CN215869454U

CN215869454U - LED support

Info

Publication number: CN215869454U
Application number: CN202121675991.5U
Authority: CN
Inventors: 黄承斌; 刘娟; 王非
Original assignee: Shenzhen Lt Optoelectronics Co ltd
Current assignee: Shenzhen Lt Optoelectronics Co ltd
Priority date: 2021-07-22
Filing date: 2021-07-22
Publication date: 2022-02-18
Anticipated expiration: 2031-07-22

Abstract

The utility model relates to the technical field of LEDs (light emitting diode), and discloses an LED support which comprises a material sheet, wherein crystal fixing functional areas for placing chips are respectively arranged on the left side and the right side of the middle position of the LED lamp bead functional area of the material sheet, the crystal fixing functional areas are separated from other positions of the material sheet in a groove digging mode, support resin is filled in the grooves in the material sheet, a layer of tin paste is attached to the crystal fixing functional areas through printing, spot coating, spraying and other modes to form a tin soldering layer, then the tin paste is fully melted through reflow soldering, the chips are placed on the tin soldering layer, fluorescent glue is filled in the bowl cup of the LED lamp beads and around the chips, the LED support is redesigned, the tin paste is not used in the packaging process of the LED lamp beads in a tin soldering mode in advance of the crystal fixing functional areas of the LED support, and the problem of tin paste control in the technological process is solved. In addition, the newly designed LED support can also well solve the problems of large die bonding voidage of the chip and the problems of secondary reflow solder paste diffusion, increased voidage, insufficient soldering, lamp failure and the like.

Description

LED support

Technical Field

The utility model relates to the technical field of LEDs, in particular to an LED bracket.

Background

At present, a conventional symmetrical bonding pad support and a flip chip are adopted for the common flip LED lamp bead, the chip is welded and fixed on the support in a mode of printing or dispensing solder paste, and then the chip is sealed in a dispensing mode to obtain a finished product of the LED lamp bead. The LED lamp bead manufactured by adopting the method has the problems of high difficulty in controlling the solder paste process in the lamp bead manufacturing process and high voidage of the solder paste after die bonding, and the problems of secondary reflow solder paste diffusion, increased voidage, insufficient soldering, lamp failure and the like of the die bonding solder paste are easy to occur in the application process.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Aiming at the defects of the prior art, the utility model provides an LED bracket.

(II) technical scheme

In order to achieve the purpose, the utility model provides the following technical scheme: the LED support comprises a material piece, resin and a soldering tin layer, wherein a die bonding functional area for placing the flip chip is arranged on the material piece, the die bonding functional area is separated from other positions of the material piece in a groove digging mode, the groove is filled with the resin and forms the support, the die bonding functional area is provided with the soldering tin layer, the flip chip is fixed on the die bonding functional area of the material piece through the soldering tin layer, and glue is filled on the support and around the flip chip.

Preferably, the positive and negative electrode materials of the flip chip can be gold, gold tin or tin.

Preferably, the number of positive and negative electrodes of the flip chip comprises one pair, two pairs, three pairs or four pairs.

Preferably, the die bonding functional region can be divided into two, four, six or eight regions by the groove.

Preferably, the soldering tin layer can be arranged in the die bonding functional area in a printing, spot coating or spraying mode.

Preferably, the thickness of the solder layer after melting is 1 to 100 um.

Preferably, the material for realizing the connection between the flip chip and the die bonding functional area comprises solder paste or soldering flux.

(III) advantageous effects

Compared with the prior art, the utility model provides the LED bracket which has the following beneficial effects:

1. this LED support, through redesign LED support, the solid brilliant functional area of LED support is the mode of going up tin in advance, makes LED lamp pearl packaging process not use the tin cream, solves the problem of tin cream management and control in the course of the technology. In addition, the newly designed LED support can also well solve the problems of large die bonding voidage of the chip and the problems of secondary reflow solder paste diffusion, increased voidage, insufficient soldering, lamp failure and the like.

2. According to the LED support, the support is subjected to tinning operation after the support is manufactured, tinning is not required in a lamp bead packaging process, and the problem that tin paste process control difficulty is high in the lamp bead process can be solved. Different tin amounts can be adjusted when the bracket is tinned in advance, and crystal solidification is carried out in a flux mode subsequently, so that the crystal solidification void ratio can be effectively reduced. In addition, through digging the recess and the solid brilliant functional area of mode interval and other positions of recess intussuseption resin, can effectively solve because of lamp pearl secondary reflux in-process tin cream diffusion leads to the voidage increase, rosin joint, dead light scheduling problem.

Drawings

FIG. 1 is a schematic view of the structure of the inverted LED lamp bead of the present invention;

FIG. 2 is a schematic diagram of the front structure of the flip-chip LED bracket of the present invention;

FIG. 3 is a schematic side view of the inverted ELD frame of the present invention;

fig. 4 is a manufacturing flow chart of the inverted LED bracket and the lamp bead of the present invention.

In the figure: 1. a scaffold resin; 2. fluorescent glue; 3. a chip; 4. a solder layer; 5. a web.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example one

Referring to fig. 1-4, an LED support includes a material sheet 5, a resin 1 and a solder layer 4, the material sheet 5 is provided with a die bonding functional area for placing a flip chip 3, the die bonding functional area is separated from other positions of the material sheet 5 by digging a groove, the groove is filled with the resin 1 to form the support, the die bonding functional area is provided with the solder layer 4, the flip chip 3 is fixed on the die bonding functional area of the material sheet 5 through the solder layer 4, and the support is filled with glue 2 around the flip chip 3.

Wherein the content of the first and second substances,

the positive and negative electrode materials of the flip chip 3 may be gold, gold tin or tin.

The number of positive and negative electrodes of the flip chip 3 includes one pair, two pairs, three pairs or four pairs.

The die bond function region can be divided into two, four, six or eight regions by the grooves.

The soldering tin layer can be arranged in the die bonding functional area in a printing, spot coating or spraying mode.

The thickness of the solder layer after melting is 1-100 um.

The material for realizing the connection between the flip chip 3 and the die bonding functional area comprises solder paste or soldering flux.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

LED support, including tablet (5), resin (1) and soldering tin layer (4), its characterized in that: the flip chip packaging structure is characterized in that a die bonding functional area for placing the flip chip (3) is arranged on the material piece (5), the die bonding functional area is separated from other positions of the material piece (5) in a groove digging mode, the groove is filled with resin (1) and forms a support, the die bonding functional area is provided with a soldering tin layer (4), the flip chip (3) is fixed on the die bonding functional area of the material piece (5) through the soldering tin layer (4), and glue (2) is filled on the support and around the flip chip (3).
2. The LED holder according to claim 1, wherein: the number of the positive electrode and the negative electrode of the flip chip (3) comprises one pair, two pairs, three pairs or four pairs.
3. The LED holder according to claim 1, wherein: the die bonding functional region can be divided into two, four, six or eight by the groove.
4. The LED holder according to claim 1, wherein: the soldering tin layer can be arranged in the die bonding functional area in a printing, spot coating or spraying mode.
5. The LED holder according to claim 1, wherein: the thickness of the soldering tin layer after being melted is 1-100 um.