WO2021031299A1 - 振动感测装置感测振动的方法以及振动感测装置 - Google Patents

振动感测装置感测振动的方法以及振动感测装置 Download PDF

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Publication number
WO2021031299A1
WO2021031299A1 PCT/CN2019/109026 CN2019109026W WO2021031299A1 WO 2021031299 A1 WO2021031299 A1 WO 2021031299A1 CN 2019109026 W CN2019109026 W CN 2019109026W WO 2021031299 A1 WO2021031299 A1 WO 2021031299A1
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Prior art keywords
sensing device
chamber
elastic
vibration
pressure sensing
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PCT/CN2019/109026
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English (en)
French (fr)
Inventor
端木鲁玉
付博
李欣亮
方华斌
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潍坊歌尔微电子有限公司
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Publication of WO2021031299A1 publication Critical patent/WO2021031299A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Definitions

  • the present invention relates to the technical field of vibration sensing, and more specifically, to a method for sensing vibration by a vibration sensing device and a vibration sensing device.
  • the existing vibration sensing device usually includes a housing and a mass set in the housing.
  • the mass block is suspended inside the shell through the diaphragm.
  • the housing has an open end.
  • the base plate of the pressure sensing device is hermetically connected to the open end.
  • a MEMS chip and an ASIC chip are arranged on the side of the substrate opposite to the housing, and also a shell arranged outside the MEMS chip and the ASIC chip.
  • the substrate has a communication hole.
  • the MEMS chip communicates with the inner cavity of the housing through the communication hole.
  • the vibration sensing device is fixed on the equipment to be measured.
  • the vibration is transmitted to the shell, which drives the shell to sound and vibrate.
  • the mass Since the mass has a set mass and the diaphragm has elasticity, the mass will vibrate relative to the shell.
  • the vibration of the mass causes the volume of the chambers on both sides of the diaphragm to change. Since the inner cavity is airtight, the volume in the cavity will change, and the pressure in the cavity will change accordingly.
  • the MEMS chip senses the change in pressure and generates a corresponding electrical signal.
  • the electrical signal is amplified by the ASIC chip and then transmitted to the external circuit.
  • the external circuit collects the electrical signal.
  • the existing vibration sensing device can only sense the pressure change of one chamber, and the sensing sensitivity is low.
  • An object of the present invention is to provide a new technical solution for the vibration sensing method of the vibration sensing device.
  • the vibration sensing device includes: a housing in which a cavity is formed inside the housing; a pressure generating device, the pressure generating device includes an elastic element and a mass element, and the elastic element is arranged in the cavity The mass element is suspended in the cavity by the elastic element, and can move in the cavity together with the elastic element, the mass element and the elastic element separate the cavity into a hermetic The first chamber and the second chamber; and a pressure sensing device, the pressure sensing device is respectively in communication with the first chamber and the second chamber; the method includes: through the pressure sensing The measurement device obtains the pressure difference between the first chamber and the second chamber; and calculates the vibration state of the position where the pressure sensing device is located based on the pressure difference.
  • the mass element includes the pressure sensing device, and the pressure sensing device is connected to the elastic element.
  • the elastic element includes a connecting part located in the middle, an elastic part arranged around the connecting part, and an edge part arranged around the elastic part.
  • the edge part is connected to the housing, and the connecting part is connected to the mass. Component connection.
  • the quality element further includes a substrate, the pressure sensing device is fixed on the substrate, the substrate is connected to the connecting portion, a through hole is provided on the substrate, and the pressure sensing device is One side of the sensing part of the sensing device is exposed to the first chamber, and the other side of the sensing part communicates with the second chamber through the through hole; or
  • One side of the sensing part of the pressure sensing device is exposed to the second chamber, and the other side of the sensing part communicates with the first chamber through the through hole.
  • the elastic element includes a supporting structure and an elastic diaphragm connected to the supporting structure.
  • One end of the supporting structure is connected to the mass element, and the other end is connected to the inner wall of the housing.
  • the diaphragm is arranged around the mass element.
  • the pressure sensing device is connected to an external circuit through a conductor provided on the supporting structure.
  • a vibration sensing device includes: a housing forming a cavity inside the housing; a pressure generating device, the pressure generating device includes an elastic element and a mass element, the elastic element is arranged in the cavity; the mass element passes The elastic element is suspended in the cavity and can move together with the elastic element in the cavity.
