CN209820983U - Hardness testing device for silicon chip - Google Patents

Hardness testing device for silicon chip Download PDF

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Publication number
CN209820983U
CN209820983U CN201920112183.4U CN201920112183U CN209820983U CN 209820983 U CN209820983 U CN 209820983U CN 201920112183 U CN201920112183 U CN 201920112183U CN 209820983 U CN209820983 U CN 209820983U
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CN
China
Prior art keywords
fixed
silicon chip
hardness
screw rod
moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920112183.4U
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Chinese (zh)
Inventor
陈正青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foshan Nanhai Yijing Science And Technology Co Ltd
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Foshan Nanhai Yijing Science And Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Priority to CN201920112183.4U priority Critical patent/CN209820983U/en
Application granted granted Critical
Publication of CN209820983U publication Critical patent/CN209820983U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a hardness testing device of silicon chip, the on-line screen storage device comprises a base, the upper end of base is fixed with power device, the control box is installed to power device's upper end, hardness test pressure head is installed to the lower extreme of control box, equidistant a plurality of buffer of being fixed with in the upper end of base, a plurality of buffer's upper end are equipped with the connecting plate jointly, the upper end of connecting plate is equipped with the mobile station, the upper end both sides of mobile station all are equipped with the spout, install two sliders in the spout, be equipped with clamping device on the slider, it is equipped with the screw rod to run through on the one end lateral wall in the spout. The utility model discloses can be stable fixed with the silicon chip of equidimension not, it is great to lead to the measuring result error to shift when preventing silicon chip test, and the convenience removes silicon chip according to the test demand, and can prevent that the centre gripping is excessive to damage silicon chip when fixed, can carry out buffer protection to silicon chip simultaneously.

