CN115642116B - Wafer bonding strength measuring device and measuring method - Google Patents
Wafer bonding strength measuring device and measuring method Download PDFInfo
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- CN115642116B CN115642116B CN202211375054.7A CN202211375054A CN115642116B CN 115642116 B CN115642116 B CN 115642116B CN 202211375054 A CN202211375054 A CN 202211375054A CN 115642116 B CN115642116 B CN 115642116B
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- 238000004364 calculation method Methods 0.000 claims description 9
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- 230000008569 process Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
The application discloses a wafer bonding strength measuring device and a measuring method, wherein the device comprises a frame, the frame is of a hollow structure, a guide frame is fixedly arranged at the top of one end of the frame, the guide frame is of a C-shaped structure, a material box matched with the guide frame is slidably arranged on the inner wall of the guide frame, and a plurality of material grooves matched with the wafer shape are uniformly formed in the inner wall of the material box along the height direction. According to the application, the material box is driven to move downwards through the lifting mechanism, the knife rest is pushed towards the wafer, so that the blade arranged on the knife rest is inserted between two bonded wafers, a gap is formed between the two bonded wafers, meanwhile, the gap length is measured by the infrared device, and the bonding strength of the wafer can be obtained by calculating through the calculating processor according to the gap length, and a detector is not required to hold the blade between the two bonded wafers, so that fingers are prevented from being scratched when the blade is used.
Description
Technical Field
The application relates to the technical field of wafer processing and manufacturing, in particular to a wafer bonding strength measuring device and a measuring method.
Background
The low-temperature wafer direct bonding technology is the most popular bonding method studied in recent years, and is the most difficult bonding method with the highest requirements on the surface morphology and the surface treatment process of the silicon wafer, and the defect that the bonded wafer pair cannot be repaired due to poor surface morphology or surface treatment of the silicon wafer. The process of wafer direct bonding has undergone a process from early high temperature wafer bonding to low temperature wafer bonding which is currently widely studied and popularized, mainly in order to overcome the influence of high temperature on devices, so people are focusing on the study of low temperature wafer bonding. The main studies at present include hydrophilic bonding and hydrophobic bonding. The nature of low temperature direct bonding is that by surface treatment of the silicon surface, the surface energy is increased, and then two or more silicon wafers are bonded together by water molecule bridging (hydrophilic bonding) or HF molecule bridging (hydrophobic bonding) and intermolecular forces.
In the low-temperature wafer direct bonding technology, bonding strength is one of the most important measurement characteristics, and is an important index related to bonding quality. The bonding strength is small, and the two bonded wafers are likely to crack in the processing process, so that failure is caused. The small variation of manufacturing process parameters (especially the surface pretreatment step and bonding conditions of the wafer) can directly influence the strength performance of a bonding interface, so that the bonding strength is insufficient to reflect certain links in the bonding process, and problems are caused; the bonding strength is high, and the bonding interface cracks and voids are slightly affected by the tight contact of the two wafers, so that devices manufactured by using the bonding technology are less prone to failure caused by damage of environmental factors such as temperature, humidity and the like.
At present, the bonding strength measurement modes are destructive measurement modes, including a crack propagation and diffusion method, a straight pulling method, a micro wedge groove test method, a static oil pressure test method and a four-point bending test method, wherein the crack propagation and diffusion method is most commonly used. The crack propagation and propagation method is commonly called a blade insertion method or a double cantilever beam test method, is the most traditional and most common method for measuring surface energy (namely bonding strength), two wafers are separated by inserting a thin blade into a bonding interface, gaps are formed between the two wafers, and then the bonding strength of the wafers is finally obtained by measuring the lengths of the gaps through infrared detection or ultrasonic detection and other systems and calculating.
When the bonding strength of a wafer is measured by a crack propagation and propagation method, a tester usually holds the blade between two wafers, and the blade is easy to slip on the wafer due to the fact that the surface of the wafer is smooth, so that the blade is easy to scratch fingers.
Disclosure of Invention
The application aims to solve the defects in the prior art and provides a wafer bonding strength measuring device and a measuring method.
In order to achieve the above purpose, the present application adopts the following technical scheme:
the utility model provides a wafer bonding strength measuring device and measuring method, includes the frame, the frame is hollow structure, the top fixed mounting of frame one end has the leading truck, the leading truck is C shape structure, the inner wall slidable mounting of leading truck has rather than assorted magazine, a plurality of and wafer form assorted silo have evenly been seted up to the inner wall of magazine along its direction of height, the frame is located the inside of magazine below and is equipped with discharge mechanism, be equipped with elevating system between leading truck and the magazine, the upper surface that the frame is close to the magazine is equipped with the detection mechanism that is used for detecting wafer bonding strength, the surface that the frame is close to the relative both sides of magazine is equipped with the clamping mechanism who is used for pressing from both sides tight wafer.
