CN216209634U

CN216209634U - Detection device for semiconductor wafer

Info

Publication number: CN216209634U
Application number: CN202122019062.5U
Authority: CN
Inventors: 林虹虹
Original assignee: Jiaxing Hongyu Technology Co ltd
Current assignee: Jiaxing Hongyu Technology Co ltd
Priority date: 2021-08-25
Filing date: 2021-08-25
Publication date: 2022-04-05
Anticipated expiration: 2031-08-25

Abstract

The utility model relates to the technical field of semiconductor wafers and discloses a detection device for a semiconductor wafer. This detection device for semiconductor wafer, through the fixed plate, first spout, first slider, the sliding plate, the replacement membrane, the second spout, the second slider, the fixed column, the thread pin axle, the column spinner and the setting of detecting the head, if light is not good when using, place the wafer on the sliding plate, to one side pulling sliding plate, the sliding plate drives first slider slide take out to the suitable position of light on first spout, will detect the head and to one side pulling, it drives the second slider slide and takes out to suitable position on the second spout to detect the head, be convenient for detect the wafer, finally according to the angle, to one side pulling column spinner, the thread pin axle drives the column spinner and carries out rotation regulation position, be convenient for use.

Description

Detection device for semiconductor wafer

Technical Field

The utility model relates to the technical field of semiconductor wafers, in particular to a detection device for a semiconductor wafer.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, which is often made into a wafer, the wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and then doped into a silicon crystal seed crystal, and then is slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal bar is ground, polished and sliced to form a silicon wafer, namely the wafer, the main processing modes of the wafer are wafer processing and batch processing, namely one or more wafers are processed simultaneously, the processing and measuring equipment is more and more advanced along with the smaller and smaller characteristic size of the semiconductor, so that the wafer processing has new data characteristics, meanwhile, the characteristic size is reduced, the influence of the number of particles in the air on the quality and reliability of the processed wafer is increased along with the improvement of cleanness, and the number of the particles also has new data characteristics, since the wafer needs to be inspected after the wafer is manufactured, an inspection apparatus for a semiconductor wafer needs to be used.

Traditional detection device for semiconductor wafer, the effect is all not good for most regulation when using, when indoor light sense can't measure, can't change the position of detecting the head through adjusting, leads to when light is relatively poor, can't detect, still needs the manual flashlight of using of workman to throw light on, uses comparatively not convenient.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Aiming at the defects of the prior art, the utility model provides a detection device for a semiconductor wafer, which aims to solve the problems that most of traditional detection devices for semiconductor wafers in the background art have poor adjustment effects when in use, cannot change the position of a detection head through adjustment when indoor light sensation cannot be measured, cannot perform detection when light is poor, and is inconvenient to use because workers need to manually use a flashlight for illumination.

(II) technical scheme

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a detection apparatus for semiconductor wafer, includes the base, moving mechanism is all installed to the bottom both sides of base, elevating system is installed at the top of base, slide mechanism is installed at elevating system's top, the backup pad is installed to slide mechanism's outer wall, adjustment mechanism is installed to the outer wall of backup pad.

Preferably, moving mechanism includes universal wheel, dead lever, hinge and rotary rod, the universal wheel all sets up in base bottom both sides, a plurality of dead lever has all been welded to the bottom of base, the hinge is installed to the bottom of dead lever, the bottom of hinge is connected with the rotary rod, through the setting of universal wheel, dead lever, hinge and rotary rod, promotes the base universal wheel and drives the base and remove when using, after removing suitable position, with the rotary rod pulling downwards, the hinge drives the rotary rod and rotates, makes the rotary rod card go into inside the universal wheel, fixes the universal wheel.

Preferably, elevating system includes lift cover, stopper, spacing hole and lifter, the lift cover welding is at the base top, the outer wall of lift cover runs through there is the stopper, the outer wall of stopper and the inner wall cooperation installation in spacing hole, the outer wall surface at the lifter is seted up in spacing hole, through the setting of lift cover, stopper, spacing hole and lifter, upwards stimulates the lifter to suitable position when using, inserts spacing downthehole portion with the stopper this moment, fixes the lifter, is convenient for carry out altitude mixture control to detection device, is convenient for be applied to all kinds of scenes.