  • the mass element and the elastic element separate the cavity into a closed first chamber and A second chamber; and a pressure sensing device that communicates with the first chamber and the second chamber respectively; and a pressure sensing device that is connected to the pressure sensing device, respectively
  • the first chamber is in communication with the second chamber, and the pressure sensing device is configured to sense a pressure difference between the first chamber and the second chamber.
  • the mass element includes the pressure sensing device, and the pressure sensing device is connected to the elastic element.
  • the elastic element includes a connecting part located in the middle, an elastic part arranged around the connecting part, and an edge part arranged around the elastic part, the edge part is connected to the housing, and the connecting part is connected to the mass. Component connection.
  • the quality element further includes a substrate, the pressure sensing device is fixed on the substrate, the substrate is connected to the connecting portion, a through hole is provided on the substrate, and the pressure sensing device is One side of the sensing part of the sensing device is exposed to the first chamber, and the other side of the sensing part communicates with the second chamber through a through hole; or
  • One side of the sensing part of the pressure sensing device is exposed to the second chamber, and the other side of the sensing part communicates with the first chamber through a through hole.
  • the elastic element includes a supporting structure and an elastic diaphragm connected to the supporting structure.
  • One end of the supporting structure is connected to the mass element, and the other end is connected to the inner wall of the housing.
  • the diaphragm is arranged around the mass element.
  • the pressure sensing device is connected to an external circuit through a conductor provided on the supporting structure.
  • the quality element further includes a signal amplifier, the signal amplifier is disposed on the substrate, and the signal amplifier is connected to the pressure sensing device.
  • the elastic element includes an elastic diaphragm or a damping glue.
  • the housing includes a side wall arranged around the substrate and a bottom opposite to the substrate, and pads are arranged on the outside of the bottom, and the pads are embedded in the side walls.
  • the conductor is connected to the pressure sensing device.
  • it further includes a ring-shaped support portion, the ring-shaped support portion is disposed around the elastic element and connected to the elastic element, the housing includes an upper shell and a lower shell, the upper shell and the The lower shells are respectively sealed and connected to opposite sides of the annular support portion, the first chamber is formed between the upper shell and the mass element, and the lower shell and the mass element are formed between the Mentioned second chamber.
  • the inventor of the present invention found that in the prior art, only the pressure sensing device is provided in the first chamber or the second chamber, and only the pressure change of one chamber is sensed to detect the vibration state of the object to be detected.
  • the pressure difference between the two chambers is larger than the pressure change of one chamber, so the sensing The method is more sensitive to vibration.
  • Fig. 1 is a schematic diagram of a vibration sensing device according to an embodiment of the present disclosure.
  • Fig. 2 is a schematic diagram of a vibration structure according to an embodiment of the present disclosure.
  • Fig. 3 is a schematic structural diagram of a vibration sensing device according to an embodiment of the present disclosure.
  • Fig. 4 is a schematic structural diagram of another vibration sensing device according to an embodiment of the present disclosure.
  • the vibration sensing device is a bone voiceprint sensing device, an environment sensing device, and the like. As shown in Fig. 1, the vibration sensing device includes a housing 26, a pressure generating device and a pressure sensing device.
  • a cavity is formed inside the housing 26.
  • the material of the housing 26 is metal, plastic or PCB board.
  • the shape of the housing 26 is a cylindrical shape, a rectangular parallelepiped, or the like.
  • the pressure generating device includes an elastic element and a mass element.
  • the elastic element is arranged in the cavity.
  • the elastic element is used to provide elastic restoring force for the mass element.
  • the elastic element includes a connecting part, an elastic part arranged around the connecting part, and an edge part arranged around the vibrating part.
  • the elastic part can be elastically deformed to provide elastic restoring force.
  • the edge portion is connected to the inner wall of the housing 26.
  • the mass element is suspended in the cavity through the elastic element and can move in the cavity together with the elastic element.
  • the mass element is connected to the connection part.
  • the mass element and the elastic element divide the cavity into a sealed first chamber 15 and a second chamber 16.
  • the first chamber 15 and the second chamber 16 have a set volume.
  • the two chambers are sealed with gas at a predetermined pressure.
  • the gas is air, nitrogen, inert gas, etc.
  • the pressure sensing device communicates with the first chamber 15 and the second chamber 16 respectively.
  • the pressure sensing device is used to sense the pressure difference between the first chamber 15 and the second chamber 16.
  • pressure sensing devices are electric sensors, piezoelectric sensors, eddy current sensors, inductive sensors, capacitive sensors, and so on.