Description

Hardness testing device for silicon chip
Technical Field
The utility model relates to a hardness detects technical field, especially relates to a hardness testing device of silicon chip.
Background
By hardness is meant the ability of a material to resist the penetration of a harder object into its surface. According to different test methods and application ranges, hardness units can be divided into Brinell hardness, Vickers hardness, Rockwell hardness, micro Vickers hardness and the like, different units have different test methods and are suitable for materials or occasions with different characteristics, and the hardness test is one of important indexes for detecting the material performance and is one of the fastest and most economical test methods. It can be a common method for mechanical property test because hardness test can reflect the difference of material in chemical composition, tissue structure and processing technology. Is often applied to various industries as a supervision means.
The existing hardness testing device is inconvenient to fix the silicon chip, is easy to shift during testing, causes large testing error, has no buffer during testing, and is easy to crush the silicon chip by directly contacting with the silicon chip.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a silicon wafer hardness testing device to solve the drawbacks of the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a hardness detection device for silicon chips comprises a base, wherein a power device is fixed at the upper end of the base, a control box is installed at the upper end of the power device, a hardness test pressure head is installed at the lower end of the control box, a plurality of buffer devices are fixed at the upper end of the base at equal intervals, a connecting plate is jointly arranged at the upper ends of the buffer devices, a moving table is arranged at the upper end of the connecting plate, sliding grooves are formed in two sides of the upper end of the moving table, two sliding blocks are installed in the sliding grooves, clamping devices are arranged on the sliding blocks, screw rods penetrate through the side wall of one end in each sliding groove, rotating wheels are fixed at one end of each screw rod, the two rotating wheels are connected through a transmission belt in a transmission mode, one end of one screw rod is rotatably connected to the side wall of the other end in one sliding groove, one end of the other screw rod penetrates through the, and a turntable is fixed at one end of the screw rod, a forward thread and a reverse thread are arranged on the screw rod, one of the slide block threads is sleeved at one end of the screw rod provided with the forward thread, the other slide block thread is sleeved at one end of the screw rod provided with the reverse thread, four grooves are arranged at the lower end of the mobile station, and a mobile device is arranged in each groove.
Preferably, the moving device comprises an electric telescopic rod arranged at the bottom in the groove, moving grooves are formed in opposite side walls in the groove, moving blocks are installed in the moving grooves, a connecting block is jointly fixed between the two moving blocks, rail wheels are arranged at the lower end of the connecting block, two placing grooves are formed in the upper end of the connecting plate, two rail wheels on the same side are in one group, and two rail wheels on the same group are installed in the placing grooves.
Preferably, buffer includes a plurality of dead levers of equidistant fixing in the base upper end, be equipped with the cavity in the dead lever, the bottom in the cavity is fixed with the second spring, the upper end of second spring is fixed with the fixed block, the upper end of fixed block is fixed with the push rod, the one end lateral wall in the cavity is run through and the upper end that extends to the dead lever to the one end of push rod, the lower extreme at the connecting plate is fixed to the upper end of push rod.
Preferably, clamping device is including setting up the fixed plate in the slider upper end, run through on the fixed plate and be equipped with two connecting rods, two fixed plates of same end are a set of, and the one end of four connecting rods of same set is fixed with the movable plate jointly, the cover is equipped with first spring on the connecting rod, one side at the movable plate is fixed to the one end of first spring, the other end of first spring is fixed in one side of fixed plate, the other end of connecting rod is fixed with the stopper.
Preferably, the rail wheel is coated with a rubber layer.
Preferably, a display screen is installed at one side of the control box.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the silicon chip is conveniently clamped through the matching among the clamping device, the screw rod and the sliding block, the problem that the silicon chip is easy to shift during the hardness test is solved, the silicon chip is stably fixed, and the silicon chip is prevented from being damaged by excessive clamping;
2. the silicon chip is convenient to move through the matching between the moving device and the buffer device, the problem that the silicon chip is easy to be crushed during testing is solved, the effect of buffering during testing the silicon chip is achieved, and the silicon chip is prevented from being crushed; in summary, the device can stably fix silicon chips with different sizes, prevent the silicon chip from being displaced during testing to cause larger error of the measurement result, facilitate the movement of the silicon chip according to the testing requirement, prevent the silicon chip from being damaged by excessive clamping during fixing, and simultaneously perform buffer protection on the silicon chip.
Drawings
FIG. 1 is a schematic structural diagram of a control box of a silicon wafer hardness testing device according to the present invention;
FIG. 2 is a schematic structural diagram of a mobile station of a hardness testing apparatus for silicon chips according to the present invention;
FIG. 3 is an enlarged view of a structure at A position of a silicon wafer hardness testing apparatus according to the present invention;
FIG. 4 is an enlarged view of a structure at a position B of a silicon wafer hardness testing apparatus according to the present invention;
FIG. 5 is a schematic diagram of an internal structure of a fixing rod of a hardness testing device for silicon chips according to the present invention.