As a further scheme of the application, the detection mechanism comprises a supporting plate fixedly arranged on the upper surfaces of two opposite sides of the frame, a plurality of supporting rods are uniformly inserted into the outer surface of the supporting plate, the supporting rods penetrate through the outer surface of the supporting plate and are slidably arranged with the supporting plate, a moving block is fixedly arranged at the end part of the supporting rods, which is close to one end of the material box, a baffle is fixedly arranged at the other end of the supporting rods, two lugs are symmetrically and fixedly arranged on the outer surfaces of two opposite sides of the moving block, two guide rods are respectively inserted into the outer surfaces of the two lugs, two connecting blocks are respectively and fixedly arranged at one ends of the two guide rods, which are far away from the moving block, a knife rest is fixedly arranged between the two connecting blocks, a blade is arranged on the outer surface of the knife rest, which is close to one side of the blade, an infrared device is fixedly arranged between the moving block and the material box, a limiting mechanism is arranged between the frame and the connecting blocks, a reset component is arranged on the outer surface of the supporting rods, and a buffer component is arranged on the outer surfaces of the guide rods.
As a further scheme of the application, the pushing mechanism comprises two supporting blocks symmetrically and fixedly arranged on the outer surfaces of two opposite sides of the frame, two rotating rods are respectively rotatably arranged on the outer surfaces of the two supporting blocks, a pushing rod is fixedly arranged between the outer surfaces of one side, adjacent to the same ends, of the two rotating rods, a chute is arranged on the outer surface, close to the supporting blocks, of the moving block in a penetrating way, the pushing rod is inserted into the chute and is slidably arranged with the inner wall of the chute, and a plurality of L-shaped pushing hooks are uniformly and fixedly arranged on the outer surface, close to the rotating rod, of one side, far away from the pushing rod, of the material box.
As a further scheme of the application, the reset assembly comprises a reset spring sleeved on the outer surface of the supporting rod, and the reset spring is arranged between the supporting plate and the baffle plate.
As a further scheme of the application, the buffer assembly comprises a buffer spring sleeved on the outer surface of the guide rod, and the buffer spring is arranged between the support lugs and the connecting block.
As a further scheme of the application, the limiting mechanism comprises brackets fixedly arranged on the upper surfaces of the two opposite sides of the frame, and a stop block is fixedly arranged on the lower surface of the bracket, which is close to the connecting block.
As a further scheme of the application, the clamping mechanism comprises two fixing rods fixedly arranged on the outer surface of the frame, the outer surfaces of the two fixing rods are slidably provided with a moving plate, the outer surfaces of the moving plate are uniformly inserted with a plurality of push rods, the push rods penetrate through the outer surface of the moving plate and are slidably arranged with the outer surface of the moving plate, a clamping block is fixedly arranged at one end part of each push rod close to the material box, the clamping block penetrates through the outer surface of the guide frame and is slidably arranged with the outer surface of the guide frame, a plurality of rectangular grooves are uniformly formed in the outer surface of each material box close to the material groove in a penetrating manner, two L-shaped rods are symmetrically and fixedly arranged on the outer surfaces of two opposite sides of the moving block, a push post is fixedly arranged on the lower surface of one end, far away from the moving block, of each moving plate, a guide plate is fixedly arranged on the outer surface, close to one side of the guide frame, of each guide plate is penetrated with a guide groove matched with the push post, the inner wall of each push post is slidably arranged with the guide groove, the outer surface of each push rod is sleeved with a tight spring, the tight spring is arranged between the moving plate and the clamping block, and one end, which is far away from the guide frame, and the fixed and is fixedly provided with a limiting ring.
As a further scheme of the application, the unloading mechanism comprises two conveying rollers rotatably arranged between the inner walls of the two opposite sides of the frame through two supporting shafts, conveying belts are sleeved on the outer surfaces of the two conveying rollers, the two conveying rollers are horizontally arranged in the frame in parallel, a conveying motor is fixedly arranged on the outer surface of the frame, and the output end of the conveying motor penetrates through the outer surface of the frame and is fixedly arranged with the end part of one supporting shaft.
