CN205611070U - Welded structure of fingerprint identification module becket - Google Patents
Welded structure of fingerprint identification module becket Download PDFInfo
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- CN205611070U CN205611070U CN201620357043.XU CN201620357043U CN205611070U CN 205611070 U CN205611070 U CN 205611070U CN 201620357043 U CN201620357043 U CN 201620357043U CN 205611070 U CN205611070 U CN 205611070U
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- becket
- soldering dish
- recognition module
- fingerprint recognition
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Abstract
The utility model provides a welded structure of fingerprint identification module becket, including becket, base plate, one deck nickel element layer has been plated on the becket surface, is equipped with two -sided hourglass soldering dish on the base plate, and the becket passes through the tin cream welding together with the two -sided hourglass soldering dish of base plate lower surface. This welded structure of fingerprint identification module becket welds the signal foot of becket and base plate, has strengthened its fastness, has overcome the becket and has easily drop and lead to the problem of fingerprint identification disabler, has promoted the reliability of fingerprint identification module, has reduced the production defective rate of fingerprint identification module.
Description
Technical field
This utility model belongs to technical field of electronic products, is specifically related to the Welding Structure of a kind of fingerprint recognition module becket.
Background technology
On mobile phone use fingerprint module need a becket conduction element, its effect be in order to human body conducting realize fingerprint enable identify certification effect, i.e. need to communicate with fingerprint chip part signal.Traditional becket assembles, it it is the signaling point will drawn in chip on substrate (FPC flexible circuit board), coat conducting resinl, region outside signaling point is coated black glue and is turned on strong metal ring on substrate, but, the becket fastness that the method assembles is poor, is reached 3kg by external force and easily makes becket come off, causes fingerprint identification function to lose efficacy.
Utility model content
The purpose of this utility model is substrate and the problem of becket laminating fastness difference overcoming existing fingerprint recognition module.
For this, this utility model provides the Welding Structure of a kind of fingerprint recognition module becket, including becket, substrate, described becket surface is coated with one layer of nickel element layer, described substrate is provided with two-sided leakage soldering dish, and described becket is welded together by tin cream with the two-sided leakage soldering dish of base lower surface.
Further, above-mentioned two-sided leakage soldering dish has four, is separately positioned on the corner of substrate.
Further, above-mentioned two-sided leakage soldering disk shape is circular, square and oval.
Further, the aperture of above-mentioned two-sided leakage soldering dish via is 0.5～2.0mm.
Further, the Welding Structure of this fingerprint recognition module becket also includes that reinforcement steel disc, described reinforcement steel disc are arranged on base lower surface, and reinforcement steel disc is provided with chamfering at two-sided leakage soldering Pan Chu.
Further, the chamfering angle size of above-mentioned reinforcement steel disc is consistent with the size of windowing of two-sided leakage soldering dish.
The beneficial effects of the utility model: becket is welded by the Welding Structure of this fingerprint recognition module becket that this utility model provides with the signal pins of substrate, enhance its fastness, overcome the becket problem causing fingerprint identification function to lose efficacy easy to fall off.
Below with reference to accompanying drawing, this utility model is described in further details.
Accompanying drawing explanation
Fig. 1 is the welded becket structural representation of this utility model fingerprint recognition module becket.
Fig. 2 is the welded upper surface of base plate structural representation of this utility model fingerprint recognition module becket.
Fig. 3 is the welded base lower surface structural representation of this utility model fingerprint recognition module becket.
Fig. 4 is the welded overall structure schematic diagram of this utility model fingerprint recognition module becket.
Description of reference numerals: 1, becket；2, substrate；3, two-sided leakage soldering dish；4, reinforcement steel disc；5, nickel element layer.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole embodiments.Based on the embodiment in this utility model, all other embodiments that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of this utility model protection.
As shown in Figure 1, Figure 2, Figure 3 and Figure 4, present embodiments provide the Welding Structure of a kind of fingerprint recognition module becket, including becket 1, substrate 2, described becket 1 surface is coated with one layer of nickel element layer 5, described substrate 2 is provided with two-sided leakage soldering dish 3, and described becket 1 is welded together by tin cream with the two-sided leakage soldering dish 3 of substrate 2 lower surface.
Wherein, becket 1 material in the present embodiment is Stainless steel 316, it can not connect with stannum, and nickel element zygosity is preferable, and belong to conductor, can connect with steel, also can be connected with stannum, therefore, as it is shown in figure 1, nickel element layer 5 is plated in stainless steel metal ring 1 surface by the way of Vacuum Deposition by the present embodiment.
