CN216848196U - Wafer position detection and correction device - Google Patents

Wafer position detection and correction device Download PDF

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Publication number
CN216848196U
CN216848196U CN202220563668.7U CN202220563668U CN216848196U CN 216848196 U CN216848196 U CN 216848196U CN 202220563668 U CN202220563668 U CN 202220563668U CN 216848196 U CN216848196 U CN 216848196U
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fixedly connected
position detection
wafer position
infrared
base
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CN202220563668.7U
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梁少敏
陈洪立
俞智勇
杨亮亮
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Jiangsu Xitaixin Technology Co ltd
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Jiangsu Xitaixin Technology Co ltd
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Abstract

The utility model discloses a wafer position detection and correction device, which comprises a base, a bearing platform is arranged above the base, a buffer component is arranged between the base and the bearing platform, the wafer position detection and correction device is provided with a transverse component, a longitudinal component and a rotating component, when in detection and correction, a wafer is placed at the center of a turntable, an electric push rod drives a frame body to move, so that three infrared receivers are transversely adjusted below three infrared transmitters, then a first motor drives a screw block to move outside the screw rod, so that the three infrared receivers are longitudinally adjusted below the three infrared transmitters, a second motor drives the turntable to rotate, so that the three infrared receivers are adjusted to be aligned with the lower parts of the three infrared transmitters, when the three infrared receivers all receive signals of the three infrared transmitters, an alarm sounds at the moment, the position of the wafer can be detected and corrected.

