CN207601824U - 指纹感测模块及智能卡 - Google Patents
指纹感测模块及智能卡 Download PDFInfo
- Publication number
- CN207601824U CN207601824U CN201721766773.6U CN201721766773U CN207601824U CN 207601824 U CN207601824 U CN 207601824U CN 201721766773 U CN201721766773 U CN 201721766773U CN 207601824 U CN207601824 U CN 207601824U
- Authority
- CN
- China
- Prior art keywords
- fingerprint
- sensing module
- sensor device
- fingerprint sensor
- fingerprint sensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
- G06K19/10—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards
- G06K19/14—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards the marking being sensed by radiation
- G06K19/145—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards the marking being sensed by radiation at least one of the further markings being adapted for galvanic or wireless sensing, e.g. an RFID tag with both a wireless and an optical interface or memory, or a contact type smart card with ISO 7816 contacts and an optical interface or memory
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07345—Means for preventing undesired reading or writing from or onto record carriers by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches
- G06K19/07354—Means for preventing undesired reading or writing from or onto record carriers by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches by biometrically sensitive means, e.g. fingerprint sensitive
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/08—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
- G06K19/10—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds or more than one marking of the same kind in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards
- G06K19/18—Constructional details
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/94—Hardware or software architectures specially adapted for image or video understanding
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Multimedia (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Engineering & Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- Software Systems (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE1651654-4 | 2016-12-15 | ||
| SE1651654 | 2016-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207601824U true CN207601824U (zh) | 2018-07-10 |
Family
ID=60781507
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721766773.6U Active CN207601824U (zh) | 2016-12-15 | 2017-12-15 | 指纹感测模块及智能卡 |
| CN201711350145.4A Active CN108229340B (zh) | 2016-12-15 | 2017-12-15 | 指纹感测模块及其制造方法、智能卡及其制造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711350145.4A Active CN108229340B (zh) | 2016-12-15 | 2017-12-15 | 指纹感测模块及其制造方法、智能卡及其制造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10395164B2 (enExample) |
| EP (2) | EP3564852B1 (enExample) |
| JP (2) | JP7065094B2 (enExample) |
| KR (1) | KR102468554B1 (enExample) |
| CN (2) | CN207601824U (enExample) |
| WO (1) | WO2018111174A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108229340A (zh) * | 2016-12-15 | 2018-06-29 | 指纹卡有限公司 | 指纹感测模块及其制造方法、智能卡及其制造方法 |
| US11023702B2 (en) | 2016-12-15 | 2021-06-01 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
| CN113924576A (zh) * | 2019-12-12 | 2022-01-11 | 指纹卡安娜卡敦知识产权有限公司 | 用于卡集成的生物计量传感器模块 |
| US11610429B2 (en) | 2016-12-15 | 2023-03-21 | Fingerprint Cards Anacatum Ip Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180165495A1 (en) * | 2016-12-09 | 2018-06-14 | Fingerprint Cards Ab | Electronic device |
| US10984304B2 (en) | 2017-02-02 | 2021-04-20 | Jonny B. Vu | Methods for placing an EMV chip onto a metal card |
| FR3069081B1 (fr) * | 2017-07-17 | 2021-08-20 | Safran Identity & Security | Carte electronique comprenant un capteur d'empreinte et procede de fabrication d'une telle carte |
| WO2019014883A1 (zh) * | 2017-07-20 | 2019-01-24 | 深圳市汇顶科技股份有限公司 | 芯片封装结构、芯片模组及电子终端 |
| US10509936B2 (en) * | 2017-08-28 | 2019-12-17 | Superc-Touch Corporation | Fingerprint identification apparatus having conductive structure |
| US20200051938A9 (en) * | 2017-12-18 | 2020-02-13 | China Wafer Level Csp Co., Ltd. | Fingerprint chip packaging method and fingerprint chip package |
