CN115642116A - Wafer bonding strength measuring device and measuring method - Google Patents
Wafer bonding strength measuring device and measuring method Download PDFInfo
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- CN115642116A CN115642116A CN202211375054.7A CN202211375054A CN115642116A CN 115642116 A CN115642116 A CN 115642116A CN 202211375054 A CN202211375054 A CN 202211375054A CN 115642116 A CN115642116 A CN 115642116A
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Abstract
The invention discloses a wafer bonding strength measuring device and a wafer bonding strength measuring method. According to the invention, the lifting mechanism drives the material box to move downwards, and simultaneously, the tool rest is pushed towards the wafer, so that the blade arranged on the tool rest is inserted between the two bonded wafers, a gap is generated between the two bonded wafers, meanwhile, the length of the gap is measured by using the infrared device, and the calculation is carried out by using the calculation processor according to the length of the gap, so that the bonding strength of the wafer can be obtained, and a detection person does not need to hold the blade to insert between the two bonded wafers, so that the finger is prevented from being scratched when the blade is used.
Description
Technical Field
The invention relates to the technical field of wafer processing and manufacturing, in particular to a device and a method for measuring bonding strength of a wafer.
Background
The low-temperature wafer direct bonding technology is the most popular bonding method studied in recent years, and is the most difficult bonding method with the highest requirements on the surface appearance and surface treatment process of the silicon wafer, and the bonded wafer pair has irreparable defect due to the poor surface appearance or surface treatment of the silicon wafer. The direct wafer bonding process has gone from the early high-temperature wafer bonding to the currently widely researched and promoted low-temperature wafer bonding process, mainly for overcoming the influence of high temperature on the device, so people have started to pay attention to the research on the low-temperature wafer bonding. Major studies at present include hydrophilic bonding and hydrophobic bonding. The essence of low-temperature direct bonding is that surface energy is improved by surface treatment of silicon surface, and then two or more silicon wafers are bonded together by water molecule bridging (hydrophilic bonding) or HF molecule bridging (hydrophobic bonding) and intermolecular force.
In the low-temperature wafer direct bonding technology, the bonding strength is one of the most important measurement characteristics, and is an important index related to the bonding quality. The bonding strength is low, and the two bonded wafers are likely to crack during processing, resulting in failure. The small variation of the parameters of the manufacturing process (especially the surface pretreatment step and the bonding conditions of the wafer) can directly influence the strength performance of the bonding interface, so that the bonding strength is not enough to reflect the problems of some links in the bonding process; the bonding strength is high, which proves that the two wafers are tightly contacted, the influence of bonding interface cracks and cavities is very little, and the device manufactured by using the bonding technology is not easy to be damaged by environmental factors such as temperature, humidity and the like to fail.
At present, destructive measurement methods are adopted for measuring bonding strength, and include a crack propagation diffusion method, a straight pull method, a micro wedge groove test method, a static oil pressure test method and a four-point bending test method, wherein the crack propagation diffusion method is most commonly used. The crack propagation diffusion method is commonly called as a blade insertion method or a double cantilever beam test method, and is the most traditional and most common method for measuring surface energy (namely bonding strength).
When the bonding strength of the wafer is measured by a crack propagation diffusion method, a blade is usually held by a tester to be inserted between two wafers, and the surface of the wafer is smooth, so that the blade is easy to slip on the wafer, and the blade is easy to scratch fingers.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a wafer bonding strength measuring device and a wafer bonding strength measuring method.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a wafer bonding strength measuring device and measuring method, includes the frame, the frame is hollow structure, the top fixed mounting of frame one end has the leading truck, the leading truck is C shape structure, the inner wall slidable mounting of leading truck has rather than assorted magazine, a plurality of silos that match with the wafer shape are evenly seted up along its direction of height's inner wall to the magazine, the inside that the frame is located the magazine below is equipped with shedding mechanism, be equipped with elevating system between leading truck and the magazine, the frame is close to the upper surface of magazine and is equipped with the detection mechanism that is used for detecting wafer bonding strength, the frame is close to the surface of the relative both sides of magazine and is equipped with the clamping mechanism that is used for pressing from both sides tight wafer.