Description

Wafer position detection and correction device
Technical Field
The utility model relates to a wafer processing technology field specifically is a wafer position detection proofreading device.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and doped into a silicon crystal seed crystal, then the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, and a silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely the wafer.
The existing wafer position detection and correction is that a wafer is usually placed on an inspection bench, the correction is very inconvenient to adjust manually and continuously, machine operation is carried out during detection, and the generated vibration easily influences the correction precision, so that a wafer position detection and correction device is provided for solving the problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wafer position detection proofreading device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a wafer position detection proofreading device, includes the base, the top of base is equipped with the bearing platform, be equipped with the buffering subassembly between base and the bearing platform, the top of bearing platform is equipped with horizontal subassembly, vertical subassembly, rotating assembly respectively, and three infrared receiver, the one end fixedly connected with L shaped plate of base, one side fixed mounting of institute L shaped plate has the alarm, the top fixedly connected with spliced pole of L shaped plate, the bottom fixedly connected with connection pad of spliced pole, the bottom fixed mounting of connection pad has three infrared emitter.
As a preferred technical scheme of the utility model, the buffering subassembly includes the guide post, the equal fixedly connected with guide post of top both sides front and back end department of base, four the one end of guide post all runs through to the top of accepting the platform, and four the outside of guide post and the below cover that is located the accepting platform have tied buffering spring, all be equipped with the through-hole with the mutual adaptation of the outside size of four guide posts around the accepting platform both sides.
As a preferred technical scheme of the utility model, horizontal subassembly includes the fixed plate, top one side fixedly connected with fixed plate of bearing platform, one side fixed mounting of fixed plate has electric push rod, the flexible end fixedly connected with framework of electric push rod, the equal fixedly connected with connecting block in bottom both ends of framework, two the equal fixedly connected with slider in bottom of connecting block, the spout has all been seted up to the top front and back end of bearing platform.
As an optimal technical scheme of the utility model, two constitute sliding connection between the outside of slider and the inside of two spouts.
As a preferred technical scheme of the utility model, vertical subassembly includes first motor, the one end fixed mounting of framework has first motor, the output of first motor runs through to the inside fixedly connected with lead screw of framework, the surface threaded connection of lead screw has the silk piece.
As an optimized technical scheme of the utility model, the inside of silk piece is equipped with the internal thread that matches each other with the surface of lead screw.
As a preferred technical scheme of the utility model, rotating assembly is including accepting the board, the top fixedly connected with of silk piece accepts the board, the top fixed mounting who accepts the board has the second motor, the output fixedly connected with carousel of second motor, the top and the three infrared receiver fixed connection of carousel.
As an optimal technical scheme of the utility model, the three infrared receiver at carousel top and the three infrared emitter of connection pad bottom are the equidistance setting.
Compared with the prior art, the beneficial effects of the utility model reside in that:
1. this wafer position detects proofreading device is through setting up horizontal subassembly, vertical subassembly and rotating assembly, when detecting the proofreading, place the wafer in carousel center department, it removes to drive the frame through the electric push rod, make its three infrared receiver transversely adjust to the below of three infrared emitter, then first motor drives the silk piece and removes in the outside of lead screw, it vertically adjusts to the below of three infrared emitter to drive three infrared receiver, later the second motor drives the carousel and rotates, make its three infrared receiver adjust to align with the below of three infrared emitter, when three infrared receiver all accepts the signal to three infrared emitter, the alarm sends alert ring this moment, can be with the wafer position detection proofreading of placing.
2. This wafer position detection proofreading device is through setting up buffering subassembly, when examining, produces the vibration and can play better cushioning effect when the machine operation, avoids influencing the precision of proofreading.
Drawings
Figure 1 is a schematic view of a first perspective of the present invention,
figure 2 is a schematic view of a second perspective of the present invention,
figure 3 is a schematic view of a third perspective of the present invention,
fig. 4 is an enlarged view of a portion a in fig. 2 according to the present invention.
In the figure: 1. a base; 2. a buffer assembly; 201. a guide post; 202. a buffer spring; 3. a receiving table; 4. a transverse assembly; 401. a fixing plate; 402. an electric push rod; 403. a frame body; 404. connecting blocks; 405. a slider; 406. a chute; 5. a longitudinal component; 501. a first motor; 502. a screw rod; 503. silk blocks; 6. a rotating assembly; 601. a bearing plate; 602. a second motor; 603. a turntable; 7. an infrared receiver; 8. an L-shaped plate; 9. an alarm; 10. connecting columns; 11. a connecting disc; 12. an infrared emitter.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides the following solutions:
the utility model provides a wafer position detection calibrating device, the on-line screen storage device comprises a base 1, base 1's top is equipped with the carrying platform 3, be equipped with buffering subassembly 2 between base 1 and the carrying platform 3, the top of carrying platform 3 is equipped with horizontal subassembly 4 respectively, vertical subassembly 5, rotating assembly 6, with three infrared receiver 7, base 1's one end fixedly connected with L shaped plate 8, one side fixed mounting of institute L shaped plate 8 has alarm 9, the top fixedly connected with spliced pole 10 of L shaped plate 8, the bottom fixedly connected with connection pad 11 of spliced pole 10, the bottom fixed mounting of connection pad 11 has three infrared emitter 12, the device can effectively calibrate the position of wafer, and is simple in operation, and convenient in use.
Buffering subassembly 2 includes guide post 201, the equal fixedly connected with guide post 201 of base 1's top both sides front and back end department, the one end of four guide post 201 all runs through to the top of accepting platform 3, and the outside of four guide post 201 and the below cover that is located accepting platform 3 have cushion spring 202, accept platform 3 both sides front and back portion all be equipped with the through-hole of the mutual adaptation of the outside size of four guide post 201, can produce when vibrating in the machine operation, play better cushioning effect.
Horizontal subassembly 4 includes fixed plate 401, top one side fixedly connected with fixed plate 401 of accepting platform 3, one side fixed mounting of fixed plate 401 has electric push rod 402, the flexible end fixedly connected with framework 403 of electric push rod 402, the equal fixedly connected with connecting block 404 in bottom both ends of framework 403, the equal fixedly connected with slider 405 in bottom of two connecting blocks 404, spout 406 has all been seted up to the top front and back end of accepting platform 3, constitute sliding connection between the outside of two sliders 405 and the inside of two spout 406, electric push rod 402 drives framework 403 and removes, make its three infrared receiver 7 adjust to the below of three infrared emitter 12, can transversely proofread.
The longitudinal component 5 comprises a first motor 501, the first motor 501 is fixedly mounted at one end of the frame body 403, the output end of the first motor 501 penetrates through the lead screw 502 fixedly connected to the inside of the frame body 403, the outer surface of the lead screw 502 is in threaded connection with a screw block 503, the inside of the screw block 503 is provided with an internal thread matched with the outer surface of the lead screw 502, the first motor 501 drives the screw block 503 to move outside the lead screw 502, three infrared receivers 7 are adjusted to be below the three infrared emitters 12, and longitudinal calibration can be carried out.
Rotating assembly 6 is including accepting board 601, the top fixedly connected with of silk piece 503 accepts board 601, the top fixed mounting who accepts board 601 has second motor 602, the output fixedly connected with carousel 603 of second motor 602, the top and the three infrared receiver 7 fixed connection of carousel 603, three infrared receiver 7 at carousel 603 top and the three infrared emitter 12 of connection pad 11 bottom are the equidistance setting, second motor 602 drives carousel 603 and rotates, can adjust three infrared receiver 7 to align with the below of three infrared emitter 12.
The working principle is as follows: when detecting and calibrating, firstly, a wafer is placed at the center of a turntable 603, an electric push rod 402 is started to drive a frame body 403 to move through the electric push rod 402, then two sliding blocks 405 slide in two sliding grooves 406 respectively to enable three infrared receivers 7 to be transversely adjusted to be below three infrared transmitters 12, then a first motor 501 is started, the first motor 501 drives a wire block 503 to move outside a screw rod 502 to enable the three infrared receivers 7 on the turntable 603 to be longitudinally adjusted to be below the three infrared transmitters 12, finally, a second motor 602 is started, the second motor 602 drives the turntable 603 to rotate to enable the three infrared receivers 7 to be adjusted to be aligned with the below of the three infrared transmitters 12, when the three infrared receivers 7 receive signals of the three infrared transmitters 12, an alarm 9 sends out warning sound at the moment, and then the position of the placed wafer can be detected and calibrated, when the machine works, the bearing table 3 is stressed to move up and down to drive the four buffer springs 202 to compress or reset, so that a better buffer effect can be achieved, and the influence on the calibration precision is avoided.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (8)

