WO2021031497A1 - 一种振动感测装置 - Google Patents

一种振动感测装置 Download PDF

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Publication number
WO2021031497A1
WO2021031497A1 PCT/CN2019/129220 CN2019129220W WO2021031497A1 WO 2021031497 A1 WO2021031497 A1 WO 2021031497A1 CN 2019129220 W CN2019129220 W CN 2019129220W WO 2021031497 A1 WO2021031497 A1 WO 2021031497A1
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WIPO (PCT)
Prior art keywords
substrate
cavity
housing
vibration
sensing device
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PCT/CN2019/129220
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English (en)
French (fr)
Inventor
端木鲁玉
付博
李欣亮
方华斌
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歌尔微电子有限公司
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Publication of WO2021031497A1 publication Critical patent/WO2021031497A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means

Definitions

  • the present invention relates to the technical field of vibration sensing, and more specifically, the present invention relates to a vibration sensing device.
  • the existing vibration sensing device usually includes a housing and a mass arranged in the housing.
  • the mass block is suspended inside the shell through the diaphragm.
  • the housing has an open end.
  • the substrate of the vibration sensor is hermetically connected to the open end.
  • a MEMS chip and an ASIC chip are arranged on the side of the substrate opposite to the housing, and also a shell arranged outside the MEMS chip and the ASIC chip.
  • the substrate has communication holes.
  • the MEMS chip communicates with the inner cavity of the housing through the communication hole.
  • the vibration sensing device is fixed on the equipment to be measured.
  • the vibration is transmitted to the shell, which drives the shell to sound and vibrate.
  • the mass Since the mass has a set mass and the diaphragm has elasticity, the mass will vibrate relative to the shell.
  • the vibration of the mass causes the volume of the chambers on both sides of the diaphragm to change. Since the inner cavity is airtight, the volume in the cavity will change, and the pressure in the cavity will change accordingly.
  • the MEMS chip senses the pressure change, it generates a corresponding electrical signal.
  • the electrical signal is amplified by the ASIC chip and then transmitted to the external circuit.
  • the external circuit collects the electrical signal.
  • the existing vibration sensing device can usually only sense the pressure change of one chamber, and its sensing sensitivity is relatively low.
  • the pads used for connecting with the external circuit are arranged on the side of the shell housing the MEMS chip and the ASIC chip.
  • the pads used for connecting with the external circuit are arranged on the side of the shell housing the MEMS chip and the ASIC chip.
  • the space occupied by the metal vias is relatively large.
  • An object of the present invention is to provide a new technical solution for a vibration sensing device.
  • a vibration sensing device including:
  • a housing the housing has an open end, and a cavity is formed inside the housing;
  • An elastic element, the elastic element is arranged in the cavity
  • a mass element the mass element is suspended in the cavity by the elastic element, and can move in the cavity together with the elastic element to change the pressure in the cavity;
  • the substrate further includes an adapter part arranged around the housing, and the pad is arranged on the adapter part.
  • the vibration sensor further includes a signal amplifier, the signal amplifier is disposed on the substrate, and the sensing element is connected to the signal amplifier.
  • the signal amplifier is an ASIC chip.
  • the sensing element is a MEMS chip
  • the MEMS chip includes a substrate and a sensing film
  • the substrate is a hollow structure
  • the sensing film is disposed at one end of the substrate and covers the hollow structure, the hollow structure forms the back cavity, and the other end of the substrate is fixedly connected to the substrate.
  • the elastic element includes an elastic part located in the middle part and an edge part arranged around the elastic part, and the edge part is connected with the inner wall of the housing.
  • the mass element is attached to the surface of the elastic element.
  • Fig. 1 is a schematic structural diagram of a vibration sensing device according to an embodiment of the present disclosure.
  • Fig. 2 is a schematic structural diagram of another vibration sensing device according to an embodiment of the present disclosure.
