CN216250638U

CN216250638U - Defect detector for semiconductor wafer detection

Info

Publication number: CN216250638U
Application number: CN202122031410.0U
Authority: CN
Inventors: 陈冠铭
Original assignee: Individual
Current assignee: Shandong Shengsuan Software Technology Co ltd
Priority date: 2021-08-26
Filing date: 2021-08-26
Publication date: 2022-04-08
Anticipated expiration: 2031-08-26

Abstract

The utility model discloses a defect detector for detecting a semiconductor wafer, which comprises an installation seat, wherein an upright post is fixedly arranged at the center of the installation seat, the top of the upright post is movably connected with a placing disc through a positioning pin, a motor is fixedly arranged at the top of the placing disc, a rotating disc is fixedly arranged on an output shaft of the motor, accommodating rods are fixedly arranged on two sides of the rotating disc, and an installation column is fixedly arranged at the center of the back of the installation seat. The mounting seat is arranged to mount the mounting column, the mounting column is arranged to mount the detection lamp, the detection lamp is arranged to detect the wafer, the air cylinder is arranged to adjust the placing disc, and the motor is arranged to drive the rotary disc.

Description

Defect detector for semiconductor wafer detection

Technical Field

The utility model relates to the technical field of wafers, in particular to a defect detector for detecting a semiconductor wafer.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and then doped into a silicon crystal seed crystal, the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely a wafer, and the current domestic wafer production line mainly takes 8 inches and 12 inches.

The main processing modes of the wafer are sheet processing and batch processing, i.e. 1 or more wafers are processed simultaneously. With the smaller and smaller characteristic size of a semiconductor, the processing and measuring equipment is more and more advanced, so that the wafer processing has new data characteristics, the defects of the production batch of the wafer need to be subjected to spot inspection in the wafer production process, the conventional detecting equipment is inconvenient for angle adjustment, and the spot inspection efficiency is greatly reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a defect detector for detecting a semiconductor wafer, which has the advantages of good detection effect and convenience in adjustment, and solves the problems that the defects of a production batch of the wafer need to be subjected to spot detection in the production process of the wafer, the conventional detection equipment is inconvenient to adjust the angle, and the spot detection efficiency is greatly reduced.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a semiconductor wafer detects uses defect detecting machine, includes the mount pad, the center department fixed mounting of mount pad has the stand, there is the dish at the top of stand through locating pin swing joint, the top fixed mounting who places the dish has the motor, the output shaft fixed mounting of motor has the carousel, the equal fixed mounting in both sides of carousel has the pole of holding, the center department fixed mounting at the mount pad back has the erection column, the positive fixed mounting of erection column has the detection lamp, the left side fixed mounting at mount pad top has the cylinder, the top fixed mounting of cylinder has first activity hinge, logical groove has been seted up to the inside of mount pad, the inside that leads to the groove is provided with the carriage release lever, hold the one side that the pole is close to relatively and seted up the second spout, the inside sliding connection of second spout has the second slider.

Preferably, a second movable hinge is fixedly mounted on the left side of the bottom of the placing plate, a first adjusting rod is movably connected to the bottom of the second movable hinge, and the bottom of the first adjusting rod is movably connected with the top of the first movable hinge.

Preferably, a third movable hinge is fixedly mounted on the right side of the bottom of the placing plate, a second adjusting rod is movably connected to the bottom of the third movable hinge, and a fourth movable hinge is movably connected to the bottom of the second adjusting rod.

Preferably, the bottom of the fourth movable hinge is fixedly connected with the top of the moving rod, and first sliding grooves are formed in the mounting seat and located on two sides of the through groove.

Preferably, the first sliding block is connected to the inside of the first sliding groove in a sliding manner, and one side, close to the first sliding block, of the first sliding block is fixedly connected to two sides of the moving rod.

Preferably, a clamping block is fixedly mounted on one side, close to the second sliding block, of the second sliding groove, and a spring is fixedly mounted inside the second sliding groove and located at the top of the second sliding block.

Compared with the prior art, the utility model has the following beneficial effects:

1. the mounting seat is arranged to mount the mounting column, the mounting column is arranged to mount the detection lamp, the detection lamp is arranged to detect the wafer, the air cylinder is arranged to adjust the placing disc, the motor is arranged to drive the rotary disc, the rotary disc is arranged to accommodate the wafer, the through groove is arranged to accommodate the moving rod, the moving rod is arranged to adjust the other side of the placing disc, and meanwhile the problems that in the wafer production process, the defects of the production batch of the wafer need to be subjected to spot inspection, the conventional detection equipment is inconvenient in angle adjustment, and the spot inspection efficiency is greatly reduced are solved.

2. According to the utility model, the first sliding groove is arranged to limit the first sliding block, so that the first sliding block is prevented from shaking in the moving process, the first sliding block is arranged to limit the moving rod, the moving rod is prevented from shaking in the moving process, the second sliding block is arranged to limit the clamping block, so that the clamping block is prevented from shaking in the moving process, the clamping block is arranged to limit the wafer, and the spring is arranged to limit the second sliding block.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic cross-sectional view of the present invention;

fig. 3 is a partial enlarged view of the utility model at a in fig. 2.

