CN207265089U

CN207265089U - The packaging tool of LED flip chip

Info

Publication number: CN207265089U
Application number: CN201720929682.3U
Authority: CN
Inventors: 施高伟; 涂庆镇; 邱华飞
Original assignee: Xiamen Dacol Photoelectronics Technology Co Ltd
Current assignee: Xiamen Dacol Photoelectronics Technology Co Ltd
Priority date: 2017-07-28
Filing date: 2017-07-28
Publication date: 2018-04-20
Anticipated expiration: 2027-07-28

Abstract

It the utility model is related to a kind of packaging tool of LED flip chip, the packaging tool includes bonding wire tool and pressing plate, include body and at least one bonding wire region on body on the bonding wire tool, there is a resigning area on each bonding wire region and be located at two fulcrums of resigning area opposite sides respectively, when the fulcrum area in the middle part of solder stand is placed on the fulcrum, whole solder stand is in seesaw structure, and one end that solder stand is located in resigning area is in low level, one end outside resigning area is in a high position, there is chip fixed area on the pressing plate, two electrode positions of the LED flip chip on chip fixed area are corresponding with the part that solder stand is on low level respectively, easily short circuit or open circuit during solving the problems, such as that existing existing Flip-Chip Using body directly welds.

Description

The packaging tool of LED flip chip

Technical field

A kind of LED flip chip field is the utility model is related to, a kind of encapsulation of LED flip chip is specifically related to and controls Tool.

Background technology

With the continuous development of LED flip chip (Flip-Chip) technology, the advantage of the fabric chip will be able to fully Show.Mainly by the welding of following two methods on circuit boards, one kind is directly to pass through tin cream to existing LED flip chip Or scaling powder is directly welded on circuit board, this welding method is since the size of LED flip-chips is all smaller, in electricity Be not easy to position on the plate of road, and weld when due to tin cream either scaling powder smear it is uneven there may be open circuit or short circuit Situation, and for the CSP packaging bodies covered with fluorescent glue, it is also possible to can cause to damage to fluorescent glue when clamping；It is another Kind is to encapsulate LED flip chip on the package support, is then again welded package support on circuit boards, this welding method Since the presence of package support adds thermal resistance, but also the chip ability light-emitting angle limited.

Utility model content

The utility model aims to provide a kind of LED flip chip packaging tool, to solve existing existing LED upside-down mountings core When piece packaging body directly welds the problem of easily short-circuit or open circuit.

Concrete scheme is as follows：

The utility model provides a kind of packaging tool of LED flip chip, the packaging tool include bonding wire tool and Pressing plate, includes body and at least one bonding wire region on body on the bonding wire tool, on each bonding wire region With a resigning area and respectively positioned at two fulcrums of resigning area opposite sides, when the fulcrum area in the middle part of solder stand is put When putting on the fulcrum, whole solder stand is in seesaw structure, and one end that solder stand is located in resigning area is in low Position, one end outside resigning area are in a high position, have chip fixed area, the LED on chip fixed area on the pressing plate Two electrode positions of flip-chip are corresponding with the part that solder stand is on low level respectively.

Preferably, two fulcrums of the bonding wire tool all have pressure-bearing plane on the side in resigning area.

Preferably, the resigning area is a groove, the opposite two side walls of the groove respectively with body intersect two All there is a recess extended along seamed edge at a seamed edge, the first magnet is installed in the recess, the shape on first magnet Into fulcrum.

Preferably, multiple fixed grooves positioned at groove side, the fixed groove are additionally provided with the surface of the body Second magnet is inside installed.

Preferably, the bottom surface in the resigning area is additionally provided with accommodating grooves.

Also being sticked on the pressing plate has film, and the film has viscosity, the LED upside-down mountings core on the face of pressing plate The light-emitting surface of piece, which is fixed on film, to be had on sticking face.

The packaging tool and packaging body of LED flip chip provided by the utility model have following compared with prior art Beneficial effect：

1st, solder stand is welded on the electrode of LED flip chip so that LED between packaging body provided by the utility model Flip-chip can be welded on circuit board by solder stand, avoided the occurrence of because of breaking or short-circuit the asking of welding appearance Topic, and due to the limitation of no package support, can be with nearly 360 degree of light-emitting angle.

2nd, packaging tool provided by the utility model is used as the fulcrum of solder stand by the seamed edge of groove, has structure letter The advantages of list, easy to manufacture.The displacement of stent is limited additionally by magnet, can ensure LED flip-chips and solder stand Between position.

Brief description of the drawings

Fig. 1 shows the schematic diagram of packaging body.