As a further scheme of the application, the lifting mechanism comprises a strip-shaped groove penetrating through the back of the guide frame, a lifting block is fixedly arranged on the outer surface of one side, close to the strip-shaped groove, of the material box, the lifting block is slidably arranged on the inner wall of the strip-shaped groove, two limiting blocks are respectively and fixedly arranged on the outer surfaces, close to the upper end and the lower end of the strip-shaped groove, of the guide frame, lifting screws are rotatably arranged between the two limiting blocks, the lifting screws penetrate through the outer surfaces of the lifting block and are in threaded connection with the lifting block, a stepping motor is fixedly arranged on the upper surface, close to the top end, of the limiting blocks, and the output end of the stepping motor penetrates through the lower surface of the limiting blocks and is fixedly arranged on the top end of the lifting screws.
As a further aspect of the present application, the method comprises the steps of:
s1: sequentially placing a plurality of wafers to be detected into a trough formed in the inner wall of a material box from bottom to top;
s2: the material box is driven to move downwards by the lifting mechanism until the blade is aligned between two wafers which are well bonded;
s3: when the material box moves downwards, the blade can be inserted between two wafers to be detected through the pushing mechanism, so that gaps are generated between the two wafers which are well bonded, meanwhile, the infrared device is utilized to measure the lengths of the gaps, and the bonding strength of the wafers can be obtained through calculation of the calculation processor according to the lengths of the gaps;
s4: after the bonding strength of the wafer is detected, the lifting mechanism continuously drives the material box to move downwards, so that the detected wafer is moved out of the material box by the conveyor belt, and the detected wafer is collected.
The beneficial effects of the application are as follows:
1. when driving the magazine through elevating system and moving downwards, fixed mounting pushes away the hook in the L shape of magazine side and will push away the movable block to the direction of magazine through pushing mechanism, make the movable block can be through guide arm and buffer spring with the blade carrier to the wafer promotion, make the blade that sets up on the blade carrier insert between two wafers that bond well, make produce the gap between two wafers that bond well, simultaneously, utilize infrared device to measure gap length, and calculate through calculation processor according to gap length, can obtain the bonding strength of wafer, do not need the detection personnel to hold the blade and insert between two wafers that bond well, prevent to scratch finger when using the blade.
2. When the movable block moves towards the direction of the material box, the L-shaped rods symmetrically and fixedly arranged on the two sides of the movable block move along with the movable block, so that the pushing posts arranged on the lower surface of one end of the L-shaped rods far away from the movable block can push the movable plate towards the direction of the guide frame through the guide grooves formed in the guide plates, the movable plate can push the clamping block towards the direction of the material box through the abutting springs, the clamping block clamps the two sides of the wafer, and the wafer is prevented from moving when the blade is inserted, so that the blade is difficult to insert between the two wafers.
3. After the bonding strength to the wafer detects and accomplish the back, continue to drive the magazine and move down through elevating system, make L shape pushing catch on the magazine after crossing the bull stick, the movable block can reset under reset spring's elasticity effect, make the blade can follow two wafers and take out, simultaneously, two clamp splice unclampes the centre gripping to the wafer, make the wafer can follow the magazine and move down, place when the wafer of bottommost falls onto the conveyer belt in the magazine, the conveyer belt shifts out the magazine with the wafer that detects, so as to collect the wafer after the detection is accomplished.
Drawings
FIG. 1 is a schematic diagram of a right-side view of a wafer bonding strength measurement device according to the present application;
FIG. 2 is a schematic diagram illustrating a left-hand structure of a wafer bonding strength measurement apparatus according to the present application;
FIG. 3 is a schematic diagram of a material box of a wafer bonding strength measuring device according to the present application;
FIG. 4 is a schematic diagram illustrating a cross-sectional structure of a frame of a wafer bonding strength measurement device according to the present application;
FIG. 5 is a schematic diagram of a detecting mechanism of a wafer bonding strength measuring device according to the present application;
FIG. 6 is a schematic diagram of a clamping mechanism of a wafer bonding strength measuring device according to the present application;
FIG. 7 is an enlarged view of the structure of FIG. 4 at A;
FIG. 8 is an enlarged view of the structure at B in FIG. 7;
fig. 9 is a schematic diagram of a tool rest structure of a wafer bonding strength measurement device according to the present application.
In the figure: 1. a frame; 2. a guide frame; 3. a magazine; 301. a trough; 4. a discharging mechanism; 401. a support shaft; 402. a conveying roller; 403. a conveyor belt; 404. a conveying motor; 5. a lifting mechanism; 501. a limiting block; 502. lifting screw rods; 503. a lifting block; 504. a bar-shaped groove; 505. a stepping motor; 6. a detection mechanism; 601. a support plate; 602. a support rod; 603. a moving block; 604. a support lug; 605. a guide rod; 606. a tool holder; 607. a connecting block; 608. a blade; 609. an infrared device; 610. a baffle; 611. a return spring; 612. a buffer spring; 7. a clamping mechanism; 701. a fixed rod; 702. a moving plate; 703. a push rod; 704. clamping blocks; 705. a spring is abutted tightly; 706. a guide plate; 707. a guide groove; 708. an L-shaped rod; 709. pushing a column; 710. rectangular grooves; 711. a limiting ring; 8. a limiting mechanism; 801. a bracket; 802. a stop block; 9. a pushing mechanism; 901. a support block; 902. a rotating rod; 903. a push rod; 904. a chute; 905. l-shaped push hook.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
Examples
Referring to fig. 1-9, a wafer bonding strength measuring device and a measuring method thereof, the wafer bonding strength measuring device comprises a frame 1, wherein the frame 1 is of a hollow structure, a guide frame 2 is fixedly arranged at the top of one end of the frame 1, the guide frame 2 is of a C-shaped structure, a material box 3 matched with the guide frame 2 is slidably arranged on the inner wall of the guide frame 2, a plurality of material tanks 301 matched with the wafer shape are uniformly arranged on the inner wall of the material box 3 along the height direction, a discharging mechanism 4 is arranged in the frame 1 below the material box 3, a lifting mechanism 5 is arranged between the guide frame 2 and the material box 3, a detecting mechanism 6 for detecting the wafer bonding strength is arranged on the upper surface of the frame 1 close to the material box 3, and clamping mechanisms 7 for clamping wafers are arranged on the outer surfaces of the frame 1 close to the two opposite sides of the material box 3.
In this embodiment, the detection mechanism 6 includes a support plate 601 fixedly mounted on the upper surfaces of two opposite sides of the frame 1, a plurality of support rods 602 are uniformly inserted into the outer surface of the support plate 601, the plurality of support rods 602 penetrate through the outer surface of the support plate 601 and are slidably mounted with the support plate, a moving block 603 is fixedly mounted at the end of the plurality of support rods 602 near one end of the magazine 3, a baffle 610 is fixedly mounted at the other end of the plurality of support rods 602, two lugs 604 are symmetrically and fixedly mounted on the outer surfaces of two opposite sides of the moving block 603, two guide rods 605 are respectively inserted into the outer surfaces of the two lugs 604, two connecting blocks 607 are respectively fixedly mounted at the ends of the two guide rods 605 far from the moving block 603, check rings are respectively fixedly mounted at the ends of the two guide rods 605 and the two support rods 602 far from the tool rest 606, the guide rods 605 are respectively used for limiting the support rods 602 to prevent falling, a tool rest 606 is fixedly mounted between the two connecting blocks 607, blade 608 is arranged on the outer surface of one side of the blade holder 606 close to the material box 3, a mounting groove matched with the blade 608 is arranged on the blade holder 606, the blade 608 is movably mounted in the mounting groove up and down, an elastic piece is mounted in the mounting groove below the blade 608, and is used for providing a certain downward movement space for the blade 608, and simultaneously assisting in upward resetting of the blade 608, after the bonding position of the blade 608 and two wafers is propped against, the blade 608 can slightly move along with the movement of the wafers along with the downward movement of the wafers, so that the blade 608 can be inserted between the two wafers under the action of the thrust of a moving block 603 and a buffer spring 612, after the blade 608 is pulled out from the space between the two wafers, the blade 608 can automatically return to the initial position upwards so as to detect the next wafer, an infrared device 609 is fixedly mounted on the outer surface of one side of the blade holder 606 close to the blade 608, the infrared device 609 measures the gap length between two wafers through an infrared camera; a pushing mechanism 9 is arranged between the moving block 603 and the material box 3, a limiting mechanism 8 is arranged between the frame 1 and the connecting block 607, a reset component is arranged on the outer surface of the supporting rod 602, and a buffer component is arranged on the outer surface of the guide rod 605.
In this embodiment, the pushing mechanism 9 includes two supporting blocks 901 symmetrically and fixedly installed on the outer surfaces of two opposite sides of the frame 1, two rotating rods 902 are respectively rotatably installed on the outer surfaces of the two supporting blocks 901, a pushing rod 903 is fixedly installed between the outer surfaces of two adjacent sides of the same ends of the two rotating rods 902, a chute 904 is formed by penetrating the outer surface of the moving block 603, which is close to the supporting block 901, the pushing rod 903 is inserted into the chute 904 and slidably installed with the inner wall of the chute 904, and a plurality of L-shaped pushing hooks 905 are uniformly and fixedly installed on the outer surface, which is close to the rotating rod 902 and far away from one side of the pushing rod 903, of the material box 3.
When the wafer bonding machine is used, the L-shaped push hook 905 fixedly arranged on the side edge of the material box 3 is abutted against the outer surface of one end of the rotary rod 902 away from the push rod 903, along with the continued movement of the material box 3, the L-shaped push hook 905 applies downward pressure to one end of the rotary rod 902, so that the rotary rod 902 can rotate by taking the supporting block 901 as a rotation center, the push rod 903 fixedly arranged on the other end of the rotary rod 902 can push the moving block 603 towards the direction of the material box 3 through the chute 904, the moving block 603 can push the tool rest 606 towards the wafer through the guide rod 605 and the buffer spring 612, the blade 608 arranged on the tool rest 606 is inserted between two wafers which are well bonded, a gap is formed between the two wafers which are well bonded, meanwhile, the gap length is measured by the infrared device 609, and the bonding strength of the wafers can be obtained through calculation of the calculation processor according to the gap length.
In this embodiment, the reset assembly includes a reset spring 611 sleeved on the outer surface of the support rod 602, the reset spring 611 is disposed between the support plate 601 and the baffle 610, and after the L-shaped push hook 905 on the magazine 3 passes over the rotating rod 902, the moving block 603 can reset under the action of the elastic force of the reset spring 611, so that the blade 608 can be pulled out from two wafers.
In this embodiment, the buffer assembly includes a buffer spring 612 sleeved on the outer surface of the guide rod 605, where the buffer spring 612 is disposed between the support lug 604 and the connection block 607, and the buffer spring 612 is used to transmit the thrust of the moving block 603 to the tool rest 606.
After the tool rest 606 abuts against the stop block 802 through the connecting block 607 to stop moving, the moving block 603 is still pushed continuously, and when the moving block 603 is continuously moved, a certain movable space is reserved between the tool rest 606 and the moving block 603 by movably connecting the tool rest 606 and the moving block 603.
In this embodiment, the limiting mechanism 8 includes a bracket 801 fixedly mounted on the upper surfaces of the opposite sides of the frame 1, and a stopper 802 is fixedly mounted on the lower surface of the bracket 801 near the connection block 607.
When the wafer bonding strength detection device is used, the stop block 802 fixedly mounted on the lower surface of the support 801 can block the tool rest 606 through the connecting block 607, so that the tool rest 606 can stop moving continuously after moving to the stop block 802, the depth of the insert 608 inserted between every two wafers is the same, and the accuracy of wafer bonding strength detection is improved.
In this embodiment, the clamping mechanism 7 includes two fixing rods 701 fixedly mounted on the outer surface of the frame 1, the outer surfaces of the two fixing rods 701 are slidably mounted with a moving plate 702, a plurality of push rods 703 are uniformly inserted into the outer surface of the moving plate 702, the plurality of push rods 703 penetrate through the outer surface of the moving plate 702 and are slidably mounted with the same, a clamping block 704 is fixedly mounted at one end portion of the plurality of push rods 703 close to the material box 3, the clamping block 704 penetrates through the outer surface of the guide frame 2 and is slidably mounted with the same, a plurality of rectangular grooves 710 are uniformly formed in the outer surface of the material box 3 close to the material groove 301 in a penetrating manner, two L-shaped rods 708 are symmetrically and fixedly mounted on two opposite outer surfaces of the moving block 603, push posts 709 are fixedly mounted on the lower surface of one end of the two L-shaped rods 708 away from the moving block 603, guide plates 706 are fixedly mounted on the outer surface of the moving plate 702 close to one side of the guide frame 2, guide plates 706 are fixedly mounted on the upper surface of the guide plate 706, guide grooves 707 matched with the push posts 709 are formed in penetrating through the upper surface of the guide plates 709, the inner walls of the guide grooves 707 are slidably mounted with the guide frames 707, the outer surfaces of the push rods 703 are sleeved with abutting springs 705, the abutting springs 705 are arranged between the moving plate 702 and the moving plate 704 and the clamping blocks 704, the outer surfaces of the guide plates are close to the guide frames 703, the guide rings 703 are arranged on the guide rings 703, the guide rings 703 are arranged on the inner walls of the guide rings, and the guide rings 703 are far from the fixing shafts are arranged to the fixing shafts and are far from the fixing shafts 703, and are used for fixing the fixing shafts to and fixing the one end of the fixing shafts 703.
