method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4033549A1 (en) * | 2021-01-25 | 2022-07-27 | Chongyi Jingyi Lighting Products Co., Ltd. | Lamp bead support and light fixture |
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| CN212365986U (en) * | 2020-09-11 | 2021-01-15 | 东莞市天佑半导体有限公司 | Novel LED lamp bead six-foot support |
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2020
- 2020-09-11 CN CN202010955783.4A patent/CN111933780A/en active Pending
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| CN212365986U (en) * | 2020-09-11 | 2021-01-15 | 东莞市天佑半导体有限公司 | Novel LED lamp bead six-foot support |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4033549A1 (en) * | 2021-01-25 | 2022-07-27 | Chongyi Jingyi Lighting Products Co., Ltd. | Lamp bead support and light fixture |
| US11680698B2 (en) | 2021-01-25 | 2023-06-20 | Chongyi Jingyi Lighting Products Co., Ltd | Lamp bead support with opening between electrical contacts and light fixture having the same |
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