  • the pressure sensing device is one and exposed to the first chamber 15 and the second chamber 16.
  • the pressure sensing device is a capacitive sensor, which can directly sense the pressure difference between the two chambers.
  • the method includes: acquiring the pressure difference between the first chamber 15 and the second chamber 16 through a pressure sensing device; and
  • the vibration sensing device is installed on the object to be detected, for example, human joints, robot joints, and so on.
  • the vibration of the object to be detected drives the housing 26 to vibrate. Due to the combined action of the inertia of the mass element and the elastic restoring force of the elastic element, the mass element will vibrate relative to the housing 26.
  • the vibration of the mass element and the elastic element causes the volume of the first chamber 15 and the second chamber 16 to change. Since both chambers are closed chambers, the volume of the first chamber 15 and the second chamber 16 The pressure of the gas will change.
  • the pressure sensing device senses the pressure difference between the first chamber 15 and the second chamber 16 and converts the pressure difference into an electrical signal, such as a voltage signal, a current signal, or a capacitance signal.
  • the electrical signal is calculated to obtain the vibration state of the object to be detected. For example, amplitude, vibration frequency, etc.
  • the inventor of the present invention found that in the prior art, only a pressure sensing device is provided in the first chamber 15 or the second chamber 16, and only the pressure change of one chamber is sensed to detect the vibration state of the object to be detected.
  • the pressure difference between the two chambers is larger than that of one chamber.
  • the sensing method has higher sensitivity for sensing vibration.
  • the mass element includes a pressure sensing device.
  • the pressure sensing device is connected with the elastic element.
  • the pressure sensing device is a MEMS chip.
  • the MEMS chip includes a substrate 12 and a sensing film 11.
  • the substrate 12 has a hollow structure.
  • the sensing film 11 is a piezoelectric element, a capacitive element, a piezoresistive element, or the like.
  • the sensing film 11 is provided at one end of the substrate 12 and covers the hollow structure.
  • the hollow structure forms the back cavity 13.
  • the other end of the substrate 12 is connected to the elastic element.
  • the substrate 12 is connected to the connecting portion of the diaphragm 14.
  • the edge portion is connected to the inner wall of the housing 26.
  • the sensing film 11 is connected to an external circuit through a metal wire.
  • the pressure sensing device itself has a set mass, and it relies on its own mass as a mass element, without other mass elements, which makes the structure of the vibration sensing device simpler.
  • the quality element may also be a separately provided element.
  • the mass element further includes a substrate 17.
  • the substrate 17 is a PCB board.
  • the pressure sensing device is fixed on the substrate 17.
  • the MEMS chip is soldered on the substrate 17.
  • the MEMS chip is connected to the circuit on the PCB through a metal wire.
  • the substrate 17 is connected to the connection portion.
  • a through hole 23 is provided on the substrate 17.
  • the through hole 23 is a round hole, a square hole, or the like.
  • One side of the sensing part (for example, the sensing membrane 11) of the pressure sensing device is exposed to the first chamber 15, and the other side of the sensing part communicates with the second chamber 16 through the through hole 23; or
  • One side of the sensing part (for example, the sensing membrane 11) of the pressure sensing device is exposed to the second chamber 16 and the other side of the sensing part communicates with the first chamber 15 through the through hole 23.
  • the substrate 17 has a larger connection area than a pressure sensing device (such as a MEMS chip).
  • a pressure sensing device such as a MEMS chip
  • the substrate 17 is directly bonded to the diaphragm 14 by an adhesive.
  • the substrate 17 increases the mass of the mass element. Under the same vibration, the amplitude of the mass element is larger, which makes the vibration sensing device more sensitive.
  • the difficulty of opening the through hole 23 on the substrate 17 is small and the processing is easy.
  • the diaphragm 14 vibrates with the mass element as a whole, and the vibration is balanced.
  • the elastic element includes a supporting structure 18 and an elastic diaphragm connected to the supporting structure 18.
  • One end of the supporting structure 18 is connected with the mass element, and the other end is connected with the inner wall of the housing 26.
  • the supporting structure 18 supports the substrate 17 and the pressure sensing device.
  • the elastic diaphragm is arranged around the mass element.
  • the material of the support structure 18 is plastic or metal.
  • the elastic diaphragm is a thin film, such as the aforementioned diaphragm 14.
  • the mass element vibrates with the support structure 18 as a fulcrum.
  • the mass element has the largest amplitude from the distal end of the support structure 18, and the proximal end connected to the support structure 18 has the smallest amplitude.
