CN215184044U

CN215184044U - Light-emitting diode packaging structure and light-emitting diode bulb

Info

Publication number: CN215184044U
Application number: CN202121663172.9U
Authority: CN
Inventors: 王海涛
Original assignee: Shenzhen Huameixin Photoelectric Co ltd
Current assignee: Shenzhen Huameixin Photoelectric Co ltd
Priority date: 2021-07-21
Filing date: 2021-07-21
Publication date: 2021-12-14
Anticipated expiration: 2031-07-21

Abstract

The utility model discloses a light emitting diode packaging structure and light emitting diode bulb, including base and epoxy encapsulation, the last fixed surface of base is connected with the epoxy encapsulation, the external fixation that the upper surface of base is located the epoxy encapsulation inlays and is equipped with the pottery radiating ring, the last fixed surface of base is connected with fixed fastener, the inside of epoxy encapsulation is equipped with the basement, the lower surface one end fixedly connected with positive pole pin of basement, the lower surface other end fixedly connected with negative pole pin of basement, the lower terminal surface that the upper surface of base is located epoxy encapsulation and pottery radiating ring is equipped with the heat conduction paster. Light emitting diode packaging structure and emitting diode bulb, can encapsulate epoxy resin and dispel the heat with higher speed, prolonged the life of epoxy resin encapsulation to positive pole pin and negative pole pin can be changed after the rupture damages.

Description

Light-emitting diode packaging structure and light-emitting diode bulb

Technical Field

The utility model relates to a light emitting diode field, in particular to light emitting diode packaging structure and light emitting diode bulb.

Background

The light emitting diode is packaged by epoxy resin, and a light source is generated by a semiconductor chip, so that the LED has the advantages of energy conservation, environmental protection and the like; however, the existing stage of the light emitting diode has some defects, and the light emitting diode can generate a large amount of heat in the process of generating a light source, but the heat is mostly dissipated naturally through the light emitting diode, so that the heat dissipation effect is low, and the service life is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides emitting diode packaging structure and emitting diode bulb can effectively solve the technical problem among the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

light emitting diode packaging structure and light emitting diode bulb, including base and epoxy encapsulation, the last fixed surface of base is connected with the epoxy encapsulation, the upper surface of base is located the external fixation of epoxy encapsulation and inlays and be equipped with the pottery radiating ring, the last fixed surface of base is connected with fixed fastener, the inside of epoxy encapsulation is equipped with the basement, the lower surface one end fixedly connected with positive pole pin of basement, the lower surface other end fixedly connected with negative pole pin of basement, the lower terminal surface that the upper surface of base is located epoxy encapsulation and pottery radiating ring is equipped with the heat conduction paster.

Preferably, the upper surface of base has seted up the inner groovy, the upper surface of base has seted up and has inlayed the groove, the slot has been seted up to the bottom of inner groovy, inlay the inside both sides surface of establishing the groove and seted up spacing hole.

Preferably, the number of the slots is two, the number of the embedding slots is three, and the three embedding slots are annularly distributed on the upper surface of the base.

Preferably, the inside spacing post that is equipped with of one end of fixed fastener, the surface cover of spacing post is equipped with return spring, fixed fastener inlays the spacing hole and the base swing joint who establishes in the groove through spacing post embedding.

Preferably, the substrate is composed of a cathode terminal and an anode terminal.

Preferably, the upper surface of negative pole lug is equipped with the reflection bowl, the inside of reflection bowl is equipped with semiconductor chip, be connected with the wire between positive pole lug and the negative pole lug, the one end and the semiconductor chip of wire are connected, the rectangular channel has all been seted up to the lower surface of negative pole lug and positive pole lug, negative pole pin and positive pole pin are fixed with the base through embedding rectangular channel.

Preferably, the length of the cathode pin is greater than that of the anode pin, and the epoxy resin is packaged in a transparent shape.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses in, through the pottery radiating ring and the heat conduction paster that set up, emitting diode can produce the heat when shining, and the bottom that the heat transfer reaches the epoxy encapsulation is dispelled the heat on being transmitted the pottery radiating ring by the heat conduction paster for the epoxy encapsulation can not influence life because of long-time high temperature, through the fixed fastener that sets up, can be more firm fix the upper surface at the base to the pottery radiating ring, and the convenience is changed the pottery radiating ring.

Drawings

Fig. 1 is an overall structure diagram of the led package structure and the led bulb of the present invention;

FIG. 2 is a partial cross-sectional view of the LED package structure and the LED bulb of the present invention;

FIG. 3 is a diagram of the structure of the LED package and the base structure of the LED bulb of the present invention;

fig. 4 is a diagram of the structure of the led package and the base structure of the led bulb according to the present invention.

In the figure: 1. a base; 101. an inner groove; 102. a slot; 103. embedding a groove; 2. packaging with epoxy resin; 3. a ceramic heat dissipating ring; 4. fixing the clamping piece; 5. a heat conducting patch; 6. a substrate; 601. a cathode connecting column; 602. an anode connecting column; 603. a reflective bowl; 604. a semiconductor chip; 605. a wire; 7. a cathode pin; 8. and an anode pin.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-4, the light emitting diode package structure and the light emitting diode bulb include a base 1 and an epoxy package 2, the upper surface of the base 1 is fixedly connected with the epoxy package 2, the upper surface of the base 1 is fixedly embedded with a ceramic heat dissipation ring 3 outside the epoxy package 2, the upper surface of the base 1 is fixedly connected with a fixing clip 4, the epoxy package 2 is internally provided with a base 6, one end of the lower surface of the base 6 is fixedly connected with an anode pin 8, the other end of the lower surface of the base 6 is fixedly connected with a cathode pin 7, and the upper surface of the base 1 is provided with a heat conduction patch 5 on the lower end surfaces of the epoxy package 2 and the ceramic heat dissipation ring 3;