Fig. 2 shows a kind of schematic diagram of embodiment of packaging tool.

Fig. 3 shows the schematic diagram of another embodiment of packaging tool.

Fig. 4 shows the schematic diagram of Gum injecting tool.

Embodiment

To further illustrate each embodiment, the utility model is provided with attached drawing.These attached drawings is in the utility model exposure A part for appearance, it can coordinate the associated description of specification to explain the running of embodiment original mainly to illustrate embodiment Reason.Cooperation refers to these contents, and those of ordinary skill in the art will be understood that other possible embodiments and this practicality are new The advantages of type.Component in figure is not necessarily to scale, and similar element numbers are conventionally used to indicate similar component.

The utility model is further illustrated in conjunction with the drawings and specific embodiments.

Embodiment 1

As shown in Figure 1, the utility model provides a kind of packaging body, including a LED flip chip 1 and two solder stands 2a and 2b, two electrode 1a and 1b of the LED flip chip by conducting resinl 3 directly with two spaced bonding wire branch Frame 2a is fixedly connected with 2b phases.Each solder stand includes exposed welding electrode area 24 and the chip electrode fixed area 20 at both ends, And the fulcrum area 22 among the two, two chip electrodes of the LED flip chip by conducting resinl respectively with two The chip electrode fixed area of solder stand is fixed, and the fulcrum area is located on the outside of flip LED.

With reference to figure 1, it is preferred that be also wrapped on packing colloid 4 in the LED flip chip 1.Wherein packing colloid 4 can be with It is simple packaging plastic or is mixed with the packaging plastic of fluorescent powder.

With reference to figure 1, LED flip chip is directly anchored to bonding wire branch by packaging body provided by the utility model by conducting resinl On frame, not only the electrode of LED flip chip is extended out, makes it easier to be subjected to, and due to not encapsulating The limitation of stent, has nearly 360 degree of light-emitting angle, while has the advantage that CSP is encapsulated and stent encapsulates.

Embodiment 2

The utility model additionally provides a kind of packaging tool, and with reference to figure 2, body 5 and position are included on the bonding wire tool There is a resigning area 50 at least one bonding wire region on body, on each bonding wire region and be located at resigning area phase respectively To two fulcrums (5a and 5b) of both sides, when the fulcrum area in the middle part of solder stand (2a or 2b) is placed on the fulcrum When, whole solder stand is in seesaw structure, and one end that solder stand is located in resigning area is in low level, positioned at resigning area Outer one end is in a high position, has chip fixed area on the pressing plate, two of the LED flip chip on chip fixed area Electrode position is corresponding with the part that solder stand is on low level respectively.

Also being sticked on the pressing plate 8 has film 7, and the film has viscosity, the LED upside-down mountings on the face of pressing plate The light-emitting surface of chip, which is fixed on film, to be had on sticking face.

With reference to figure 2, as a preferred solution of bonding wire tool, the resigning area in the bonding wire region is a groove 50a, Two side walls opposite the groove 50a are respectively fulcrum with intersect two seamed edges of body, and the two of the bonding wire tool A fulcrum all has pressure-bearing plane 54 on the side in resigning area.Solder stand (2a and 2b) can have flanging or with The matched recess of fulcrum is supported on fulcrum (5a and 5b) so that solder stand (2a and 2b) turns on the fulcrum (5a and 5b) The situation slided or dropped will not be produced when dynamic.With reference to figure 2, the bottom surface of the groove 50a is additionally provided with accommodating grooves 52, houses Groove 52 is used to collect the conducting resinl to drop on solder stand.

With reference to figure 3, as another preferred solution of bonding wire tool, the resigning area in the bonding wire region is a groove 50b, Two side walls opposite the groove 50b are respectively with all having one along the recessed of seamed edge extension at intersect two seamed edges of body Mouthful, the first magnet 60 is installed in the recess, fulcrum (5a ' and 5b ') is formed on first magnet 60.In Fig. 3 One magnet 60 is the magnet of rectangle, i.e. the upper seamed edge of the first magnet is fulcrum.Due to forming fulcrum on the first magnet 60, Apply the solder stand on the packaging tool that preferably there is ferromagnetic solder stand, such as silver-plated retort stand.It can utilize The magnetism of first magnet 60 enables what solder stand stablized be positioned on fulcrum.With reference to figure 3, the bottom surface of the groove 50b Accommodating grooves 52 ' are additionally provided with, for collecting the conducting resinl to drop on solder stand.With reference to figure 3, further, the body Surface on be additionally provided with multiple fixed grooves positioned at groove side, the second magnet 62 is installed in the fixed groove, with In the positioning of auxiliary solder stand.