In the figure: the device comprises a control box 1, a display screen 2, a hardness testing pressure head 3, a power device 4, a connecting plate 5, a fixing rod 6, a base 7, a rotating wheel 8, a transmission belt 9, a screw rod 10, a fixing plate 11, a sliding block 12, a moving table 13, an electric telescopic rod 14, a rail wheel 15, a moving block 16, a connecting block 17, a first spring 18, a connecting rod 19, a moving plate 20, a push rod 21, a fixing block 22 and a second spring 23.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-5, a hardness testing device for silicon chips comprises a base 7, a power device 4 is fixed on the upper end of the base 7, a control box 1 is installed on the upper end of the power device 4, a display screen 2 is installed on one side of the control box 1, so that a test result can be conveniently checked, a hardness testing pressure head 3 is installed on the lower end of the control box 1, a plurality of buffer devices are fixed on the upper end of the base 7 at equal intervals, a connecting plate 5 is commonly arranged on the upper ends of the plurality of buffer devices, a moving table 13 is arranged on the upper end of the connecting plate 5, sliding grooves are respectively arranged on two sides of the upper end of the moving table 13, two sliding blocks 12 are installed in the sliding grooves, clamping devices are arranged on the sliding blocks 12, so that the silicon chips can be stably fixed through the clamping devices, the displacement of the chips during testing can;
a screw 10 is arranged on the side wall of one end in the sliding chute in a penetrating way, a rotating wheel 8 is fixed at one end of the screw 10, the two rotating wheels 8 are in transmission connection through a transmission belt 9, one end of one screw 10 is connected to the side wall of the other end in one sliding chute in a rotating way, one end of the other screw 10 is connected to the side wall of the other end in the other sliding chute in a penetrating way and extends to one end of a mobile station 13, a turntable is fixed at one end of the screw 10, the screw 10 is provided with forward threads and reverse threads, one sliding block 12 is sleeved at one end of the screw 10 provided with the forward threads, the other sliding block 12 is sleeved at one end of the screw 10 provided with the reverse threads, four grooves are arranged at the lower end of the mobile station 13, a moving device is arranged in the grooves, the turntable is rotated to drive one screw 10 to rotate, thereby driving one of the screws 10 to rotate, and simultaneously driving the other screw 10 to rotate synchronously through the rotating wheel 8 and the transmission belt 9, so as to conveniently clamp the silicon chip, and conveniently move the silicon chip according to the test requirement through the moving device.
The utility model discloses in, mobile device is including setting up the electric telescopic handle 14 of bottom in the recess, all be equipped with the shifting chute on the relative lateral wall in the recess, all install movable block 16 in the shifting chute, be fixed with connecting block 17 jointly between two movable blocks 16, the lower extreme of connecting block 17 is equipped with rail wheel 15, the cladding has the rubber layer on rail wheel 15, noise when reducing the removal, the upper end of connecting plate 5 is equipped with two standing grooves, two rail wheels 15 with one side are a set of, all install in the standing groove with two rail wheels 15 of a set of, electric telescopic handle 14 drives connecting block 17 and descends, drive rail wheel 15 and standing groove bottom inconsistent then, make things convenient for moving platform 13 to remove, thereby drive silicon chip according to the test demand and remove.
The utility model discloses in, buffer fixes a plurality of dead levers 6 in base 7 upper end including equidistant, be equipped with the cavity in the dead lever 6, bottom in the cavity is fixed with second spring 23, the upper end of second spring 23 is fixed with fixed block 22, the upper end of fixed block 22 is fixed with push rod 21, the one end lateral wall in the cavity is run through to the one end of push rod 21 and extends to the upper end of dead lever 6, the lower extreme at connecting plate 5 is fixed to the upper end of push rod 21, through push rod 21, the cooperation between fixed block 22 and the second spring 23, conveniently cushion the protection to the silicon chip when the silicon chip test, prevent that the silicon chip from being crushed.
The utility model discloses in, clamping device is including setting up fixed plate 11 in slider 12 upper end, it is equipped with two connecting rods 19 to run through on the fixed plate 11, two fixed plates 11 with the one end are a set of, the one end of four connecting rods 19 with a set of is fixed with movable plate 20 jointly, the cover is equipped with first spring 18 on the connecting rod 19, one side at movable plate 20 is fixed to the one end of first spring 18, one side at fixed plate 11 is fixed to the other end of first spring 18, the other end of connecting rod 19 is fixed with the stopper, slider 12 drives fixed plate 11 and removes, then through fixed plate 11, cooperation between connecting rod 19 and the first spring 18, prevent that the centre gripping from excessively leading to silicon wafer to damage.
The utility model discloses in, during the use, place silicon chip in the upper end of mobile station 13, the carousel rotates, thereby drive one of them screw rod 10 and rotate, simultaneously through rotating wheel 8 and drive belt 9 and drive another screw rod 10 synchronous rotation, conveniently with the silicon chip centre gripping, silicon chip aversion when preventing the test, two screw rods 10 rotate and drive slider 12 relative movement, through fixed plate 11, cooperation between connecting rod 19 and the first spring 18, prevent that the centre gripping from excessively leading to silicon chip to damage, electric telescopic handle 14 drives connecting block 17 and descends, then it is inconsistent with the bottom in the standing groove to drive rail wheel 15, make things convenient for mobile station 13 to remove, thereby it removes to drive silicon chip according to the test demand, through push rod 21, cooperation between fixed block 22 and the second spring 23, the convenience is to the silicon chip buffering protection when the silicon chip test, prevent that silicon chip from being crushed.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (6)

