CN205752239U - A kind of LED encapsulation structure - Google Patents
A kind of LED encapsulation structure Download PDFInfo
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- CN205752239U CN205752239U CN201620554297.0U CN201620554297U CN205752239U CN 205752239 U CN205752239 U CN 205752239U CN 201620554297 U CN201620554297 U CN 201620554297U CN 205752239 U CN205752239 U CN 205752239U
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Abstract
This utility model relates to a kind of LED encapsulation structure；LED encapsulation structure, is provided with solid weldering functional areas including upper surface and LED chip, lower surface are installed with the PCB substrate of pin；Admittedly weldering functional areas are electrically connected with pin；LED chip is electrically connected with weldering functional areas admittedly；PCB substrate includes the sheet material that two superimposed is fixedly connected；Lower sheet material is provided with the first through hole, and thickness is identical with reserved upper stannum height；The inner surface of the first through hole is provided with metal level；Pin is electrically connected with this metal level；Upper sheet material is provided with the second through hole；It is packed full with conducting metal in second through hole；Admittedly weldering functional areas are electrically connected with the conducting metal in the second through hole；Conducting metal and the metal level of the inner surface of the first through hole in second through hole are electrically connected with.This structure, eats stannum area when increasing welding, improves the reliability of follow-up welding；Owing to reserved stannum position height of eating is controlled, simplify the production procedure of PCB substrate.
Description
Technical field
The present invention relates to LED encapsulation technology, particularly relate to a kind of LED encapsulation structure.
Background technology
The front pad of LED component is used for chip placement, and backside pads is used for upper stannum；Front pad and backside pads have two
Kind connected mode:
The first LED component, as it is shown in figure 1, by metal leg carries out bending formation " L " type pin, draw by " L " type
Foot forms the electric connection of positive and negative.
The second LED component, as in figure 2 it is shown, hole to PCB substrate ad-hoc location, by plating, change on through hole
Learn technique and make to be formed on hole wall plated metal, formed the electric connection of positive and negative by through hole.In order to prevent LED component packaging plastic
Water spills over the back side from front or tin cream spills over front from the back side time client uses, and typically can fill by through hole by implant.
The CHIP type LED component of this kind of structure only has backside pads can eat stannum, compares " L " type pin, upper stannum weak effect, easily causes
LED component rosin joint.
In the second LED component, only have backside pads can eat stannum to solve LED component, compare " L " type pin,
Upper stannum weak effect, the problem easily causing LED component rosin joint, as it is shown on figure 3, number of patent application is CN20151049071.1, name
It is referred to as LED encapsulation structure and the patent of invention of method for packing thereof, although what this technical scheme can solve the problem that pin 5 eats stannum ability relatively
Difference, the problem that rosin joint rate is high.But this technical scheme cannot accurately control implant number, it is impossible to the accurately height of reserved upper stannum
Degree, can there is bigger error with design height in the height of the through hole vacated.It is also flowable materials because of implant, fills
Thing surface cannot form smooth face, affects attractive in appearance and upper stannum effect.
Summary of the invention
In order to make up the defect of above-mentioned prior art, it is an object of the invention to provide in one that stannum area is big, can accurately control
Stannum height in system, Shang Ximian be smooth and the upper extraordinary LED encapsulation structure of stannum effect.
For reaching above-mentioned purpose, the technical scheme is that a kind of LED encapsulation structure, including PCB substrate；Described PCB
The upper surface of substrate is provided with solid weldering functional areas, and lower surface is installed with pin；The described functional areas of weldering admittedly are electrically connected with described pin；
The upper surface of described PCB substrate is additionally provided with LED chip；Described LED chip is electrically connected with weldering functional areas admittedly by bonding line；Institute
State PCB substrate upper surface and be additionally provided with the colloid for fixing LED chip；Described PCB substrate includes that two superimposed is fixedly connected
Sheet material together；Lower sheet material is provided with the first through hole, and thickness is identical with reserved upper stannum height；The interior table of described first through hole
Face is provided with metal level；Described pin is electrically connected with this metal level；Upper sheet material is provided with the second through hole；Described second through hole is built-in
Fill up conducting metal；The described functional areas of weldering admittedly are electrically connected with the conducting metal in the second through hole；Leading in described second through hole
The metal level of the inner surface of electric metal and the first through hole is electrically connected with.