As a further scheme of the invention, the detection mechanism comprises supporting plates fixedly mounted on the upper surfaces of two opposite sides of the rack, a plurality of supporting rods are uniformly inserted into the outer surface of each supporting plate, the supporting rods penetrate through the outer surface of each supporting plate and are slidably mounted with the supporting plates, a moving block is fixedly mounted at the end part of each supporting rod close to one end of the material box, a baffle is fixedly mounted at the other end of each supporting rod, two support lugs are symmetrically and fixedly mounted on the outer surface of two opposite sides of the moving block, two guide rods are respectively inserted into the outer surfaces of the two support lugs, two connecting blocks are respectively and fixedly mounted at one ends of the two guide rods far away from the moving block, a tool rest is fixedly mounted between the two connecting blocks, a blade is arranged on the outer surface of one side of the tool rest close to the material box, an infrared device is fixedly mounted on the outer surface of one side of the tool rest close to the blade, a pushing mechanism is arranged between the moving block and the material box, a limiting mechanism is arranged between the rack and the connecting blocks, a reset assembly is arranged on the outer surface of each supporting rod, and a buffer assembly is arranged on the outer surface of the guide rod.
As a further scheme of the invention, the pushing mechanism comprises two supporting blocks which are symmetrically and fixedly arranged on the outer surfaces of two opposite sides of the rack, two rotating rods are respectively and rotatably arranged on the outer surfaces of the two supporting blocks, a pushing rod is fixedly arranged between the outer surfaces of the adjacent sides of the same ends of the two rotating rods, a chute is formed in the outer surface of the moving block close to the supporting blocks in a penetrating mode, the pushing rod is inserted into the chute and is slidably arranged with the inner wall of the chute, and a plurality of L-shaped push hooks are uniformly and fixedly arranged on the outer surface of the magazine close to the side, far away from the pushing rod, of the rotating rod.
As a further scheme of the invention, the reset assembly comprises a reset spring sleeved on the outer surface of the support rod, and the reset spring is arranged between the support plate and the baffle plate.
As a further scheme of the invention, the buffer assembly comprises a buffer spring sleeved on the outer surface of the guide rod, and the buffer spring is arranged between the support lug and the connecting block.
As a further scheme of the invention, the limiting mechanism comprises brackets fixedly arranged on the upper surfaces of two opposite sides of the rack, and the lower surface of each bracket, which is close to the connecting block, is fixedly provided with a stop block.
As a further scheme of the invention, the clamping mechanism comprises two fixed rods fixedly mounted on the outer surface of the frame, a movable plate is slidably mounted on the outer surface of the two fixed rods, a plurality of push rods are uniformly inserted into the outer surface of the movable plate, the push rods penetrate through the outer surface of the movable plate and are slidably mounted with the movable plate, clamping blocks are fixedly mounted at the end parts of the push rods close to one end of the magazine, the clamping blocks penetrate through the outer surface of the guide frame and are slidably mounted with the guide frame, a plurality of rectangular grooves are uniformly penetrated through the outer surface of the magazine close to the trough, two L-shaped rods are symmetrically and fixedly mounted on the outer surfaces of the two opposite sides of the movable block, push posts are fixedly mounted on the lower surfaces of the two L-shaped rods far away from one end of the movable block, guide plates are fixedly mounted on the outer surface of the movable plate close to one side of the guide frame, guide grooves matched with the push posts are penetrated through the upper surface of the guide plates, the push posts are slidably mounted with the inner walls of the guide grooves, abutting springs are sleeved on the outer surfaces of the push rods, the push posts are arranged between the movable plate and the clamping blocks, and limiting rings are fixedly mounted at the fixed rods and one ends of the fixed rods far away from the guide frame.
As a further scheme of the invention, the discharging mechanism comprises two conveying rollers which are rotatably arranged between the inner walls of the two opposite sides of the rack through two supporting shafts, the outer surfaces of the two conveying rollers are sleeved with conveying belts, the two conveying rollers are horizontally arranged in the rack in parallel, the outer surface of the rack is fixedly provided with a conveying motor, and the output end of the conveying motor penetrates through the outer surface of the rack and is fixedly arranged with the end part of one supporting shaft.
As a further scheme of the invention, the lifting mechanism comprises a strip-shaped groove penetrating through the back of the guide frame, a lifting block is fixedly mounted on the outer surface of one side of the material box close to the strip-shaped groove, the lifting block is slidably mounted with the inner wall of the strip-shaped groove, two limiting blocks are respectively and fixedly mounted on the outer surfaces of the guide frame close to the upper end and the lower end of the strip-shaped groove, a lifting screw is rotatably mounted between the two limiting blocks, the lifting screw penetrates through the outer surface of the lifting block and is in threaded connection with the lifting screw, a stepping motor is fixedly mounted on the upper surface of the limiting block close to the top end, and the output end of the stepping motor penetrates through the lower surface of the limiting block and is fixedly mounted with the top end of the lifting screw.