| TWI705538B (zh) * | 2018-06-29 | 2020-09-21 | 同欣電子工業股份有限公司 | 指紋感測封裝模組的製法 |
| USD956760S1 (en) * | 2018-07-30 | 2022-07-05 | Lion Credit Card Inc. | Multi EMV chip card |
| WO2020082323A1 (zh) * | 2018-10-26 | 2020-04-30 | 深圳市汇顶科技股份有限公司 | 指纹检测打码装置、指纹检测系统和电子设备 |
| SG10201902933WA (en) | 2019-04-01 | 2020-11-27 | Advanide Holdings Pte Ltd | An improved card with fingerprint biometrics |
| FR3095287B1 (fr) * | 2019-04-19 | 2022-11-04 | Linxens Holding | Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module |
| FR3095285B1 (fr) | 2019-04-19 | 2022-11-11 | Linxens Holding | Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module |
| FR3095536B1 (fr) | 2019-04-25 | 2021-09-24 | Idemia Identity & Security France | Module de carte à microcircuit avec capteur d’empreinte digitale et coque de protection |
| KR102138671B1 (ko) * | 2019-05-14 | 2020-08-11 | (주)비티비엘 | 지문센서부가 개선된 스마트카드 |
| US20210081743A1 (en) | 2019-08-12 | 2021-03-18 | Federal Card Services, LLC | Dual interface metal cards and methods of manufacturing |
| US11113593B2 (en) | 2019-08-15 | 2021-09-07 | Federal Card Services; LLC | Contactless metal cards with fingerprint sensor and display |
| US12277462B2 (en) | 2019-08-14 | 2025-04-15 | Federal Card Services, LLC | Metal-containing dual interface smartcards |
| CN110458143B (zh) * | 2019-08-21 | 2022-04-15 | 京东方科技集团股份有限公司 | 指纹识别装置、进行指纹识别的方法以及电子设备 |
| US11341385B2 (en) | 2019-11-16 | 2022-05-24 | Federal Card Services, LLC | RFID enabled metal transaction card with shaped opening and shaped slit |
| US11055683B1 (en) * | 2020-04-02 | 2021-07-06 | Capital One Services, Llc | Computer-based systems involving fingerprint or biometrically-activated transaction cards and methods of use thereof |
| FR3111215B1 (fr) | 2020-06-04 | 2022-08-12 | Linxens Holding | Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module |
| EP3933697B1 (en) * | 2020-07-01 | 2022-06-15 | Fingerprint Cards Anacatum IP AB | Biometric imaging module and method for manufacturing a biometric imaging module |
| CN116324799A (zh) | 2020-10-23 | 2023-06-23 | 维萨国际服务协会 | 用于生物识别卡的集成生物识别传感器和存储器 |
| SE2051294A1 (en) * | 2020-11-06 | 2022-05-07 | Fingerprint Cards Anacatum Ip Ab | Integrated biometric sensor module and method for manufacturing a smartcard comprising an integrated biometric sensor module |
| KR20240018865A (ko) | 2022-08-03 | 2024-02-14 | 삼성전자주식회사 | 지문 센서 패키지 및 이를 포함하는 스마트 카드 |
| WO2024049340A1 (en) * | 2022-08-29 | 2024-03-07 | Fingerprint Cards Anacatum Ip Ab | Biometric imaging device and method for manufacturing the biometric imaging device |
| FR3144885A1 (fr) | 2023-01-09 | 2024-07-12 | Linxens Holding | Module de carte à puce renforcé et procédé de fabrication d’une telle carte à puce |
| KR102758876B1 (ko) * | 2023-09-27 | 2025-01-23 | 주식회사 이터널 | 전원 공급 필름 및 이러한 전원 공급 필름을 이용한 지문 인식 카드의 사용자 지문 등록 방법 |
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| JP3769332B2 (ja) * | 1996-09-13 | 2006-04-26 | 大日本印刷株式会社 | Icカードの製造方法 |
| DE19921231A1 (de) | 1999-05-07 | 2000-11-09 | Giesecke & Devrient Gmbh | Fingerabdrucksensor für Chipkarte |
| FR2797075B1 (fr) | 1999-07-26 | 2001-10-12 | Gemplus Card Int | Procede de fabrication de dispositif portable a circuits integres, de type carte a puce de format reduit par rapport au format standard |
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| NO316776B1 (no) | 2001-12-07 | 2004-05-03 | Idex Asa | Pakkelosning for fingeravtrykksensor |
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| US6924496B2 (en) | 2002-05-31 | 2005-08-02 | Fujitsu Limited | Fingerprint sensor and interconnect |
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| JP4904769B2 (ja) | 2005-10-21 | 2012-03-28 | 富士通セミコンダクター株式会社 | 半導体装置 |
| CN100590643C (zh) * | 2007-01-17 | 2010-02-17 | 南茂科技股份有限公司 | 指纹辨识器的薄膜封装构造 |
| JP2010122015A (ja) | 2008-11-18 | 2010-06-03 | Fujitsu Ltd | センサユニット及び電子装置の製造方法 |
| NO20093601A1 (no) | 2009-12-29 | 2011-06-30 | Idex Asa | Overflatesensor |
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| WO2011160014A1 (en) * | 2010-06-18 | 2011-12-22 | Authentec, Inc. | Finger sensor including encapsulating layer over sensing area and related methods |