In the figure: 1. a mounting seat; 2. a travel bar; 3. a cylinder; 4. a first movable hinge; 5. a second movable hinge; 6. a turntable; 7. an accommodating rod; 8. a clamping block; 9. mounting a column; 10. detecting a light; 11. a motor; 12. placing a tray; 13. a third movable hinge; 14. a column; 15. a fourth movable hinge; 16. a through groove; 17. a first chute; 18. a first slider; 19. a second chute; 20. a spring; 21. and a second slider.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description herein, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings to facilitate the description of the patent and to simplify the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be considered limiting of the patent. In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can, for example, be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Referring to fig. 1-3, a defect detector for semiconductor wafer inspection comprises a mounting base 1, a column 14 is fixedly installed at the center of the mounting base 1, the top of the column 14 is movably connected with a placing disc 12 through a positioning pin, a motor 11 is fixedly installed at the top of the placing disc 12, a turntable 6 is fixedly installed at the output shaft of the motor 11, accommodating rods 7 are fixedly installed at both sides of the turntable 6, a mounting column 9 is fixedly installed at the center of the back of the mounting base 1, a detecting lamp 10 is fixedly installed at the front of the mounting column 9, an air cylinder 3 is fixedly installed at the left side of the top of the mounting base 1, a first movable hinge 4 is fixedly installed at the top of the air cylinder 3, a through groove 16 is formed in the mounting base 1, a moving rod 2 is arranged in the through groove 16, a second sliding groove 19 is formed in one side, which the accommodating rod 7 is relatively close to, and a second sliding block 21 is connected in the second sliding groove 19, the mounting seat 1 is arranged to mount the mounting post 9, the mounting post 9 is arranged to mount the detection lamp 10, the detection lamp 10 is arranged to detect the wafer, the air cylinder 3 is arranged to adjust the placing disc 12, the motor 11 is arranged to drive the rotary disc 6, the rotary disc 6 is arranged to hold the wafer, the through groove 16 is arranged to hold the moving rod 2, the moving rod 2 is arranged to adjust the other side of the placing disc 12, the left side of the bottom of the placing disc 12 is fixedly provided with the second movable hinge 5, the bottom of the second movable hinge 5 is movably connected with the first adjusting rod, the bottom of the first adjusting rod is movably connected with the top of the first movable hinge 4, the right side of the bottom of the placing disc 12 is fixedly provided with the third movable hinge 13, the bottom of the third movable hinge 13 is movably connected with the second adjusting rod, and the bottom of the second adjusting rod is movably connected with the fourth movable hinge 15, the bottom of the fourth movable hinge 15 is fixedly connected with the top of the moving rod 2, the first sliding grooves 17 are respectively arranged in the mounting seat 1 and positioned at two sides of the through groove 16, the first sliding block 18 is limited by arranging the first sliding grooves 17, the first sliding block 18 is prevented from shaking in the moving process, the first sliding block 18 is slidably connected in the first sliding grooves 17, one side, close to the first sliding block 18, is fixedly connected with two sides of the moving rod 2, the moving rod 2 is limited by arranging the first sliding block 18, the moving rod 2 is prevented from shaking in the moving process, the clamping block 8 is fixedly arranged at one side, close to the second sliding block 21, in the second sliding groove 19, the spring 20 is fixedly arranged at the top of the second sliding block 21, the clamping block 8 is limited by arranging the second sliding block 21, the clamping block 8 is prevented from shaking in the moving process, and the wafer is limited by arranging the clamping block 8, the second slider 21 is limited by the spring 20.

During the use, will detect lamp 10 and open, put the wafer on the surface of carousel 6 simultaneously, loosen fixture block 8, under spring 20's effect, make second slider 21 drive fixture block 8 downstream, thereby fix the wafer, with cylinder 3 rebound, drive through cylinder 3 and place a set 12 rebound, thereby make carriage release lever 2 drive first slider 18 rebound, adjust the angle of placing set 12, open motor 11 at last, it rotates to place a set 12 through motor 11 drive, thereby detect the wafer.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A defect detector for detecting a semiconductor wafer comprises a mounting seat (1), and is characterized in that: the mounting structure is characterized in that a stand column (14) is fixedly mounted at the center of the mounting seat (1), a placing disc (12) is movably connected to the top of the stand column (14) through a positioning pin, a motor (11) is fixedly mounted at the top of the placing disc (12), a turntable (6) is fixedly mounted at an output shaft of the motor (11), accommodating rods (7) are fixedly mounted on two sides of the turntable (6), a mounting column (9) is fixedly mounted at the center of the back of the mounting seat (1), a detection lamp (10) is fixedly mounted on the front of the mounting column (9), a cylinder (3) is fixedly mounted on the left side of the top of the mounting seat (1), a first movable hinge (4) is fixedly mounted at the top of the cylinder (3), a through groove (16) is formed in the mounting seat (1), a moving rod (2) is arranged in the through groove (16), and a second sliding groove (19) is formed in one side, close to the accommodating rods (7), the inside of the second sliding groove (19) is connected with a second sliding block (21) in a sliding manner.

2. The defect detector as claimed in claim 1, wherein: a second movable hinge (5) is fixedly mounted on the left side of the bottom of the placing disc (12), a first adjusting rod is movably connected to the bottom of the second movable hinge (5), and the bottom of the first adjusting rod is movably connected with the top of the first movable hinge (4).

3. The defect detector as claimed in claim 1, wherein: a third movable hinge (13) is fixedly mounted on the right side of the bottom of the placing disc (12), a second adjusting rod is movably connected to the bottom of the third movable hinge (13), and a fourth movable hinge (15) is movably connected to the bottom of the second adjusting rod.

4. The defect detector as claimed in claim 3, wherein: the bottom of the fourth movable hinge (15) is fixedly connected with the top of the moving rod (2), and first sliding grooves (17) are formed in the mounting seat (1) and located on two sides of the through groove (16).

5. The defect detector as claimed in claim 4, wherein: the inner part of the first sliding groove (17) is connected with a first sliding block (18) in a sliding mode, and one side, close to the first sliding block (18), of the first sliding block is fixedly connected with the two sides of the moving rod (2).

6. The defect detector as claimed in claim 1, wherein: one side that second slider (21) is close to relatively has fixture block (8), the inside of second spout (19) and the top fixed mounting who is located second slider (21) have spring (20).