WO2016197517A1 - 热沉式贴片led发光管 - Google Patents

热沉式贴片led发光管 Download PDF

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Publication number
WO2016197517A1
WO2016197517A1 PCT/CN2015/092588 CN2015092588W WO2016197517A1 WO 2016197517 A1 WO2016197517 A1 WO 2016197517A1 CN 2015092588 W CN2015092588 W CN 2015092588W WO 2016197517 A1 WO2016197517 A1 WO 2016197517A1
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Prior art keywords
led
heat sink
horizontal section
section
electrode lead
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PCT/CN2015/092588
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English (en)
French (fr)
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刘振亮
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刘振亮
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Priority to US15/526,338 priority Critical patent/US20170338391A1/en
Publication of WO2016197517A1 publication Critical patent/WO2016197517A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Definitions

  • the utility model relates to the field of LEDs, in particular to a heat sink type patch LED lighting tube.
  • the soldering feet at the bottom of the existing SMD LED lighting tubes are flat and are directly soldered to the circuit board.
  • the heat generated by the lamp points is blocked by the fiber-optic circuit board with poor thermal conductivity, in an outdoor high temperature environment. An increase in the temperature of the lamp will cause light decay and dead light.
  • Increasing the heat dissipation capability of the SMD-type LED tube, especially the low-power full-color series of LED tubes, is the technical core and key of the outdoor LED SMD display.
  • the utility model provides a heat sink type patch LED light-emitting tube with simple structure, low cost and good heat dissipation effect.
  • a heat sink type patch LED lighting tube comprising: a first electrode lead used as a heat sink, comprising a first horizontal section sequentially connected, first a bending section, a second horizontal section and a protruding section; a second electrode lead comprising a third horizontal section, a second bending section and a fourth horizontal section sequentially connected; the package body, the first electrode lead and the second electrode The pin is enclosed by the package into a bracket, and the protruding portion protrudes downward from the outside of the package; the LED chip is mounted on the first horizontal section of the first electrode lead, and the first electrode and the first horizontal section of the LED chip Connected, the second electrode of the LED wafer is connected to the third horizontal segment by a wire.
  • the LED wafer is fixed to the first horizontal section by silver glue or insulating glue.
  • the package comprises an upper portion of a cylindrical or truncated cone shape and a lower portion of the square.
  • the first horizontal section, the first bending section, the third horizontal section and the second bending section are all disposed in the lower portion, and the second horizontal section and the fourth horizontal section are flush with the bottom surface of the lower part.
  • the LED wafer is located within the upper mounting cavity.
  • the mounting cavity is filled with an encapsulant.
  • the mounting cavity has a cylindrical or truncated cone shape.
  • the first electrode lead and the second electrode lead are disposed in pairs
  • the heat sink type LED light emitting tube comprises a plurality of pairs of first electrode pins and second electrode pins, and the number of the LED chips is plural An LED chip is disposed on each of the first electrode pins.
  • the number of LED chips is three, and the three LED chips are red, green and blue LED chips, respectively.
  • the utility model can conduct the heat generated by the LED chip to the second horizontal section via the first horizontal section of the first electrode lead, and the heat sink formed by the protruding section passes through the circuit board due to the actual patch welding of the utility model.
  • the copper via hole is reserved, and the heat of the wafer is directly transmitted from the surface of the circuit board lamp to the other side of the circuit board by the copper material with high thermal conductivity, thereby transferring heat to the external environment to achieve the heat sink heat dissipation effect.
