CN105355765A - Led packaging structure - Google Patents
Led packaging structure Download PDFInfo
- Publication number
- CN105355765A CN105355765A CN201510784630.7A CN201510784630A CN105355765A CN 105355765 A CN105355765 A CN 105355765A CN 201510784630 A CN201510784630 A CN 201510784630A CN 105355765 A CN105355765 A CN 105355765A
- Authority
- CN
- China
- Prior art keywords
- led chip
- led
- reflector
- heat
- electrode plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
Abstract
The invention discloses an LED packaging structure comprising an LED chip, a positive electrode plate, a negative electrode plate, a heat radiation substrate, packaging gel and a reflecting cup. The LED chip is packaged in the packaging gel. The LED chip is electrically connected with the positive electrode plate and the negative electrode plate respectively. The bottom surface of the LED chip abuts against the heat radiation substrate. The packaging gel fills in the reflecting cup. The external side of the reflecting cup is also provided with a light absorption layer. Generation of the halo effect can be avoided, emergent light quality can be increased and heat radiation is great.
Description
Technical field
The present invention relates to a kind of LED encapsulation structure, belong to LED technical field.
Background technology
At present, LED industry is one of industry attracted most attention in recent years, be developed so far, LED product has had energy-conservation, power saving, high efficiency, the reaction time is fast, the life cycle time is long and not mercurous, have the advantages such as environmental benefit, but LED high power products is the brightness required for obtaining and color, has reflector and arrange in LED encapsulation structure.Described reflector typically uses plastics and makes, such plastics are when the miniaturized and thinning reflector of product, the light of LED chip is easily through described reflector, therefore the saturation of product bright dipping not only can be caused not enough, also can, because of the refraction relation of light through described reflector, encapsulating structure be made to produce halation phenomenon.The mode of current improvement, has and to cover a metal level in the outside in described reflector or thicken described reflector again, and these modes improved can increase the manufacturing cost of encapsulating structure, is unfavorable for miniaturized product design development simultaneously.
Summary of the invention
Technical problem to be solved by this invention is the defect overcoming prior art, provides a kind of LED encapsulation structure, and it can avoid producing halo effect, increases and light quality, and heat radiation is good.
The present invention solves the problems of the technologies described above the technical scheme taked: a kind of LED encapsulation structure, comprise LED chip, positive plate, negative plate, heat-radiating substrate, packing colloid and reflector, LED chip is encapsulated in packing colloid, LED chip is electrically connected with positive plate and negative plate respectively, the bottom surface of LED chip is against on heat-radiating substrate, packing colloid is filled in reflector, and the outside of reflector is also provided with light absorbing zone.
Further, the bottom surface of described heat-radiating substrate is provided with one deck silicone grease layer.
Further, described positive plate and negative plate have weld part, and the bottom surface of its weld part is positioned at the top of heat-radiating substrate bottom surface.
After have employed technique scheme, because the outside of described reflector has light absorbing zone, make the light of LED chip penetrate through reflective cup, can directly be absorbed by light absorbing zone, halation phenomenon can not be produced in outside of the present invention, and then saturation and the contrast color of light of the present invention can be maintained, improve shortcoming existing at present.
Accompanying drawing explanation
Fig. 1 is the structural representation of LED encapsulation structure of the present invention.
Embodiment
In order to make content of the present invention more easily be clearly understood, below according to specific embodiment also by reference to the accompanying drawings, the present invention is further detailed explanation.
As shown in Figure 1, a kind of LED encapsulation structure, comprise LED chip 8, positive plate 7, negative plate 4, heat-radiating substrate 5, packing colloid 1 and reflector 2, LED chip 8 is encapsulated in packing colloid 1, LED chip 8 is electrically connected with positive plate 7 and negative plate 4 respectively, the bottom surface of LED chip 8 is against on heat-radiating substrate 5, and packing colloid 1 is filled in reflector 2, and the outside of reflector 2 is also provided with light absorbing zone 3.
In order to make radiating effect better, the bottom surface of heat-radiating substrate 5 is provided with one deck silicone grease layer 6.
For the ease of welding the present invention, positive plate 7 and negative plate 4 have weld part 74, and the bottom surface of its weld part 74 is positioned at the top of heat-radiating substrate 5 bottom surface.
Operation principle of the present invention is as follows:
Because the outside of described reflector 2 has light absorbing zone 3, make the light of LED chip 8 penetrate through reflective cup 2, can directly be absorbed by light absorbing zone 3, halation phenomenon can not be produced in outside of the present invention, and then saturation and the contrast color of light of the present invention can be maintained, improve shortcoming existing at present.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. a LED encapsulation structure, comprise LED chip (8), positive plate (7), negative plate (4), heat-radiating substrate (5), packing colloid (1) and reflector (2), LED chip (8) is encapsulated in packing colloid (1), LED chip (8) is electrically connected with positive plate (7) and negative plate (4) respectively, the bottom surface of LED chip (8) is against on heat-radiating substrate (5), packing colloid (1) is filled in reflector (2), it is characterized in that: the outside of reflector (2) is also provided with light absorbing zone (3).
2. LED encapsulation structure according to claim 1, is characterized in that: the bottom surface of described heat-radiating substrate (5) is provided with one deck silicone grease layer (6).
3. LED encapsulation structure according to claim 1 and 2, is characterized in that: described positive plate (7) and negative plate (4) have weld part (74), and the bottom surface of its weld part (74) is positioned at the top of heat-radiating substrate (5) bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510784630.7A CN105355765A (en) | 2015-11-16 | 2015-11-16 | Led packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510784630.7A CN105355765A (en) | 2015-11-16 | 2015-11-16 | Led packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105355765A true CN105355765A (en) | 2016-02-24 |
Family
ID=55331690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510784630.7A Pending CN105355765A (en) | 2015-11-16 | 2015-11-16 | Led packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105355765A (en) |
-
2015
- 2015-11-16 CN CN201510784630.7A patent/CN105355765A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160224 |