The Welding Structure of this fingerprint recognition module becket uses two-sided leakage soldering dish 3, its effect is to promote front leakage soldering dish and becket 1 firm welding, by leakage stannum hole, tin sweat(ing) is penetrated on front pad and becket 1 after tin cream on reverse side leakage soldering dish, when flatiron is directed at reverse side leakage soldering dish heating, tin cream bottom positive and negative and becket 1 can reach fusing point, and combined with becket 1 by pad, thus play conducting effect.Preferably, above-mentioned two-sided leakage soldering dish 3 has four, is separately positioned on the corner of substrate 2, and two-sided leakage soldering dish 3 shape can be circular, square and oval etc., and the aperture of two-sided leakage soldering dish 3 via is 0.5～2.0mm.
One more preferably embodiment, the Welding Structure of this fingerprint recognition module becket also includes that reinforcement steel disc 4, described reinforcement steel disc 4 are arranged on substrate 2 lower surface, and reinforcement steel disc 4 is provided with chamfering at two-sided leakage soldering Pan3Chu；Further, the chamfering angle size of reinforcement steel disc 4 is consistent with the size of windowing of two-sided leakage soldering dish 3.
The welded concrete welding process of this fingerprint recognition module becket that this utility model provides is as follows:
First, as it is shown in figure 1, plate last layer nickel element layer 5 by the way of Vacuum Deposition on becket 1 surface.
Then, as shown in Figure 2, the one side pad putting conducting resinl in conventional substrate 2 changing into two-sided leakage soldering dish 3, is cancelled by the size of windowing of two-sided leakage soldering dish 3 by the reinforcement steel disc 4 bottom two-sided leakage soldering dish 3, four limit chamferings as shown in Figure 3 are reinforcement steel disc cancellation part.
Finally, filling on a substrate 2 by becket 1, the side that becket 1 is coated with nickel element layer 5 is corresponding with the two-sided leakage soldering dish 3 on substrate 2, then by tin cream point on the two-sided leakage soldering dish 3 in reinforcement face, tin cream and becket 1 being welded together by electric cautery, structure is as shown in Figure 4.
In sum, becket is welded by the Welding Structure of this fingerprint recognition module becket that this utility model provides with the signal pins of substrate, enhance its fastness, overcome the becket problem causing fingerprint identification function to lose efficacy easy to fall off, improve the reliability of fingerprint recognition module, decrease the production fraction defective of fingerprint recognition module.
Exemplified as above is only to illustration of the present utility model, is not intended that the restriction to protection domain of the present utility model, within the every and same or analogous design of this utility model belongs to protection domain of the present utility model.
Claims (6)
1. the Welding Structure of a fingerprint recognition module becket, including becket (1), substrate (2), it is characterized in that: described becket (1) surface is coated with one layer of nickel element layer (5), described substrate (2) is provided with two-sided leakage soldering dish (3), and described becket (1) is welded together by tin cream with two-sided leakage soldering dish (3) of substrate (2) lower surface.
2. the Welding Structure of fingerprint recognition module becket as claimed in claim 1, it is characterised in that: described two-sided leakage soldering dish (3) has four, is separately positioned on the corner of substrate (2).
3. the Welding Structure of fingerprint recognition module becket as claimed in claim 2, it is characterised in that: described two-sided leakage soldering dish (3) is generally circular in shape, square and oval.
4. the Welding Structure of fingerprint recognition module becket as claimed in claim 3, it is characterised in that: the aperture of described two-sided leakage soldering dish (3) via is 0.5～2.0mm.
5. the Welding Structure of the fingerprint recognition module becket as described in any one of Claims 1 to 4, it is characterized in that: also include reinforcement steel disc (4), described reinforcement steel disc (4) is arranged on substrate (2) lower surface, and reinforcement steel disc (4) is provided with chamfering at two-sided leakage soldering dish (3) place.
6. the Welding Structure of fingerprint recognition module becket as claimed in claim 5, it is characterised in that: the chamfering angle size of described reinforcement steel disc (4) is consistent with the size of windowing of two-sided leakage soldering dish (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620357043.XU CN205611070U (en) | 2016-04-26 | 2016-04-26 | Welded structure of fingerprint identification module becket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620357043.XU CN205611070U (en) | 2016-04-26 | 2016-04-26 | Welded structure of fingerprint identification module becket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205611070U true CN205611070U (en) | 2016-09-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620357043.XU Active CN205611070U (en) | 2016-04-26 | 2016-04-26 | Welded structure of fingerprint identification module becket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205611070U (en) |
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2016
- 2016-04-26 CN CN201620357043.XU patent/CN205611070U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | "change of name, title or address" | ||
| CP03 | "change of name, title or address" |
Address after: 437400 sanyingxing Technology Co., Ltd., Tongcheng Economic Development Zone, Xianning City, Hubei Province Patentee after: Hubei sanyingxing Photoelectric Technology Co.,Ltd. Address before: 437400 sanyingxing high tech park, Tongcheng Economic Development Zone, Xianning City, Hubei Province Patentee before: HUBEI SUNWIN TECHNOLOGY GROUP Co.,Ltd. |