the upper surface of the base 1 is provided with an inner groove 101, the upper surface of the base 1 is provided with an embedding groove 103, the bottom of the inner groove 101 is provided with a slot 102, and the surfaces of two sides of the inside of the embedding groove 103 are provided with limiting holes; the number of the slots 102 is two, the number of the embedding slots 103 is three, and the three embedding slots 103 are annularly distributed on the upper surface of the base 1; a limiting column is arranged in one end of the fixed clamping piece 4, a return spring is sleeved on the surface of the limiting column, and the fixed clamping piece 4 is movably connected with the base 1 through a limiting hole embedded in the embedding groove 103 through the limiting column; the substrate 6 consists of a cathode connecting column 601 and an anode connecting column 602; the upper surface of the cathode connecting column 601 is provided with a reflecting bowl 603, a semiconductor chip 604 is arranged inside the reflecting bowl 603, a lead 605 is connected between the anode connecting column 602 and the cathode connecting column 601, one end of the lead 605 is connected with the semiconductor chip 604, rectangular grooves are formed in the lower surfaces of the cathode connecting column 601 and the anode connecting column 602, and the cathode pin 7 and the anode pin 8 are fixed with the substrate 6 through being embedded into the rectangular grooves; the length of cathode lead 7 is greater than the length of anode lead 8, and epoxy encapsulation 2 is transparent.

Through the pottery radiating ring 3 and the heat conduction paster 5 that set up, emitting diode can produce the heat when shining, the bottom of epoxy encapsulation 2 is transmitted to the heat, then dispel the heat on the pottery radiating ring 3 is transmitted by heat conduction paster 5 again, make epoxy encapsulation 2 can not influence life because of long-time high temperature, through the fixed fastener 4 that sets up, can be more firm fix the upper surface at base 1 to pottery radiating ring 3, and the convenience is changed pottery radiating ring 3.

It should be noted that, the utility model relates to a light emitting diode packaging structure and light emitting diode bulb, when using, semiconductor chip 604 gives out light and generates heat, the heat that produces is transmitted to the surface of epoxy encapsulation 2, heat conduction paster 5 transmits the heat of epoxy encapsulation 2 to ceramic radiating ring 3 and dispels the heat, make the temperature on epoxy encapsulation 2 surface obtain effectual release, make the life of epoxy encapsulation 2 obtain effectual extension, when the radiating effect of ceramic radiating ring 3 becomes low, need to change ceramic radiating ring 3, when changing, overturn first and open fixed fastener 4, then dismantle ceramic radiating ring 3 and change, after changing well, ceramic radiating ring 3 imbeds in inner groovy 101 and fixes with fixed fastener 4, when using, after anode pin 8 and cathode pin 7 break and destroy, the anode pin 8 and the cathode pin 7 can be removed and replaced.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. LED packaging structure and LED bulb, its characterized in that: including base (1) and epoxy encapsulation (2), the last fixed surface of base (1) is connected with epoxy encapsulation (2), the external fixation that the upper surface of base (1) is located epoxy encapsulation (2) inlays and is equipped with ceramic cooling ring (3), the last fixed surface of base (1) is connected with fixed fastener (4), the inside of epoxy encapsulation (2) is equipped with base (6), the lower surface one end fixedly connected with positive pole pin (8) of base (6), the lower surface other end fixedly connected with negative pole pin (7) of base (6), the lower terminal surface that the upper surface of base (1) is located epoxy encapsulation (2) and ceramic cooling ring (3) is equipped with heat conduction paster (5).

2. The led package structure and the led bulb of claim 1, wherein: inner groovy (101) have been seted up to the upper surface of base (1), the upper surface of base (1) has been seted up and has been inlayed and establish groove (103), slot (102) have been seted up to the bottom of inner groovy (101), inlay the inside both sides surface of establishing groove (103) and seted up spacing hole.

3. The led package and the led bulb of claim 2, wherein: the number of the slots (102) is two, the number of the embedding slots (103) is three, and the three embedding slots (103) are annularly distributed on the upper surface of the base (1).

4. The led package structure and the led bulb of claim 3, wherein: the fixing clamp is characterized in that a limiting column is arranged inside one end of the fixing clamp (4), a return spring is sleeved on the surface of the limiting column, and the fixing clamp (4) is embedded into a limiting hole in the embedding groove (103) through the limiting column and is movably connected with the base (1).

5. The LED package structure and the LED bulb as set forth in claim 4, wherein: the substrate (6) is composed of a cathode connecting column (601) and an anode connecting column (602).

6. The LED package structure and the LED bulb of claim 5, wherein: the upper surface of negative pole lug (601) is equipped with reflection bowl (603), the inside of reflection bowl (603) is equipped with semiconductor chip (604), be connected with wire (605) between positive pole lug (602) and negative pole lug (601), the one end and the semiconductor chip (604) of wire (605) are connected, the rectangular channel has all been seted up to the lower surface of negative pole lug (601) and positive pole lug (602), negative pole pin (7) and positive pole pin (8) are fixed with base (6) through embedding rectangular channel.

7. The LED package structure and the LED bulb of claim 5, wherein: the length of the cathode pin (7) is larger than that of the anode pin (8), and the epoxy resin package (2) is transparent.