Preferably, the sliding mechanism comprises a fixed plate, a first sliding groove, a first sliding block, a sliding plate and a replacement film, the fixed plate is welded at the top of the lifting rod, the first sliding groove is formed in the two side surfaces of the outer wall of the fixed plate, the first sliding block matched with the first sliding groove is installed inside the first sliding groove, the sliding plate is welded on the inner side of the first sliding block, the replacement film is bonded on the outer wall of the sliding plate, and through the arrangement of the fixed plate, the first sliding groove, the first sliding block and the sliding plate, when the sliding mechanism is used, if light is not good, a wafer is placed on the sliding plate, the sliding plate is pulled to one side, and the sliding plate drives the first sliding block to slide on the first sliding groove and be drawn out to a position where the light is suitable, so that the sliding mechanism can be used conveniently.

Preferably, the outer wall of replacing the membrane closely laminates with the outer wall of sliding plate, and the size of replacing the membrane is identical with the sliding plate size, through the setting of replacing the membrane, will replace the membrane and install on the sliding plate fixedly using, is convenient for protect the wafer.

Preferably, adjustment mechanism includes second spout, second slider, fixed column, thread pin axle, column spinner and detects the head, the second spout is seted up at the backup pad outer wall, the internally mounted of second spout has assorted second slider with it, the bottom welding of second slider has the fixed column, thread pin axle is installed to the bottom of fixed column, thread pin axle's bottom is connected with the column spinner, the bottom of column spinner is installed and is detected the head, through the setting of second spout and second slider, will detect the head and stimulate to one side when using, detects the head and drive the second slider and slide on the second spout and take out to suitable position, is convenient for detect the wafer.

Preferably, the column spinner passes through the thread pin axle and constitutes revolution mechanic with the fixed column, and the diameter of column spinner is the same with the diameter of fixed column, through fixed column, thread pin axle, column spinner and the setting that detects the head, according to the angle when using, to one side pulling column spinner, thread pin axle drives the column spinner and carries out rotation regulation position, is convenient for use.

(III) advantageous effects

Compared with the prior art, the utility model provides a detection device for a semiconductor wafer, which has the following beneficial effects:

1. this detection device for semiconductor wafer, through the fixed plate, first spout, first slider, the sliding plate, the replacement membrane, the second spout, the second slider, the fixed column, the thread pin axle, the column spinner and the setting of detecting the head, if light is not good when using, place the wafer on the sliding plate, to one side pulling sliding plate, the sliding plate drives first slider slide take out to the suitable position of light on first spout, will detect the head and to one side pulling, it drives the second slider slide and takes out to suitable position on the second spout to detect the head, be convenient for detect the wafer, finally according to the angle, to one side pulling column spinner, the thread pin axle drives the column spinner and carries out rotation regulation position, be convenient for use.

2. This detection device for semiconductor wafer through the setting of universal wheel, dead lever, hinge and rotary rod, promotes the base universal wheel and drives the base and remove when using, after removing suitable position, with the downward pulling of rotary rod, the hinge drives the rotary rod and rotates, makes the rotary rod card go into inside the universal wheel, fixes the universal wheel.

3. This detection device for semiconductor wafer through the setting of lift cover, stopper, spacing hole and lifter, upwards stimulates the lifter to suitable position when using, inserts spacing downthehole portion with the stopper this moment, fixes the lifter, is convenient for carry out altitude mixture control to detection device, is convenient for be applied to all kinds of scenes.

Drawings

FIG. 1 is a schematic view of the front view of the present invention;

FIG. 2 is a schematic structural diagram of a moving mechanism according to the present invention;

FIG. 3 is a schematic view of an adjusting mechanism according to the present invention;

FIG. 4 is an enlarged view of the structure at A in FIG. 1 according to the present invention.

