CN220818871U

CN220818871U - Semiconductor wafer thickness detection device

Info

Publication number: CN220818871U
Application number: CN202322442841.5U
Authority: CN
Inventors: 安璐; 廖齐文; 杨世勇
Original assignee: Sichuan Jueyuanxiang Semiconductor Technology Co ltd
Current assignee: Sichuan Jueyuanxiang Semiconductor Technology Co ltd
Priority date: 2023-09-06
Filing date: 2023-09-06
Publication date: 2024-04-19
Anticipated expiration: 2033-09-06

Abstract

The utility model relates to the technical field of thickness detection devices, in particular to a semiconductor wafer thickness detection device which comprises a detection table, wherein a chute is formed in the top of the detection table, a cavity is formed in an inner cavity of the detection table, and a first motor is fixedly arranged at the bottom of the cavity. According to the utility model, through the matching arrangement among the structures such as the detection head, the first contact, the first bulb, the second contact, the second bulb, the contact and the like, the wafer body is placed under the detection head, the detection head can detect all parts of the wafer body, when the contact is positioned between the first contact and the second contact, the wafer body belongs to qualified products, when the contact contacts the second contact or the first contact, the first bulb and the second bulb emit light, so that a detector is reminded of unqualified wafer bodies, when the first bulb is on, the thickness of the wafer body is indicated to be too large, when the second bulb is on, the thickness of the wafer body is indicated to be relatively low, and the wafer body can be distinguished through the first bulb and the second bulb, so that the wafer body can be conveniently processed later.

Description

Semiconductor wafer thickness detection device

Technical Field

The utility model relates to the technical field of thickness detection devices, in particular to a semiconductor wafer thickness detection device.

Background

Semiconductors refer to materials with conductivity between conductors and insulators at normal temperature, and are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, and the like, and in the manufacturing process of semiconductors, substrates need to be ground to a specified thickness, and then chips are separated.

The detection device of current semiconductor wafer thickness, as described in the chinese patent of bulletin number CN216694746U, the device comprises a base plate, the top central part of bottom plate is with place box fixed connection, place the inner wall bottom of box and a plurality of be linear array form equidistant reset spring's one end fixed connection, the other end and the guard plate fixed connection of a plurality of reset spring, one side fixedly connected with measuring strip of guard plate, the measuring strip extends to outside and with measuring rod fixed connection through the sliding tray of seting up on the bottom plate lateral wall, the top and the sleeve joint pole fixed connection of measuring rod, pass through connecting rod and magnifying glass fixed connection on the outer wall of sleeve joint pole. The device can be through being provided with subassemblies such as reset spring, can be when carrying out thickness measurement to the wafer through measuring stick and magnifying glass cooperation use reach the audio-visual wafer thickness of seeing of messenger's inspector, can prevent the damage that hard collision caused the crystal moreover, guarantees its life.

With respect to the above related art, the inventor considers that the above detection device can only detect the entire thickness of the wafer, and cannot detect whether the local thickness of the wafer is qualified, which is not beneficial to the correction of the wafer, and has weak practicability.

Disclosure of utility model

In order to solve the problems that the detection device can only detect the whole thickness of a wafer, can not detect whether the local thickness of the wafer is qualified, is unfavorable for rectifying and changing the wafer and has weak practicability, the application provides a semiconductor wafer thickness detection device.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor wafer thickness detection device, includes the detection platform, the spout has been seted up at the top of detection platform, the cavity has been seted up to the inner chamber of detection platform, the bottom of cavity is fixed and is equipped with first motor, the output shaft fixedly connected with pivot of first motor, the outer wall threaded connection of pivot has the slider, and the bottom laminating of slider and cavity, the top of slider rotates and is connected with the bracing piece, the outer wall fixedly connected with horizontal seat of bracing piece, the top of bracing piece outer wall is fixed and is equipped with the turbine, the second motor after the top installation of horizontal seat, the output shaft fixedly connected with worm of second motor, the one end rotation that the worm kept away from the second motor is connected with the supporting shoe, and the bottom of supporting shoe and the top fixedly connected with of horizontal seat, the one end that the bracing piece was kept away from to the horizontal seat wears to be equipped with the inspection pole, the outer wall fixedly provided with pull rod of inspection pole, the top fixedly is equipped with inspection head, the outer wall fixedly provided with contact of inspection pole, the bottom fixedly connected with mounting panel of horizontal seat, one side fixedly connected with first bulb of first bulb, the first bulb fixedly connected with mounting panel of first bulb below the first bulb is located the first bulb fixedly connected with mounting panel of opposite side.

Optionally, a sucking disc is fixedly arranged at the bottom of the detection table.

Optionally, the fixed fixing base that is equipped with in top of detecting the platform, the inner chamber threaded connection of fixing base has the screw rod, the one end rotation of screw rod is connected with the fixed plate, two the wafer body has been placed between the fixed plate.