1. A silicon wafer hardness testing device comprises a base (7), characterized in that: the device is characterized in that a power device (4) is fixed at the upper end of a base (7), a control box (1) is installed at the upper end of the power device (4), a hardness testing pressure head (3) is installed at the lower end of the control box (1), a plurality of buffering devices are fixed at the upper end of the base (7) at equal intervals, a connecting plate (5) is jointly arranged at the upper ends of the buffering devices, a moving platform (13) is arranged at the upper end of the connecting plate (5), sliding grooves are formed in two sides of the upper end of the moving platform (13), two sliding blocks (12) are installed in the sliding grooves, clamping devices are arranged on the sliding blocks (12), a screw rod (10) penetrates through the side wall of one end in each sliding groove, a rotating wheel (8) is fixed at one end of the screw rod (10), the two rotating wheels (8) are in transmission connection through a driving belt (9), one end of one screw rod (10) is, one end of another screw rod (10) runs through the other end lateral wall in another spout and extends to the one end of mobile station (13), and the one end of this screw rod (10) is fixed with the carousel, be equipped with forward screw thread and reverse screw thread on screw rod (10), one of them slider (12) screw thread cup joints the one end that is equipped with forward screw thread on screw rod (10), and another slider (12) screw thread cup joints the one end that is equipped with reverse screw thread on screw rod (10), the lower extreme of mobile station (13) is equipped with four recesses, be equipped with the mobile device in the recess.
2. The apparatus for testing the hardness of silicon wafer according to claim 1, wherein the moving device comprises an electric telescopic rod (14) disposed at the bottom of the groove, moving grooves are disposed on the opposite side walls of the groove, moving blocks (16) are mounted in the moving grooves, a connecting block (17) is commonly fixed between the two moving blocks (16), a rail wheel (15) is disposed at the lower end of the connecting block (17), two placing grooves are disposed at the upper end of the connecting plate (5), two rail wheels (15) on the same side are in one group, and two rail wheels (15) in the same group are mounted in the placing grooves.
3. The apparatus for testing the hardness of silicon wafer according to claim 1, wherein the buffer device comprises a plurality of fixing rods (6) fixed at equal intervals on the upper end of the base (7), a cavity is formed in the fixing rods (6), a second spring (23) is fixed at the bottom of the cavity, a fixing block (22) is fixed at the upper end of the second spring (23), a push rod (21) is fixed at the upper end of the fixing block (22), one end of the push rod (21) penetrates through one end side wall of the cavity and extends to the upper end of the fixing rod (6), and the upper end of the push rod (21) is fixed at the lower end of the connecting plate (5).
4. The apparatus for testing the hardness of a silicon wafer according to claim 1, wherein the clamping device comprises a fixed plate (11) disposed at the upper end of the sliding block (12), two connecting rods (19) are disposed through the fixed plate (11), the two fixed plates (11) at the same end are in a group, a moving plate (20) is commonly fixed to one end of the four connecting rods (19) in the same group, a first spring (18) is sleeved on the connecting rods (19), one end of the first spring (18) is fixed to one side of the moving plate (20), the other end of the first spring (18) is fixed to one side of the fixed plate (11), and a limiting block is fixed to the other end of the connecting rods (19).
5. The apparatus for testing the hardness of silicon wafer according to claim 2, wherein the rail wheel (15) is coated with a rubber layer.
6. The apparatus for testing the hardness of silicon wafer according to claim 1, wherein a display screen (2) is installed on one side of the control box (1).
CN201920112183.4U 2019-01-23 2019-01-23 Hardness testing device for silicon chip Expired - Fee Related CN209820983U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920112183.4U CN209820983U (en) 2019-01-23 2019-01-23 Hardness testing device for silicon chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920112183.4U CN209820983U (en) 2019-01-23 2019-01-23 Hardness testing device for silicon chip

Publications (1)

Publication Number Publication Date
CN209820983U true CN209820983U (en) 2019-12-20

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ID=68871745

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920112183.4U Expired - Fee Related CN209820983U (en) 2019-01-23 2019-01-23 Hardness testing device for silicon chip

Country Status (1)

Country Link
CN (1) CN209820983U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114509361A (en) * 2022-01-24 2022-05-17 邱文彬 Multistage incremental chip hardness testing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114509361A (en) * 2022-01-24 2022-05-17 邱文彬 Multistage incremental chip hardness testing device

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191220

Termination date: 20210123