As a further scheme of the invention, the method comprises the following steps:
s1: sequentially placing a plurality of wafers to be detected into a material groove formed in the inner wall of the material box from bottom to top;
s2: the material box is driven to move downwards by the lifting mechanism until the blade is aligned between the two bonded wafers;
s3: when the material box moves downwards, the blade can be inserted between two wafers to be detected through the pushing mechanism, so that a gap is generated between the two bonded wafers, meanwhile, the length of the gap is measured through the infrared device, and the bonding strength of the wafers can be obtained through calculation through the calculation processor according to the length of the gap;
s4: after the bonding strength of the wafer is detected, the material box is continuously driven to move downwards through the lifting mechanism, so that the detected wafer is moved out of the material box by the conveyor belt, and the detected wafer is collected conveniently.
The beneficial effects of the invention are as follows:
1. when driving the magazine downstream through elevating system, fixed mounting will promote the movable block to the direction of magazine through pushing mechanism in the L shape of magazine side pushes away the hook, make the movable block can promote the knife rest to the wafer through guide arm and buffer spring, the blade that makes setting on the knife rest inserts to between the good two wafers of bonding, make and produce the gap between the good two wafers of bonding, and simultaneously, utilize infrared device to measure gap length, and calculate through calculating the treater according to gap length, can derive the bonding strength of wafer, do not need the handheld blade of measurement personnel to insert to between the good two wafers of bonding, prevent that the fish tail from pointing when using the blade.
2. When the moving block moves towards the direction of the material box, the L-shaped rods symmetrically and fixedly installed on the two sides of the moving block move along with the moving block, the pushing columns, arranged on the lower surface of one end, far away from the moving block, of the L-shaped rods can push the moving block towards the direction of the guide frame through the guide grooves formed in the guide plate, the moving block can push the clamping blocks towards the direction of the material box through the abutting springs, the two sides of the wafer are clamped by the clamping blocks, and the situation that the wafer is moved when the blade is inserted is prevented, so that the blade is difficult to insert between the two wafers is avoided.
3. After the bonding strength to the wafer detects the completion, continue to drive the magazine through elevating system and move down, make L shape on the magazine push away the hook after crossing the bull stick, the movable block can reset under reset spring's elastic force effect, make the blade take out from two wafers, and simultaneously, the centre gripping to the wafer is loosened to two clamp splice, make the wafer can follow the magazine and move down, place in the magazine when the wafer of below falls to the conveyer belt, the conveyer belt shifts out the magazine with the wafer that has detected to the wafer after detecting the completion, so that collect the wafer after detecting the completion.
Drawings
Fig. 1 is a schematic diagram of a right-view structure of a wafer bonding strength measuring apparatus according to the present invention;
fig. 2 is a schematic left-view structural diagram of a wafer bonding strength measuring apparatus according to the present invention;
FIG. 3 is a schematic diagram of a magazine structure of a wafer bonding strength measuring apparatus according to the present invention;
fig. 4 is a schematic cross-sectional structural view of a frame of a wafer bonding strength measuring apparatus according to the present invention;
fig. 5 is a schematic view of a detecting mechanism of a wafer bonding strength measuring apparatus according to the present invention;
fig. 6 is a schematic view of a clamping mechanism of a wafer bonding strength measuring apparatus according to the present invention;
FIG. 7 is an enlarged view of the structure at A in FIG. 4;
FIG. 8 is an enlarged view of the structure at B in FIG. 7;
fig. 9 is a schematic view of a tool rest structure of a wafer bonding strength measuring apparatus according to the present invention.