Optionally, the top fixedly connected with dog of measuring staff, and the diameter of dog is greater than the diameter of measuring staff.

Optionally, the wafer body is in a good when the contact is between the first contact and the second contact.

Optionally, the first bulb and the second bulb emit light with different colors, the first bulb emits red light, and the second bulb emits yellow light.

Optionally, a reinforcing block is fixedly arranged on the side wall of the mounting plate, and one side of the reinforcing block is fixedly connected with the bottom of the horizontal seat.

Compared with the prior art, the utility model has the beneficial effects that:

according to the application, through the matching arrangement among the structures such as the detection head, the first contact, the first bulb, the second contact, the second bulb, the contact and the like, the wafer body is placed under the detection head, the detection head can detect all parts of the wafer body, when the contact is positioned between the first contact and the second contact, the wafer body belongs to qualified products, when the contact contacts the second contact or the first contact, the first bulb and the second bulb emit light, so that a detector is reminded of unqualified wafer bodies, when the first bulb is on, the thickness of the wafer body is indicated to be too large, when the second bulb is on, the thickness of the wafer body is indicated to be relatively low, and the wafer body can be distinguished through the first bulb and the second bulb, so that the wafer body can be conveniently processed later.

According to the application, the wafer body is placed under the detection head through the cooperation arrangement among the structures such as the fixing seat, the screw rod and the fixing plate, and the fixing plate is driven to fix the wafer body by rotating the screw rod to move on the fixing seat, so that the wafer body can be kept stable during detection, and the influence on the detection result is avoided.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is an enlarged view of FIG. 1A in accordance with the present utility model;

fig. 3 is a schematic cross-sectional structure of the present utility model.

In the figure: 1. a detection table; 2. a suction cup; 3. a chute; 4. a cavity; 5. a first motor; 6. a rotating shaft; 7. a slide block; 8. a support rod; 9. a horizontal seat; 10. a turbine; 11. a second motor; 12. a worm; 13. a support block; 14. a detection rod; 15. a stop block; 16. a pull rod; 17. a detection head; 18. a mounting plate; 19. a first contact; 20. a first bulb; 21. a second contact; 22. a second bulb; 23. a fixing seat; 24. a screw; 25. a fixing plate; 26. a wafer body; 27. a reinforcing block; 28. a contact.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, a semiconductor wafer thickness detecting device includes a detecting table 1, a sucker 2 is fixedly arranged at the bottom of the detecting table 1, and the detecting table 1 can be more stable when placed by arranging the sucker 2, so that the detecting table 1 is prevented from shaking.

The spout 3 has been seted up at the top of detecting platform 1, cavity 4 has been seted up to the inner chamber of detecting platform 1, cavity 4's bottom fixed first motor 5 that is equipped with, the output shaft fixedly connected with pivot 6 of first motor 5, the outer wall threaded connection of pivot 6 has slider 7, and slider 7 is laminated with cavity 4's bottom, the top of slider 7 rotates and is connected with bracing piece 8, the outer wall fixedly connected with horizontal seat 9 of bracing piece 8, the top of bracing piece 8 outer wall is fixed and is equipped with turbine 10, the top of horizontal seat 9 is installed second motor 11 afterwards, the output shaft fixedly connected with worm 12 of second motor 11, the one end that worm 12 kept away from second motor 11 rotates and is connected with supporting shoe 13, and the bottom of supporting shoe 13 and the top fixedly connected with of horizontal seat 9, the one end that horizontal seat 9 kept away from bracing piece 8 wears to be equipped with the measuring rod 14, the outer wall fixedly of measuring rod 14 is equipped with pull rod 16, the top fixedly connected with dog 15 of measuring rod 14, and the diameter of dog 15 is greater than the diameter of measuring rod 14, stop through dog 15 to measuring rod 14, avoid measuring rod 14 to drop.

The top of the detection rod 14 is fixedly provided with a detection head 17, the outer wall of the detection rod 14 is fixedly provided with a contact 28, the bottom of the horizontal seat 9 is fixedly connected with a mounting plate 18, the side wall of the mounting plate 18 is fixedly provided with a reinforcing block 27, one side of the reinforcing block 27 is fixedly connected with the bottom of the horizontal seat 9, and the strength of connection between the mounting plate 18 and the horizontal seat 9 is increased through the reinforcing block 27, so that the mounting plate 18 is more stable.

One side of the mounting plate 18 is fixedly connected with a first contact 19, the other side of the mounting plate 18 is fixedly connected with a first bulb 20, a second contact 21 is fixedly arranged on one side of the mounting plate 18 and below the first contact 19, and a second bulb 22 is fixedly connected on the other side of the mounting plate 18 and below the first bulb 20.