  • Fig. 3 is a schematic structural diagram of yet another vibration sensing device according to an embodiment of the present disclosure.
  • any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiment may have different values.
  • the housing 7 has a dish-like structure with an open end. A cavity is formed inside the housing 7.
  • the material of the housing 7 is metal, plastic or PCB board.
  • the shape of the housing 7 is a cylindrical shape, a rectangular parallelepiped, or the like. Those skilled in the art can flexibly adjust according to actual needs, and there is no limitation on this.
  • the elastic element 8 is arranged in the cavity.
  • the elastic element 8 is used to provide elastic restoring force to the mass element 9.
  • the elastic element 8 may be, for example, an elastic diaphragm.
  • the elastic element 8 can also be other elastic elements well known to those skilled in the art, and there is no limitation on this.
  • the mass element 9 is suspended in the cavity through the elastic element 8 and can move in the cavity together with the elastic element 8 to change the pressure in the cavity.
  • the mass element 9 and the elastic part of the elastic element 8 are connected by an adhesive, that is, the mass element 9 is attached to the surface of the elastic element 8, so that the mass element 9 and the elastic element 8 are firmly combined Together, the mass element 9 can move with the elastic element 8 stably.
  • the mass element 9 and the elastic element 8 can also be connected together in other ways known to those skilled in the art.
  • the mass element 9 is a mass of a predetermined weight. The weight of the mass block can be flexibly adjusted by those skilled in the art as required, and there is no limitation on this.
  • the entire cavity can be divided into two parts, the first cavity 701 and the second cavity 702.
  • the first chamber 701 and the second chamber 702 both have a set volume. Seal the gas with a predetermined pressure in the two chambers.
  • the gas can be, for example, air, nitrogen, inert gas, etc., and those skilled in the art can flexibly choose according to needs, and there is no limitation on this.
  • the vibration sensor of the present invention includes a packaging structure with a housing cavity 201 formed by a substrate 1 and a housing 2, and a sensor housed in the housing cavity 203 and fixedly arranged on the substrate 1.
  • Element for example, MEMS chip 4
  • the substrate 1 is hermetically connected to the open end of the housing 7.
  • At least one pad 6 is provided on the outer surface of the substrate 1.
  • the pad 6 is connected to the sensing element through a conductor 3 penetrating the substrate 1.
  • the pad 6 is used for connection with an external circuit.
  • a through hole 101 is also provided on the substrate 1.
  • the through hole 101 is used to connect the cavity formed in the housing 7 with the sensing element.
  • the through hole 101 is a round hole, a square hole, etc., and those skilled in the art can flexibly adjust according to specific needs, and there is no limitation on this.
  • the difficulty of opening the through hole 101 on the substrate 1 is small and the processing is easy.
  • the vibration sensing device provided by the embodiment of the present invention can obtain the pressure difference between the first chamber 701 and the second chamber 702 through the vibration sensor; and calculate the vibration state at the location of the vibration sensor through the pressure difference.
  • the vibration sensing device is installed on the object to be detected, for example, a human joint, a robot joint, etc.
  • the vibration of the object to be detected will drive the housing 7 to vibrate. Due to the combined action of the inertia of the mass element 9 and the elastic restoring force of the elastic element 8, the mass element 9 will vibrate relative to the housing 7.
  • the vibration of the mass element 9 and the elastic element 8 causes the volume of the first chamber 701 and the second chamber 702 to change. Since both chambers are closed chambers, the first chamber 701 and the second chamber 702 The pressure of the gas inside will change.
  • the vibration sensor senses the pressure difference between the first chamber 701 and the second chamber 702, and converts the pressure difference into an electrical signal, such as a voltage signal, a current signal, or a capacitance signal.
  • the electrical signal is calculated to obtain the vibration state of the object to be detected. For example, amplitude, vibration frequency, etc.