  • the pressure sensing device can also function to sense the pressure difference between the two chambers.
  • the supporting structure 18 has greater structural strength and supporting force than the diaphragm 14 and can effectively increase the service life of the vibration sensing device.
  • the pressure sensing device is connected to an external circuit through a conductor 19 provided on the support structure 18.
  • the support structure 18 is a plastic material, a through hole is formed in the support structure 18, and a conductor 19 is provided in the through hole.
  • the metal wire of the pressure sensing device is directly connected to the conductor 19; or indirectly connected to the conductor through other equipment.
  • the quality component also includes a signal amplifier.
  • the signal amplifier is provided on the substrate 17.
  • the signal amplifier is connected with the pressure sensing device.
  • the signal amplifier is an ASIC chip 20.
  • the ASIC chip 20 is integrated on the substrate 17.
  • the MEMS chip is connected to the ASIC chip 20 through metal wires.
  • the ASIC chip 20 is connected to the substrate 17 through metal wires.
  • the substrate 17 is connected to an external circuit through a conductor 19 on the supporting structure 18.
  • the signal amplifier, the MEMS chip and the substrate 17 together serve as a mass element, which makes the mass element have a greater mass and the sensitivity of the vibration sensing device is higher.
  • the MEMS chip and the ASIC chip 20 are located on the side of the first chamber 15 or the side of the second chamber 16, which can be set by those skilled in the art according to actual needs.
  • the elastic element is a damping glue 24.
  • the damping glue 24 includes silica gel, rubber, and the like.
  • the damping glue 24 has elasticity and can provide elastic restoring force.
  • the damping glue 24 can also play a role of bonding. For example, before curing, the side of the substrate 17 and the side wall of the housing 26 are bonded together by the damping glue 24. Then, the damping glue 24 is cured by heating, UV irradiation or the like. The cured damping glue 24 obtains structural strength and elastic deformation ability.
  • the housing 26 includes a side wall arranged around the substrate 17 and a bottom opposite to the substrate 17.
  • a pad 22 is provided on the outside of the bottom.
  • the pad 22 is connected to the pressure sensing device through a conductor 19 buried in the sidewall.
  • a via 21 is formed in the side wall of the housing 26, that is, a metalized hole.
  • the via 21 has a conductor 19 inside.
  • the pad 22 is provided on the outside of the bottom wall.
  • the pad 22 is connected to the conductor in the via 21.
  • the via 21 is connected to the conductor 19 in the support structure 18. When in use, the bonding pad 22 can be directly welded to the external circuit.
  • the vibration sensing device further includes an annular supporting portion 25.
  • the annular supporting portion 25 has a hollow structure.
  • the ring-shaped supporting portion 25 is arranged on the outer periphery of the elastic element and connected with the elastic element.
  • the elastic element and the mass element are located in the hollow structure.
  • the ring-shaped support 25, the elastic element and the mass element together constitute a flat vibration part.
  • the housing 26 includes an upper housing 26a and a lower housing 26b.
  • the upper shell 26a and the lower shell 26b are sealingly connected to opposite sides of the annular support portion 25, respectively.
  • the first cavity 15 is formed between the upper shell 26a and the mass element
  • the second cavity 16 is formed between the lower shell 26b and the mass element.
  • the upper shell 26a and the lower shell 26b are both dish-like structures with one end open.
  • the open end of the upper shell 26a and the open end of the lower shell 26b are oppositely arranged on both sides of the annular support part 25.
  • the entire vibration sensing device includes an upper case 26a, a lower case 26b, and a vibration component.
  • a vibration component When connecting, it is only necessary to connect the upper shell 26a and the lower shell 26b to both sides of the vibrating component.
  • the aforementioned pad 22 is located on the upper case 26a or the lower case 26b.