Specifically, referring to fig. 1-3, a fixing seat 23 is fixedly arranged at the top of the detection table 1, a screw 24 is in threaded connection with an inner cavity of the fixing seat 23, one end of the screw 24 is rotatably connected with a fixing plate 25, a wafer body 26 is placed between the two fixing plates 25, a rubber pad is arranged on the inner wall of the fixing plate 25, and abrasion of the wafer body 26 caused when the fixing plate 25 clamps the wafer body 26 can be avoided.

Specifically, referring to fig. 1-3, the wafer body 26 is a good product when the contact 28 is located between the first contact 19 and the second contact 21, and the contact 28 indicates that the thickness of the wafer body 26 is too low when the contact 28 is in contact with the second contact 21, and indicates that the thickness of the wafer body 26 is too large when the contact 28 is in contact with the first contact 19.

Specifically, referring to fig. 1-3, the first bulb 20 and the second bulb 22 have different light emitting colors, the first bulb 20 is bright red, and the second bulb 22 is bright yellow, so that the problem of the wafer body 26 can be resolved by setting the bright light of different colors.

Working principle: during operation, the wafer body 26 is placed under the detection head 17, the detection head 17 can detect all parts of the wafer body 26, the wafer body 26 belongs to qualified products when the contact 28 is located between the first contact 19 and the second contact 21, when the contact 28 contacts the second contact 21 or the first contact 19, the first bulb 20 and the second bulb 22 can emit light, so that a detection person is reminded of unqualified the wafer body 26, the first bulb 20 indicates that the thickness of the wafer body 26 is overlarge when being lightened, the second bulb 22 indicates that the thickness of the wafer body 26 is lower when being lightened, the wafer body 26 can be distinguished through the first bulb 20 and the second bulb 22, the wafer body 26 can be conveniently processed later, the wafer body 26 is placed under the detection head 17, the fixing plate 25 is driven to fix the wafer body 26 through rotating the screw 24 on the fixing seat 23, and the wafer body 26 can be kept stable during detection.

The foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The semiconductor wafer thickness detection device comprises a detection table (1), and is characterized in that: the utility model discloses a detecting platform, including detecting platform (1), spout (3) have been seted up at the top of detecting platform (1), cavity (4) have been seted up to the inner chamber of detecting platform (1), the fixed first motor (5) that is equipped with in bottom of cavity (4), the output shaft fixedly connected with pivot (6) of first motor (5), the outer wall threaded connection of pivot (6) has slider (7), and the laminating of slider (7) and the bottom of cavity (4), the top rotation of slider (7) is connected with bracing piece (8), the outer wall fixedly connected with horizontal seat (9) of bracing piece (8), the top of bracing piece (8) is fixed and is equipped with turbine (10), second motor (11) after the top of horizontal seat (9) is installed, the output shaft fixedly connected with worm (12) of second motor (11), the one end rotation that second motor (11) were kept away from to worm (12) is connected with supporting shoe (13), and the bottom of supporting shoe (13) and the top fixed connection of horizontal seat (9), the one end that bracing piece (9) kept away from bracing piece (8) is rotated and is equipped with bracing piece (14), the top (14) of detecting rod (14) is equipped with measuring head (14), measuring head (14) is equipped with measuring head (14), the outer wall of the detection rod (14) is fixedly provided with a contact (28), the bottom of the horizontal seat (9) is fixedly connected with a mounting plate (18), one side of the mounting plate (18) is fixedly connected with a first contact (19), the other side of the mounting plate (18) is fixedly connected with a first bulb (20), one side of the mounting plate (18) is fixedly provided with a second contact (21) below the first contact (19), and the other side of the mounting plate (18) is fixedly connected with a second bulb (22) below the first bulb (20).

2. A semiconductor wafer thickness inspection apparatus according to claim 1, wherein: the bottom of the detection table (1) is fixedly provided with a sucker (2).

3. A semiconductor wafer thickness inspection apparatus according to claim 1, wherein: the top of detecting platform (1) is fixed and is equipped with fixing base (23), the inner chamber threaded connection of fixing base (23) has screw rod (24), the one end rotation of screw rod (24) is connected with fixed plate (25), two wafer body (26) have been placed between fixed plate (25).

4. A semiconductor wafer thickness inspection apparatus according to claim 1, wherein: the top of detection pole (14) fixedly connected with dog (15), and the diameter of dog (15) is greater than the diameter of detection pole (14).

5. A semiconductor wafer thickness inspection apparatus according to claim 1, wherein: the wafer body (26) is of a good quality when the contact (28) is located between the first contact (19) and the second contact (21).

6. A semiconductor wafer thickness inspection apparatus according to claim 1, wherein: the first bulb (20) and the second bulb (22) emit light in different colors, the first bulb (20) emits red light, and the second bulb (22) emits yellow light.

7. A semiconductor wafer thickness inspection apparatus according to claim 1, wherein: the side wall of the mounting plate (18) is fixedly provided with a reinforcing block (27), and one side of the reinforcing block (27) is fixedly connected with the bottom of the horizontal seat (9).