  • the vibration sensor is usually only provided in the first chamber 701 or the second chamber 702. At this time, only the pressure change of one chamber is sensed to detect the object to be detected. Vibration state.
  • the vibration sensor can sense the pressure difference between the first chamber 701 and the second chamber 702, and has the characteristic of high sensitivity for sensing vibration.
  • the pad 6 is directly arranged on the substrate 1 of the vibration sensor.
  • just solder the pad 6 with the external circuit which is very convenient to use.
  • This design changes the traditional way of arranging pads on the housing of the vibration sensor, can avoid the way of product cavity wall wiring, simplify the overall structure of the product, reduce the difficulty of product production, and improve the reliability of the product.
  • the pad 6 is arranged on the outside of the substrate 1, and the pad 6 and the housing 7 are located on the same side.
  • the lateral size of the substrate 1 is larger than the lateral size of the housing 7 (the direction shown in FIG. 1), so as to reserve a space for the pad 6 on the substrate 1.
  • a conductor 3 is buried in the substrate 1.
  • the pad 6 is electrically connected to the sensing element through a conductor 3 buried in the substrate 1.
  • a via is formed at a suitable position of the substrate 1, that is, a metalized via.
  • the pad 6 is connected to the conductor in the via hole. When in use, just solder the pad 6 with the external circuit.
  • the pad 6 is arranged on the outside of the substrate 1, and the pad 6 and the housing 2 are located on the same side.
  • the lateral size of the substrate 1 is larger than the lateral size of the housing 2 (the direction shown in FIG. 2), so as to reserve a space for the pad 6 on the substrate 1.
  • a conductor 3 is buried in the substrate 1.
  • the pad 6 is electrically connected to the sensing element through a conductor 3 embedded in the substrate 1.
  • a via is formed at a suitable position of the substrate 1, that is, a metalized via.
  • the pad 6 is connected to the conductor in the via hole. When in use, just solder the pad 6 with the external circuit.
  • the substrate 1 further includes an adapter part 10 arranged around the housing 7, and the pad 6 is arranged on the adapter part 10.
  • the pad 6 and the housing 7 are located on the same side of the substrate 1.
  • conductors 3 are buried in the substrate 1 and the interposer 10, respectively.
  • the pad 6 is electrically connected to the sensing element through the conductor 3 embedded in the interposer 10 and the conductor 3 embedded in the substrate 1.
  • via holes that is, metalized via holes, are formed at appropriate positions of the substrate 1 and the adapter portion 10, respectively.
  • At least one pad 6 is provided on the substrate 1.
  • Those skilled in the art can appropriately adjust the number of pads 6 as needed. For example, two pads, three pads, or more pads are provided on the substrate 1, which is not limited.
  • the sensing element of the present invention uses a MEMS chip 4.
  • MEMS chip 4 Of course, other elements well-known in the art can also be used, which is not limited.
  • the vibration sensor of the present invention also includes a signal amplifier.
  • the signal amplifier is provided on the substrate 1.
  • the sensing element is connected with the signal amplifier.
  • the signal amplifier is an ASIC chip 5.
  • the ASIC chip 5 is integrated on the substrate 1.
  • the MEMS chip 4 is connected to the ASIC chip 5 through metal wires.
  • the ASIC chip 5 can be used to amplify the signal collected by the MEMS chip 4.
  • the housing 2 and the substrate 1 are fixedly connected together, and the housing 2 and the substrate 1 can enclose a receiving cavity 201.
  • the containing cavity 201 can be used to contain the MEMS chip 4 and the ASIC chip 5.
  • the structure of the housing 2 includes a side wall portion provided around the substrate 1 and a top portion opposite to the substrate 1.
  • the top material is, for example, metal materials, plastic materials, PCB boards, etc., which is not limited.
  • the substrate 1 is, for example, a PCB board.
  • the housing 2 and the substrate 1 can be fixed together by glue bonding or solder paste welding.