Further, described first through hole and the second through hole are all made by mechanical, radium-shine or chemical corrosion method.
Further, the metal level of the inner surface of described first through hole is made by plating or chemical technology.
Further, described upper sheet material and lower sheet material are fixedly connected by the way of mechanical press and/or glue are bonding
Together.
The present invention compared with prior art provides the benefit that: the technical program, owing to lower sheet material is provided with the first through hole,
Make the both sides of the LED component after cutting out by the first through hole centrage and pin define the pin of L-shaped, increase and eat stannum
Area, substantially increases the reliability of follow-up welding.The most important thing is, in the technical program, PCB substrate is by lower sheet material and upper plate
Material overlap is fixed together, and the thickness of lower sheet material is with reserved to eat stannum height identical so that reserved stannum position height of eating is controlled,
Enormously simplify the production procedure of PCB substrate；Simultaneously as need not need again to fill implant so that eat the smooth of stannum position
It is the best to spend, and improves the reliability of follow-up welding.
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings.
Accompanying drawing explanation
Fig. 1 is the structural representation that in prior art, the first LED encapsulation structure cuts out single led lamp bead；
Fig. 2 is that in prior art, the second LED encapsulation structure cuts out the structural representation of single led lamp bead (through hole is filled out
Full implant)；
Fig. 3 is that (through hole is or not the structural representation that in prior art, the third LED encapsulation structure cuts out single led lamp bead
Fill up implant)；
Fig. 4 is the structural representation before PCB substrate cuts in the embodiment of the present invention；
Fig. 5 is the structural representation cutting out single led lamp bead on the basis of Fig. 4.
Reference
1 PCB substrate 11 times sheet material
111 first through hole 1111 metal levels
Sheet material 121 second through hole on 12
2 weld functional areas 3 pin admittedly
4 LED chip 5 bonding lines
6 colloid 7 glue
8 metals
Detailed description of the invention
In order to more fully understand the technology contents of the present invention, below in conjunction with specific embodiment, technical scheme is entered
One step introduction and explanation, but it is not limited to this.
As shown in Figure 4, a kind of LED encapsulation structure, including PCB substrate 1；The upper surface of PCB substrate 1 is provided with solid weldering functional areas
2, lower surface is installed with pin 3；The described functional areas 2 of weldering admittedly are electrically connected with pin 3；The upper surface of PCB substrate 1 is additionally provided with LED
Chip 4；LED chip 4 is electrically connected with weldering functional areas 2 admittedly by bonding line 5；PCB substrate 1 upper surface is additionally provided with for fixing
The colloid 6 of LED chip 4；PCB substrate 1 includes the sheet material that two superimposed is fixedly connected；Lower sheet material 11 is provided with first and leads to
Hole 111, and thickness is identical with reserved upper stannum height；The inner surface of the first through hole 111 is provided with metal level 1111；Pin 3 with should
Metal level 1111 is electrically connected with；Upper sheet material 12 is provided with the second through hole 121；It is packed full with conducting metal in second through hole 121；Gu weldering
Conducting metal in functional areas 2 and the second through hole 121 is electrically connected with；Conducting metal in second through hole 121 and the first through hole 111
The metal level 1111 of inner surface be electrically connected with.
It is processed for convenience and rapidly to the first through hole 111 and the second through hole 121, the first through hole 111 and second
Through hole 121 is all made by mechanical, radium-shine or chemical corrosion method.
For convenience and rapidly the inner surface at the first through hole 111 crosses metal level 1111, the interior table of the first through hole 111
The metal level 1111 in face is made by plating or chemical technology.