  • the above-mentioned supporting structure 18 forms a connection with the annular supporting portion 25 as a part of the housing 26. Those skilled in the art can make settings according to actual needs.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Measuring Fluid Pressure (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)

Abstract

一种振动感测装置感测振动的方法以及振动感测装置，该振动感测装置包括：壳体（26），在壳体（26）的内部形成腔体；压力产生装置，所述压力产生装置包括弹性元件和质量元件，所述弹性元件设置在所述腔体内；所述质量元件通过所述弹性元件悬置在所述腔体内，并能随所述弹性元件一起在所述腔体内移动，所述质量元件和所述弹性元件将所述腔体分隔为密闭的第一腔室（15）和第二腔室（16）；以及压力感测装置，压力感测装置分别与第一腔室（15）和第二腔室（16）连通；所述方法包括：通过压力感测装置获取第一腔室（15）和第二腔室（16）之间的压强差；以及通过压强差计算压力感测装置所在位置的振动状态。

Description

振动感测装置感测振动的方法以及振动感测装置 技术领域
本发明涉及振动感测技术领域，更具体地，涉及一种振动感测装置感测振动的方法以及振动感测装置。
背景技术
现有的振动感测装置通常包括壳体和设置在壳体内的质量块。质量块通过振膜悬置在壳体的内部。壳体具有敞开端。压力感测装置的基板密封连接在敞开端。在基板的与壳体相对的一侧设置有MEMS芯片、ASIC芯片，还包括设置在MEMS芯片和ASIC芯片外的外壳。基板具有连通孔。MEMS芯片通过连通孔与壳体的内腔连通。
在工作时，振动感测装置被固定在待测量设备上。在该设备工作时，振动传递到壳体上，带动壳体发声振动。由于质量块具有设定的质量，并且振膜具有弹性，故质量块会相对于壳体发生振动。该质量块的振动使得振膜两侧的腔室的容积发生变化。由于内腔是密闭的，故会导致腔室内的容积发声变化，腔室内的压强随之发生变化。MEMS芯片感测到压强的变化会产生相应的电信号。该电信号经ASIC芯片放大后传输至外部电路。外部电路采集该电信号。
然而，现有的振动感测装置仅能感测一个腔室的压强的变化，感测灵敏度低。
因此，需要提供一种新的技术方案，以解决上述技术问题。
发明内容
本发明的一个目的是提供一种振动感测装置感测振动的方法的新技术方案。
根据本发明的一个方面，提供了一种振动感测装置感测振动的方法。 该方法所述振动感测装置包括：壳体，在所述壳体的内部形成腔体；压力产生装置，所述压力产生装置包括弹性元件和质量元件，所述弹性元件设置在所述腔体内；所述质量元件通过所述弹性元件悬置在所述腔体内，并能随所述弹性元件一起在所述腔体内移动，所述质量元件和所述弹性元件将所述腔体分隔为密闭的第一腔室和第二腔室；以及压力感测装置，所述压力感测装置分别与所述第一腔室和所述第二腔室连通；所述方法包括：通过所述压力感测装置获取所述第一腔室和所述第二腔室之间的压强差；以及通过所述压强差计算所述压力感测装置所在位置的振动状态。
可选地，所述质量元件包括所述压力感测装置，所述压力感测装置与所述弹性元件连接。
可选地，所述弹性元件包括位于中部的连接部、围绕连接部设置的弹性部和围绕弹性部设置的边缘部，所述边缘部与所述壳体连接，所述连接部与所述质量元件连接。
可选地，所述质量元件还包括基板，所述压力感测装置被固定在所述基板上，所述基板与所述连接部连接，在所述基板上设置有通孔，所述压力感测装置的感测部的一侧暴露于第一腔室，所述感测部的另一侧通过所述通孔与所述第二腔室连通；或者
所述压力感测装置的感测部的一侧暴露于第二腔室，所述感测部的另一侧通过所述通孔与所述第一腔室连通。
可选地，所述弹性元件包括支撑结构和与所述支撑结构连接的弹性膜片，所述支撑结构的一端与所述质量元件连接，另一端与所述壳体的内壁连接，所述弹性膜片围绕所述质量元件设置。
可选地，所述压力感测装置通过设置在所述支撑结构上的导体与外部电路连接。