When the moving block 603 moves towards the direction of the material box 3, the L-shaped rods 708 symmetrically and fixedly arranged at two sides of the moving block 603 move along with the moving block, so that the L-shaped rods 708 are far away from the pushing posts 709 arranged on the lower surface of one end of the moving block 603, the moving plate 702 can be pushed towards the direction of the guide frame 2 through the guide grooves 707 formed in the guide plate 706, the moving plate 702 can push the clamping block 704 towards the direction of the material box 3 through the abutting springs 705, the clamping block 704 clamps two sides of a wafer, and the wafer is prevented from moving when the blade 608 is inserted, so that the blade 608 is difficult to insert between two wafers.
In this embodiment, the unloading mechanism 4 includes two conveying rollers 402 rotatably installed between inner walls of opposite sides of the frame 1 through two supporting shafts 401, the conveying rollers 402 are fixedly installed on the outer surfaces of the supporting shafts 401, conveying belts 403 are sleeved on the outer surfaces of the two conveying rollers 402, the two conveying rollers 402 are horizontally arranged in the frame 1 in parallel, a conveying motor 404 is fixedly installed on the outer surface of the frame 1, and an output end of the conveying motor 404 penetrates through the outer surface of the frame 1 and is fixedly installed with an end portion of one supporting shaft 401.
When in use, the conveying motor 404 drives the conveying rollers 402 to rotate through the supporting shaft 401, so that the conveying belts 403 sleeved on the two conveying rollers 402 convey the detected wafers.
In this embodiment, elevating system 5 is including running through the bar groove 504 of seting up in the guide frame 2 back, the magazine 3 is close to the surface fixed mounting of bar groove 504 one side and has lifting block 503, lifting block 503 and the inner wall slidable mounting of bar groove 504, the guide frame 2 is close to the surface at both ends about bar groove 504 respectively fixed mounting have two stopper 501, rotate between two stopper 501 and install lifting screw 502, lifting screw 502 runs through the surface of lifting block 503 and rather than threaded connection, the upper surface fixed mounting of stopper 501 near the top has step motor 505, step motor 505's output runs through the lower surface of stopper 501 and rather than the top fixed mounting of lifting screw 502.
When the wafer detecting device is used, the lifting screw 502 is driven to rotate through the stepping motor 505, and the lifting screw 502 drives the material box 3 to move downwards through the lifting block 503, so that wafers placed in the material box 3 are sequentially detected.
In this embodiment, the method includes the following steps:
s1: sequentially placing a plurality of wafers to be detected into a trough 301 formed in the inner wall of the material box 3 from bottom to top;
s2: the material box 3 is driven to move downwards by the lifting mechanism 5 until the blade 608 is aligned between the two bonded wafers;
s3: while the material box 3 moves downwards, the blade 608 can be inserted between two wafers to be detected through the pushing mechanism 9, so that gaps are generated between the two wafers to be detected, meanwhile, the infrared device 609 is used for measuring the gap length, and the bonding strength of the wafers can be obtained through calculation of a calculation processor according to the gap length;
s4: after the bonding strength of the wafer is detected, the lifting mechanism 5 continues to drive the material box 3 to move downwards, so that the conveyor 403 moves the detected wafer out of the material box 3, and the detected wafer is collected.
From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects: when the wafer to be detected is used, the bonded wafers to be detected are sequentially placed into the trough 301 formed in the inner wall of the material box 3 from bottom to top, the material box 3 is driven to move downwards through the lifting mechanism 5, the blade 608 is aligned between the bonded two wafers, the L-shaped push hooks 905 fixedly mounted on the side edge of the material box 3 are abutted against the outer surface of one end of the rotating rod 902 far away from the push rod 903 while the material box 3 moves downwards, the L-shaped push hooks 905 apply downward pressure to one end of the rotating rod 902 along with the continuous movement of the material box 3, the rotating rod 902 can rotate by taking the supporting block 901 as a rotation center, the push rod 903 fixedly mounted at the other end of the rotating rod 902 can push the moving block 603 towards the material box 3 through the chute 904, the moving block 603 can push the blade holder 606 towards the wafers through the guide rod 605 and the buffer spring 612, the blade 608 arranged on the blade holder 606 is inserted between the bonded two wafers, gaps are formed between the bonded two wafers, simultaneously, the slit length of the slit is measured by the aid of the device 609, the slit length is calculated according to the slit length, and the slit infrared strength is calculated by the processor, namely, the wafer 608 can be prevented from being scratched when the wafers 608 are required to be inserted between the two wafers by hands, and a person can be prevented from being scratched.