In the figure: 1. a frame; 2. a guide frame; 3. a magazine; 301. a trough; 4. a discharge mechanism; 401. a support shaft; 402. a conveying roller; 403. a conveyor belt; 404. a transfer motor; 5. a lifting mechanism; 501. a limiting block; 502. a lifting screw; 503. a lifting block; 504. a strip-shaped groove; 505. a stepping motor; 6. a detection mechanism; 601. a support plate; 602. a support bar; 603. a moving block; 604. supporting a lug; 605. a guide bar; 606. a tool holder; 607. connecting blocks; 608. a blade; 609. an infrared device; 610. a baffle plate; 611. a return spring; 612. a buffer spring; 7. a clamping mechanism; 701. a fixing rod; 702. moving the plate; 703. a push rod; 704. a clamping block; 705. the spring is tightly propped; 706. a guide plate; 707. a guide groove; 708. an L-shaped rod; 709. pushing the column; 710. a rectangular groove; 711. a limiting ring; 8. a limiting mechanism; 801. a support; 802. a stopper; 9. a pushing mechanism; 901. a supporting block; 902. a rotating rod; 903. a push rod; 904. a chute; 905. an L-shaped push hook.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
Examples
Referring to fig. 1-9, a wafer bonding strength measuring device and a wafer bonding strength measuring method include a frame 1, the frame 1 is of a hollow structure, a guide frame 2 is fixedly mounted at the top of one end of the frame 1, the guide frame 2 is of a C-shaped structure, a magazine 3 matched with the guide frame 2 is slidably mounted on the inner wall of the guide frame 2, a plurality of material grooves 301 matched with the wafer shape are uniformly formed in the inner wall of the magazine 3 along the height direction, a discharging mechanism 4 is arranged inside the frame 1 below the magazine 3, a lifting mechanism 5 is arranged between the guide frame 2 and the magazine 3, a detecting mechanism 6 for detecting the wafer bonding strength is arranged on the upper surface of the frame 1 close to the magazine 3, and clamping mechanisms 7 for clamping the wafer are arranged on the outer surfaces of two opposite sides of the frame 1 close to the magazine 3.
In this embodiment, the detecting mechanism 6 includes a supporting plate 601 fixedly mounted on the upper surfaces of two opposite sides of the frame 1, a plurality of supporting rods 602 are uniformly inserted into the outer surface of the supporting plate 601, the plurality of supporting rods 602 penetrate through the outer surface of the supporting plate 601 and are slidably mounted therewith, a moving block 603 is fixedly mounted at the end of the plurality of supporting rods 602 close to one end of the magazine 3, a baffle plate 610 is fixedly mounted at the other end of the plurality of supporting rods 602, two supporting lugs 604 are symmetrically and fixedly mounted on the outer surface of two opposite sides of the moving block 603, two guide rods 605 are respectively inserted into the outer surfaces of the two supporting lugs 604, two connecting blocks 607 are respectively and fixedly mounted at one ends of the two guide rods 605 far away from the moving block 603, retaining rings are respectively and fixedly mounted at one ends of the two guide rods 605 and the two supporting rods 602 far away from the tool holder 606, and are respectively used for limiting the supporting rods 602 for preventing falling off, a tool holder 606 is fixedly mounted between the two connecting blocks 607, the outer surface of the knife rest 606 close to one side of the magazine 3 is provided with a blade 608, the knife rest 606 is provided with a mounting groove matched with the blade 608, the blade 608 is movably mounted in the mounting groove up and down, an elastic part is mounted in the mounting groove below the blade 608 and used for providing a certain downward moving space for the blade 608 and assisting the blade 608 to reset upwards, after the blade 608 abuts against the bonding position of two wafers, the blade 608 can slightly move along with the movement of the wafers along with the continuous downward movement of the wafers, so that the blade 608 can be inserted between the two wafers under the thrust action of a moving block 603 and a buffer spring 612, after the blade 608 is pulled out from between the two wafers, the blade 608 can automatically return to the initial position upwards to detect the next wafer, the outer surface of the knife rest 606 close to one side of the blade 608 is fixedly provided with an infrared device 609, the infrared device 609 measures the length of a gap between the two wafers through an infrared camera; a pushing mechanism 9 is arranged between the moving block 603 and the magazine 3, a limiting mechanism 8 is arranged between the rack 1 and the connecting block 607, a resetting component is arranged on the outer surface of the supporting rod 602, and a buffering component is arranged on the outer surface of the guide rod 605.
In this embodiment, the pushing mechanism 9 includes two supporting blocks 901 symmetrically and fixedly mounted on the outer surfaces of two opposite sides of the rack 1, the outer surfaces of the two supporting blocks 901 are respectively rotatably mounted with two rotating rods 902, a push rod 903 is fixedly mounted between the outer surfaces of the same ends of the two rotating rods 902 on the adjacent side, the outer surface of the moving block 603 close to the supporting block 901 is penetrated and provided with a chute 904, the push rod 903 is inserted into the chute 904 and slidably mounted on the inner wall of the chute 904, and a plurality of L-shaped push hooks 905 are uniformly and fixedly mounted on the outer surface of the magazine 3 close to the side of the rotating rod 902 away from the push rod 903.
