CN204289531U - 全彩led封装结构及led显示模组 - Google Patents
全彩led封装结构及led显示模组 Download PDFInfo
- Publication number
- CN204289531U CN204289531U CN201420845847.5U CN201420845847U CN204289531U CN 204289531 U CN204289531 U CN 204289531U CN 201420845847 U CN201420845847 U CN 201420845847U CN 204289531 U CN204289531 U CN 204289531U
- Authority
- CN
- China
- Prior art keywords
- pin frame
- full
- chip
- led
- encapsulating housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 38
- 238000004020 luminiscence type Methods 0.000 claims abstract description 28
- 238000005452 bending Methods 0.000 claims abstract description 13
- 238000005476 soldering Methods 0.000 claims description 18
- 230000000875 corresponding Effects 0.000 claims description 17
- 229910052718 tin Inorganic materials 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound 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[Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000006071 cream Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
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O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Abstract
本实用新型适用于发光二极管领域，提供了一种全彩LED封装结构及LED显示模组，包括封装壳体和呈一列封装于封装壳体中的全彩发光单元；各全彩发光单元包括多个发光芯片和分别与各发光芯片电性相连的多个金属支架，各金属支架的具有引伸并折弯至封装壳体的背面的引脚端；多个发光芯片包括蓝光LED芯片、绿光LED芯片和红光LED芯片，多个金属支架包括共极引脚架、蓝光引脚架、绿光引脚架和红光引脚架，蓝光LED芯片、红光LED芯片及绿光LED芯片均与共极引脚架电性相连。通过将两个全彩发光单元封装于一个封装壳体中，从而提高该封装壳体中全彩LED的密度，进而提高形成的LED显示模组的全彩LED密度。
Description
技术领域
[0001] 本实用新型属于发光二极管领域，尤其涉及一种全彩LED封装结构及使用该全彩LED封装结构的LED显示模组。
背景技术
[0002] 发光二极管LED (Light Emitting D1de)是一种固态的半导体器件，它可以直接把电转化为光。它改变了白炽灯钨丝发光与节能灯三基色粉发光的原理，而采用电场发光。LED的特点非常明显，寿命长、光效高、无辐射与低功耗。
[0003] LED的光谱几乎全部集中于可见光频段.LED光源可利用红、绿、蓝三基色原理，在计算机技术控制下使三种颜色具有256级灰度并任意混合，即可产生256X256X256 =16777216种颜色，形成不同光色的组合变化多端，实现丰富多彩的动态变化效果及各种图像。