Referring to figs. 2 and 3, utilize packaging tool provided in this embodiment make embodiment 1 packaging body operating procedure It is as follows, LED flip chip 1 is fixed to blue film 7 with sorting machine first and is had on sticking face；Then blue film is fixed to pressing plate On 8, wherein the face being bonded with pressing plate is the face for being not fixed to LED flip chip；Two solder stands 2a and 2b are positioned respectively On two fulcrums 5a and 5b of bonding wire tool, to form the structure of seesaw, the adjacent both ends of two solder stands all in Low level, each solder stand are in point conducting resinl 3 on the part of low level；Pressing plate 8 and bonding wire tool are positioned, so that LED upside-down mountings Two electrodes 1a and 1b of chip are corresponding with two solder stands 2a and 2b respectively, pressing plate are pushed, since solder stand is in Seesaw structure, therefore pressing plate can first be in contact with the high-order portion of solder stand, during continuing pushing, solder stand High-order portion is down rotated around fulcrum, and put have conducting resinl low portion up rotated around fulcrum so that conducting resinl with The contact electrode of LED flip chip, during pressing plate continues pushing, a part of conducting resinl is extruded solder stand, falls Fall in groove and accommodating grooves, without being impacted to chip；Packaging tool connection pressing plate is put into togerther baking oven again In toasted so that conductive adhesive curing so that solder stand be fixed to LED flip chip electrode on；Finally by pressing plate Slowly peeled off with blue film, you can obtain the packaging body described in embodiment 1.If once encapsulate the multiple encapsulation to connect together Body, then the step of also needing to cut, to form single packaging body.

With reference to figure 4, if necessary to put packing colloid in LED flip chip, Gum injecting tool 9 can be prepared, which controls Tool is more than the injecting glue groove 90 of LED flip chip thickness with a depth, and solder stand is then fixed on Gum injecting tool 9, and LED flip chip is vacantly put into a manner of LED flip chip is directed downwardly into injecting glue groove 90, and encapsulation is injected in injecting glue groove Colloid 4, packing colloid covers LED flip chip, but is not covered with solder stand；Finally Gum injecting tool is fallen together with LED Cartridge chip is put into togerther in oven and is toasted, and cures packing colloid, then packaging body is taken out from Gum injecting tool.Its The injecting glue groove 90 of middle Gum injecting tool can be designed to the shape needed for packing colloid so that packing colloid can with one-pass molding, It need not carry out secondary operation.

Although specifically showing and describing the utility model with reference to preferred embodiment, those skilled in the art should This is understood, in the spirit and scope for not departing from the utility model that the appended claims are limited, in form and details On the utility model can be made a variety of changes, be the scope of protection of the utility model.

Claims

1. a kind of packaging tool of LED flip chip, which includes bonding wire tool and pressing plate, it is characterised in that：Institute Stating includes body and at least one bonding wire region on body on bonding wire tool, have one to allow on each bonding wire region Position area and two fulcrums for being located at resigning area opposite sides respectively, when the fulcrum area in the middle part of solder stand is placed on the branch When on point, whole solder stand is in seesaw structure, and one end that solder stand is located in resigning area is in low level, positioned at allowing One end outside the area of position is in a high position, has chip fixed area on the pressing plate, the LED flip chip on chip fixed area Two electrode positions are corresponding with the part that solder stand is on low level respectively.

2. the packaging tool of LED flip chip according to claim 1, it is characterised in that：Two of the bonding wire tool Fulcrum all has pressure-bearing plane on the side in resigning area.

3. the packaging tool of LED flip chip according to claim 2, it is characterised in that：The resigning area is a groove, The opposite two side walls of the groove are respectively with all having a recess extended along seamed edge, institute at intersect two seamed edges of body State and the first magnet is installed in recess, fulcrum is formed on first magnet.

4. the packaging tool of LED flip chip according to claim 3, it is characterised in that：On the surface of the body also Equipped with multiple fixed grooves positioned at groove side, the second magnet is installed in the fixed groove.

5. the packaging tool of LED flip chip according to claim 1, it is characterised in that：The bottom surface in the resigning area is also Equipped with accommodating grooves.

6. the packaging tool of LED flip chip according to claim 1, it is characterised in that：Also being sticked on the pressing plate has Film, the film have viscosity on the face of pressing plate, and the light-emitting surface of the LED flip chip, which is fixed on film, has viscosity Face on.