根据本公开的另一个方面，提供了一种振动感测装置。该装置包括：壳体，在所述壳体的内部形成腔体；压力产生装置，所述压力产生装置包括弹性元件和质量元件，所述弹性元件设置在所述腔体内；所述质量元件通过所述弹性元件悬置在所述腔体内，并能随所述弹性元件一起在所述腔体内移动，所述质量元件和所述弹性元件将所述腔体分隔为密闭的第一腔 室和第二腔室；以及压力感测装置，所述压力感测装置分别与所述第一腔室和所述第二腔室连通；以及压力感测装置，所述压力感测装置分别与所述第一腔室和所述第二腔室连通，所述压力感测装置被配置为用于感测所述第一腔室和所述第二腔室之间的压强差。
可选地，所述质量元件包括所述压力感测装置，所述压力感测装置与所述弹性元件连接。
可选地，所述弹性元件包括位于中部的连接部，围绕连接部设置的弹性部和围绕弹性部设置的边缘部，所述边缘部与所述壳体连接，所述连接部与所述质量元件连接。
可选地，所述质量元件还包括基板，所述压力感测装置被固定在所述基板上，所述基板与所述连接部连接，在所述基板上设置有通孔，所述压力感测装置的感测部的一侧暴露于第一腔室，所述感测部的另一侧通过通孔与所述第二腔室连通；或者
所述压力感测装置的感测部的一侧暴露于第二腔室，所述感测部的另一侧通过通孔与所述第一腔室连通。
可选地，所述弹性元件包括支撑结构和与所述支撑结构连接的弹性膜片，所述支撑结构的一端与所述质量元件连接，另一端与所述壳体的内壁连接，所述弹性膜片围绕所述质量元件设置。
可选地，所述压力感测装置通过设置在所述支撑结构上的导体与外部电路连接。
可选地，所述质量元件还包括信号放大器，所述信号放大器被设置在所述基板上，所述信号放大器与所述压力感测装置连接。
可选地，所述弹性元件包括弹性膜片或者阻尼胶。
可选地，所述壳体包括围绕所述基板设置的侧壁以及与所述基板相对的底部，在所述底部的外侧设置有焊盘，所述焊盘通过埋设在所述侧壁内的导体与所述压力感测装置连接。
可选地，还包括环形支撑部，所述环形支撑部设置在所述弹性元件的外周围，并与所述弹性元件连接，所述壳体包括上壳和下壳，所述上壳和所述下壳分别密封连接在所述环形支撑部的相对的两侧，所述上壳与所述 质量元件之间形成所述第一腔室，所述下壳与所述质量元件之间形成所述第二腔室。
本发明的发明人发现，在现有技术中，仅在第一腔室或者第二腔室内设置压力感测装置，仅感测一个腔室的压强变化来检测待检测物体的振动状态。在本公开实施例中，由于第一腔室和第二腔室的容积是此消彼长的，故两个腔室的压强差相比于一个腔室的压强变化要大，因此该感测方法感测振动的灵敏度更高。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1是根据本公开的一个实施例的振动感测装置的原理图。
图2是根据本公开的一个实施例的振动结构的示意图。
图3是根据本公开的一个实施例的振动感测装置的结构示意图。
图4是根据本公开的一个实施例的另一种振动感测装置的结构示意图。
附图标记说明：
11：感应膜；12：衬底；13：背腔；14：振膜；15：第一腔室；16：第二腔室；17：基板；18：支撑结构；19：导体；20：ASIC芯片；21：过孔；22：焊盘；23：通孔；24：阻尼胶；25：环形支撑部；26：壳体；26a：上壳；26b：下壳。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作 为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
根据本公开的一个实施例，提供了一种振动感测装置感测振动的方法。该振动感测装置为骨声纹传感装置、环境感测装置等。如图1所示，振动感测装置包括：壳体26、压力产生装置和压力感测装置。
在壳体26的内部形成腔体。例如，壳体26的材质为金属、塑料或者PCB板。壳体26的形状为圆柱状、长方体等。
压力产生装置包括弹性元件和质量元件。弹性元件设置在腔体内。弹性元件用于为质量元件提供弹性回复力。例如，弹性元件包括连接部、围绕连接部设置的弹性部和围绕振动部设置的边缘部。弹性部能够发生弹性形变，从而提供弹性回复力。边缘部与壳体26的内壁连接。
质量元件通过弹性元件悬置在腔体内，并能随弹性元件一起在腔体内移动。例如，质量元件与连接部连接。质量元件和弹性元件将腔体分隔为密闭的第一腔室15和第二腔室16。第一腔室15和第二腔室16具有设定的容积。两个腔室内密封预定压力的气体。气体为空气、氮气、惰性气体等。