In the figure: 1. a base; 2. a moving mechanism; 201. a universal wheel; 202. fixing the rod; 203. a hinge; 204. rotating the rod; 3. a lifting mechanism; 301. a lifting sleeve; 302. a limiting block; 303. a limiting hole; 304. a lifting rod; 4. a sliding mechanism; 401. a fixing plate; 402. a first chute; 403. a first slider; 404. a sliding plate; 405. replacing the membrane; 5. a support plate; 6. an adjustment mechanism; 601. a second chute; 602. a second slider; 603. fixing a column; 604. a threaded pin shaft; 605. a spin column; 606. and a detection head.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, a detecting device for a semiconductor wafer includes a base 1, moving mechanisms 2 are mounted on two sides of the bottom of the base 1, each moving mechanism 2 includes a universal wheel 201, a fixing rod 202, a hinge 203 and a rotating rod 204, the universal wheels 201 are disposed on two sides of the bottom of the base 1, a plurality of fixing rods 202 are welded on the bottom of the base 1, the hinges 203 are mounted on the bottoms of the fixing rods 202, the rotating rod 204 is connected to the bottom of the hinge 203, the universal wheels 201, the fixing rods 202, the hinges 203 and the rotating rod 204 are disposed, when the detecting device is used, the universal wheels 201 of the base 1 are pushed to drive the base 1 to move, when the detecting device is moved to a proper position, the rotating rod 204 is pulled downwards, the hinges 203 drive the rotating rod 204 to rotate, the rotating rod 204 is clamped into the universal wheels 201 to fix the universal wheels 201, a lifting mechanism 3 is mounted on the top of the base 1, the lifting mechanism 3 includes a lifting sleeve 301, The lifting sleeve 301 is welded on the top of the base 1, the outer wall of the lifting sleeve 301 penetrates through the limiting block 302, the outer wall of the limiting block 302 is installed in a matched mode with the inner wall of the limiting hole 303, the limiting hole 303 is formed in the outer wall surface of the lifting rod 304, the lifting rod 304 is pulled upwards to a proper position through the arrangement of the lifting sleeve 301, the limiting block 302, the limiting hole 303 and the lifting rod 304 when the lifting mechanism is used, the limiting block 302 is inserted into the limiting hole 303 at the moment to fix the lifting rod 304, the height of the detection device is convenient to adjust, the detection device is convenient to apply to various scenes, the top of the lifting mechanism 3 is provided with the sliding mechanism 4, the sliding mechanism 4 comprises a fixing plate 401, a first sliding chute 402, a first sliding block 403, a sliding plate 404 and a replacing film 405, the fixing plate 401 is welded on the top of the lifting rod 304, the two side surfaces of the outer wall of the fixing plate 401 are both provided with the first sliding chutes 402, the first sliding chute 402 is internally provided with a first sliding block 403 matched with the first sliding chute 402, the inner side of the first sliding block 403 is welded with a sliding plate 404, the outer wall of the sliding plate 404 is adhered with a replacing film 405, through the arrangement of the fixed plate 401, the first sliding chute 402, the first sliding block 403 and the sliding plate 404, when the wafer is used, if the light is not good, the wafer is placed on the sliding plate 404, the sliding plate 404 is pulled to one side, the sliding plate 404 drives the first sliding block 403 to slide and draw out on the first sliding chute 402 to a position with proper light, so that the wafer is convenient to use, the outer wall of the replacing film 405 is tightly attached to the outer wall of the sliding plate 404, the size of the replacing film 405 is matched with that of the sliding plate 404, through the arrangement of the replacing film 405, the replacing film 405 is installed on the sliding plate 404 for fixing, so that the wafer is convenient to protect, the outer wall of the sliding mechanism 4 is provided with a supporting plate 5, and the outer wall of the supporting plate 5 is provided with an adjusting mechanism 6, the adjusting mechanism 6 comprises a second sliding chute 601, a second sliding block 602, a fixed column 603, a threaded pin 604, a rotating column 605 and a detection head 606, the second sliding chute 601 is arranged on the outer wall of the supporting plate 5, the second sliding chute 601 is internally provided with the second sliding block 602 matched with the second sliding chute 601, the fixed column 603 is welded at the bottom of the second sliding block 602, the threaded pin 604 is arranged at the bottom of the fixed column 603, the rotating column 605 is connected to the bottom of the threaded pin 604, the detection head 606 is arranged at the bottom of the rotating column 605, the detection head 606 is pulled to one side when the adjusting mechanism is used, the detection head 606 drives the second sliding block 602 to slide and draw out to a proper position on the second sliding chute 601, the wafer can be conveniently detected, the rotating column 605 and the fixed column 603 form a rotating structure through the threaded pin 604, the diameter of the rotating column 605 is the same as that of the fixed column 603, and the fixed column 603 are connected through the threaded pin 603, The arrangement of the threaded pin shaft 604, the rotary column 605 and the detection head 606 pulls the rotary column 605 to one side according to the angle when in use, and the threaded pin shaft 604 drives the rotary column 605 to rotate and adjust the position, so that the use is convenient.

