CN201606724U - LED down lamp with heat radiation of helical fins - Google Patents
LED down lamp with heat radiation of helical fins Download PDFInfo
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- CN201606724U CN201606724U CN201020125011XU CN201020125011U CN201606724U CN 201606724 U CN201606724 U CN 201606724U CN 201020125011X U CN201020125011X U CN 201020125011XU CN 201020125011 U CN201020125011 U CN 201020125011U CN 201606724 U CN201606724 U CN 201606724U
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Abstract
The patent discloses an LED down lamp with the heat radiation of helical fins, which comprises a heat-radiation casing and an LED light source module arranged in the heat-radiation casing, wherein the LED light source module comprises a basal plate of a lamp body and at least one LED lamp arranged at one side of the basal plate of the lamp body, the other side of the basal plate of the lamp body is provided with a graphite heat-radiation block, the side face of the graphite heat-radiation block and the bottom surface of the graphite heat-radiation block, which does not contact with the basal plate of the lamp body, both contact with the wall face of an inner cavity of the heat-radiation casing tightly, and the side wall of the heat-radiation casing is provided with a plurality of helical heat-radiation fins. In the LED down lamp, the graphite heat-radiation block and the helical heat-radiation fins are combined, so that the heat-radiation effect of the LED down lamp is reinforced, the attractive appearance of the down lamp is compromised, the heat-radiation effect is better, and the service life of a product is prolonged.
Description
Technical field
The utility model relates to lighting technical field, refers to especially a kind ofly carry out the LED Down lamp of enhance heat by helical fin etc., belongs to lighting engineering structure field.
Background technology
LED (Light Emitting Diode), light emitting diode is a kind of solid-state semiconductor devices, it can directly be converted into light to electricity.The heart of LED is a semi-conductive wafer, and an end of wafer is attached on the support, and an end is a negative pole, and the other end connects the positive pole of power supply, makes entire wafer by epoxy encapsulation.Semiconductor wafer is made up of two parts, and a part is a P-type semiconductor, occupies an leading position in its hole, the inside, and the other end is a N-type semiconductor, mainly is electronics here.But when these two kinds of semiconductors couple together, just form a P-N knot between them.When electric current acted on this wafer by lead, electronics will be pushed to the P district, and electronics will send energy with the form of photon, the luminous principle of LED that Here it is then with hole-recombination in the P district.Led light source have use low-tension supply, power consumption less, strong, the stability height of applicability, response time weak point, environmentally safe, multicolor luminous etc. advantage, though the existing illuminating equipment costliness of price still is considered to it and will inevitably substitutes existing illuminating device.
The LED Down lamp is a kind of lighting that is embedded into the light down-ejection type of fixed object inside.The LED Down lamp is to belong to the directional type lighting, has only its opposite just can be subjected to light, and beam angle belongs to optically focused, and light is more concentrated, and the light and shade contrast is strong.Outstanding more illuminated object, the lumen degree is higher, more sets off out quiet ambiance.Existing LED Down lamp generally comprises led light source module and optical processing unit, at the back side of led light source module one heat abstractor is set.Heat dissipation problem is the technical barrier of restriction LED lamp development always, because the heat radiating LED lamp designers have to carry out balance between life of product and radiating effect, the radiating mode of LED lamp mainly contains at present: Natural Heat Convection, install fan forced heat radiation, heat pipe and loop heat pipe heat radiation etc. additional.Install fan forced heat radiation mode system complex additional, reliability is low, heat pipe and loop heat pipe radiating mode cost height, Natural Heat Convection is then emphasized the radiating effect of heat abstractor itself.General Natural Heat Convection device is illustrated in figure 1 as the fin heat radiation at present, the structure of heat abstractor changes to some extent according to the power of LED lamp, generally speaking, the higher LED lamp of power requires better radiating effect, therefore, it is very big that radiator structure tends to do, thereby influence the exquisiteness and the volume of entire product itself.Can the better LED Down lamp of a kind of radiating effect is provided be the technical problem that those skilled in the art press for solution.
The utility model content
The purpose of this utility model provides a kind of LED Down lamp of helical fin heat radiation, this LED Down lamp combines the graphite radiating piece with the spiral heat dissipation fin, thereby strengthened LED Down lamp radiating effect, not only taken into account the good looking appearance of Down lamp, and better heat-radiation effect, prolonged service life of product.
The technical scheme that the utility model provides is as follows:
A kind of LED Down lamp of helical fin heat radiation, comprise a heat-dissipating casing and be arranged on the interior led light source module of described heat-dissipating casing, described led light source module comprises a lamp body substrate and at least one the LED lamp that is provided with in a side of lamp body substrate, the opposite side of described lamp body substrate is provided with the graphite radiating piece, the side of described graphite radiating piece reaches and does not all closely contact with the inner chamber wall of described heat-dissipating casing with the bottom surface of described lamp body substrate contacts, and the sidewall of described heat-dissipating casing is provided with some helical form radiating fins.
Further, described LED lamp is arranged on the described lamp body substrate in concentrically ringed mode.
Further, be provided with heat-conducting glue between described graphite radiating piece and the described lamp body substrate.
Further, described lamp body substrate is connected with a power line, and described power line is arranged on the bottom of described heat-dissipating casing.
Further, be provided with the supporting reflector of some and described LED lamp in the described heat-dissipating casing, described LED lamp is arranged in the described reflector.