压力感测装置分别与第一腔室15和第二腔室16连通。压力感测装置用于感测第一腔室15和第二腔室16的压强差。例如，压力感测装置为电动式传感器、压电式传感器、涡流式传感器、电感式传感器、电容式传感器等。
例如，压力感测装置为两个，分别感测两个腔室的压强，并通过处理装置的计算，得出两个腔室的压强差。
还可以是，压力感测装置为一个，并且暴露于第一腔室15和第二腔室16。压力感测装置为电容式传感器，该传感器能直接感测两个腔室的压强差。
该方法包括：通过压力感测装置获取第一腔室15和第二腔室16之间的压强差；以及
通过压强差计算压力感测装置所在位置的振动状态。
在使用时，该振动感测装置被安装在待检测物体上，例如，人的关节、机器人的关节等。待检测物体的振动带动壳体26振动，由于质量元件的惯性以及弹性元件的弹性回复力的共同作用，故质量元件会相对壳体26发生振动。质量元件和弹性元件的振动使得第一腔室15和第二腔室16的体积发生变化，由于两个腔室都是密闭的腔室，故第一腔室15和第二腔室16内的气体的压强会发生变化。
在该例子中，压力感测装置感测第一腔室15和第二腔室16的压强差，并将压强差转换为电信号，例如电压信号、电流信号或者电容信号等。电信号经过计算从而得到待检测物体的振动状态。例如，振幅大小、振动频率等。
本发明的发明人发现在现有技术中，仅在第一腔室15或者第二腔室16内设置压力感测装置，仅感测一个腔室的压强变化来检测待检测物体的振动状态。在本公开实施例中，由于第一腔室15和第二腔室16的容积是此消彼长的，故两个腔室的压强差相比于一个腔室的压强变化要大，因此该感测方法感测振动的灵敏度更高。
在一个例子中，如图3-4所示，质量元件包括压力感测装置。压力感测装置与弹性元件连接。例如，压力感测装置为MEMS芯片。MEMS芯片包括衬底12和感应膜11。衬底12为中空结构。感应膜11为压电元件、电容元件、压阻元件等。感应膜11设置在衬底12的一端，并覆盖中空结构。中空结构形成背腔13。衬底12的另一端与弹性元件连接。衬底12连接在振膜14的连接部。边缘部与壳体26的内壁连接。感应膜11通过金属线与外部电路导通。
在该例子中，压力感测装置本身具有设定的质量，其依靠自身的质量 作为质量元件，而不需要设置其他的质量元件，这使得振动感测装置的结构更简单。
在其他示例中，质量元件也可以是单独设置的元件。
压力感测装置的体积通常很小，与振膜14连接比较困难，并且衬底12通常为硬质材料，不易于与振膜14连接。在一个例子中，质量元件还包括基板17。例如，基板17为PCB板。压力感测装置被固定在基板17上。例如，MEMS芯片焊接在基板17上。MEMS芯片通过金属线与PCB板上的电路连接。
如图2所述，基板17与连接部连接。在基板17上设置有通孔23。通孔23为圆孔、方孔等。压力感测装置的感测部(例如，感应膜11)的一侧暴露于第一腔室15，感测部的另一侧通过通孔23与第二腔室16连通；或者
压力感测装置的感测部(例如，感应膜11)的一侧暴露于第二腔室16，感测部的另一侧通过通孔23与第一腔室15连通。
在该例子中，基板17与压力感测装置(例如MEMS芯片)相比具有更大的连接面积。例如，通过粘结剂直接将基板17粘结在振膜14上。
此外，基板17增大了质量元件的质量，相同振动下，质量元件的振幅更大，这使得振动感测装置的灵敏度更高。
此外，在基板17上开设通孔23的难度小，易于加工。
在该例子中，振膜14与质量元件整体振动，振动均衡。
在其他示例中，也可以是振膜14与质量元件的发生非均衡的振动。例如，如图3-4所示，弹性元件包括支撑结构18和与支撑结构18连接的弹性膜片。支撑结构18的一端与质量元件连接，另一端与壳体26的内壁连接。例如，支撑结构18对于基板17、压力感测装置起到支撑的作用。弹性膜片围绕质量元件设置。例如，支撑结构18的材质为塑料、金属。弹性膜片为薄膜状，例如上述的振膜14。
在该例子中，质量元件以支撑结构18为支点进行振动。质量元件距离支撑结构18的远端的振幅最大，与支撑结构18连接的近端振幅最小。在这种设置方式中，压力感测装置同样能够起到感测两个腔室的压强差的 作用。
支撑结构18相比于振膜14具有更大的结构强度和支撑力，能够有效地提高振动感测装置的使用寿命。
