CN105390601A - Heat-radiating LED packaging structure - Google Patents
Heat-radiating LED packaging structure Download PDFInfo
- Publication number
- CN105390601A CN105390601A CN201510784202.4A CN201510784202A CN105390601A CN 105390601 A CN105390601 A CN 105390601A CN 201510784202 A CN201510784202 A CN 201510784202A CN 105390601 A CN105390601 A CN 105390601A
- Authority
- CN
- China
- Prior art keywords
- heat
- led chip
- radiating substrate
- reflector
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
The invention discloses a heat-radiating LED packaging structure comprising an LED chip, a positive plate, a negative plate, a heat radiating substrate, a packaging colloid and a reflective cup. The LED chip is packaged inside the packaging colloid and electrically connected with the positive plate and the negative plate, and the bottom side of the LED chip abuts on the heat radiating substrate. The packaging colloid fills the reflective cup. The bottom of the heat radiating substrate is provided with multiple fin-shaped heat sinks. The light quality is increased, and the heat radiating performance is good.
Description
Technical field
The present invention relates to a kind of heat dissipation LED encapsulating structure, belong to LED technical field.
Background technology
At present, LED industry is one of industry attracted most attention in recent years, be developed so far, LED product has had energy-conservation, power saving, high efficiency, the reaction time is fast, the life cycle time is long and not mercurous, have the advantages such as environmental benefit, but LED high power products is the brightness required for obtaining and color, has reflector and arrange in LED encapsulation structure.Described reflector typically uses plastics and makes, such plastics are when the miniaturized and thinning reflector of product, the light of LED chip is easily through described reflector, therefore the saturation of product bright dipping not only can be caused not enough, also can, because of the refraction relation of light through described reflector, encapsulating structure be made to produce halation phenomenon.The mode of current improvement, has and to cover a metal level in the outside in described reflector or thicken described reflector again, and these modes improved can increase the manufacturing cost of encapsulating structure, is unfavorable for miniaturized product design development simultaneously.
Summary of the invention
Technical problem to be solved by this invention is the defect overcoming prior art, provides a kind of LED encapsulation structure, which increases out light quality, and heat radiation is good.
The present invention solves the problems of the technologies described above the technical scheme taked: a kind of heat dissipation LED encapsulating structure, comprise LED chip, positive plate, negative plate, heat-radiating substrate, packing colloid and reflector, LED chip is encapsulated in packing colloid, LED chip is electrically connected with positive plate and negative plate respectively, the bottom surface of LED chip is against on heat-radiating substrate, packing colloid is filled in reflector, and the bottom of heat-radiating substrate is provided with multiple fin-shaped fin.
Further, the outside of described reflector is also provided with light absorbing zone.
Further, described positive plate and negative plate have weld part, and the bottom surface of its weld part is positioned at the top of heat-radiating substrate bottom surface.
After have employed technique scheme, the bottom of heat-radiating substrate of the present invention has fin-shaped fin, adds heat-sinking capability, and the reflector of setting can increase it and go out light quality.In addition, because the outside of described reflector has light absorbing zone, make the light of LED chip penetrate through reflective cup, can directly be absorbed by light absorbing zone, halation phenomenon can not be produced in outside of the present invention, and then saturation and the contrast color of light of the present invention can be maintained.
Accompanying drawing explanation
Fig. 1 is the structural representation of heat dissipation LED encapsulating structure of the present invention.
Embodiment
In order to make content of the present invention more easily be clearly understood, below according to specific embodiment also by reference to the accompanying drawings, the present invention is further detailed explanation.
As shown in Figure 1, a kind of heat dissipation LED encapsulating structure, comprise LED chip 8, positive plate 7, negative plate 4, heat-radiating substrate 5, packing colloid 1 and reflector 2, LED chip 8 is encapsulated in packing colloid 1, LED chip 8 is electrically connected with positive plate 7 and negative plate 4 respectively, the bottom surface of LED chip 8 is against on heat-radiating substrate 5, and packing colloid 1 is filled in reflector 2, and the bottom of heat-radiating substrate 5 is provided with multiple fin-shaped fin 5-1.
The outside of reflector 2 is also provided with light absorbing zone 3.
Positive plate 7 and negative plate 4 have weld part 74, and the bottom surface of its weld part 74 is positioned at the top of heat-radiating substrate 5 bottom surface.
Operation principle of the present invention is as follows:
The bottom of heat-radiating substrate 5 of the present invention has fin-shaped fin 5-1, adds heat-sinking capability, and the reflector 2 of setting can increase it and go out light quality.In addition, because the outside of described reflector 2 has light absorbing zone 3, make the light of LED chip 8 penetrate through reflective cup 2, can directly be absorbed by light absorbing zone 3, halation phenomenon can not be produced in outside of the present invention, and then saturation and the contrast color of light of the present invention can be maintained.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. a heat dissipation LED encapsulating structure, comprise LED chip (8), positive plate (7), negative plate (4), heat-radiating substrate (5), packing colloid (1) and reflector (2), LED chip (8) is encapsulated in packing colloid (1), LED chip (8) is electrically connected with positive plate (7) and negative plate (4) respectively, the bottom surface of LED chip (8) is against on heat-radiating substrate (5), packing colloid (1) is filled in reflector (2), it is characterized in that: the bottom of heat-radiating substrate (5) is provided with multiple fin-shaped fin (5-1).
2. heat dissipation LED encapsulating structure according to claim 1, is characterized in that: the outside of reflector (2) is also provided with light absorbing zone (3).
3. heat dissipation LED encapsulating structure according to claim 1 and 2, is characterized in that: described positive plate (7) and negative plate (4) have weld part (74), and the bottom surface of its weld part (74) is positioned at the top of heat-radiating substrate (5) bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510784202.4A CN105390601A (en) | 2015-11-16 | 2015-11-16 | Heat-radiating LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510784202.4A CN105390601A (en) | 2015-11-16 | 2015-11-16 | Heat-radiating LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105390601A true CN105390601A (en) | 2016-03-09 |
Family
ID=55422665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510784202.4A Pending CN105390601A (en) | 2015-11-16 | 2015-11-16 | Heat-radiating LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105390601A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106025054A (en) * | 2016-06-29 | 2016-10-12 | 海宁市智慧光电有限公司 | High-reliability superbright wafer type LED light source |
-
2015
- 2015-11-16 CN CN201510784202.4A patent/CN105390601A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106025054A (en) * | 2016-06-29 | 2016-10-12 | 海宁市智慧光电有限公司 | High-reliability superbright wafer type LED light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160309 |
|
| WD01 | Invention patent application deemed withdrawn after publication |