CN217883965U

CN217883965U - Flash memory packaging structure suitable for USB flash disk

Info

Publication number: CN217883965U
Application number: CN202221143330.2U
Authority: CN
Inventors: 张治强
Original assignee: Guangdong Changxing Semiconductor Technology Co ltd
Current assignee: Guangdong Changxing Semiconductor Technology Co ltd
Priority date: 2022-05-12
Filing date: 2022-05-12
Publication date: 2022-11-22
Anticipated expiration: 2032-05-12

Abstract

The utility model relates to a flash memory packaging structure field of USB flash disk especially relates to a flash memory packaging structure suitable for USB flash disk, including the PCB board, the PCB board is squarely, and the even fixed mounting in each side edge of PCB board has a plurality of groups edge pin PAD, and the central point of PCB board puts fixed mounting and has the flash memory wafer, and a plurality of groups PAD are installed to the top layer of PCB board and the edge of flash memory wafer, and are connected with the metal wire between PAD and the flash memory wafer of PCB board top layer. The utility model discloses a reasonable pin definition, interval and walking the line, the line of walking of deuterogamying the U mother board application end reaches impedance match, is applicable to all USB flash disks master controls, and unified standard, messenger's production are more convenient, reduce to slow down the material, and control cost, volume are littleer, use more extensively.

Description

Flash memory packaging structure suitable for USB flash disk

Technical Field

The utility model relates to an packaging structure technical field of USB flash disk especially relates to a flash memory packaging structure suitable for USB flash disk.

Background

At present, U disk drive schemes in the market are numerous, for example, a famous scheme merchant such as Anguo, kebang, sandi, yixian, SMI, and the like is available, and each scheme merchant pushes own flash memory package and respective pin definition, which brings great inconvenience to U disk production and troubles of circuit board design updating. Therefore, the flash memory packaging structure suitable for the U disk is provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the unable unified packaging standard in the market that exists among the prior art, because the DIE pin definition diverse that each scheme merchant is, lead to hardly solving wiring/interference scheduling problem, and the flash memory packaging structure who is applicable to the USB flash disk that proposes.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a flash memory packaging structure suitable for USB flash disk, includes the PCB board, the PCB board is squarely, and the even fixed mounting in each limit edge of PCB board has a plurality of groups edge pin PAD, and the central point of PCB board puts fixed mounting has the flash memory wafer, and a plurality of groups PAD are installed to the edge of PCB board top and flash memory wafer, and are connected with the metal wire between PAD and the flash memory wafer of PCB board top layer.

As a preferred technical scheme of this application, the length of side of PCB board is 4.5mm.

As a preferred technical scheme of this application, the distance between adjacent edge pin pad is 0.15mm.

As a preferred technical scheme of this application, the width of edge pin pad is 0.2mm, and the length is 0.4mm.

The beneficial effects of the utility model are that:

1. DIE of all U disk scheme manufacturers in the packaging market unifies pin definition of flash memory chips, reduces chip packaging material preparation, reduces material preparation for U disk production and manufacturing, and reduces design work caused by different flash memory packaging.

2. When a certain semi-finished product needs to update the scheme, the master control can be directly replaced, the efficiency is improved, and the flash memory packaging can also be applied to UDP packaging.

This encapsulation is through reasonable pin definition, interval and line, and the line of walking of the USB flash disk mother board application end of deuterogamying reaches impedance match, is applicable to all USB flash disks master controls, and unified standard, messenger's production are more convenient, reduce to stay slow material, and control cost, volume are littleer, use more extensively.

Drawings

Fig. 1 is a schematic top-layer structure diagram of a flash memory package structure suitable for a usb disk according to the present invention;

fig. 2 is a schematic bottom structure diagram of a flash memory package structure suitable for a usb disk.

In the figure: PCB board 1, marginal pin PAD 2, PAD3, flash memory wafer 4, metal wire 5.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-2, a flash memory packaging structure suitable for a USB flash disk, including PCB board 1, PCB board 1 is square, and the even fixed mounting in each side edge of PCB board 1 has a plurality of edge pin PADs 2 of group, and the central point of PCB board 1 puts fixed mounting to have flash memory wafer 4, and a plurality of PAD3 of group are installed to the edge of PCB board 1 top layer and flash memory wafer 4, and are connected with metal wire 5 between PAD3 and the flash memory wafer 4 of PCB board 1 top layer, and metal wire 5 is alloy line or gold thread.

Further, the side length of the PCB board 1 is 4.5mm.

Further, the distance between adjacent edge pin pads 2 is 0.15mm.

Further, the edge pin pad 2 has a width of 0.2mm and a length of 0.4mm.

The working process is as follows: this equipment is at the in-process of actual production, at first through encapsulating PCB board 1, then carry out solid brilliant operation, be about to flash memory wafer 4 fixed to PCB board 1 on, then bind the line, realize promptly that the electrical apparatus between flash memory wafer 4 and the circuit board is connected, then realize the plastic envelope shaping operation through the mould pressing, cut processing to it after that, will put in order the board segmentation to single chip, wash it, detach unnecessary impurity, then carry out performance test and appearance inspection to the finished product after wasing, put in storage to the certified products at last and handle.

Finally, it should be noted that: in the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate the directions or positional relationships based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a flash memory packaging structure suitable for USB flash disk, includes PCB board (1), its characterized in that, PCB board (1) is squarely, and the even fixed mounting in each side edge of PCB board (1) has a plurality of groups edge pin PAD (2), and the central point of PCB board (1) puts fixed mounting and has flash memory wafer (4), and a plurality of groups PAD (3) are installed to the top layer of PCB board (1) and the edge of flash memory wafer (4), and are connected with between PAD (3) and the flash memory wafer (4) of PCB board (1) top layer metal wire (5).

2. The flash memory packaging structure suitable for the USB flash disk of claim 1, wherein the PCB board (1) has a side length of 4.5mm.

3. The flash memory packaging structure suitable for the U disk of claim 1, wherein the distance between adjacent edge pin pads (2) is 0.15mm.

4. The flash memory packaging structure suitable for the U disk of claim 1, wherein the width of the edge pin pad (2) is 0.2mm, and the length is 0.4mm.