When the moving block 603 moves towards the direction of the material box 3, the L-shaped rods 708 symmetrically and fixedly arranged at two sides of the moving block 603 move along with the moving block, so that the pushing posts 709 arranged on the lower surface of one end of the L-shaped rods 708 far away from the moving block 603 can push the moving plate 702 towards the direction of the guide frame 2 through the guide grooves 707 formed on the guide plate 706, the moving plate 702 can push the clamping block 704 towards the direction of the material box 3 through the abutting springs 705, the clamping block 704 clamps two sides of a wafer, and the wafer is prevented from moving when the blade 608 is inserted, so that the blade 608 is difficult to insert between two wafers.
After the bonding strength of the wafers is detected, the lifting mechanism 5 is used for continuously driving the material box 3 to move downwards, so that the L-shaped push hook 905 on the material box 3 passes over the rotating rod 902, the moving block 603 can reset under the action of the elastic force of the reset spring 611, the blade 608 can be pulled out of the two wafers, meanwhile, the two clamping blocks 704 are used for loosening the clamping of the wafers, the wafers can move downwards along with the material box 3, and when the lowest wafer placed in the material box 3 falls onto the conveying belt 403, the conveying belt 403 moves the detected wafers out of the material box 3 so as to collect the detected wafers.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the application described herein may be capable of being practiced otherwise than as specifically illustrated and described. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (2)
1. The utility model provides a wafer bonding strength measuring device, includes frame (1), frame (1) is hollow structure, its characterized in that, the top fixed mounting of frame (1) one end has leading truck (2), leading truck (2) are C shape structure, the inner wall slidable mounting of leading truck (2) has material box (3) rather than assorted, material box (3) evenly offer a plurality of silo (301) rather than wafer form assorted along the inner wall of its direction of height, frame (1) is located inside of material box (3) below and is equipped with shedding mechanism (4), be equipped with elevating system (5) between leading truck (2) and material box (3), the upper surface that frame (1) is close to material box (3) is equipped with detection mechanism (6) that are used for detecting wafer bonding strength, the surface that frame (1) is close to material box (3) both sides are equipped with clamping mechanism (7) that are used for pressing from both sides, detection mechanism (6) are including fixed mounting in backup pad (601) on the upper surface of frame (1) both sides relatively, backup pad (601) are equipped with evenly and insert and are equipped with many backup pads (602) and are installed and are run through with many one end (602) and are installed with the backup pad (602), the other ends of the support rods (602) are fixedly provided with baffle plates (610), the outer surfaces of two opposite sides of the moving block (603) are symmetrically and fixedly provided with two support lugs (604), the outer surfaces of the two support lugs (604) are respectively provided with two guide rods (605) in an inserted mode, one ends of the guide rods (605) far away from the moving block (603) are respectively and fixedly provided with two connecting blocks (607), a knife rest (606) is fixedly arranged between the two connecting blocks (607), the outer surfaces of one side of the knife rest (606) close to the material box (3) are provided with blades (608), the outer surfaces of one side of the knife rest (606) close to the blades (608) are fixedly provided with infrared devices (609), a pushing mechanism (9) is arranged between the moving block (603) and the material box (3), the outer surfaces of the machine frame (1) and the connecting blocks (607) are provided with limiting mechanisms (8), the outer surfaces of the support rods (605) are provided with reset components, the outer surfaces of the guide rods (605) are provided with buffer components, the pushing mechanism (9) comprises two support blocks (901) symmetrically and fixedly arranged on the outer surfaces of two opposite sides of the machine frame (1), the two support blocks (901) close to one side of the outer surfaces of the machine frame (902) respectively, the two adjacent outer surfaces (902) are fixedly provided with the rotating shafts (902), the movable block (603) is close to the outer surface of the supporting block (901) and penetrates through the chute (904), the pushing rod (903) is inserted in the chute (904) and is slidably mounted with the inner wall of the chute (904), a plurality of L-shaped pushing hooks (905) are uniformly and fixedly mounted on the outer surface of one side, which is close to the rotating rod (902), of the material box (3) and far away from the pushing rod (903), the reset assembly comprises