When the device is used, the L-shaped push hook 905 fixedly mounted on the side of the magazine 3 abuts against the outer surface of one end, far away from the push rod 903, of the rotating rod 902, and with the continuous movement of the magazine 3, the L-shaped push hook 905 applies downward pressure to one end of the rotating rod 902, so that the rotating rod 902 can rotate by taking the supporting block 901 as a rotation center, the push rod 903 fixedly mounted at the other end of the rotating rod 902 can push the moving block 603 towards the magazine 3 through the inclined groove 904, the moving block 603 can push the tool rest 606 towards the wafers through the guide rod 605 and the buffer spring 612, a blade 608 arranged on the tool rest 606 is inserted between the two bonded wafers, a gap is formed between the two bonded wafers, meanwhile, the gap length is measured through the infrared device 609, and the wafer bonding strength can be obtained through calculation by the calculation processor according to the gap length.
In this embodiment, the reset component includes a reset spring 611 sleeved on the outer surface of the supporting rod 602, the reset spring 611 is disposed between the supporting plate 601 and the baffle 610, and after the L-shaped push hook 905 on the magazine 3 passes over the rotating rod 902, the moving block 603 can be reset under the elastic force of the reset spring 611, so that the blade 608 can be pulled out from the two wafers.
In this embodiment, the buffering assembly includes a buffering spring 612 sleeved on the outer surface of the guide rod 605, the buffering spring 612 is disposed between the support lug 604 and the connecting block 607, and the buffering spring 612 is used for transmitting the pushing force of the moving block 603 on the cutter holder 606.
After the tool rest 606 abuts against the stopper 802 through the connecting block 607 and stops moving, the moving block 603 continues to be pushed, and the tool rest 606 and the moving block 603 are movably connected, so that a certain moving space is left between the tool rest 606 and the moving block 603 when the moving block 603 continues to move.
In this embodiment, the limiting mechanism 8 includes a bracket 801 fixedly mounted on the upper surfaces of two opposite sides of the frame 1, and a stopper 802 is fixedly mounted on the lower surface of the bracket 801 close to the connecting block 607.
When the wafer bonding strength detection device is used, the stop block 802 fixedly arranged on the lower surface of the bracket 801 can stop the tool rest 606 through the connecting block 607, so that the tool rest 606 can stop moving continuously after moving to the stop block 802, the depth of the blade 608 inserted between two wafers in each group is the same, and the accuracy of wafer bonding strength detection is improved.
In this embodiment, the clamping mechanism 7 includes two fixing rods 701 fixedly mounted on the outer surface of the rack 1, a moving plate 702 is slidably mounted on the outer surface of the two fixing rods 701, a plurality of push rods 703 are uniformly inserted into the outer surface of the moving plate 702, the plurality of push rods 703 penetrate through the outer surface of the moving plate 702 and are slidably mounted therewith, a clamping block 704 is fixedly mounted at one end of each push rod 703 close to the magazine 3, the clamping block 704 penetrates through the outer surface of the guide frame 2 and is slidably mounted therewith, a plurality of rectangular grooves 710 are uniformly penetrated through the outer surface of the magazine 3 close to the trough 301, two L-shaped rods 708 are symmetrically and fixedly mounted on the outer surfaces of two opposite sides of the moving block 603, a pushing column 709 is fixedly mounted on the lower surface of one end of each L-shaped rod 708 far away from the moving block 603, a guide plate 706 is fixedly mounted on the outer surface of one side of the moving plate 702 close to the guide frame 2, a guide groove 707 matched with the pushing column 709 is penetrated through the upper surface of the guide plate 706, the pushing column 709 is slidably mounted with the inner wall of the guide groove 707, a resisting spring 705 is sleeved on the outer surface of the pushing rod 703, a resisting spring 705 is disposed between the moving plate 702 and the clamping block 704, a limiting ring 701 is fixedly mounted on one end of the fixing rod 703 far away from the guide frame 2, and the fixing rod 701, and a limiting ring 711 for preventing the push rod 703 from falling off of the fixing rod 703, and the push rod 703, and preventing the push rod 703 from the limiting ring 711, and the push rod 703 from falling off of the push rod 703.