  • the structure is simple, the heat dissipation effect is obvious, and the cost is low.
  • Fig. 1 schematically shows a schematic structural view of the present invention.
  • the present invention provides a heat sink type patch LED light-emitting tube, comprising: a first electrode lead used as a heat sink, comprising a first horizontal section 1 and a first bending section 2 connected in sequence a second horizontal section 3 and a protruding section 10; a second electrode lead comprising a third horizontal section 4, a second bending section 5 and a fourth horizontal section 6 connected in sequence; a package body 7, a first electrode lead and The second electrode pin is enclosed by the package as a bracket, and the protruding portion protrudes downward from the outside of the package; the LED chip 8 is mounted on the first horizontal segment 1 of the first electrode pin, and the first of the LED chip 8 The electrode is connected to the first horizontal section 1, and the second electrode of the LED wafer 8 is connected to the third horizontal section 4 via a wire 9.
  • the first electrode pin and the second electrode pin have both conductive and heat conducting functions, and the LED chip 8 is fixed on the first electrode pin.
  • the first electrode lead and the second electrode lead are stamped by a metal stamping process.
  • the second horizontal section 3 and the fourth horizontal section 6 are disposed on the same plane to constitute a solder fillet.
  • the heat generated by the LED chip 8 is conducted to the second horizontal section 3 via the first horizontal section 1 of the first electrode lead. Since the actual patch is welded, the heat sink formed by the protruding section passes through the circuit board. The copper via hole is left, and the heat of the wafer is directly transmitted from the point of the circuit board lamp to the other side of the circuit board by the copper material with high thermal conductivity, thereby transferring heat to the external environment, thereby achieving the heat sink function and having a simple structure. The heat dissipation effect is obvious and the cost is low.
  • the protruding section 10 is arranged to protrude downward relative to the second horizontal section 3.
  • the LED wafer 8 is fixed in the first horizontal section 1 by silver glue 11 or insulating glue.
  • Silver glue 11 has electrical and thermal conductivity functions.
  • the package 7 comprises a cylindrical or truncated cone shaped upper portion 12 and a squared lower portion 13.
  • the outdoor surface mount display pursues the problem that the contrast of the black and white screen is higher and better.
  • the outer shape of the upper circle is used to ensure that the circular white area of the upper part is minimized under the premise of ensuring the light output of the LED chip and being packaged.
  • the lower square is optimal for the flatness, stability and reliability required for the packaging process.
  • the first horizontal section 1, the first bending section 2, the third horizontal section 4 and the second bending section 5 are all disposed in the lower portion 13, the second horizontal section 3 and the fourth horizontal section 6 and the lower part 13 The bottom is flush.
  • the second horizontal section 3, the fourth horizontal section 6, and the protruding section 10 are exposed, and thus, have good airtightness and waterproof performance.
  • the LED wafer 8 is located within the mounting cavity of the upper portion 12.
  • the mounting cavity has a cylindrical or truncated cone shape.
  • the mounting cavity is filled with encapsulant 14 .
  • the encapsulant 14 functions to transparently protect the LED chip 8.
  • the first electrode lead and the second electrode lead are arranged in pairs, and the heat sink type LED light emitting tube comprises a plurality of pairs of first electrode pins and second electrode pins, and the number of LED chips 8 is plural An LED chip 8 is disposed on each of the first electrode pins.
  • the number of LED chips 8 is three, and the three LED chips 8 are red, green and blue LED chips, respectively. In this way, a full color LED lighting tube can be constructed.
  • the number of LED chips 8 is not limited to three, and may be more.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

