CN206849834U - 一种抗冲击用的引线框架 - Google Patents

一种抗冲击用的引线框架 Download PDF

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CN206849834U
CN206849834U CN201720690892.1U CN201720690892U CN206849834U CN 206849834 U CN206849834 U CN 206849834U CN 201720690892 U CN201720690892 U CN 201720690892U CN 206849834 U CN206849834 U CN 206849834U
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lead
groove
slide glass
shock resistance
fin
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黄斌
王锋涛
周开友
谢锐
林国荣
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SICHUAN JINWAN ELECTRONIC CO Ltd
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Abstract

本实用新型公开了一种抗冲击用的引线框架，包括铜基单元，所述铜基单元包括依次连接成一体的散热片（1）、载片（2）、内引线（4）和外引线（5）；所述的载片（2）的正面设置有第一V型槽（9）和第二V型槽（10）；所述的散热片（1）上设置有切割槽（13）；所述的内引线（4）的正面设置有第三V型槽（16）和第四V型槽（17），内引线（4）的背面设置有第五V型槽（18）；所述的内引线（4）和外引线（5）均为4条。本实用新型设置有多处与塑封体连接的锁紧结构，在元器件冲击时，塑封体与载片不容易脱掉，提高了产品的震动性和延长产品的使用寿命。