[0004] 随着发光二极管技术的不断发展，LED显示屏越来越多地应用在室内室外等多种场合。LED显示屏一般由若干LED显示模组拼接而成。请参阅图1，各LED显示模组则是由多个贴片式全彩LED封装结构91焊接在电路板92上形成的，这就要求全彩LED封装结构91具有良好的抗寒、防水、防尘和冷却性能。然而目前的全彩LED封装一般是采用胶水进行固晶粘接，在大电流的冲击，容易出现接触不良；而其红光LED芯片、蓝光LED芯片和绿光LED芯片都通过导线与相应的金属支架进行连接，使用导线较多，容易导致在焊线(bondingwire)工艺的第二焊点在回焊及使用过程中出现断线，翘焊等接触不良的问题。
实用新型内容
[0005] 本实用新型的目的在于提供一种全彩LED封装结构，旨在解决现有全彩LED封装结构容易出现接触不良的问题。
[0006] 本实用新型是这样实现的，一种全彩LED封装结构，包括封装壳体和封装于所述封装壳体中的全彩发光单元；所述全彩发光单元包括用于发出RGB三色光的多个发光芯片和分别与各所述发光芯片电性相连的多个金属支架，各所述金属支架的具有引伸并折弯至所述封装壳体的背面的引脚端；多个所述金属支架包括共极引脚架、蓝光引脚架、绿光引脚架和红光引脚架；多个所述发光芯片包括两极分别回流焊焊接于所述共极引脚架与所述蓝光引脚架上的倒装蓝光LED芯片、两极分别回流焊焊接于所述共极引脚架与所述绿光引脚架上的倒装绿光LED芯片和回流焊焊接于所述共极引脚架上的红光LED芯片，所述红光LED芯片通过导线与所述红光引脚架电性相连。
[0007] 进一步地，所述封装壳体包括依次相连的第一边、第二边、第三边和第四边；所述共极引脚架包括靠近所述第二边且用于焊接固定所述红光LED芯片的第一段、由所述第一段朝向所述第四边的方向延伸的第二段和由所述第二段朝向所述封装壳体的背面折弯的第三段，所述第三段的端部为该共极引脚架的所述引脚端。
[0008] 进一步地，所述绿光引脚架和所述红光引脚架分别位于所述共极引脚架的第二段的两侧，所述绿光引脚架和所述蓝光引脚架位于所述共极引脚架靠近所述第一边的一侧。
[0009] 进一步地，所述绿光引脚架的引脚端和所述蓝光引脚架的引脚端均由所述第一边折弯至所述封装壳体的背面；所述红光引脚架的引脚端与所述共极引脚架的引脚端均由所述第三边折弯至所述封装壳体的背面。
[0010] 进一步地，所述红光LED芯片、所述倒装蓝光LED芯片和所述倒装绿光LED芯片呈一字形分布设置。
[0011] 进一步地，所述第一段的宽度大于所述第二段的宽度，所述第二段位于所述封装壳体中部区域上靠近所述第三边的一侧，所述绿光引脚架具有与所述倒装绿光LED芯片电性相连的绿光电极端，所述绿光电极端邻近所述共极引脚架的第二段；所述蓝光引脚架具有与所述倒装蓝光LED芯片电性相连的蓝光电极端，所述蓝光电极端邻近所述共极引脚架的第二段。
[0012] 进一步地，所述导线远离所述红光LED芯片的一端固定有与所述红光引脚架回流焊焊接的焊锡脚。
[0013] 进一步地，所述封装壳体包括支撑各所述金属支架的支撑座和将各所述金属支架固定于所述支撑座上的灯杯，所述灯杯上对应于各所述全彩发光单元的位置开设有露出所述全彩发光单元的凹腔，各所述凹腔中填充有封装胶。
[0014] 进一步地，所述支撑座的侧边上对应于各所述金属支架的位置开设有容置相应所述金属支架的凹槽。
[0015] 本实用新型通过使用倒装蓝光LED芯片和倒装绿光LED芯片，并将红光LED芯片、倒装蓝光LED芯片和倒装绿光LED芯片通过回流焊焊接在相应的金属支架上，仅需要将红光LED芯片通过导线与红光引脚架相连，减少了导线的使用数量，从而降低断线发生的概率，保证各发光芯片与金属支架连接牢固，提高承受电流冲击能力，防止翘焊，保证该全彩LED封装结构的各发光芯片接触良好。
[0016] 本实用新型的另一目的在于提供一种LED显示模组，包括电路板和安装于所述电路板上的若干如上所述的全彩LED封装结构。
[0017] 本实用新型的LED显示模组使用了上述全彩LED封装结构，其发光芯片连接牢固，接触良好，保证该LED显示模组的使用寿命和防水防潮性能。
附图说明