  • the substrate 1 and the housing 7 can also be fixed together by glue bonding or solder paste welding.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)

Abstract

一种振动感测装置，包括壳体(7)，弹性元件(8)，质量元件(9)以及振动传感器；壳体(7)具有敞开端，在壳体(7)的内部形成腔体；弹性元件(8)设置在腔体内；质量元件(9)通过弹性元件(8)悬置在腔体内，并能随弹性元件(8)一起在腔体内移动，以改变腔体内的压强；振动传感器包括由基板(1)和外壳(2)形成的具有容纳腔的封装结构，和收容在容纳腔内且固定设置在基板上的感测元件；基板(1)密封连接在壳体(7)的敞开端，基板(1)的外表面上设置有至少一个焊盘(6)，焊盘(6)通过贯穿基板(1)的导体与感测元件连接，感测元件被配置为用于感测腔体内的压强或者腔体内不同区域的压强差。该振动感测装置的技术效果为：将焊盘直接设置在基板上，简化了走线方式。

Description

一种振动感测装置 技术领域
本发明涉及振动感测技术领域，更具体地，本发明涉及一种振动感测装置。
背景技术
现有的振动感测装置通常包括壳体以及设置在壳体内的质量块。质量块通过振膜悬置在壳体的内部。壳体具有敞开端。振动传感器的基板密封连接在敞开端。在基板的与壳体相对的一侧设置有MEMS芯片、ASIC芯片，还包括设置在MEMS芯片和ASIC芯片外的外壳。基板上具有连通孔。MEMS芯片通过连通孔与壳体的内腔连通。
在工作时，振动感测装置被固定在待测量设备上。在该设备工作时，振动传递到壳体上，带动壳体发声振动。由于质量块具有设定的质量，并且振膜具有弹性，故质量块会相对于壳体发生振动。该质量块的振动使得振膜两侧的腔室的容积发生变化。由于内腔是密闭的，故会导致腔室内的容积发生变化，腔室内的压强随之发生变化。当MEMS芯片感测到压强的变化会产生相应的电信号。该电信号经ASIC芯片放大后传输至外部电路。外部电路采集该电信号。然而，现有的振动感测装置通常仅能感测一个腔室的压强变化，其感测灵敏度是比较低的。
此外，现有的振动感测装置，都是将用于与外部电路连接的焊盘设置在收容MEMS芯片和ASIC芯片的外壳一侧。在这种结构下，通常需要在该外壳上，例如在侧壁上开设金属导通孔，此时金属导通孔所占用的空间比较大。而且，在收容MEMS芯片和ASIC芯片的腔室内形成较多导通位置，其制作难度也比较大，很容易将外界的异物带入腔室内，从而会降低产品的可靠性。
因此，需要提供一种新的技术方案，以解决上述技术问题。
发明内容
本发明的一个目的是提供一种振动感测装置的新技术方案。
根据本发明的一个方面，提供一种振动感测装置，包括：
壳体，所述壳体具有敞开端，在所述壳体的内部形成腔体；
弹性元件，所述弹性元件设置在所述腔体内；
质量元件，所述质量元件通过所述弹性元件悬置在所述腔体内，并能随所述弹性元件一起在所述腔体内移动，以改变所述腔体内的压强；以及
振动传感器，所述振动传感器包括由基板和外壳形成的具有容纳腔的封装结构，和收容在所述容纳腔内且固定设置在所述基板上的感测元件；所述基板密封连接在所述壳体的敞开端，所述基板的外表面上设置有至少一个焊盘，所述焊盘通过贯穿所述基板的导体与所述感测元件连接，所述感测元件被配置为用于感测所述腔体内的压强或者所述腔体内不同区域的压强差。
可选地，在所述基板上，所述焊盘与所述壳体位于同一侧。
可选地，在所述基板上，所述焊盘与所述外壳位于同一侧。
可选地，所述基板还包括围绕所述壳体设置的转接部，所述焊盘设置在所述转接部上。
可选地，所述振动传感器还包括信号放大器，所述信号放大器被设置在所述基板上，所述感测元件与所述信号放大器连接。
可选地，所述信号放大器为ASIC芯片。
可选地，所述感测元件为MEMS芯片；
所述MEMS芯片包括衬底和感应膜；
所述衬底为中空结构；
