CN204190945U - 一种mems麦克风的上盖及基板 - Google Patents
一种mems麦克风的上盖及基板 Download PDFInfo
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- CN204190945U CN204190945U CN201420739867.4U CN201420739867U CN204190945U CN 204190945 U CN204190945 U CN 204190945U CN 201420739867 U CN201420739867 U CN 201420739867U CN 204190945 U CN204190945 U CN 204190945U
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- 239000000758 substrate Substances 0.000 title claims abstract description 37
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 14
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 6
- 239000006071 cream Substances 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 4
- 238000010422 painting Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
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Application Number | Priority Date | Filing Date | Title |
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CN201420739867.4U CN204190945U (zh) | 2014-11-28 | 2014-11-28 | 一种mems麦克风的上盖及基板 |
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CN201420739867.4U CN204190945U (zh) | 2014-11-28 | 2014-11-28 | 一种mems麦克风的上盖及基板 |
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CN204190945U true CN204190945U (zh) | 2015-03-04 |
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CN201420739867.4U Active CN204190945U (zh) | 2014-11-28 | 2014-11-28 | 一种mems麦克风的上盖及基板 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110300361A (zh) * | 2019-06-20 | 2019-10-01 | 钰太芯微电子科技(上海)有限公司 | 一种带无线充电线圈的mems麦克风 |
WO2021031497A1 (zh) * | 2019-08-22 | 2021-02-25 | 歌尔微电子有限公司 | 一种振动感测装置 |
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2014
- 2014-11-28 CN CN201420739867.4U patent/CN204190945U/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110300361A (zh) * | 2019-06-20 | 2019-10-01 | 钰太芯微电子科技(上海)有限公司 | 一种带无线充电线圈的mems麦克风 |
WO2021031497A1 (zh) * | 2019-08-22 | 2021-02-25 | 歌尔微电子有限公司 | 一种振动感测装置 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200609 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |