CN205429006U - Heat dissipation type led packaging structure - Google Patents
Heat dissipation type led packaging structure Download PDFInfo
- Publication number
- CN205429006U CN205429006U CN201520911424.3U CN201520911424U CN205429006U CN 205429006 U CN205429006 U CN 205429006U CN 201520911424 U CN201520911424 U CN 201520911424U CN 205429006 U CN205429006 U CN 205429006U
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- China
- Prior art keywords
- led chip
- heat
- utility
- heat dissipation
- model
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- Expired - Fee Related
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Abstract
The utility model discloses a heat dissipation type LED packaging structure, including LED chip, positive plate, negative pole piece, radiating basal plate, encapsulation colloid and reflection cup, LED chip package is in encapsulation colloid, and the LED chip is connected with positive plate and negative pole piece electricity respectively, and the bottom surface of LED chip is supported on radiating basal plate, and encapsulation colloid fills in the reflection cup, and radiating basal plate's bottom is equipped with a plurality of fin -shaped fin. The utility model discloses light quality volume has been increased to the heat dissipation is good.
Description
Technical field
This utility model relates to a kind of heat dissipation LED encapsulating structure, belongs to LED encapsulation technology field.
Background technology
At present, LED industry is one of industry of attracting most attention in recent years, it is developed so far, LED product has had that energy-conservation, power saving, high efficiency, response time is fast, life cycle time length and the most mercurous, there is the advantages such as environmental benefit, but LED high power products is to obtain required brightness and color, LED encapsulation structure has a reflecting layer and arranges.Described reflecting layer typically uses plastics and makes, such plastics are at product miniaturization during thinning reflecting layer, the light of LED chip easily propagates through described reflecting layer, product the most not only can be caused to go out the saturation deficiency of light, also can pass the refraction relation in described reflecting layer because of light so that encapsulating structure produces halation phenomenon.The mode improved at present, has and covers a metal level the outside of described reflecting layer or thicken described reflecting layer again, and these modes improved can increase the manufacturing cost of encapsulating structure, is unfavorable for the product design development of miniaturization simultaneously.
Summary of the invention
Technical problem to be solved in the utility model is the defect overcoming prior art, it is provided that a kind of LED encapsulation structure, which increases out light quality, and it is good to dispel the heat.
This utility model solves above-mentioned technical problem and adopts the technical scheme that: a kind of heat dissipation LED encapsulating structure, including LED chip, positive plate, negative plate, heat-radiating substrate, packing colloid and reflector, LED chip is encapsulated in packing colloid, LED chip electrically connects with positive plate and negative plate respectively, the bottom surface of LED chip is against on heat-radiating substrate, packing colloid is filled in reflector, and the bottom of heat-radiating substrate is provided with multiple fin-shaped fin.
Further, the outside of described reflector is additionally provided with light absorbing zone.
Further, described positive plate and negative plate have weld part, and the bottom surface of its weld part is positioned at the top of heat-radiating substrate bottom surface.
After have employed technique scheme, the bottom of heat-radiating substrate of the present utility model has fin-shaped fin, adds heat-sinking capability, and the reflector of setting can increase it and go out light quality.Additionally, owing to the outside of described reflector has light absorbing zone, make LED chip penetrate the light of reflector, can directly be absorbed by light absorbing zone, at the outside halation phenomenon that produces of the present utility model, and then will not can maintain saturation and the contrast color of this utility model light.
Accompanying drawing explanation
Fig. 1 is the structural representation of heat dissipation LED encapsulating structure of the present utility model.
Detailed description of the invention
In order to make content of the present utility model be easier to be clearly understood, below according to specific embodiment and combine accompanying drawing, this utility model is described in further detail.
As shown in Figure 1, a kind of heat dissipation LED encapsulating structure, including LED chip 8, positive plate 7, negative plate 4, heat-radiating substrate 5, packing colloid 1 and reflector 2, LED chip 8 is encapsulated in packing colloid 1, LED chip 8 electrically connects with positive plate 7 and negative plate 4 respectively, the bottom surface of LED chip 8 is against on heat-radiating substrate 5, and packing colloid 1 is filled in reflector 2, and the bottom of heat-radiating substrate 5 is provided with multiple fin-shaped fin 5-1.
The outside of reflector 2 is additionally provided with light absorbing zone 3.
Positive plate 7 and negative plate 4 have weld part 74, and the bottom surface of its weld part 74 is positioned at the top of heat-radiating substrate 5 bottom surface.
Operation principle of the present utility model is as follows:
The bottom of heat-radiating substrate 5 of the present utility model has fin-shaped fin 5-1, adds heat-sinking capability, and the reflector 2 of setting can increase it and go out light quality.Additionally, owing to the outside of described reflector 2 has light absorbing zone 3, make LED chip 8 penetrate the light of reflector 2, can directly be absorbed by light absorbing zone 3, at the outside halation phenomenon that produces of the present utility model, and then will not can maintain saturation and the contrast color of this utility model light.
Particular embodiments described above; the purpose of this utility model, technical scheme and beneficial effect are further described; it is it should be understood that; the foregoing is only specific embodiment of the utility model; it is not limited to this utility model; all within spirit of the present utility model and principle, any modification, equivalent substitution and improvement etc. done, within should be included in protection domain of the present utility model.
Claims (1)
1. a heat dissipation LED encapsulating structure, including LED chip (8), positive plate (7), negative plate (4), heat-radiating substrate (5), packing colloid (1) and reflector (2), LED chip (8) is encapsulated in packing colloid (1), LED chip (8) electrically connects with positive plate (7) and negative plate (4) respectively, the bottom surface of LED chip (8) is against on heat-radiating substrate (5), packing colloid (1) is filled in reflector (2), it is characterized in that: the bottom of heat-radiating substrate (5) is provided with multiple fin-shaped fin (5-1), the outside of reflector (2) is additionally provided with light absorbing zone (3), described positive plate (7) and negative plate (4) have weld part (74), the bottom surface of its weld part (74) is positioned at the top of heat-radiating substrate (5) bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520911424.3U CN205429006U (en) | 2015-11-16 | 2015-11-16 | Heat dissipation type led packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520911424.3U CN205429006U (en) | 2015-11-16 | 2015-11-16 | Heat dissipation type led packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205429006U true CN205429006U (en) | 2016-08-03 |
Family
ID=56518248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520911424.3U Expired - Fee Related CN205429006U (en) | 2015-11-16 | 2015-11-16 | Heat dissipation type led packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205429006U (en) |
-
2015
- 2015-11-16 CN CN201520911424.3U patent/CN205429006U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160803 Termination date: 20161116 |