所述感应膜设置在所述衬底的一端并覆盖所述中空结构，所述中空结构形成所述背腔，所述衬底的另一端与所述基板固定连接。
可选地，所述弹性元件为弹性膜片。
可选地，所述弹性元件包括位于中部的弹性部以及围绕所述弹性部设置的边缘部，所述边缘部与所述壳体的内壁连接。
可选地，所述质量元件贴合在所述弹性元件的表面上。
本发明实施例提供的振动感测装置，将焊盘设置在振动传感器的基板上，改变了传统的在产品腔壁内走线的方式，该方式能简化产品的整体结构，降低产品的制作难度以及提高产品的可靠性。并且，该振动传感器还具有感测振动的灵敏度高的特点。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本发明的实施例，并且连同说明书一起用于解释本发明的原理。
图1是根据本公开的一个实施例的振动感测装置的结构示意图。
图2是根据本公开的一个实施例的另一种振动感测装置的结构示意图。
图3是根据本公开的一个实施例的又一种振动感测装置的结构示意图。
附图标记说明：
1：基板；101：通孔；2：外壳；201：容纳腔；3：导体，4：MEMS芯片；401：衬底；402：感应膜；403：背腔；5：ASIC芯片；6：焊盘；7：壳体；701：第一腔室；702：第二腔室；8：弹性元件；9：质量元件；10：转接部。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但在适当情况下，所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例 性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
根据本发明的一个实施例，提供了一种振动感测装置。该振动感测装置可以为骨声纹传感装置、环境感测装置等。如图1-图3所示，该振动感测装置包括：壳体7、弹性元件8、质量元件9以及振动传感器。
壳体7呈皿状结构，其具有敞开端。在壳体7的内部形成有腔体。例如，壳体7的材质为金属、塑料或者PCB板等。壳体7的形状为圆柱状、长方体等。本领域技术人员可以根据实际需要灵活调整，对此不作限制。
弹性元件8设置在腔体内。弹性元件8用于为质量元件9提供弹性回复力。本实施例中，弹性元件8例如可以是弹性膜片。当然，弹性元件8也可以为本领域技术人员熟知的其它弹性件，对此不作限制。
在一个例子中，弹性元件8包括弹性部以及围绕该弹性部设置的边缘部。其中，弹性部能够发生弹性形变，从而提供弹性回复力。边缘部用于与壳体7的内壁连接，从而将弹性元件8稳定的设置在腔体内。
质量元件9通过弹性元件8悬置在腔体内，并能够随弹性元件8一起在腔体内移动，以改变腔体内的压强。在一个例子中，质量元件9与弹性元件8的弹性部之间通过粘合剂连接，即，质量元件9贴合在弹性元件8的表面上，以使质量元件9与弹性元件8牢固的结合在一起，从而使质量元件9能稳定的随着弹性元件8一起移动。当然，质量元件9与弹性元件8之间也可以采用本领域技术人员熟知的其它方式连接在一起。此外，本实施例中，质量元件9为预定重量的质量块。而对于质量块的重量本领域技术人员可以根据需要灵活调整，对此不作限制。
质量元件9和弹性元件8连接在一起后，可以将整个腔体分隔为第一腔室701和第二腔室702两个部分。其中，第一腔室701和第二腔室702均具有设定的容积。在两个腔室内密封预定压力的气体。气体例如可以为空气、氮气、惰性气体等，本领域技术人员可以根据需要灵活选择，对此 不作限制。
本发明实施例提供的振动感测装置，如图1-图3所示，振动传感器与壳体7内的腔体相连通。该振动传感器被构造为：用于感测腔体内的压强或者腔体内不同区域的压强差。例如，该振动传感器被构造为：用于感测第一腔室701和第二腔室702的压强差。其中，所述振动传感器例如可以为电动式传感器、压电式传感器、涡流式传感器、电感式传感器、电容式传感器等，本领域技术人员可以根据需要灵活选择，对此不作限制。
本发明的振动传感器，如图1-图3所示，包括由基板1和外壳2形成的具有容纳腔201的封装结构，以及收容在该容纳腔203内且固定设置在基板1上的感测元件(例如，MEMS芯片4)。基板1密封连接在壳体7的敞开端。基板1的外表面上设置有至少一个焊盘6。焊盘6通过贯穿基板1的导体3与感测元件连接。焊盘6用于与外部电路连接。
并且，在基板1上还设置有通孔101。该通孔101用于将壳体7内形成的腔体与感测元件连通。在本实施例中，通孔101为圆孔、方孔等，本领域技术人员可以根据具体需要灵活调整，对此不作限制。此外，在基板1上开设通孔101的难度小，易于加工。
本发明实施例提供的振动感测装置，能通过振动传感器获取第一腔室701和第二腔室702之间的压强差；以及通过压强差计算振动传感器所在位置的振动状态。
在使用时，该振动感测装置被安装在待检测物体上，例如，人的关节、机器人的关节等位置。待检测物体的振动会带动壳体7产生振动，由于质量元件9的惯性以及弹性元件8的弹性回复力的共同作用，故质量元件9会相对壳体7发生振动。质量元件9和弹性元件8的振动使得第一腔室701和第二腔室702的体积发生变化，由于两个腔室都是密闭的腔室，故第一腔室701和第二腔室702内的气体的压强会发生变化。
在该例子中，振动传感器感测第一腔室701和第二腔室702的压强差，并将压强差转换为电信号，例如电压信号、电流信号或者电容信号等。电信号经过计算从而得到待检测物体的振动状态。例如，振幅大小、振动频率等。
本发明的发明人发现，在现有技术中，通常是仅在第一腔室701或者第二腔室702内设置振动传感器，此时仅感测一个腔室的压强变化来检测待检测物体的振动状态。而在本发明的实施例中，振动传感器可以对第一腔室701和第二腔室702的压强差进行感测，具有感测振动的灵敏度高的特点。
本发明实施例提供的振动感测装置，将焊盘6直接设置在振动传感器的基板1上。在使用时，将焊盘6与外部电路焊接即可，使用起来非常方便。该设计改变了传统的在振动传感器的外壳上设置焊盘的方式，可以避免出现产品腔壁走线的方式，简化了产品的整体结构，降低了产品的制作难度，以及提高产品的可靠性。其中，在基板1上设置焊盘6的方式有多种，本领域技术人员可以根据实际情况灵活设置。
在一个例子中，如图1所示，将焊盘6设置在基板1的外侧，且使焊盘6与壳体7位于同一侧。此时，基板1的横向尺寸大于壳体7的横向尺寸(如图1示出的方向)，以给基板1上预留出设置焊盘6的空间。在基板1内埋设有导体3。焊盘6通过埋设在基板1内的导体3与感测元件电连接。例如，在基板1的合适位置形成过孔，即金属化通孔。过孔内具有导体3。焊盘6与过孔内的导体连接。在使用时，将焊盘6与外部电路焊接即可。
在一个例子中，如图2所示，将焊盘6设置在基板1的外侧，且使焊盘6与外壳2位于同一侧。此时，基板1的横向尺寸大于外壳2的横向尺寸(如图2示出的方向)，以给基板1上预留出设置焊盘6的空间。在基板1内埋设有导体3。焊盘6通过埋设在基板1内的导体3与感测元件电连接。例如，在基板1的合适位置形成过孔，即金属化通孔。过孔内具有导体3。焊盘6与过孔内的导体连接。在使用时，将焊盘6与外部电路焊接即可。
在一个例子中，如图3所示，基板1还包括围绕壳体7设置的转接部10，将焊盘6设置在转接部10上。此时，焊盘6与壳体7位于基板1的同一侧。该结构下，要在基板1和转接部10内分别埋设有导体3。焊盘6通过转接部10内埋设的导体3和基板1内埋设的导体3与感测元件电连接。 例如，在基板1和转接部10的合适位置分别形成过孔，即金属化通孔。每个过孔内具有导体3。在使用时，将焊盘6与外部电路焊接即可。
此外，本发明中，在基板1上设置有至少一个焊盘6。本领域技术人员可以根据需要对焊盘6的数量进行适当的调整。例如，在基板1上设置两个焊盘，三个焊盘，或者更多个焊盘，对此不作限制。
本发明的感测元件采用的是MEMS芯片4。当然，也可以采用本领域熟知的其它元件，对此不作限制。
如图1-图3所示，所述MEMS芯片4包括衬底401以及感应膜402。衬底401为中空结构。其中，感应膜402例如为压电元件、电容元件、压阻元件等。感应膜402设置在衬底401的一端，并覆盖中空结构。该中空结构形成背腔403，该背腔403可以通过基板1上开设的通孔101与壳体7的腔体连通。衬底401的另一端与基板1固定连接。
