CN218069784U - Positioning device for detecting thickness precision of semiconductor wafer - Google Patents
Positioning device for detecting thickness precision of semiconductor wafer Download PDFInfo
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- CN218069784U CN218069784U CN202220128703.2U CN202220128703U CN218069784U CN 218069784 U CN218069784 U CN 218069784U CN 202220128703 U CN202220128703 U CN 202220128703U CN 218069784 U CN218069784 U CN 218069784U
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Abstract
The utility model belongs to the technical field of the semiconductor wafer technique and specifically relates to a positioner is used in detection of semiconductor wafer thickness precision, which comprises a supporting plate, the wafer body, the top side of backup pad is equipped with examines test table, the top side of examining test table is equipped with the revolving stage, the bottom side of backup pad is equipped with the dismouting board, the top side of revolving stage is equipped with and presss from both sides tight frame, the one side of pressing from both sides tight frame is equipped with a plurality of springs, the top side of revolving stage is equipped with the guide block respectively, spacing, the top side of examining test table is equipped with two gibs, the top side of examining test table is equipped with electric putter one, the fixed push pedal that is equipped with of axle head of electric putter one, push pedal sliding connection is in one side of gib block, the top side of dismouting board is equipped with the motor, the fixed controller that is equipped with in one side of backup pad, this positioner is used in detection of semiconductor wafer thickness precision, positioning stability is high, convenient operation is swift, thickness detects the precision, overall stability is high.
Description
Technical Field
The utility model relates to a semiconductor wafer technical field especially relates to a semiconductor wafer thickness positioner for precision detection.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and then doped into a silicon crystal seed crystal, the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal bar is ground, polished and sliced to form a silicon wafer, namely the wafer, the domestic wafer production line takes the main processing mode of 8 inches and 12 inches as wafers as wafer processing and batch processing, namely 1 or more wafers are processed simultaneously, along with the fact that the characteristic size of a semiconductor is smaller and smaller, the processing and measuring equipment is more and more advanced, new data characteristics appear in wafer processing, meanwhile, the characteristic size is reduced, the influence of the number of particles in the air on the quality and reliability of the processed wafer is increased during wafer processing, and along with the improvement of cleanness, the number of the particles also has new data characteristics.
A positioning device is needed when the thickness of a wafer is detected, and the existing positioning device is simple in structure, low in working efficiency and poor in positioning stability.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving and having the wafer among the prior art and need use positioner when carrying out thickness detection, current positioner, simple structure, work efficiency is low, the poor shortcoming of positioning stability, and the semiconductor wafer thickness positioner for precision detection that proposes.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a semiconductor wafer thickness positioner for precision measurement, includes backup pad, wafer body, the cavity structure that is of backup pad sets up, the fixed detection platform that is equipped with in top side of backup pad, the top side of detecting the platform is rotated to connect and is equipped with the revolving stage, the detachable connection in bottom side of backup pad is equipped with the dismouting board, the top side of revolving stage is equipped with a plurality of tight frames that press from both sides through spout sliding connection, the fixed a plurality of springs that are equipped with in one side of pressing from both sides tight frame, one side of spring is inconsistent with one side of revolving stage, the top side of revolving stage is fixed guide block, spacing respectively, the parallel symmetry in top side of detecting the platform is fixed and is equipped with two gibs, the detachable connection in top side of detecting the platform is equipped with electric putter one, the fixed push pedal that is equipped with of axle head of electric putter one, push pedal sliding connection is in one side of gib, the top side of dismouting board is equipped with the motor, the axle head of motor is connected with the bottom side of revolving stage, the fixed controller that is equipped with one side of backup pad.
Preferably, the top side of the rotating table is detachably connected with a second electric push rod, a pressing plate is fixedly arranged at the shaft end of the second electric push rod, and one side of the pressing plate is abutted to one side of the clamping frame.
Preferably, a groove is fixedly formed in the top side of the clamping frame, a support frame is fixedly arranged on the top side of the detection table, and the bottom side of the support frame is detachably connected with a laser thickness gauge.
Preferably, a conveying belt is fixedly arranged on one side of the detection table, and a wedge-shaped material guide plate is fixedly arranged on one side, close to the guide strip, of the conveying belt.
Preferably, a plurality of filling strips are fixedly arranged on the top side of the rotating platform.