Description

一种抗冲击用的引线框架
技术领域
本实用新型涉及半导体电子元器件的制造技术领域，尤其涉及一种抗冲击用的引线框架。
背景技术
引线框架作为集成电路的芯片载体，是一种借助于键合材料（金丝、铝丝、铜丝）实现芯片内部电路引出端与外引线的电气连接，形成电气回路的关键结构件，它起到了和外部导线连接的桥梁作用，绝大部分的半导体集成块中都需要使用引线框架，是电子信息产业中重要的基础材料。目前，半导体电子元器件通常由芯片、塑封体、金丝或者铝丝、引线框架组装而成，为了提高自动化生产效率，引线框架一般由多个相同的铜基单元排列而成，而每个铜基单元包括依次连接成一体的散热片、载片、内引线和外引线，载片用于承载电子元器件的芯片，芯片通过塑封体包封后封装在载片上。
如图1和图2所示，当采用现有的引线框架在元器件上使用时，具有以下缺点：（1）在元器件上使用会出现局部冲击波过大的情况，即在终端使用时，电器有运动，就会产会冲击；而现有技术的引线框架散热片过大，会使得框架质量过大，冲击波对框架内部芯片作用后，会导致芯片开裂或提前失效；（2）结构简单，与塑封体连接的锁紧结构少，在冲击时，塑封体与载片容易脱掉，把芯片拉坏导致产品报废；（3）现有技术的引线框架的工序复杂，引脚（内引线与外引线合称为引脚）只有三只，需要单独焊接导线在载片上，然后再在散热片上焊一组线来与电路板连接，增加焊接工时，生产成本增加。
实用新型内容
本实用新型的目的在于克服现有技术的不足，提供一种抗冲击用的引线框架，解决现有技术框架质量大、锁紧结构少以及生产成本高的问题。
本实用新型的目的是通过以下技术方案来实现的：一种抗冲击用的引线框架，包括铜基单元，所述铜基单元包括依次连接成一体的散热片、载片、内引线和外引线，所述散热片上设有定位孔，所述内引线上设有焊脚；所述散热片和载片的连接处设有燕尾槽和锁定孔，所述锁定孔设置在燕尾槽上，所述锁定孔的内壁沿圆周方向设有环状凸肋；所述的载片的正面设置有第一V型槽和第二V型槽；所述的散热片上设置有切割槽；所述的内引线的正面设置有第三V型槽和第四V型槽，内引线的背面设置有第五V型槽；所述的内引线和外引线均为4条。
进一步地，所述的切割槽设置为两条；每条切割槽的一端均与定位孔连接，另一端均延伸至散热片的侧边。
进一步地，所述的锁定孔为长圆孔。
进一步地，所述的载片下端一侧设置有第一内引线，所述的第一内引线与载片直接连接；从第一内引线到载片下端的另一侧还一次设置有第二内引线、第三内引线和第四内引线；所述的第二内引线、第三内引线和第四内引线上均设置有焊脚，第二内引线上的焊脚的宽度大于第三内引线和第四内引线上的焊脚的宽度。
进一步地，第一内引线和第二内引线之间的间距大于第三内引线和第四内引线之间的间距。
进一步地，第三内引线上焊脚的宽度和第四内引线上的焊脚的宽度相同。
进一步地，所述的载片底面四周还设置有固胶凹槽。
本实用新型的有益效果是：
（1）本实用新型设置有多处与塑封体连接的锁紧结构，在元器件冲击时，塑封体与载片不容易脱掉，提高了产品的震动性和延长产品的使用寿命。
（2）本实用新型采用了4只引脚的结构，只需要芯片直接焊接在载片上通过内引线与电路板连接，而不需要额外在散热片上焊接一组导与电路板连接，降低了焊接工时，降低生产成本。
（3）本实用新型在散热片上还设置有切割槽，可以进一步降低引线框架质量：当完成封塑操作后，沿着切割槽将部分散热片进行切割；解决现有技术会框架质量过大，元器件的冲击波对框架内部芯片作用后，会导致芯片开裂或提前失效的问题。同时由于采用了4只引脚的结构，使得不需要散热片焊接导线，也为降低引线框架质量提供了有力的基础。
附图说明
图1为现有技术引线框架导线连接以及散热片大小的正面结构示意图；
图2为现有技术引线框架导线连接以及散热片大小的侧面结构示意图；
图3为本实用新型结构示意图；
图4为图3的B-B向视图；
图5为图3的E-E向视图；
图6为图3的C-C向视图；
图7为图3的D-D向视图；
图8为图3的侧视图；
图9为图8的局部放大示意图；
图10为本实用新型通过切割槽切割以及焊接导线后的结构示意图；
图11为图10的结构经过塑封后的侧面结构示意图；
图中，1-散热片，2-载片，3-定位孔，4-内引线，5-外引线，6-焊脚，7-锁定孔，8-燕尾槽，9-第一V型槽，10-第二V型槽，11-环状凸肋，12-固胶凹槽，13-切割槽，14-导线，15-塑封体，16-第三V型槽，17-第四V型槽，18-第五V型槽，19-芯片，4-1-第一内引线，4-2-第二内引线，4-3-第三内引线，4-4-第四内引线。
具体实施方式
下面结合附图进一步详细描述本实用新型的技术方案，但本实用新型的保护范围不局限于以下所述。
如图3和图8所示，一种抗冲击用的引线框架，包括铜基单元，所述铜基单元包括依次连接成一体的散热片1、载片2、内引线4和外引线5，所述散热片1上设有定位孔3，所述内引线4上设有焊脚6；如图4和图5所示，所述散热片1和载片2的连接处设有燕尾槽8和锁定孔7，所述锁定孔7设置在燕尾槽8上，所述锁定孔7的内壁沿圆周方向设有环状凸肋11；所述的载片2的正面设置有第一V型槽9和第二V型槽10；如图6所示，所述的散热片1上设置有切割槽13；如图9所示，所述的内引线4的正面设置有第三V型槽16和第四V型槽17，内引线4的背面设置有第五V型槽18；所述的内引线4和外引线5均为4条。
具体地，燕尾槽8、锁定孔7、环状凸肋11、第一V型槽9、第二V型槽10、第三V型槽16、第四V型槽17、第五V型槽18和下述的固胶凹槽9 都是用于防止封装后塑封体15的脱落，提高了塑封体15与载片2的结合强度。其中，锁定孔7为一贯穿散热片1和载片2连接处的通孔，向锁定孔7内注入塑胶，将安装好的芯片19与载片2进行塑胶封住，为了防止注塑后的塑封体15脱落，所述锁定孔7的内壁沿圆周方向上设有环状凸肋11，环状凸肋11在锁定孔7对塑封体15起着倒钩的作用，防止震动时塑封体15分离或脱落，锁定孔7为长圆孔其形状如图3所示。
采用上述结构，使得本实用新型存在很多与塑封体15连接的锁紧结构，在冲击时，塑封体15与载片2不容易脱掉，提高了产品的震动性和延长产品的使用寿命。
在本实施例中，采用了4只引脚的结构，如图3、图10和图11所示；采用本实施例的结构，只需要芯片19直接焊接在载片2上通过内引线4-1与电路板连接，而不需要额外在散热片1上焊接一组导线14与电路板连接，降低了焊接工时，降低生产成本。
更优地，在本实施例中，如图3、图10和图11所示，4组引脚的具体的结构如下：所述的载片2下端一侧设置有第一内引线4-1，所述的第一内引线4-1与载片2直接连接；从第一内引线4-1到载片2下端的另一侧还一次设置有第二内引线4-2、第三内引线4-3和第四内引线4-4；所述的第二内引线4-2、第三内引线4-3和第四内引线4-4上均设置有焊脚6，第二内引线4-2上的焊脚6的宽度大于第三内引线4-3和第四内引线4-4上的焊脚6的宽度。当焊接完成后，第二内引线4-2、第三内引线4-3和第四内引线4-4的焊脚6均通过导线与载片2上的芯片19连接。更优地，在本实施例中，第一内引线4-1和第二内引线4-2之间的间距大于第三内引线4-3和第四内引线4-4之间的间距。更优地在本实施例中，第三内引线4-3上焊脚的宽度和第四内引线4-4上的焊脚6的宽度相同。
而切割槽13在本实施例中的作用是可以进一步降低引线框架质量：当完成封塑操作后，沿着切割槽13将部分散热片1进行切割，切割后的示意图如10和图11所示。解决现有技术会框架质量过大，冲击波对框架内部芯片19作用后，会导致芯片19开裂或提前失效的问题。同时由于采用了4只引脚的结构，使得不需要散热片1焊接导线，也为降低引线框架质量提供了有力的基础。
更优地，在本实施例中，如图3所示，所述的切割槽13设置为两条；每条切割槽13的一端均与定位孔3连接，另一端均延伸至散热片1的侧边。
更优地，在本实施例中，如图3和图7所示，所述的载片2底面四周还设置有固胶凹槽12。
本实用新型是通过实施例来描述的，但并不对本实用新型构成限制，参照本实用新型的描述，所公开的实施例的其他变化，如对于本领域的专业人士是容易想到的，这样的变化应该属于本实用新型权利要求限定的范围之内。