[0018] 图1是现有技术提供的全彩发光二极管灯珠的正视结构示意图；
[0019] 图2是本实用新型实施例提供的全彩LED封装结构的正视结构示意图；
[0020] 图3是图2的全彩LED封装结构的正视方向的透视结构示意图；
[0021] 图4是图2的全彩LED封装结构的右视结构示意图；
[0022] 图5是图2的全彩LED封装结构的仰视结构示意图；
[0023] 图6是图5的全彩LED封装结构中A部分的放大结构示意图；
[0024] 图7是图2的全彩LED封装结构的后视结构示意图。
[0025] 图8是本实用新型实施例提供的LED显示模组的部分区域的放大结构示意图。具体实施方式
[0026] 为了使本实用新型的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本实用新型进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。
[0027] 请参阅图2、图3和图4，本实用新型实施例提供的一种全彩LED封装结构100，包括封装壳体4和全彩发光单元I ;全彩发光单元I均封装在封装壳体4中。
[0028] 全彩发光单元I包括多个发光芯片10和多个金属支架20 ;多个发光芯片10分别用于发出RGB(红、绿、蓝)三色光，多个金属支架20分别与各发光芯片10电性相连，用来为各发光芯片10共电；为方便与电路板相连，各金属支架20具有引伸并折弯至封装壳体4的背面的引脚端201，将引脚端201折弯至封装壳体4的背面，从而形成贴片式引脚。上述的多个发光芯片10包括倒装蓝光LED芯片13、倒装绿光LED芯片12和红光LED芯片11。上述的多个金属支架20包括共极引脚架24、蓝光引脚架22、绿光引脚架21和红光引脚架23 ;并且共极引脚架24、蓝光引脚架22、绿光引脚架21和红光引脚架23均具有引脚端201。倒装蓝光LED芯片13的两极通过回流焊分别与蓝光引脚架22和共极引脚架24电性相连，倒装绿光LED芯片12的两极通过回流焊分别与绿光引脚架21和共极引脚架24电性相连。请一并参阅图5和图6，红光LED芯片11通过回流焊固定在共极引脚架24上，并与共极引脚架24固定相连，红光LED芯片通过导线15与红光引脚架23电性相连。倒装蓝光LED芯片13用来发出蓝色光，倒装绿光LED芯片12用来发出绿色光，红光LED芯片11用来发出红色光，从而使该全彩发光单元I能发出不同的颜色。
[0029] 通过使用倒装蓝光LED芯片13和倒装绿光LED芯片12，并将红光LED芯片11、倒装蓝光LED芯片13和倒装绿光LED芯片12通过回流焊焊接在相应的金属支架20上，仅需要将红光LED芯片11通过导线15与红光引脚架23相连，减少了导线15的使用数量，从而降低断线发生的概率，保证各发光芯片10与金属支架20连接牢固，提高承受电流冲击能力，防止翘焊，保证该全彩LED封装结构100的各发光芯片10接触良好。
[0030] 请参阅图2、图3和图7，封装壳体4包括依次相连的第一边41、第二边42、第三边43和第四边44，即封装壳体4包括四边，分别为第一边41、第二边42、第三边43和第四边44 ο
[0031] 共极引脚架24包括靠近第二边42且用于焊接固定红光LED芯片11的第一段241、由第一段241朝向第四边44的方向延伸的第二段242和由第二段242朝向封装壳体4的背面折弯的第三段243，第三段243的端部为该共极引脚架24的引脚端244。这样可以将倒装蓝光LED芯片13和倒装绿光LED芯片12与共极引脚架24的第二段242相连，而将红光LED芯片11固定在共极引脚架24的第一段241上，方便布局红光引脚架23、蓝光引脚架22和绿光引脚架21的位置，同时以便加工制作共极引脚架24，也方便安装固定倒装蓝光LED芯片13、倒装绿光LED芯片12和红光LED芯片11。在其它实施例中，第三段243还可以与第一段241相连。
[0032] 绿光引脚架21和红光引脚架23分别位于共极引脚架24的第二段242的两侧，绿光引脚架21和蓝光引脚架22位于共极引脚架24靠近封装壳体4的第一边41的一侧。这种结构布局，可以将各金属支架20的面积设计较大，方便通过各金属支架20对发光芯片10进行散热。