When the moving block 603 moves towards the magazine 3, the L-shaped rods 708 symmetrically and fixedly mounted on both sides of the moving block 603 move along with the moving block, so that the pushing posts 709 arranged on the lower surface of one end of the L-shaped rods 708, which is far away from the moving block 603, can push the moving block 702 towards the direction of the guide frame 2 through the guide grooves 707 formed in the guide plates 706, the moving block 702 can push the clamping blocks 704 towards the magazine 3 through the abutting springs 705, the clamping blocks 704 clamp both sides of the wafer, and the wafer is prevented from moving when the blade 608 is inserted, so that the blade 608 is difficult to be inserted between two wafers.
In this embodiment, discharge mechanism 4 includes and rotates two transfer rollers 402 of installing between the relative both sides inner wall of frame 1 through two back shaft 401, transfer roller 402 fixed mounting is in the surface of back shaft 401, the surface cover of two transfer rollers 402 is equipped with conveyer belt 403, and two transfer roller 402 horizontal direction parallel arrangement are in the inside of frame 1, the surface fixed mounting of frame 1 has transfer motor 404, the output of transfer motor 404 run through the surface of frame 1 and with the tip fixed mounting of one of them back shaft 401.
When the wafer inspection device is used, the conveying motor 404 drives the conveying rollers 402 to rotate through the supporting shaft 401, so that the conveying belts 403 sleeved on the two conveying rollers 402 convey wafers after detection.
In this embodiment, elevating system 5 is including running through the bar groove 504 of seting up in 2 backs of leading truck, magazine 3 is close to the outer fixed surface of bar groove 504 one side and has elevator 503, elevator 503 and the inner wall slidable mounting of bar groove 504, the leading truck 2 is close to the surface of bar groove 504 upper and lower both ends respectively fixed mounting have two stoppers 501, rotate between two stoppers 501 and install lifting screw 502, lifting screw 502 runs through elevator 503's surface and rather than threaded connection, the last fixed surface who is close to stopper 501 on top installs step motor 505, step motor 505's output run through stopper 501's lower surface and with lifting screw 502's top fixed mounting.
When the wafer detection device is used, the stepping motor 505 drives the lifting screw 502 to rotate, so that the lifting screw 502 drives the material box 3 to move downwards through the lifting block 503, and wafers placed in the material box 3 are detected in sequence.
In this embodiment, the method includes the following steps:
s1: a plurality of wafers to be detected are sequentially placed into a material groove 301 formed in the inner wall of the material box 3 from bottom to top;
s2: the material box 3 is driven to move downwards by the lifting mechanism 5 until the blade 608 is aligned between the two bonded wafers;
s3: when the material box 3 moves downwards, the blade 608 can be inserted between two wafers to be detected through the pushing mechanism 9, so that a gap is generated between the two bonded wafers, meanwhile, the infrared device 609 is used for measuring the length of the gap, and the calculation processor calculates the length of the gap, so that the bonding strength of the wafers can be obtained;
s4: after the bonding strength of the wafer is detected, the material box 3 is continuously driven to move downwards by the lifting mechanism 5, so that the detected wafer is moved out of the material box 3 by the conveyor belt 403, and the detected wafer is collected conveniently.
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects: when the device is used, bonded wafers to be detected are sequentially placed into a trough 301 formed in the inner wall of a magazine 3 from bottom to top, the magazine 3 is driven to move downwards through a lifting mechanism 5, a blade 608 is aligned between the bonded two wafers, when the magazine 3 moves downwards, an L-shaped push hook 905 fixedly mounted on the side of the magazine 3 abuts against the outer surface of one end, away from a push rod 903, of a rotating rod 902, the L-shaped push hook 905 exerts downward pressure on one end of the rotating rod 902 along with the continuous movement of the magazine 3, the rotating rod 902 can rotate by taking a supporting block 901 as a rotation center, the push rod 903 fixedly mounted at the other end of the rotating rod 902 can push a moving block 603 towards the magazine 3 through a chute 904, the moving block 603 can push a tool rest 606 towards the wafers through a guide rod 605 and a buffer spring 612, the blade 608 arranged on the tool rest 606 is inserted between the bonded two wafers, a gap is formed between the bonded two wafers, meanwhile, the gap length is measured by an infrared device 609, the calculation processor according to obtain the bonding strength of the bonded wafers, and the bonded wafers can be detected without scratching by fingers when the bonded wafers.
When the moving block 603 moves towards the magazine 3, the L-shaped rods 708 symmetrically and fixedly mounted on both sides of the moving block 603 move along with the moving block, so that the pushing posts 709 arranged on the lower surface of one end of the L-shaped rods 708, which is far away from the moving block 603, can push the moving block 702 towards the direction of the guide frame 2 through the guide grooves 707 formed in the guide plate 706, so that the moving block 702 can push the clamping blocks 704 towards the magazine 3 through the abutting springs 705, the clamping blocks 704 clamp both sides of the wafer, and the wafer is prevented from moving when the blade 608 is inserted, and the blade 608 is difficult to be inserted between two wafers.