Claims (7)

1.一种抗冲击用的引线框架，包括铜基单元，所述铜基单元包括依次连接成一体的散热片（1）、载片（2）、内引线（4）和外引线（5），所述散热片(1）上设有定位孔（3），所述内引线（4）上设有焊脚（6）；所述散热片（1）和载片（2）的连接处设有燕尾槽（8）和锁定孔（7），所述锁定孔（7）设置在燕尾槽（8）上，所述锁定孔（7）的内壁沿圆周方向设有环状凸肋（11）；其特征在于：所述的载片（2）的正面设置有第一V型槽（9）和第二V型槽（10）；所述的散热片（1）上设置有切割槽（13）；所述的内引线（4）的正面设置有第三V型槽（16）和第四V型槽（17），内引线（4）的背面设置有第五V型槽（18）；所述的内引线（4）和外引线（5）均为4条。
2.根据权利要求1所述的一种抗冲击用的引线框架，其特征在于：所述的切割槽（13）设置为两条；每条切割槽（13）的一端均与定位孔（3）连接，另一端均延伸至散热片（1）的侧边。
3. 根据权利要求1所述的一种抗冲击用的引线框架，其特征在于：所述的锁定孔（7）为长圆孔。
4.根据权利要求1所述的一种抗冲击用的引线框架，其特征在于：所述的载片（2）下端一侧设置有第一内引线（4-1），所述的第一内引线（4-1）与载片（2）直接连接；从第一内引线（4-1）到载片（2）下端的另一侧还一次设置有第二内引线（4-2）、第三内引线（4-3）和第四内引线（4-4）；所述的第二内引线（4-2）、第三内引线（4-3）和第四内引线（4-4）上均设置有焊脚（6），第二内引线（4-2）上的焊脚（6）的宽度大于第三内引线（4-3）和第四内引线（4-4）上的焊脚（6）的宽度。
5.根据权利要求4所述的一种抗冲击用的引线框架，其特征在于：第一内引线（4-1）和第二内引线（4-2）之间的间距大于第三内引线（4-3）和第四内引线（4-4）之间的间距。
6.根据权利要求4所述的一种抗冲击用的引线框架，其特征在于：第三内引线（4-3）上焊脚的宽度和第四内引线（4-4）上的焊脚（6）的宽度相同。
7.根据权利要求1所述的一种抗冲击用的引线框架，其特征在于：所述的载片（2）底面四周还设置有固胶凹槽（12）。
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CN108637084A (zh) * 2018-05-09 2018-10-12 四川金湾电子有限责任公司 一种半导体引线框架的加工工艺

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108637084A (zh) * 2018-05-09 2018-10-12 四川金湾电子有限责任公司 一种半导体引线框架的加工工艺
CN108637084B (zh) * 2018-05-09 2019-06-04 四川金湾电子有限责任公司 一种半导体引线框架的加工工艺

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