CN217072080U

CN217072080U - Novel anchor clamps of test bonding shearing force

Info

Publication number: CN217072080U
Application number: CN202123299049.6U
Authority: CN
Inventors: 周丹; 殷敏
Original assignee: Suzhou Huaqinyuan Microelectronics Technology Co ltd
Current assignee: Suzhou Huaqinyuan Microelectronics Technology Co ltd
Priority date: 2021-12-24
Filing date: 2021-12-24
Publication date: 2022-07-29
Anticipated expiration: 2031-12-24

Abstract

The utility model discloses a novel anchor clamps of test bonding shearing force, include the base that is connected with the dynamometer, the up end of base is provided with first anchor clamps, second anchor clamps, third anchor clamps, first anchor clamps with third anchor clamps set up respectively in the both sides of second anchor clamps, just first anchor clamps are close to one side of second anchor clamps is provided with the step, the inside of first anchor clamps is provided with and runs through the groove, just the push rod has been cup jointed to the inside that runs through the groove for promote the test sample, the second anchor clamps with the one side that first anchor clamps are relative also is provided with the step, the internal connection of third anchor clamps has adjustment mechanism, just adjustment mechanism with the second anchor clamps are connected. The device can be applicable to the measurement of the shearing force of the small-size wafer of equidimension not, and the device simple structure simultaneously, convenient operation, use cost is low, is fit for large-scale use.

Description

Novel anchor clamps of test bonding shearing force

Technical Field

The utility model relates to a technical field of shearing force test fixture especially relates to a novel anchor clamps of test bonding shearing force.

Background

The shear test can measure the resistance performance of the material under the action of the shear force, and is one of the basic test methods for testing the mechanical performance of the material. Although the success of the shear test depends on many factors, the clamp is one of the most basic and important devices. In the existing shear force dynamometer at present, most clamps are suitable for larger samples, and fewer clamps are suitable for tiny samples. And the smaller the sample, the higher the accuracy requirements for the fixture.

Bonding refers to a technique in which two pieces of semiconductor materials with clean and flat surfaces are directly bonded under a certain condition after surface cleaning, and wafers are bonded into a whole through van der waals force, molecular force and even atomic force. At present, with the application of various novel materials to wafer bonding in new fields, research and development of wafer bonding are accelerated. And the bonding strength is important for the excellence of the wafer bonding process. For the research of the bonding strength, the bonded sample needs to be subjected to a shear force experiment to obtain the shear stress of the bonded sample, so as to adjust the bonding process.

The existing device for obtaining the shearing force of the bonded sample is complex in structure, troublesome in operation and high in corresponding cost, and different clamps are used for bonded wafers of different sizes, so that the device is low in applicability.

SUMMERY OF THE UTILITY MODEL

Aiming at the problems in the prior art, a novel clamp for testing the bonding shearing force is provided, and comprises a base connected with a dynamometer, wherein a first clamp, a second clamp and a third clamp are arranged on the upper end face of the base;

the first clamp and the third clamp are respectively arranged on two sides of the second clamp, a step is arranged on one side of the first clamp close to the second clamp, a through groove is formed in the first clamp, and a push rod is sleeved in the through groove and used for pushing a test sample;

the step is also arranged on the surface, opposite to the first clamp, of the second clamp, an adjusting mechanism is connected inside the third clamp, and the adjusting mechanism is connected with the second clamp.

As a further description of the above technical solution: the second clamp is composed of bilaterally symmetrical limiting blocks and a movable block which is connected between the two groups of limiting blocks in a sliding mode.

As a further description of the above technical solution: the step is arranged on one side of the movable block close to the first clamp.

As a further description of the above technical solution: the cross section of stopper is the type of falling L structure, the cross section of movable block is the type of falling T structure.

As a further description of the above technical solution: the adjusting mechanism is an adjusting screw and is abutted against the movable block.

As a further description of the above technical solution: the height of the step is 0.3mm-0.5mm, preferably 0.4 mm.

As a further description of the above technical solution: the base is connected with the dynamometer through a plurality of groups of first fixing screws, and the first clamp, the second clamp and the third clamp are connected with the base through second fixing screws.

As a further description of the above technical solution: the bottom surface of the inner part of the through groove and the upper surface of the step are positioned on the same horizontal plane.

As a further description of the above technical solution: the cross section of the through groove is square, and the cross section of the push rod is also square.

As a further description of the above technical solution: one end of the push rod is abutted against a push rod of an external dynamometer.