[0033] 本实施例中，全彩发光单元I包括三个发光芯片10，即倒装蓝光LED芯片13、红光LED芯片11及倒装绿光LED芯片12各为一个。三个发光芯片10呈一字形排列，即红光LED芯片11、倒装蓝光LED芯片13和倒装绿光LED芯片12呈一字形分布设置；从而达到均质的视频显示效果和较高的色彩逼真度。
[0034] 共极引脚架24的第一段241的宽度大于其第二段242的宽度，第二段242位于封装壳体4中部区域上靠近第三边43的一侧；绿光引脚架21具有与倒装绿光LED芯片12电性相连的绿光电极端212，绿光电极端212邻近共极引脚架24的第二段242 ;蓝光引脚架22具有与倒装蓝光LED芯片13电性相连的蓝光电极端222，蓝光电极端222邻近共极引脚架24的第二段242。绿光引脚架21和蓝光引脚架22并排设置。这种设置可以使红光LED芯片11、倒装蓝光LED芯片13和倒装绿光LED芯片12位置封装壳体4的中部位置，从而使用该全彩LED封装结构100发光更均匀。
[0035] 绿光引脚架21的引脚端211和蓝光引脚架22的引脚端221均由封装壳体4的第一边41折弯至该封装壳体4的背面；红光引脚架23的引脚端231与共极引脚架24的引脚端244均由封装壳体4的第三边43折弯至该封装壳体4的背面。这种设置可以将各金属支架20的引脚端201对称分布在封装壳体4的两边，方便各金属支架20的布局，也方便安装该全彩LED封装结构100的电路板的电路设计。在其它实施例中，共极引脚架24的引脚端244也可以由封装壳体4的第二边42或第四边44折弯至该封装壳体4的背面。
[0036] 请参阅图2、图4、图5和图6，导线15远离红光LED芯片11的一端固定有焊锡脚151，以方便通过焊锡脚151通过回流焊焊接地红光引脚架23上，保证导线15与红光引脚架23的良好与牢固接触。具体地，红光LED芯片11可以使用焊锡膏固定在共极引脚架24上，将导线15的焊锡脚151固定在红光引脚架23，再经回流焊，将红光LED芯片11焊接在共极引脚架24，将导线15与红光引脚架23相连。优选地，可以使用高温230度以上锡膏固定红光LED芯片11 ;采用回流焊的工艺进行共金焊接，同时导线15的焊锡脚151可以采用点锡膏的工艺，采用回流焊的工艺进行共金焊接，将焊锡脚151与红光引脚架23相连。当然，红光LED芯片11、倒装蓝光LED芯片13和倒装绿光LED芯片12也可以使用高温锡膏固定，采用回流焊的工艺进行共金焊接。
[0037] 封装壳体4包括支撑座45和灯杯46，灯杯46上对应于各全彩发光单元I的位置开设有凹腔(图中未示出)，以露出相应的全彩发光单元I ;各凹腔中填充有封装胶47，通过封装胶47将各全彩发光单元I进行封装固定在灯杯46中。而支撑座45用来支撑各金属支架20，灯杯46制作于支撑座45上，并且将各金属支架20固定于支撑座45上。优选地，支撑座45和灯杯46可以注塑成型。而各金属支架20的引脚端201则折弯至支撑座45的背面。封装胶47可以为雾状半透明扩散胶体，以使该全彩发光单元I发出的光线均匀分布。封装胶47可以为环氧树脂，也可为硅胶等。
[0038] 进一步地，支撑座45的侧边上对应于各金属支架20的位置开设有容置相应金属支架20的凹槽(图中未标出)。在支撑座45的侧边上对应开设凹槽，将各金属支架20置于对应的凹槽中，可以使支撑座45的侧边对应金属支架20的部分区域的相对外侧面与支撑座45和灯杯46的侧面相持平，或者使灯杯46的侧面伸出支撑座45的侧边对应金属支架20的部分区域的相对外侧面。为了提高LED显示模组的对比度，封装壳体4 一般设为黑色，即灯杯46和支撑座45 —般为黑色；而金属支架20上则往往会镀银等，以提高金属支架20的导电率，降低其电阻。而设置凹槽，将金属支架20置于对应的凹槽中，可以使灯杯46的侧面挡住支撑座45侧面对应的金属支架20的部分区域的相对外侧，防止金属支架20上镀银的亮色露出，从而进一步提高对比度。经实验证实，对比度可以提升20% -30%。