For convenience, quickly and firmly upper sheet material 12 and lower sheet material 11 overlap are fixedly connected, upper sheet material 12
It is fixedly connected by the way of mechanical press and/or glue are bonding with lower sheet material 11.
The concrete method for packing of this LED encapsulation structure, comprises the steps:
A, specifically applying according to LED component, first determine lower sheet material 11 and the thickness of upper sheet material 12, then at lower sheet material 11
Multiple first through hole 111 of upper manufacture, and multiple pin 3 is set on its bottom surface；Upper sheet material 12 manufactures multiple second through hole
121, and the multiple weldering functional areas 2 admittedly of surface configuration thereon；Inner surface at the first through hole 111 plates full metal level 1111, the
It is packed full with conducting metal in two through holes 121；Then lower sheet material 11 and upper sheet material 12 overlap are fixedly connected, constitute PCB
Substrate 1, and conducting metal and metal level 1111 are electrically connected with；In each weldering functional areas 2 admittedly and second through hole 121
Conducting metal contacts, it is achieved be electrically connected with；Each two pin 3 is relatively fixed at the both sides of first through hole 111, and difference
Metal level 1111 in the inner surface of this first through hole 111 contacts, it is achieved be electrically connected with；
B, arranging multiple LED chip 4 at the upper surface of upper sheet material 12, the both positive and negative polarity of each LED chip 4 is respectively by bonding
Line 5 admittedly welds functional areas 2 and contacts with adjacent two, it is achieved be electrically connected with；Then with colloid 6, each LED chip 4 is fixed on
The upper surface of sheet material 12；
C, PCB substrate 1 is cut, cut face vertical with PCB substrate 1, and by the centrage of the first through hole 111,
Cut out single LED component, the anode of its LED chip 4, admittedly welds 2, one, functional areas the first through hole 111 inner surface with one
Being electrically connected with a pin 3, the negative electrode of its LED chip 4 welds 111 tables in functional areas 2, another first through hole admittedly with another
Face and another pin 3 are electrically connected with.
On lower sheet material 11, process the first through hole 111 for convenience and rapidly, upper sheet material 12 processes second
Through hole 121, uses mechanical, radium-shine or chemical corrosion method, manufactures the first through hole 111 and the second through hole 121；The side of alsoing for simultaneously
Just and rapidly the inner surface at the first through hole 111 crosses metal level 1111, uses plating or chemical technology at the first through hole 111
Inner surface cross metal level 1111.
In order to simplify structure, realize in metal level 1111 and second through hole 121 of the inner surface of the first through hole 111 simultaneously
Conducting metal is electrically connected with, and the metal level 1111 with its inner surface that is formed around of the upper port of each first through hole 111 contacts
Metal 8, the lower port of each second through hole 121 be formed around the metal 8 that the conducting metal built-in with it contacts；Upper sheet material
12 and lower sheet material 11 overlap when being fixed together, the metal 8 contacted with metal level 1111 and the gold contacted with conducting metal
Belong to 8 to contact, to realize conducting metal and the electric connection of metal level 1111.
For the ease of cutting out single LED component in PCB substrate 1, the centrage of the first through hole 111 is positioned at two phases
The centre of the second adjacent through hole 121 centrage, and without LED chip 4 between these two the second adjacent through holes 121.
In order to lower sheet material 11 and upper sheet material 12 overlap securely are fixed together, at lower sheet material 11 upper surface without metal 8
Position, first apply glue 7, then upper sheet material 12 be placed on the upper surface of lower sheet material 11 so that the following table of upper sheet material 12
On face, fit with glue 7 in the position without metal 8, is fixed together by mechanical press overlap the most again.
As it is shown in figure 5, in order to increase upper stannum area, improve the reliability of welding, the upper stannum position of single LED component is
Part after the metal level 1111 of the inner surface of two the first through holes 111 is cleaved and two pins 3.