本发明的振动传感器除了上述的感测元件外，还包括信号放大器。该信号放大器被设置在基板1上。感测元件与信号放大器连接。
在一个例子中，信号放大器为ASIC芯片5。ASIC芯片5集成在基板1上。MEMS芯片4通过金属线与ASIC芯片5连接。ASIC芯片5可用于将MEMS芯片4采集到的信号进行放大处理。
本发明的振动传感器，其外壳2与基板1固定连接在一起，外壳2与基板1可以围成容纳腔201。该容纳腔201可用于收容MEMS芯片4和ASIC芯片5。
在一个例子中，外壳2的结构为：包括围绕基板1设置的侧壁部，以及与基板1相对的顶部。其中，顶部的材质例如为金属材料、塑料材料、PCB板等，对此不作限制。基板1例如为PCB板。
此外，外壳2与基板1之间可以通过胶体粘接或者锡膏焊接结合固定在一起。同样地，基板1与壳体7之间也可以通过胶体粘接或者锡膏焊接结合固定在一起。本领域技术人员可以根据需要灵活选择，对此不作限制。
虽然已经通过示例对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围 和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种振动感测装置，其特征在于：包括：
    壳体，所述壳体具有敞开端，在所述壳体的内部形成腔体；
    弹性元件，所述弹性元件设置在所述腔体内；
    质量元件，所述质量元件通过所述弹性元件悬置在所述腔体内，并能随所述弹性元件一起在所述腔体内移动，以改变所述腔体内的压强；以及
    振动传感器，所述振动传感器包括由基板和外壳形成的具有容纳腔的封装结构，和收容在所述容纳腔内且固定设置在所述基板上的感测元件；所述基板密封连接在所述壳体的敞开端，所述基板的外表面上设置有至少一个焊盘，所述焊盘通过贯穿所述基板的导体与所述感测元件连接，所述感测元件被配置为用于感测所述腔体内的压强或者所述腔体内不同区域的压强差。
  2. 根据权利要求1所述的振动感测装置，其特征在于：在所述基板上，所述焊盘与所述壳体位于同一侧。
  3. 根据权利要求1所述的振动感测装置，其特征在于：在所述基板上，所述焊盘与所述外壳位于同一侧。
  4. 根据权利要求1所述的振动感测装置，其特征在于：所述基板还包括围绕所述壳体设置的转接部，所述焊盘设置在所述转接部上。
  5. 根据权利要求1所述的振动感测装置，其特征在于，所述振动传感器还包括信号放大器，所述信号放大器被设置在所述基板上，所述感测元件与所述信号放大器连接。
  6. 根据权利要求5所述的振动感测装置，其特征在于，所述信号放大器为ASIC芯片。
  7. 根据权利要求1所述的振动感测装置，其特征在于：所述感测元件为MEMS芯片；
    所述MEMS芯片包括衬底和感应膜；
    所述衬底为中空结构；
    所述感应膜设置在所述衬底的一端并覆盖所述中空结构，所述中空结构形成背腔，所述背腔与所述腔体连通，所述衬底的另一端与所述基板固定连接。
  8. 根据权利要求1所述的振动感测装置，其特征在于，所述弹性元件为弹性膜片。
  9. 根据权利要求1所述的振动感测装置，其特征在于，所述弹性元件包括位于中部的弹性部以及围绕所述弹性部设置的边缘部，所述边缘部与所述壳体的内壁连接。
  10. 根据权利要求1所述的振动感测装置，其特征在于：所述质量元件贴合在所述弹性元件的表面上。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210302227A1 (en) * 2020-03-25 2021-09-30 Merry Electronics Co., Ltd. Vibration sensor

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11619544B2 (en) * 2020-03-25 2023-04-04 Merry Electronics Co., Ltd. Vibration sensor having vent for pressure enhancing member