Preferably, a plurality of supporting seats are fixedly arranged at the bottom side of the supporting plate.
The utility model provides a pair of semiconductor wafer thickness positioner for precision detection, beneficial effect lies in: through setting up the revolving stage, pressing from both sides tight frame, spring, guide block, spacing, gib block, electric putter one, push pedal, provide a high-efficient thickness precision detection, the high-efficient work of multistation, this semiconductor wafer thickness positioner for precision detection, positional stability is high, and convenient operation is swift, and thickness detection precision is high, and overall stability is high.
Drawings
Fig. 1 is a schematic view of a front axial-measurement structure of a positioning device for detecting thickness accuracy of a semiconductor wafer according to the present invention;
fig. 2 is a schematic view of a bottom surface axial measurement structure of a positioning device for detecting thickness accuracy of a semiconductor wafer according to the present invention;
fig. 3 is a schematic view of a front cut axial measurement structure of a positioning device for detecting thickness accuracy of a semiconductor wafer according to the present invention;
fig. 4 is the utility model provides a semiconductor wafer thickness precision detects with positioner's front dissection axis survey in A's the schematic structure.
In the figure: the device comprises a supporting plate 1, a detection table 2, a rotating table 3, a disassembly plate 4, a clamping frame 5, a spring 6, a guide block 7, a limiting strip 8, a guide strip 9, a first electric push rod 10, a push plate 11, a conveying belt 12, a controller 13, a second electric push rod 14, a press plate 15, a support frame 16, a laser thickness gauge 17, a wafer body 18, a wedge-shaped material guide plate 19, a filling strip 20, a support seat 21 and a motor 22.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-4, a semiconductor wafer thickness precision detects and uses positioner, including backup pad 1, wafer body 18, backup pad 1 is the cavity structure setting, the fixed detection platform 2 that is equipped with in top side of backup pad 1, the top side of detecting platform 2 rotates to connect and is equipped with revolving stage 3, the detachable connection of bottom side of backup pad 1 is equipped with dismouting board 4, the top side of revolving stage 3 is equipped with a plurality of clamping frame 5 through spout sliding connection, the fixed a plurality of springs 6 that are equipped with in one side of clamping frame 5, one side of spring 6 is inconsistent with one side of revolving stage 3, the top side of revolving stage 3 is fixed respectively is equipped with guide block 7, spacing strip 8, the parallel symmetry in top side of detecting platform 2 is equipped with two guide strips 9, the detachable connection in top side of detecting platform 2 is equipped with electric putter one 10, the axle head of electric putter one 10 is fixed is equipped with push pedal 11, push pedal 11 sliding connection is in one side of guide strip 9, the top side of dismouting board 4 is equipped with motor 22, the axle head of motor 22 is connected with the bottom side of revolving stage 3, one side of backup pad 1 is fixed is equipped with controller 13.
In order to provide a limiting and stabilizing function for the clamping frame 5, the top side of the rotating platform 3 is detachably connected with a second electric push rod 14, the shaft end of the second electric push rod 14 is fixedly provided with a pressing plate 15, and one side of the pressing plate 15 is abutted to one side of the clamping frame 5.
In order to improve the thickness detection precision of the wafer, a groove is fixedly arranged on the top side of the clamping frame 5, a support frame 16 is fixedly arranged on the top side of the detection table 2, and a laser thickness gauge 17 is detachably connected and arranged on the bottom side of the support frame 16.
In order to facilitate feeding, a conveyor belt 12 is fixedly arranged on one side of the detection table 2, and a wedge-shaped material guide plate 19 is fixedly arranged on one side of the conveyor belt 12 close to the guide strip 9.
In order to prevent the wafer body 18 from sliding laterally at the guide groove of the clamping frame 5 when it is limited, a plurality of filler strips 20 are fixed on the top side of the turntable 3.
In order to improve the stability of the supporting plate 1, a plurality of supporting seats 21 are fixedly arranged at the bottom side of the supporting plate 1.