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| KR20120019729A (ko) * | 2010-08-26 | 2012-03-07 | (주)바이오스마트 | 스폿 용접을 이용하여 제조된 ic 카드 및 그 제조 방법 |
| JP5069342B2 (ja) | 2010-09-01 | 2012-11-07 | エイエスディ株式会社 | 指紋読み取りセンサ付icカードとその製造方法 |
| US9158958B2 (en) * | 2010-10-28 | 2015-10-13 | Synaptics Incorporated | Signal strength enhancement in a biometric sensor array |
| GB201208680D0 (en) | 2012-05-17 | 2012-06-27 | Origold As | Method of manufacturing an electronic card |
| SG11201505845RA (en) | 2013-01-29 | 2015-08-28 | Mary Grace | Smart card and smart card system with enhanced security features |
| WO2015013530A1 (en) * | 2013-07-24 | 2015-01-29 | Synaptics Incorporated | Signal strength enhancement in a biometric sensor array |
| US9582704B2 (en) * | 2013-08-23 | 2017-02-28 | Fingerprint Cards Ab | Connection pads for a fingerprint sensing device |
| TWI534962B (zh) | 2013-12-09 | 2016-05-21 | 茂丞科技股份有限公司 | 具有外觀隱藏的耦合電極之近接式感測器及其製造方法 |
| DE102013113901B3 (de) * | 2013-12-12 | 2015-01-08 | Innenministerium des Landes Schleswig-Holstein, vertreten durch den Innenminister | Verfahren zum Sichtbarmachen von Fingerabdrücken |
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| TWI530885B (zh) * | 2014-03-18 | 2016-04-21 | 茂丞科技股份有限公司 | 具有外露顏料層之全平面感測器及使用其之電子裝置 |
| US9576177B2 (en) * | 2014-12-11 | 2017-02-21 | Fingerprint Cards Ab | Fingerprint sensing device |
| US9449212B2 (en) | 2014-12-22 | 2016-09-20 | Fingerprint Cards Ab | Capacitive fingerprint sensor with sensing elements comprising timing circuitry |
| TWI594341B (zh) * | 2015-01-19 | 2017-08-01 | 神盾股份有限公司 | 指紋辨識裝置封裝及其製造方法 |
| KR101942141B1 (ko) * | 2015-05-12 | 2019-01-24 | 앰코테크놀로지코리아(주) | 지문센서 패키지 |
| TW201643772A (zh) | 2015-06-08 | 2016-12-16 | 指紋卡公司 | 具有中介結構的指紋感測裝置 |
| CN204808272U (zh) * | 2015-07-03 | 2015-11-25 | 宸鸿科技(厦门)有限公司 | 具有指纹识别功能的触控面板 |
| TWM523147U (zh) * | 2015-09-10 | 2016-06-01 | 茂丞科技股份有限公司 | 指紋感測單元及指紋感測模組 |
| US9792516B2 (en) * | 2016-01-26 | 2017-10-17 | Next Biometrics Group Asa | Flexible card with fingerprint sensor |
| US10395164B2 (en) * | 2016-12-15 | 2019-08-27 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
-
2017
- 2017-11-09 US US15/807,679 patent/US10395164B2/en active Active
- 2017-12-04 KR KR1020197014898A patent/KR102468554B1/ko active Active
- 2017-12-04 WO PCT/SE2017/051210 patent/WO2018111174A1/en not_active Ceased
- 2017-12-04 JP JP2019531057A patent/JP7065094B2/ja active Active
- 2017-12-13 EP EP19180709.8A patent/EP3564852B1/en active Active
- 2017-12-13 EP EP17207037.7A patent/EP3336759B1/en active Active
- 2017-12-15 CN CN201721766773.6U patent/CN207601824U/zh active Active
- 2017-12-15 CN CN201711350145.4A patent/CN108229340B/zh active Active
-
2022
- 2022-04-25 JP JP2022071629A patent/JP7289956B2/ja active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108229340A (zh) * | 2016-12-15 | 2018-06-29 | 指纹卡有限公司 | 指纹感测模块及其制造方法、智能卡及其制造方法 |
| US11023702B2 (en) | 2016-12-15 | 2021-06-01 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
| US11610429B2 (en) | 2016-12-15 | 2023-03-21 | Fingerprint Cards Anacatum Ip Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
| CN113924576A (zh) * | 2019-12-12 | 2022-01-11 | 指纹卡安娜卡敦知识产权有限公司 | 用于卡集成的生物计量传感器模块 |
Also Published As
| Publication number | Publication date |
|---|---|
| US10395164B2 (en) | 2019-08-27 |
| KR102468554B1 (ko) | 2022-11-18 |
| KR20190096977A (ko) | 2019-08-20 |
| JP2020503606A (ja) | 2020-01-30 |
| JP2022106838A (ja) | 2022-07-20 |
| CN108229340B (zh) | 2021-07-30 |
| EP3336759A1 (en) | 2018-06-20 |
| EP3564852A1 (en) | 2019-11-06 |
| WO2018111174A1 (en) | 2018-06-21 |
| CN108229340A (zh) | 2018-06-29 |
| EP3564852B1 (en) | 2023-10-18 |
| US20180174018A1 (en) | 2018-06-21 |
| EP3336759B1 (en) | 2019-06-19 |
| JP7065094B2 (ja) | 2022-05-11 |
| JP7289956B2 (ja) | 2023-06-12 |
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Effective date of registration: 20211215 Address after: Gothenburg Patentee after: Fingerprint kaana Kadun Intellectual Property Co.,Ltd. Address before: Gothenburg Patentee before: FINGERPRINT CARDS AB |