CN111510834A (zh) * 2020-05-27 2020-08-07 潍坊歌尔微电子有限公司 骨声纹传感器模组和电子设备
CN116918354A (zh) * 2021-11-26 2023-10-20 深圳市韶音科技有限公司 振动组件及传声装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070165896A1 (en) * 2006-01-19 2007-07-19 Miles Ronald N Optical sensing in a directional MEMS microphone
CN202334834U (zh) * 2011-11-24 2012-07-11 歌尔声学股份有限公司 一种麦克风
CN203848956U (zh) * 2014-04-30 2014-09-24 歌尔声学股份有限公司 压力传感器
CN204007955U (zh) * 2014-05-31 2014-12-10 歌尔声学股份有限公司 压力传感器
CN204190945U (zh) * 2014-11-28 2015-03-04 歌尔声学股份有限公司 一种mems麦克风的上盖及基板
US20160007108A1 (en) * 2014-07-07 2016-01-07 Apple Inc. Grating only optical microphone
CN108513241A (zh) * 2018-06-29 2018-09-07 歌尔股份有限公司 振动传感器和音频设备
CN208386931U (zh) * 2018-06-29 2019-01-15 歌尔股份有限公司 振动传感器和音频设备

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070165896A1 (en) * 2006-01-19 2007-07-19 Miles Ronald N Optical sensing in a directional MEMS microphone
CN202334834U (zh) * 2011-11-24 2012-07-11 歌尔声学股份有限公司 一种麦克风
CN203848956U (zh) * 2014-04-30 2014-09-24 歌尔声学股份有限公司 压力传感器
CN204007955U (zh) * 2014-05-31 2014-12-10 歌尔声学股份有限公司 压力传感器
US20160007108A1 (en) * 2014-07-07 2016-01-07 Apple Inc. Grating only optical microphone
CN204190945U (zh) * 2014-11-28 2015-03-04 歌尔声学股份有限公司 一种mems麦克风的上盖及基板
CN108513241A (zh) * 2018-06-29 2018-09-07 歌尔股份有限公司 振动传感器和音频设备
CN208386931U (zh) * 2018-06-29 2019-01-15 歌尔股份有限公司 振动传感器和音频设备

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210302227A1 (en) * 2020-03-25 2021-09-30 Merry Electronics Co., Ltd. Vibration sensor
US11781901B2 (en) * 2020-03-25 2023-10-10 Merry Electronics Co., Ltd. Vibration sensor with pressure enhancement

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