Before the device is used, the universal wheel 201 of the base 1 is pushed to drive the base 1 to move when the device is used, after the device is moved to a proper position, the rotating rod 204 is pulled downwards, the hinge 203 drives the rotating rod 204 to rotate, the rotating rod 204 is clamped into the universal wheel 201 to fix the universal wheel 201, the lifting rod 304 is pulled upwards to a proper position, the limiting block 302 is inserted into the limiting hole 303 to fix the lifting rod 304, the height adjustment of the detection device is convenient, the device is convenient to be applied to various scenes, when the device is used, if the light is not good, a wafer is placed on the sliding plate 404, the sliding plate 404 is pulled towards one side, the sliding plate 404 drives the first sliding block 403 to slide on the first sliding groove 402 and be pulled out to a proper position of the light, the device is convenient to use, at the moment, the detection head 606 is pulled towards one side, the detection head 606 drives the second sliding block 602 to slide on the second sliding groove 601 and be pulled out to a proper position, when the device is used again, the rotating column 605 is pulled to one side according to the angle, and the threaded pin shaft 604 drives the rotating column 605 to rotate to adjust the position, so that the detection is convenient.

In summary, according to the detection apparatus for a semiconductor wafer, by the arrangement of the fixed plate 401, the first sliding chute 402, the first slider 403, the sliding plate 404, the replacement film 405, the second sliding chute 601, the second slider 602, the fixed column 603, the threaded pin 604, the rotating column 605 and the detection head 606, when light is not good during use, the wafer is placed on the sliding plate 404, the sliding plate 404 is pulled to one side, the sliding plate 404 drives the first slider 403 to slide and draw out on the first sliding chute 402 to a position where light is suitable, the detection head 606 is pulled to one side, the detection head 606 drives the second slider 602 to slide and draw out on the second sliding chute 601 to a suitable position, so as to facilitate detection of the wafer, and finally, according to an angle, the rotating column 605 is pulled to one side, and the threaded pin 604 drives the rotating column 605 to rotate and adjust the position, so as to facilitate use.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A detection device for a semiconductor wafer comprises a base (1), and is characterized in that: moving mechanism (2) are all installed to the bottom both sides of base (1), elevating system (3) are installed at the top of base (1), slide mechanism (4) are installed at the top of elevating system (3), backup pad (5) are installed to the outer wall of slide mechanism (4), adjustment mechanism (6) are installed to the outer wall of backup pad (5).

2. The inspection apparatus for semiconductor wafers as set forth in claim 1, wherein: moving mechanism (2) include universal wheel (201), dead lever (202), hinge (203) and rotary rod (204), universal wheel (201) all sets up in base (1) bottom both sides, a plurality of dead lever (202) have all been welded to the bottom of base (1), hinge (203) are installed to the bottom of dead lever (202), the bottom of hinge (203) is connected with rotary rod (204).

3. The inspection apparatus for semiconductor wafers as set forth in claim 1, wherein: elevating system (3) are including lifting sleeve (301), stopper (302), spacing hole (303) and lifter (304), the welding of lifting sleeve (301) is at base (1) top, the outer wall of lifting sleeve (301) runs through there is stopper (302), the outer wall of stopper (302) and the inner wall cooperation installation of spacing hole (303), the outer wall surface at lifter (304) is seted up in spacing hole (303).

4. The inspection apparatus for semiconductor wafers as set forth in claim 1, wherein: the sliding mechanism (4) comprises a fixing plate (401), a first sliding groove (402), a first sliding block (403), a sliding plate (404) and a replacement film (405), the fixing plate (401) is welded to the top of the lifting rod (304), the first sliding groove (402) is formed in the two side surfaces of the outer wall of the fixing plate (401), the first sliding block (403) matched with the first sliding groove is installed inside the first sliding groove (402), the sliding plate (404) is welded to the inner side of the first sliding block (403), and the replacement film (405) is bonded to the outer wall of the sliding plate (404).

5. The inspection apparatus for semiconductor wafers as set forth in claim 4, wherein: the outer wall of the replacement film (405) is tightly attached to the outer wall of the sliding plate (404), and the size of the replacement film (405) is matched with that of the sliding plate (404).

6. The inspection apparatus for semiconductor wafers as set forth in claim 1, wherein: the adjusting mechanism (6) comprises a second sliding groove (601), a second sliding block (602), a fixing column (603), a threaded pin shaft (604), a rotating column (605) and a detection head (606), wherein the second sliding groove (601) is formed in the outer wall of the supporting plate (5), the second sliding block (602) matched with the second sliding groove is installed inside the second sliding groove (601), the fixing column (603) is welded at the bottom of the second sliding block (602), the threaded pin shaft (604) is installed at the bottom of the fixing column (603), the rotating column (605) is connected to the bottom of the threaded pin shaft (604), and the detection head (606) is installed at the bottom of the rotating column (605).

7. The inspection apparatus for semiconductor wafers as set forth in claim 6, wherein: the rotating column (605) and the fixed column (603) form a rotating structure through a threaded pin shaft (604), and the diameter of the rotating column (605) is the same as that of the fixed column (603).