The utility model discloses, through setting up revolving stage 3, press from both sides tight frame 5, spring 6, guide block 7, spacing 8, gib block 9, electric putter 10, push pedal 11, in use, wafer body 18 drops between two gib blocks 9, then promote push pedal 11 by electric putter 10, push into revolving stage 3 with wafer body 18 on, then press from both sides tight frame 5 by wafer body 18 self extrusion, it is spacing to utilize the resilience force of spring 6 to carry out wafer body 18, guide block 7 provides the effect of a direction, spacing 8 can avoid wafer body 18 to pass and press from both sides tight frame 5, provide a high-efficient thickness precision detection, the high-efficient work of multistation, this semiconductor wafer thickness positioner for precision detection, positional stability is high, convenient operation is swift, thickness detects the precision height, overall stability is high.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. A positioning device for detecting thickness accuracy of a semiconductor wafer comprises a supporting plate (1) and a wafer body (18), it is characterized in that the supporting plate (1) is arranged in a cavity structure, the top side of the supporting plate (1) is fixedly provided with a detection platform (2), the top side of the detection table (2) is rotatably connected with a rotating table (3), the bottom side of the supporting plate (1) is detachably connected with a detachable plate (4), the top side of the rotating platform (3) is provided with a plurality of clamping frames (5) through sliding connection of sliding chutes, a plurality of springs (6) are fixedly arranged on one side of the clamping frame (5), one side of the spring (6) is pressed against one side of the rotating platform (3), the top side of the rotating platform (3) is respectively and fixedly provided with a guide block (7) and a limit strip (8), two guide strips (9) are symmetrically and fixedly arranged on the top side of the detection platform (2) in parallel, the top side of the detection platform (2) is detachably connected with an electric push rod I (10), a push plate (11) is fixedly arranged at the shaft end of the electric push rod I (10), the push plate (11) is connected with one side of the guide bar (9) in a sliding way, a motor (22) is arranged on the top side of the dismounting plate (4), the shaft end of the motor (22) is connected with the bottom side of the rotating platform (3), and a controller (13) is fixedly arranged on one side of the supporting plate (1).
2. The positioning device for detecting the thickness precision of the semiconductor wafer as claimed in claim 1, wherein a second electric push rod (14) is detachably connected to the top side of the rotating platform (3), a pressing plate (15) is fixedly arranged at the shaft end of the second electric push rod (14), and one side of the pressing plate (15) is abutted against one side of the clamping frame (5).
3. The positioning device for detecting the thickness precision of the semiconductor wafer as claimed in claim 1, wherein a groove is fixedly arranged on the top side of the clamping frame (5), a support frame (16) is fixedly arranged on the top side of the detection platform (2), and a laser thickness gauge (17) is detachably connected to the bottom side of the support frame (16).
4. The positioning device for detecting the thickness accuracy of a semiconductor wafer according to claim 1, wherein a conveyor belt (12) is fixedly arranged on one side of the detection table (2), and a wedge-shaped material guiding plate (19) is fixedly arranged on one side of the conveyor belt (12) close to the guiding bar (9).
5. The positioning apparatus for detecting the thickness accuracy of a semiconductor wafer as claimed in claim 1, wherein a plurality of filler bars (20) are fixedly arranged on the top side of the rotary table (3).
6. The positioning apparatus for detecting the thickness accuracy of a semiconductor wafer as claimed in claim 1, wherein a plurality of supporting seats (21) are fixedly disposed on the bottom side of the supporting plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220128703.2U CN218069784U (en) | 2022-01-18 | 2022-01-18 | Positioning device for detecting thickness precision of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220128703.2U CN218069784U (en) | 2022-01-18 | 2022-01-18 | Positioning device for detecting thickness precision of semiconductor wafer |
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| Publication Number | Publication Date |
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| CN218069784U true CN218069784U (en) | 2022-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220128703.2U Active CN218069784U (en) | 2022-01-18 | 2022-01-18 | Positioning device for detecting thickness precision of semiconductor wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153758A (en) * | 2023-10-30 | 2023-12-01 | 江苏希太芯科技有限公司 | Positioning structure for semiconductor wafer thickness detector |
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2022
- 2022-01-18 CN CN202220128703.2U patent/CN218069784U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153758A (en) * | 2023-10-30 | 2023-12-01 | 江苏希太芯科技有限公司 | Positioning structure for semiconductor wafer thickness detector |
| CN117153758B (en) * | 2023-10-30 | 2023-12-22 | 江苏希太芯科技有限公司 | Positioning structure for semiconductor wafer thickness detector |
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