The technical scheme has the following advantages or beneficial effects: the base is fixed on the dynamometer through the first fixing screw, the movable block is moved by rotating the adjusting screw, the distance between the step arranged on the outer side of the movable block and the step arranged on the outer side of the first clamp is the same as the size of the bonded wafer to be tested, and the device can be suitable for chips with different sizes through the operation.

The device has the advantages that the bonded wafer is placed between the two groups of steps, the height of the steps is the same as the thickness of the lower layer of the bonded wafer, the push rod is aligned to the bonded wafer, the dynamometer is started, the dynamometer pushes the push rod to the bonded wafer, when the upper layer and the lower layer of the bonded wafer are separated, the measured force is the shearing force between the upper layer and the lower layer of the bonded wafer, the device is simple in structure and convenient to operate, the shearing force value can be obtained through simple operation, the use cost is low, the stability is high, and the damage is not prone to occurring.

The height of the step for placing the wafer is 0.3-0.5mm, and the wafer with a micro size can be placed, so that the device can measure the micro wafer.

Drawings

Embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings. The drawings are only for purposes of illustration and description, and are not intended to limit the scope of the present disclosure.

Fig. 1 is a perspective view of a novel fixture for testing bonding shear force provided by the present invention;

fig. 2 is a perspective view of a first fixture in the novel fixture for testing bonding shear force provided by the present invention;

fig. 3 is a perspective view of a second fixture in the novel fixture for testing bonding shear force provided by the present invention;

fig. 4 is a perspective view of the base in the novel fixture for testing the bonding shearing force provided by the utility model.

The above reference numerals denote: 1. a base; 2. a first clamp; 3. a second clamp; 4. a third clamp; 5. a step; 6. a through groove; 7. a push rod; 8. an adjustment mechanism; 9. a limiting block; 10. a movable block; 11. a first fixing screw; 12. and a second fixing screw.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without any creative effort belong to the protection scope of the present application.

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.

The present invention will be further described with reference to the following drawings and specific examples, but the present invention is not limited thereto.

Referring to fig. 1 to 4, the present invention provides embodiment 1: a novel clamp for testing bonding shearing force comprises a base 1 connected with a dynamometer, wherein a first clamp 2, a second clamp 3 and a third clamp 4 are arranged on the upper end face of the base 1;

the first clamp 2 and the third clamp 4 are respectively arranged at two sides of the second clamp 3, a step 5 is arranged at one side of the first clamp 2 close to the second clamp 3, a through groove 6 is arranged inside the first clamp 2, and a push rod 7 is sleeved inside the through groove 6 and used for pushing a test sample;

the opposite side of the second clamp 3 and the first clamp 2 is also provided with a step 5, the inside of the third clamp 4 is connected with an adjusting mechanism 8, and the adjusting mechanism 8 is connected with the second clamp 3.

According to the above technical solution, the first clamp 2, the second clamp 3, and the third clamp 4 are fixed on the base 1 by the second fixing screw 12, then the base 1 is fixed on the dynamometer by the first fixing screw 11, the movable block 10 is moved by rotating the adjusting screw, the distance between the step 5 provided outside the movable block 10 and the step 5 provided outside the first clamp 2 is the same as the size of the bonded wafer to be tested, and the above operation can be applied to chips of different sizes.

Further, the second clamp 3 is composed of two symmetrical limit blocks 9 and a movable block 10 connected between the two sets of limit blocks 9 in a sliding manner.

Further, a step 5 is provided on the movable block 10 on the side close to the first clamp 2.

Further, the cross section of stopper 9 is the type of falling L structure, and the cross section of movable block 10 is the type of falling T structure, and the slip track is constituteed to two sets of stoppers 9, and movable block 10 can advance or the slip that moves back along the slip track.

Further, the adjusting mechanism 8 is an adjusting screw, and the adjusting mechanism 8 abuts against the movable block 10.

Further, the height of the step 5 is 0.3mm-0.5mm, preferably 0.4mm, the overall size of the device is small, the height of the step is 0.4mm, and the thicknesses of the upper layer and the lower layer of the bonded wafer are both 0.4mm, so that the shearing force of the micro wafer can be measured.

Further, the base 1 is connected to the dynamometer by a plurality of sets of first fixing screws 11, and the first jig 2, the second jig 3 and the third jig 4 are connected to the base 1 by second fixing screws 12.