In sum: technique scheme, owing to being provided with the first through hole 111 in PCB substrate 1 so that by the first through hole
Both sides and the pin 3 of LED component after 111 centrages cut out defines the pin of L-shaped, increases and eats stannum area, significantly
Improve the reliability of follow-up welding.The most important thing is, in the technical program, PCB substrate 1 is by lower sheet material 11 and upper sheet material 12 weight
Folded it is fixed together, and the thickness of lower sheet material 11 is with reserved to eat stannum height identical so that reserve that to eat stannum position height controlled, greatly
Simplify greatly the production procedure of PCB substrate；Simultaneously as be no longer necessary to fill implant, eating stannum position will not be again as implant
Surface is such, uneven, but flatness is the best, improves the reliability of follow-up welding.
The above-mentioned technology contents only further illustrating the present invention with embodiment, in order to reader is easier to understand, but not
Representing embodiments of the present invention and be only limitted to this, any technology done according to the present invention extends or recreation, all by the present invention's
Protection.Protection scope of the present invention is as the criterion with claims.
Claims (4)
1. a LED encapsulation structure, including PCB substrate；The upper surface of described PCB substrate is provided with solid weldering functional areas, and lower surface sets
There is pin；The described functional areas of weldering admittedly are electrically connected with described pin；The upper surface of described PCB substrate is additionally provided with LED chip；Described
LED chip is electrically connected with weldering functional areas admittedly by bonding line；Described PCB substrate upper surface is additionally provided with for fixing LED chip
Colloid；It is characterized in that: described PCB substrate includes the sheet material that two superimposed is fixedly connected；Lower sheet material is provided with
One through hole, and thickness is identical with reserved upper stannum height；The inner surface of described first through hole is provided with metal level；Described pin with should
Metal level is electrically connected with；Upper sheet material is provided with the second through hole；It is packed full with conducting metal in described second through hole；Described admittedly weld function
District is electrically connected with the conducting metal in the second through hole；Conducting metal in described second through hole and the inner surface of the first through hole
Metal level is electrically connected with.
LED encapsulation structure the most according to claim 1, it is characterised in that: described first through hole and the second through hole all pass through
Mechanical, radium-shine or chemical corrosion method is made.
LED encapsulation structure the most according to claim 1, it is characterised in that: the metal level of the inner surface of described first through hole
Made by plating or chemical technology.
LED encapsulation structure the most according to claim 1, it is characterised in that: described upper sheet material and lower sheet material are pressed by machinery
Close and/or the bonding mode of glue is fixedly connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620554297.0U CN205752239U (en) | 2016-06-08 | 2016-06-08 | A kind of LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620554297.0U CN205752239U (en) | 2016-06-08 | 2016-06-08 | A kind of LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205752239U true CN205752239U (en) | 2016-11-30 |
Family
ID=57360773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620554297.0U Active CN205752239U (en) | 2016-06-08 | 2016-06-08 | A kind of LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205752239U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870300A (en) * | 2016-06-08 | 2016-08-17 | 芜湖聚飞光电科技有限公司 | LED (Light Emitting Diode) packaging structure and packaging method thereof |
| CN112331638A (en) * | 2020-09-28 | 2021-02-05 | 惠州市聚飞光电有限公司 | Light emitting diode and backlight module |
-
2016
- 2016-06-08 CN CN201620554297.0U patent/CN205752239U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870300A (en) * | 2016-06-08 | 2016-08-17 | 芜湖聚飞光电科技有限公司 | LED (Light Emitting Diode) packaging structure and packaging method thereof |
| CN112331638A (en) * | 2020-09-28 | 2021-02-05 | 惠州市聚飞光电有限公司 | Light emitting diode and backlight module |
| CN112331638B (en) * | 2020-09-28 | 2023-06-06 | 惠州市聚飞光电有限公司 | Light emitting diode and backlight module |
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| GR01 | Patent grant |