[0039] 本实施例的全彩LED封装结构100的金属支架20可以利用冲压工艺形成。制作简单方便。封装壳体4可以注塑成型，从而可以将各金属支架20牢固地固定在封装壳体4中。将各金属支架20的引脚端折弯至封装壳体4的背面，成为贴片结构，更易焊接。为方便焊接、固定各发光芯片10，可以在各金属支架上覆上锡膏。采用共金焊的方式来固定各发光芯片10，各发光芯片10不会因外界的水分和湿气的影响而翘焊。
[0040] 请参阅图3和图7，本实用新型实施例还公开了一种LED显示模组，包括电路板200和安装于电路板200上的若干如上所述的全彩LED封装结构100。该LED显示模组使用了上述全彩LED封装结构100，从而使得该LED显示模组的发光芯片10连接牢固，接触良好，保证该LED显示模组的使用寿命和防水防潮性能。
[0041] 以上所述仅为本实用新型的较佳实施例而已，并不用以限制本实用新型，凡在本实用新型的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本实用新型的保护范围之内。
Claims (10)
1.一种全彩LED封装结构，包括封装壳体和封装于所述封装壳体中的全彩发光单元；所述全彩发光单元包括用于发出RGB三色光的多个发光芯片和分别与各所述发光芯片电性相连的多个金属支架，各所述金属支架的具有引伸并折弯至所述封装壳体的背面的引脚端；其特征在于，多个所述金属支架包括共极引脚架、蓝光引脚架、绿光引脚架和红光引脚架；多个所述发光芯片包括两极分别回流焊焊接于所述共极引脚架与所述蓝光引脚架上的倒装蓝光LED芯片、两极分别回流焊焊接于所述共极引脚架与所述绿光引脚架上的倒装绿光LED芯片和回流焊焊接于所述共极引脚架上的红光LED芯片，所述红光LED芯片通过导线与所述红光引脚架电性相连。
2.如权利要求1所述的全彩LED封装结构，其特征在于，所述封装壳体包括依次相连的第一边、第二边、第三边和第四边；所述共极引脚架包括靠近所述第二边且用于焊接固定所述红光LED芯片的第一段、由所述第一段朝向所述第四边的方向延伸的第二段和由所述第二段朝向所述封装壳体的背面折弯的第三段，所述第三段的端部为该共极引脚架的所述引脚端。
3.如权利要求2所述的全彩LED封装结构，其特征在于，所述绿光引脚架和所述红光引脚架分别位于所述共极引脚架的第二段的两侧，所述绿光引脚架和所述蓝光引脚架位于所述共极引脚架靠近所述第一边的一侧。
4.如权利要求3所述的全彩LED封装结构，其特征在于，所述绿光引脚架的引脚端和所述蓝光引脚架的引脚端均由所述第一边折弯至所述封装壳体的背面；所述红光引脚架的引脚端与所述共极引脚架的引脚端均由所述第三边折弯至所述封装壳体的背面。
5.如权利要求3所述的全彩LED封装结构，其特征在于，所述红光LED芯片、所述倒装蓝光LED芯片和所述倒装绿光LED芯片呈一字形分布设置。
6.如权利要求5所述的全彩LED封装结构，其特征在于，所述第一段的宽度大于所述第二段的宽度，所述第二段位于所述封装壳体中部区域上靠近所述第三边的一侧，所述绿光引脚架具有与所述倒装绿光LED芯片电性相连的绿光电极端，所述绿光电极端邻近所述共极引脚架的第二段；所述蓝光引脚架具有与所述倒装蓝光LED芯片电性相连的蓝光电极端，所述蓝光电极端邻近所述共极引脚架的第二段。
7.如权利要求1-6任一项所述的全彩LED封装结构，其特征在于，所述导线远离所述红光LED芯片的一端固定有与所述红光引脚架回流焊焊接的焊锡脚。
8.如权利要求1-6任一项所述的全彩LED封装结构，其特征在于，所述封装壳体包括支撑各所述金属支架的支撑座和将各所述金属支架固定于所述支撑座上的灯杯，所述灯杯上对应于各所述全彩发光单元的位置开设有露出所述全彩发光单元的凹腔，各所述凹腔中填充有封装胶。
9.如权利要求8所述的全彩LED封装结构，其特征在于，所述支撑座的侧边上对应于各所述金属支架的位置开设有容置相应所述金属支架的凹槽。
10.一种LED显示模组，其特征在于，包括电路板和安装于所述电路板上的若干如权利要求1-9任一项所述的全彩LED封装结构。
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