After bonding strength to the wafer detects the completion, continue to drive magazine 3 downstream through elevating system 5, make L shape on the magazine 3 push away hook 905 after crossing bull stick 902, the movable block 603 can reset under reset spring 611's spring action, make blade 608 take out from two wafers, and simultaneously, two clamp splice 704 loosen the centre gripping to the wafer, make the wafer can follow magazine 3 downstream, place in magazine 3 when the wafer of below falls to conveyer belt 403 on, the wafer that conveyer belt 403 will detect shifts out magazine 3, so that collect the wafer after detecting the completion.
For ease of description, spatially relative terms such as "over 8230 \ 8230;,"' over 8230;, \8230; upper surface "," above ", etc. may be used herein to describe the spatial relationship of one device or feature to another device or feature as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary terms "at 8230; \8230; 'above" may include both orientations "at 8230; \8230;' above 8230; 'at 8230;' below 8230;" above ". The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a wafer bonding strength measuring device, includes frame (1), frame (1) is hollow structure, its characterized in that, the top fixed mounting of frame (1) one end has leading truck (2), leading truck (2) are C shape structure, the inner wall slidable mounting of leading truck (2) has rather than assorted magazine (3), a plurality ofly and wafer shape assorted silo (301) have evenly been seted up along its direction of height's inner wall in magazine (3), inside that frame (1) is located magazine (3) below is equipped with shedding mechanism (4), be equipped with elevating system (5) between leading truck (2) and magazine (3), the upper surface that frame (1) is close to magazine (3) is equipped with detection mechanism (6) that are used for detecting wafer bonding strength, the surface that frame (1) is close to magazine (3) both sides relatively is equipped with clamping mechanism (7) that are used for pressing from both sides tight wafer.
2. The wafer bonding strength measuring device according to claim 1, wherein the detecting mechanism (6) comprises a supporting plate (601) fixedly mounted on the upper surfaces of two opposite sides of the frame (1), a plurality of supporting rods (602) are uniformly inserted into the outer surface of the supporting plate (601), the plurality of supporting rods (602) penetrate through the outer surface of the supporting plate (601) and are slidably mounted with the supporting plate, a moving block (603) is fixedly mounted at the end part of each supporting rod (602) close to one end of the magazine (3), a baffle plate (610) is fixedly mounted at the other end of each supporting rod (602), two supporting lugs (604) are symmetrically and fixedly mounted on the outer surface of two opposite sides of the moving block (603), two guide rods (605) are respectively inserted into the outer surfaces of the two supporting lugs (604), two connecting blocks (607) are respectively and fixedly mounted at one ends of the two guide rods (603) far away from the moving block, a tool holder (606) is fixedly mounted between the two connecting blocks (607), a blade (608) is arranged on the outer surface of one side of the tool holder (606) close to the magazine (3), a blade (609) is fixedly mounted on the outer surface of one side of the tool holder (606) close to the blade (608), a pushing mechanism for the moving block (607) is arranged between the magazine (3) and the magazine (3), the outer surface of the support rod (602) is provided with a reset component, and the outer surface of the guide rod (605) is provided with a buffer component.
3. The wafer bonding strength measuring device according to claim 2, wherein the pushing mechanism (9) comprises two supporting blocks (901) symmetrically and fixedly mounted on outer surfaces of two opposite sides of the rack (1), the outer surfaces of the two supporting blocks (901) are respectively rotatably mounted with two rotating rods (902), a push rod (903) is fixedly mounted between the outer surfaces of the two rotating rods (902) on the same side, the outer surface of the moving block (603) close to the supporting blocks (901) is provided with a chute (904) in a penetrating manner, the push rod (903) is inserted into the chute (904) and is slidably mounted with the inner wall of the chute (904), and a plurality of L-shaped push hooks (905) are uniformly and fixedly mounted on the outer surface of one side, away from the push rod (903), of the magazine (3) close to the rotating rods (902).
4. The wafer bonding strength measuring device of claim 2, wherein the return assembly comprises a return spring (611) sleeved on the outer surface of the supporting rod (602), and the return spring (611) is disposed between the supporting plate (601) and the baffle (610).