提供了一种热沉式贴片LED发光管，包括：用作热沉的第一电极引脚，包括依次连接的第一水平段（1）、第一弯折段（2）、第二水平段（3）和突出段（10）；第二电极引脚，包括依次连接的第三水平段（4）、第二弯折段（5）和第四水平段（6）；封装体（7），第一电极引脚和第二电极引脚由封装体封闭成支架，且突出段（10）向下突出于封装体（7）的外部；LED晶片（8），安装在第一电极引脚的第一水平段（1）上，且LED晶片（8）的第一电极与第一水平段（1）连接，LED晶片（8）的第二电极通过导线（9）与第三水平段（4）连接。在贴片焊接时，突出段（10）形成的热沉会穿过线路板上预留的铜过孔，晶片热量由导热系数高的铜材直接由线路板灯点面传导至线路板的另一面，具有结构简单、散热效果明显、成本低的特点。

Description

热沉式贴片LED发光管 技术领域
本实用新型涉及LED领域，特别涉及一种热沉式贴片LED发光管。
背景技术
现有贴片式LED发光管底部焊脚呈平面，均直接贴焊在线路板上，灯点产生的热量被导热能力较差的材质为纤维的线路板所阻滞，在户外高温的环境中灯点温升高会造成光衰及死灯。提高贴片式发光管尤其是小功率全彩系列发光管散热能力，是户外LED贴片式显示屏的技术核心和关键。
实用新型内容
本实用新型提供了一种结构简单、成本低、散热效果好的热沉式贴片LED发光管。
为解决上述问题，作为本实用新型的一个方面，提供了一种热沉式贴片LED发光管，包括：用作热沉的第一电极引脚，包括依次连接的第一水平段、第一弯折段、第二水平段和突出段；第二电极引脚，包括依次连接的第三水平段、第二弯折段和第四水平段；封装体，第一电极引脚和第二电极引脚由封装体封闭成支架，且突出段向下突出于封装体的外部；LED晶片，安装在第一电极引脚的第一水平段上，且LED晶片的第一电极与第一水平段连接，LED晶片的第二电极通过导线与第三水平段连接。
优选地，LED晶片通过银胶或绝缘胶固定在第一水平段上。
优选地，封装体包括圆柱或圆锥台形的上部和方形的下部。
优选地，第一水平段、第一弯折段、第三水平段和第二弯折段均设置在下部内，第二水平段及第四水平段与下部的底面齐平。
优选地，LED晶片位于上部的安装腔体内。
优选地，安装腔体内填充有封装胶。
优选地，安装腔体呈圆柱或圆锥台形。
优选地，第一电极引脚和第二电极引脚成对地设置，热沉式贴片LED发光管包括多对第一电极引脚和第二电极引脚，LED晶片的个数为多个，每个第一电极引脚上都设置有一个LED晶片。
优选地，LED晶片的个数为三个，三个LED晶片分别为红色、绿色和蓝色LED晶片。
本实用新型可将LED晶片产生的热量经由第一电极引脚的第一水平段传导至第二水平段上，由于本实用新型实际贴片焊接时，突出段形成的热沉会穿过线路板上预留的铜过孔，晶片热量由导热系数高的铜材直接由线路板灯点面传导至线路板的另一面，进而将热量传导至外界环境中，达到“热沉”散热作用，具有结构简单、散热效果明显、成本低的特点。
附图说明
图1示意性地示出了本实用新型的结构示意图。
图中附图标记：1、第一水平段；2、第一弯折段；3、第二水平段；4、第三水平段；5、第二弯折段；6、第四水平段；7、封装体；8、LED晶片；9、导线；10、突出段；11、银胶；12、上部；13、下部；14、封装胶。
具体实施方式
以下结合附图对本实用新型的实施例进行详细说明，但是本实用新型可以由权利要求限定和覆盖的多种不同方式实施。
请参考图1，本实用新型提供了一种热沉式贴片LED发光管，包括：用作热沉的第一电极引脚，包括依次连接的第一水平段1、第一弯折段2、第二水平段3和突出段10；第二电极引脚，包括依次连接的第三水平段4、第二弯折段5和第四水平段6；封装体7，第一电极引脚和第二电极引脚由封装体封闭成支架，且突出段向下突出于封装体的外部；LED晶片8，安装在第一电极引脚的第一水平段1上，且LED晶片8的第一电极与第一水平段1连接，LED晶片8的第二电极通过导线9与第三水平段4连接。
其中，第一电极引脚和第二电极引脚兼具导电与导热功能，LED晶片8固定在第一电极引脚上。优选地，第一电极引脚和第二电极引脚由五金冲压工艺冲压而成。第二水平段3和第四水平段6设置在同一平面上，构成焊脚。
LED晶片8产生的热量经由第一电极引脚的第一水平段1传导至第二水平段3上，由于本实用新型实际贴片焊接时，突出段形成的热沉会穿过线路板上预留的铜过孔，晶片热量由导热系数高的铜材直接由线路板灯点面传导至线路板的另一面，进而将热量传导至外界环境中，达到“热沉”散热作用，具有结构简单、散热效果明显、成本低的特点。
优选地，突出段10相对于第二水平段3向下突出地设置。
优选地，LED晶片8通过银胶11或绝缘胶固定在第一水平段1内。银胶11具有导电及导热功能。
优选地，封装体7包括圆柱或圆锥台形的上部12和方形的下部13。针对户外表面贴装显示屏追求屏面黑白的对比度越高越好的问题，采用上圆下方的外形结构，可以在保证LED芯片出光且能封装的前提下，使上部的圆形白色面积最小，而下部的方形则是为贴装平整度、稳定性及封装过程中所需的可靠性方体性能最优。
优选地，第一水平段1、第一弯折段2、第三水平段4和第二弯折段5均设置在下部13内，第二水平段3及第四水平段6与下部13的底面齐平。这样，仅第二水平段3、第四水平段6及突出段10裸露在外，因而，具有良好的气密性和防水性能。
优选地，LED晶片8位于上部12的安装腔体内。优选地，所述安装腔体呈圆柱或圆锥台形。
优选地，安装腔体内填充有封装胶14。封装胶14起到透光保护LED晶片8的作用。
优选地，第一电极引脚和第二电极引脚成对地设置，热沉式贴片LED发光管包括多对第一电极引脚和第二电极引脚，LED晶片8的个数为多个，每个第一电极引脚上都设置有一个LED晶片8。
优选地，LED晶片8的个数为三个，三个LED晶片8分别为红色、绿色和蓝色LED晶片。这样，可以构成全彩LED发光管。当然，LED晶片8的个数也不限于三个，还可以是更多个。
以上所述仅为本实用新型的优选实施例而已，并不用于限制本实用新型，对于本领域的技术人员来说，本实用新型可以有各种更改和变化。凡在本实用新型的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本实用新型的保护范围之内。