reset springs (611) sleeved on the outer surface of the supporting rod (602), the reset springs (611) are arranged between the supporting plate (601) and the baffle (610), the buffer assembly comprises buffer springs (612) sleeved on the outer surface of the guide rod (605), the buffer springs (612) are arranged between the supporting lugs (604) and the connecting block (607), the limiting mechanism (8) comprises a bracket (801) fixedly mounted on the upper surfaces of two opposite sides of the frame (1), the lower surface, which is close to the connecting block (607), of the bracket (801) is fixedly mounted with a stop block (802), the two fixing rods (701) fixedly mounted on the outer surface of the frame (1), the two fixing rods (702) are provided with the outer surfaces of the movable plate (702), the movable plate (702) and the movable plate (702) are uniformly inserted on the outer surface of the movable plate (702), the plurality of push rods (703) penetrate through the outer surface of the moving plate (702) and are slidably mounted with the same, clamping blocks (704) are fixedly mounted at one end part of the plurality of push rods (703) close to the material box (3), the clamping blocks (704) penetrate through the outer surface of the guide frame (2) and are slidably mounted with the guide frame, a plurality of rectangular grooves (710) are uniformly formed in the outer surface of the material box (3) close to the material groove (301), two L-shaped rods (708) are symmetrically and fixedly mounted on the outer surfaces of two opposite sides of the moving block (603), pushing columns (709) are fixedly mounted on the lower surface of one end of the two L-shaped rods (708) far away from the moving block (603), a guide plate (706) is fixedly mounted on the outer surface of one side of the moving plate (702) close to the guide frame (2), guide grooves (707) matched with the pushing columns (709) are formed in the upper surface of the guide plate (706), a plurality of rectangular grooves (705) are uniformly formed in penetrating through the outer surface of the guide frame, a plurality of springs (705) are sleeved on the outer surface of the push rods (703), the springs (705) are fixedly mounted on the inner walls of the guide grooves (707), the springs (702) in a pushing mode, one end of the guide plate (704) is far away from the fixed between the clamping plates (702) and one end of the guide plate (702) and the guide frame (2), the discharging mechanism (4) comprises two conveying rollers (402) rotatably mounted between the inner walls of two opposite sides of the frame (1) through two supporting shafts (401), conveying belts (403) are sleeved on the outer surfaces of the conveying rollers (402), the two conveying rollers (402) are horizontally arranged in the frame (1) in parallel, a conveying motor (404) is fixedly mounted on the outer surface of the frame (1), the output end of the conveying motor (404) penetrates through the outer surface of the frame (1) and is fixedly mounted with the end part of one supporting shaft (401), the lifting mechanism (5) comprises a strip-shaped groove (504) penetrating through the back of the guide frame (2), lifting blocks (503) are fixedly mounted on the outer surface of one side of the material box (3) close to the strip-shaped groove (504), two limiting blocks (501) are fixedly mounted on the outer surfaces of the upper end and lower ends of the guide frame (2) close to the strip-shaped groove (504) respectively, lifting screws (502) are rotatably mounted between the two limiting blocks (501), lifting blocks (502) are fixedly mounted on the outer surfaces of the lifting blocks (503) close to the outer surfaces of the guide frame (502) in a threaded mode, the output end of the stepping motor (505) penetrates through the lower surface of the limiting block (501) and is fixedly arranged at the top end of the lifting screw (502).
2. The method of measuring a bonding strength of a wafer according to claim 1, comprising the steps of:
s1: sequentially placing a plurality of wafers to be detected into a trough (301) formed in the inner wall of a material box (3) from bottom to top;
s2: the material box (3) is driven to move downwards by the lifting mechanism (5) until the blade (608) is aligned between two wafers which are well bonded;
s3: when the material box (3) moves downwards, the blade (608) can be inserted between two wafers to be detected through the pushing mechanism (9), so that a gap is generated between the two wafers which are well bonded, meanwhile, the infrared device (609) is used for measuring the gap length, and the bonding strength of the wafers can be obtained through calculation of the calculation processor according to the gap length;
s4: after the bonding strength of the wafer is detected, the lifting mechanism (5) is used for continuously driving the material box (3) to move downwards, so that the conveyor belt (403) moves the detected wafer out of the material box (3) so as to collect the detected wafer.
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