CN204007955U - 压力传感器 - Google Patents
压力传感器 Download PDFInfo
- Publication number
- CN204007955U CN204007955U CN201420288350.8U CN201420288350U CN204007955U CN 204007955 U CN204007955 U CN 204007955U CN 201420288350 U CN201420288350 U CN 201420288350U CN 204007955 U CN204007955 U CN 204007955U
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- upper cover
- wiring board
- pressure transducer
- sensor chip
- pressure sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000002184 metal Substances 0.000 claims description 22
- 239000003292 glue Substances 0.000 claims description 10
- 230000035882 stress Effects 0.000 description 8
- 238000003466 welding Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420288350.8U CN204007955U (zh) | 2014-05-31 | 2014-05-31 | 压力传感器 |
Applications Claiming Priority (1)
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CN201420288350.8U CN204007955U (zh) | 2014-05-31 | 2014-05-31 | 压力传感器 |
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CN204007955U true CN204007955U (zh) | 2014-12-10 |
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CN201420288350.8U Expired - Lifetime CN204007955U (zh) | 2014-05-31 | 2014-05-31 | 压力传感器 |
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CN (1) | CN204007955U (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104665851A (zh) * | 2015-01-06 | 2015-06-03 | 上海交通大学 | 微型压力传感器及其封装方法 |
CN106373944A (zh) * | 2016-08-31 | 2017-02-01 | 歌尔股份有限公司 | 一种风速仪和气压计的集成装置 |
CN108847442A (zh) * | 2018-06-30 | 2018-11-20 | 山东昊润自动化技术有限公司 | 一种压力芯片封装方法 |
CN109743856A (zh) * | 2018-12-29 | 2019-05-10 | 积高电子(无锡)有限公司 | 一种传感器的封装工艺 |
WO2021031497A1 (zh) * | 2019-08-22 | 2021-02-25 | 歌尔微电子有限公司 | 一种振动感测装置 |
-
2014
- 2014-05-31 CN CN201420288350.8U patent/CN204007955U/zh not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104665851A (zh) * | 2015-01-06 | 2015-06-03 | 上海交通大学 | 微型压力传感器及其封装方法 |
CN106373944A (zh) * | 2016-08-31 | 2017-02-01 | 歌尔股份有限公司 | 一种风速仪和气压计的集成装置 |
CN106373944B (zh) * | 2016-08-31 | 2018-11-02 | 歌尔股份有限公司 | 一种风速仪和气压计的集成装置 |
CN108847442A (zh) * | 2018-06-30 | 2018-11-20 | 山东昊润自动化技术有限公司 | 一种压力芯片封装方法 |
CN109743856A (zh) * | 2018-12-29 | 2019-05-10 | 积高电子(无锡)有限公司 | 一种传感器的封装工艺 |
WO2021031497A1 (zh) * | 2019-08-22 | 2021-02-25 | 歌尔微电子有限公司 | 一种振动感测装置 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20200610 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
TR01 | Transfer of patent right |