5. The wafer bonding strength measuring device of claim 2, wherein the buffer assembly comprises a buffer spring (612) sleeved on the outer surface of the guide rod (605), and the buffer spring (612) is arranged between the support lug (604) and the connecting block (607).
6. A wafer bonding strength measuring device according to claim 2, wherein the limiting mechanism (8) comprises brackets (801) fixedly mounted on the upper surfaces of two opposite sides of the frame (1), and the lower surface of the bracket (801) near the connecting block (607) is fixedly mounted with a stop block (802).
7. The wafer bonding strength measuring device according to claim 1, wherein the clamping mechanism (7) comprises two fixing rods (701) fixedly mounted on the outer surface of the frame (1), a moving plate (702) is slidably mounted on the outer surface of the two fixing rods (701), a plurality of push rods (703) are uniformly inserted into the outer surface of the moving plate (702), the plurality of push rods (703) penetrate through the outer surface of the moving plate (702) and are slidably mounted therewith, a clamping block (704) is fixedly mounted on the end portion, close to the magazine (3), of the plurality of push rods (703), the clamping block (704) penetrates through the outer surface of the guide frame (2) and is slidably mounted therewith, a plurality of rectangular grooves (710) are uniformly penetrated through the outer surface of the magazine (3), two L-shaped rods (708) are symmetrically and fixedly mounted on the outer surfaces of two opposite sides of the moving block (603), a push column (709) is fixedly mounted on the lower surface of one end, far away from the moving block (603), a guide plate (702) is fixedly mounted on one side close to the guide frame (2), a guide plate (709) is fixedly mounted on the outer surface, a guide column (706) matched with the guide groove (706), and a guide column (707) is mounted on the inner wall of the guide plate (706), the outer surface of the push rod (703) is sleeved with a tight-supporting spring (705), the tight-supporting spring (705) is arranged between the moving plate (702) and the clamping block (704), and limiting rings (711) are fixedly mounted at the ends, far away from the guide frame (2), of the fixed rod (701) and the push rod (703).
8. The wafer bonding strength measuring device according to claim 1, wherein the unloading mechanism (4) comprises two conveying rollers (402) rotatably mounted between the inner walls of the two opposite sides of the rack (1) through two supporting shafts (401), a conveying belt (403) is sleeved on the outer surfaces of the two conveying rollers (402), the two conveying rollers (402) are horizontally arranged in the rack (1) in parallel, a conveying motor (404) is fixedly mounted on the outer surface of the rack (1), and the output end of the conveying motor (404) penetrates through the outer surface of the rack (1) and is fixedly mounted with the end of one of the supporting shafts (401).
9. The wafer bonding strength measuring device according to claim 1, wherein the lifting mechanism (5) comprises a strip-shaped groove (504) penetrating through the back of the guide frame (2), the outer surface of the magazine (3) close to one side of the strip-shaped groove (504) is fixedly provided with a lifting block (503), the lifting block (503) is slidably mounted on the inner wall of the strip-shaped groove (504), the outer surface of the guide frame (2) close to the upper end and the lower end of the strip-shaped groove (504) is fixedly provided with two limiting blocks (501), two of the limiting blocks (501) are rotatably mounted with a lifting screw (502) therebetween, the lifting screw (502) penetrates through the outer surface of the lifting block (503) and is in threaded connection with the lifting screw, the upper surface of the limiting block (501) close to the top end is fixedly provided with a stepping motor (505), and the output end of the stepping motor (505) penetrates through the lower surface of the limiting block (501) and is fixedly mounted on the top end of the lifting screw (502).
10. A method of measuring wafer bonding strength as claimed in claims 1-9, characterized by comprising the steps of:
s1: a plurality of wafers to be detected are sequentially placed into a material groove (301) formed in the inner wall of the material box (3) from bottom to top;
s2: the material box (3) is driven to move downwards by the lifting mechanism (5) until the blade (608) is aligned between the two bonded wafers;
s3: when the material box (3) moves downwards, the blade (608) can be inserted between two wafers to be detected through the pushing mechanism (9), so that a gap is generated between the two bonded wafers, meanwhile, the length of the gap is measured through the infrared device (609), and the bonding strength of the wafers can be obtained through calculation through the calculation processor according to the length of the gap;
s4: after the bonding strength of the wafer is detected, the material box (3) is continuously driven to move downwards through the lifting mechanism (5), so that the detected wafer is moved out of the material box (3) by the conveyor belt (403), and the detected wafer is collected conveniently.
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