The effect of this patent is: graphite has good heat-conducting effect, heat conduction is fast and uniform and stable, therefore be used in the heat radiation of precision components inside, this patent is incorporated into graphite in the heat radiation of LED lamp, employing combines graphite block with radiating fin mode is come the enhance heat effect, thereby the speed of heat radiation and the uniformity are all dispelled the heat considerably beyond simple fin.This patent further inventive radiating fin is arranged on the heat-dissipating casing, make the shell of LED Down lamp possess the function of dispelling the heat for internal light source simultaneously, because shell adopts the spiral heat dissipation fin shape, profile is also very attractive in appearance, make exquisite design have practicality simultaneously, kill two birds with one stone.
Description of drawings
Fig. 1 is the schematic diagram of fin radiating structure in the prior art;
Fig. 2 is the structural representation of heat-dissipating casing in this patent;
Fig. 3 is the internal structure cross-sectional schematic of patent device;
Fig. 4 is that the LED lamp of patent device is arranged schematic diagram;
The drawing reference numeral explanation:
1-LED lamp 2-heat-dissipating casing 3-graphite radiating piece 4-power line
5-reflector 6-lamp body substrate
The specific embodiment
Further specify the technical solution of the utility model below in conjunction with embodiment.
As Fig. 2, Fig. 3, shown in Figure 4, a kind of LED Down lamp of helical fin heat radiation, comprise a heat-dissipating casing 2 and be arranged on led light source module in the heat-dissipating casing 2, the led light source module comprises a lamp body substrate 6 and three LED lamps 1 that are provided with in a side of lamp body substrate 6, and the LED lamp is arranged on the lamp body substrate 6 in concentrically ringed mode.The opposite side of lamp body substrate 6 is provided with graphite radiating piece 3, and the side of graphite radiating piece 3 and the bottom surface that does not contact with lamp body substrate 6 all closely contact with the inner chamber wall of heat-dissipating casing 2, and the sidewall of heat-dissipating casing 2 is provided with some helical form radiating fins.
For the augmentation of heat transfer effect, between graphite radiating piece 3 and lamp body substrate 6, be provided with heat-conducting glue.Lamp body substrate 6 is connected with a power line 4, and power line 4 is arranged on the bottom of heat-dissipating casing 2.Be provided with the supporting reflector 5 of some and LED lamp 1 in the heat-dissipating casing 2, LED lamp 1 is arranged in the reflector 5.
Those skilled in the art will recognize that; the above-mentioned specific embodiment is exemplary; be in order to make those skilled in the art can better understand this patent content; should not be construed as is restriction to this patent protection domain; change or modify so long as disclose spiritual any being equal to of being done, all fall into this patent protection domain according to this patent.
Claims (5)
1. the LED Down lamp of helical fin heat radiation comprises a heat-dissipating casing and is arranged on led light source module in the described heat-dissipating casing, and described led light source module comprises a lamp body substrate and at least one LED lamp that a side of lamp body substrate is provided with, it is characterized in that:
The opposite side of described lamp body substrate is provided with the graphite radiating piece, the side of described graphite radiating piece reaches and does not all closely contact with the inner chamber wall of described heat-dissipating casing with the bottom surface of described lamp body substrate contacts, and the sidewall of described heat-dissipating casing is provided with some helical form radiating fins.
2. the LED Down lamp of helical fin heat radiation according to claim 1, it is characterized in that: described LED lamp is arranged on the described lamp body substrate in concentrically ringed mode.
3. the LED Down lamp of helical fin heat radiation according to claim 1 is characterized in that:
Be provided with heat-conducting glue between described graphite radiating piece and the described lamp body substrate.
4. the LED Down lamp of helical fin heat radiation according to claim 1 is characterized in that:
Described lamp body substrate is connected with a power line, and described power line is arranged on the bottom of described heat-dissipating casing.
5. the LED Down lamp of helical fin heat radiation according to claim 1 is characterized in that:
Be provided with the supporting reflector of some and described LED lamp in the described heat-dissipating casing, described LED lamp is arranged in the described reflector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020125011XU CN201606724U (en) | 2010-03-08 | 2010-03-08 | LED down lamp with heat radiation of helical fins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020125011XU CN201606724U (en) | 2010-03-08 | 2010-03-08 | LED down lamp with heat radiation of helical fins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201606724U true CN201606724U (en) | 2010-10-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020125011XU Expired - Fee Related CN201606724U (en) | 2010-03-08 | 2010-03-08 | LED down lamp with heat radiation of helical fins |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201606724U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102374427A (en) * | 2011-09-20 | 2012-03-14 | 浙江捷莱照明有限公司 | LED (light-emitting diode) bulb lamp |
| CN102444827A (en) * | 2011-12-15 | 2012-05-09 | 宁波市鄞州威迪电子有限公司 | LED (light-emitting diode) lamp |
| CN106247226A (en) * | 2015-08-28 | 2016-12-21 | 中山诺顿科研技术服务有限公司 | Condensing lens and lamp |
-
2010
- 2010-03-08 CN CN201020125011XU patent/CN201606724U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102374427A (en) * | 2011-09-20 | 2012-03-14 | 浙江捷莱照明有限公司 | LED (light-emitting diode) bulb lamp |
| CN102444827A (en) * | 2011-12-15 | 2012-05-09 | 宁波市鄞州威迪电子有限公司 | LED (light-emitting diode) lamp |
| CN106247226A (en) * | 2015-08-28 | 2016-12-21 | 中山诺顿科研技术服务有限公司 | Condensing lens and lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101013 Termination date: 20110308 |