According to the technical scheme, the bonded wafer is placed between the two groups of steps 5, the height of the steps 5 is the same as the thickness of the lower layer of the bonded wafer, the push rod 7 is aligned with the bonded wafer, then the dynamometer is started, the dynamometer pushes the push rod 7 to the bonded wafer, when the upper layer and the lower layer of the bonded wafer are separated, the measured force is the shearing force between the upper layer and the lower layer of the bonded wafer, and the device is simple in structure, convenient to operate, low in use cost, strong in stability and not prone to damage.

Further, the bottom surface inside the through groove 6 is at the same level as the upper surface of the step 5.

Further, the cross section of the through groove 6 is square, and the cross section of the push rod 7 is also square.

According to the above technical solution, the push rod 7 pushes the upper layer of the bonded wafer to separate the upper layer from the lower layer of the bonded wafer, and the force measured when the upper and lower layers of the bonded wafer are separated is the shear force.

Further, one end of the push rod 7 abuts against a push rod of an external dynamometer.

The working principle is as follows: when the device is used, firstly, the movable block 10 is moved by rotating the adjusting screw, the distance between the step 5 arranged on the outer side of the movable block 10 and the step 5 arranged on the outer side of the first clamp 2 is the same as the size of a bonded wafer to be tested, then the bonded wafer is placed between two groups of steps 5, the height of the step 5 is the same as the thickness of the lower layer of the bonded wafer, the push rod 7 is aligned with the bonded wafer, then the dynamometer is started, the dynamometer pushes the push rod 7 to push the bonded wafer, when the upper layer and the lower layer of the bonded wafer are separated, the measured force is the shearing force between the upper layer and the lower layer of the bonded wafer, the structure of the device is convenient to operate, the use cost is low, and simultaneously, the bonded wafers with different sizes can be measured by adjusting the movable block 10.

The above description is only an example of the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and it should be understood that all modifications and obvious variations of the present invention, which are equivalent to those of the present invention and illustrated in the drawings, should be included in the scope of the present invention.

Claims

1. The utility model provides a novel anchor clamps of test bonding shearing force which characterized in that: the device comprises a base (1) connected with a dynamometer, wherein a first clamp (2), a second clamp (3) and a third clamp (4) are arranged on the upper end face of the base (1);

the first clamp (2) and the third clamp (4) are respectively arranged on two sides of the second clamp (3), a step (5) is arranged on one side, close to the second clamp (3), of the first clamp (2), a through groove (6) is arranged inside the first clamp (2), and a push rod (7) is sleeved inside the through groove (6) and used for pushing a test sample;

the step (5) is also arranged on the surface, opposite to the first clamp (2), of the second clamp (3), an adjusting mechanism (8) is connected inside the third clamp (4), and the adjusting mechanism (8) is connected with the second clamp (3).

2. The novel fixture for testing bonding shear force according to claim 1, wherein: the second clamp (3) is composed of bilaterally symmetrical limiting blocks (9) and a movable block (10) which is connected between the two limiting blocks (9) in a sliding mode.

3. The novel fixture for testing bonding shear force according to claim 2, wherein: the step (5) is arranged on one side, close to the first clamp (2), of the movable block (10).

4. The novel fixture for testing bonding shear force according to claim 2, wherein: the cross section of the limiting block (9) is of an inverted L-shaped structure, and the cross section of the movable block (10) is of an inverted T-shaped structure.

5. The novel fixture for testing bonding shear force according to claim 2, wherein: the adjusting mechanism (8) is an adjusting screw, and the adjusting mechanism (8) is abutted to the movable block (10).

6. The novel fixture for testing bonding shear force according to claim 1, wherein: the height of the step (5) is 0.3mm-0.5 mm.

7. The novel fixture for testing bonding shear force according to claim 1, wherein: the base (1) is connected with the dynamometer through a plurality of groups of first fixing screws (11), the first clamp (2), the second clamp (3) and the third clamp (4) are connected with the base (1) through second fixing screws (12).

8. The novel fixture for testing bonding shear force according to claim 1, wherein: the bottom surface of the inside of the through groove (6) and the upper surface of the step (5) are in the same horizontal plane.

9. The novel fixture for testing bonding shear force according to claim 1, wherein: the cross section of the through groove (6) is square, and the cross section of the push rod (7) is also square.

10. The novel fixture for testing bonding shear force according to claim 1, wherein: one end of the push rod (7) is abutted against a push rod of an external dynamometer.