Claims (9)

  1. 一种热沉式贴片LED发光管，其特征在于，包括：
    用作热沉的第一电极引脚，包括依次连接的第一水平段(1)、第一弯折段(2)、第二水平段(3)和突出段(10)；
    第二电极引脚，包括依次连接的第三水平段(4)、第二弯折段(5)和第四水平段(6)；
    封装体(7)，所述第一电极引脚和所述第二电极引脚由所述封装体封闭成支架，且所述突出段(10)向下突出于所述封装体(7)的外部；
    LED晶片(8)，安装在所述第一电极引脚的第一水平段(1)上，且所述LED晶片(8)的第一电极与所述第一水平段(1)连接，所述LED晶片(8)的第二电极通过导线(9)与所述第三水平段(4)连接。
  2. 根据权利要求1所述的热沉式贴片LED发光管，其特征在于，所述LED晶片(8)通过银胶(11)或绝缘胶固定在所述第一水平段(1)上。
  3. 根据权利要求1所述的热沉式贴片LED发光管，其特征在于，所述封装体(7)包括圆柱或圆锥台形的上部(12)和方形的下部(13)。
  4. 根据权利要求3所述的热沉式贴片LED发光管，其特征在于，所述第一水平段(1)、所述第一弯折段(2)、所述第三水平段(4)和所述第二弯折段(5)均设置在所述下部(13)内，所述第二水平段(3)及所述第四水平段(6)与所述下部(13)的底面齐平。
  5. 根据权利要求3所述的热沉式贴片LED发光管，其特征在于，所述LED晶片(8)位于所述上部(12)的安装腔体内。
  6. 根据权利要求5所述的热沉式贴片LED发光管，其特征在于，所述安装腔体内填充有封装胶(14)。
  7. 根据权利要求5所述的热沉式贴片LED发光管，其特征在于，所述安装腔体呈圆柱或圆锥台形。
  8. 根据权利要求1所述的热沉式贴片LED发光管，其特征在于， 所述第一电极引脚和所述第二电极引脚成对地设置，所述热沉式贴片LED发光管包括多对所述第一电极引脚和所述第二电极引脚，所述LED晶片(8)的个数为多个，每个所述第一电极引脚上都设置有一个所述LED晶片(8)。
  9. 根据权利要求8所述的热沉式贴片LED发光管，其特征在于，所述LED晶片(8)的个数为三个，所述三个LED晶片(8)分别为红色、绿色和蓝色LED晶片。
PCT/CN2015/092588 2015-06-10 2015-10-22 热沉式贴片led发光管 WO2016197517A1 (zh)

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CN204696149U (zh) * 2015-06-10 2015-10-07 刘振亮 热沉式贴片led发光管
CN105679737A (zh) * 2016-01-15 2016-06-15 中山芯达电子科技有限公司 一种多芯片封装结构
CN105514056A (zh) * 2016-01-15 2016-04-20 中山芯达电子科技有限公司 一种利于热量散逸的芯片封装结构
CN105526535A (zh) * 2016-02-05 2016-04-27 赵景添 一种led灯珠、显示模组及显示屏

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