1. The utility model provides a wafer position detection verifying attachment, includes base (1), its characterized in that: the top of base (1) is equipped with and holds platform (3), be equipped with between base (1) and the platform that holds (3) buffering subassembly (2), the top of holding platform (3) is equipped with horizontal subassembly (4), vertical subassembly (5), rotating assembly (6) respectively, with three infrared receiver (7), the one end fixedly connected with L shaped plate (8) of base (1), one side fixed mounting of institute L shaped plate (8) has alarm (9), top fixedly connected with spliced pole (10) of L shaped plate (8), the bottom fixedly connected with connection pad (11) of spliced pole (10), the bottom fixed mounting of connection pad (11) has three infrared emitter (12).
2. A wafer position detection and correction apparatus as claimed in claim 1, wherein: buffering subassembly (2) are including guide post (201), equal fixedly connected with guide post (201) of top both sides front and back end department of base (1), four the one end of guide post (201) all runs through to the top of holding platform (3), and four the outside of guide post (201) and the below cover knot that is located holding platform (3) have buffering spring (202), the through-hole that all is equipped with the mutual adaptation of outside size with four guide post (201) of holding platform (3) both sides front and back portion.
3. A wafer position detection and correction apparatus as claimed in claim 1, wherein: horizontal subassembly (4) are including fixed plate (401), top one side fixedly connected with fixed plate (401) of bearing platform (3), one side fixed mounting of fixed plate (401) has electric push rod (402), the flexible end fixedly connected with framework (403) of electric push rod (402), the equal fixedly connected with connecting block (404) in bottom both ends of framework (403), two the equal fixedly connected with slider (405) in bottom of connecting block (404), spout (406) have all been seted up to the top front and back end of bearing platform (3).
4. A wafer position detection and correction apparatus as claimed in claim 3, wherein: the outer parts of the two sliding blocks (405) are in sliding connection with the inner parts of the two sliding grooves (406).
5. A wafer position detection and correction apparatus as claimed in claim 3, wherein: the longitudinal assembly (5) comprises a first motor (501), the first motor (501) is fixedly mounted at one end of the frame body (403), the output end of the first motor (501) penetrates through the inside fixedly connected with screw rod (502) of the frame body (403), and the outer surface of the screw rod (502) is in threaded connection with a screw block (503).
6. The wafer position detection and correction device according to claim 5, wherein: the inner part of the screw block (503) is provided with internal threads matched with the outer surface of the screw rod (502).
7. The wafer position detection and correction device according to claim 6, wherein: the rotating assembly (6) comprises a bearing plate (601), the top end of the wire block (503) is fixedly connected with the bearing plate (601), the top of the bearing plate (601) is fixedly provided with a second motor (602), the output end of the second motor (602) is fixedly connected with a turntable (603), and the top of the turntable (603) is fixedly connected with three infrared receivers (7).
8. The wafer position detection and correction device as claimed in claim 7, wherein: three infrared receiver (7) at carousel (603) top and three infrared emitter (12) of connection pad (11) bottom are the equidistance setting.
CN202220563668.7U 2022-03-15 2022-03-15 Wafer position detection and correction device Active CN216848196U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220563668.7U CN216848196U (en) 2022-03-15 2022-03-15 Wafer position detection and correction device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220563668.7U CN216848196U (en) 2022-03-15 2022-03-15 Wafer position detection and correction device

Publications (1)

Publication Number Publication Date
CN216848196U true CN216848196U (en) 2022-06-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115642116A (en) * 2022-11-04 2023-01-24 江苏希太芯科技有限公司 Wafer bonding strength measuring device and measuring method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115642116A (en) * 2022-11-04 2023-01-24 江苏希太芯科技有限公司 Wafer bonding strength measuring device and measuring method
CN115642116B (en) * 2022-11-04 2023-10-31 江苏希太芯科技有限公司 Wafer bonding strength measuring device and measuring method

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