在一个例子中，如图3-4所示，压力感测装置通过设置在支撑结构18上的导体19与外部电路连接。例如，支撑结构18为塑料材料，其内部形成贯穿孔，在贯穿孔内设置导体19。压力感测装置的金属线直接与导体19连接；或者通过其他设备间接地与导体连接。
在一个例子中，如图3-4所示，质量元件还包括信号放大器。信号放大器被设置在基板17上。信号放大器与压力感测装置连接。例如，信号放大器为ASIC芯片20。ASIC芯片20集成在基板17上。MEMS芯片通过金属线与ASIC芯片20连接。ASIC芯片20通过金属线与基板17连接。基板17通过支撑结构18上的导体19与外部电路导通。在该例子中，信号放大器、MEMS芯片和基板17一起作为质量元件，这使得质量元件具有更大的质量，振动感测装置的灵敏度更高。
例如，MEMS芯片、ASIC芯片20位于第一腔室15一侧或者第二腔室16一侧，本领域技术人员可以根据实际需要进行设置。
在一个例子中，如图4所示，弹性元件为阻尼胶24。例如，阻尼胶24包括硅胶、橡胶等。阻尼胶24具有弹性，能够提供弹性回复力。阻尼胶24还能起到粘结的作用，例如，在固化前，通过阻尼胶24将基板17的侧部与壳体26的侧壁粘结在一起。然后，采用加热、UV照射等方式将阻尼胶24进行固化。固化后的阻尼胶24获得结构强度和弹性变形能力。
此外，这种方式使得质量元件的组装变得容易。
在一个例子中，如图3-4所示，壳体26包括围绕基板17设置的侧壁以及与基板17相对的底部。在底部的外侧设置有焊盘22。焊盘22通过埋设在侧壁内的导体19与压力感测装置连接。例如，在壳体26的侧壁内形成过孔21，即金属化孔。过孔21内具有导体19。焊盘22设置在底壁的外侧。焊盘22与过孔21内的导体连接。过孔21与支撑结构18内的导体19连接。在使用时，直接将焊盘22与外部电路焊接即可。
在一个例子中，如图2-4所示，振动感测装置还包括环形支撑部25。 环形支撑部25为中空结构。环形支撑部25设置在弹性元件的外周围，并与弹性元件连接。弹性元件和质量元件位于中空结构内。环形支撑部25、弹性元件和质量元件一起构成扁平状的振动部件。
如图3-4所示，壳体26包括上壳26a和下壳26b。上壳26a和下壳26b分别密封连接在环形支撑部25的相对的两侧。上壳26a与质量元件之间形成第一腔室15，下壳26b与质量元件之间形成第二腔室16。例如，上壳26a和下壳26b均为一端开口的皿状结构。上壳26a的开口端和下壳26b的开口端相对设置在环形支撑部25的两侧。
在该例子中，振动感测装置的整体包括上壳26a、下壳26b和振动部件。在进行连接时，只需要将上壳26a和下壳26b连接在振动部件的两侧即可。这种模块化的设置方式使得振动感测装置的组装变得容易。
例如，上述的焊盘22位于上壳26a或者下壳26b上。上述的支撑结构18作为壳体26的一部分与环形支撑部25形成连接。本领域技术人员可以根据实际需要进行设置。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (16)

  1. 一种振动感测装置感测振动的方法，其特征在于：所述振动感测装置包括：
    壳体，在所述壳体的内部形成腔体；
    压力产生装置，所述压力产生装置包括弹性元件和质量元件，所述弹性元件设置在所述腔体内；所述质量元件通过所述弹性元件悬置在所述腔体内，并能随所述弹性元件一起在所述腔体内移动，所述质量元件和所述弹性元件将所述腔体分隔为密闭的第一腔室和第二腔室；以及
    压力感测装置，所述压力感测装置分别与所述第一腔室和所述第二腔室连通；
    所述方法包括：通过所述压力感测装置获取所述第一腔室和所述第二腔室之间的压强差；以及
    通过所述压强差计算所述压力感测装置所在位置的振动状态。
  2. 根据权利要求1所述的方法，其特征在于：所述质量元件包括所述压力感测装置，所述压力感测装置与所述弹性元件连接。
  3. 根据权利要求2所述的方法，其特征在于：所述弹性元件包括位于中部的连接部、围绕连接部设置的弹性部和围绕弹性部设置的边缘部，所述边缘部与所述壳体连接，所述连接部与所述质量元件连接。
  4. 根据权利要求3所述的方法，其特征在于：所述质量元件还包括基板，所述压力感测装置被固定在所述基板上，所述基板与所述连接部连接，在所述基板上设置有通孔，所述压力感测装置的感测部的一侧暴露于第一腔室，所述感测部的另一侧通过所述通孔与所述第二腔室连通；或者
    所述压力感测装置的感测部的一侧暴露于第二腔室，所述感测部的另一侧通过所述通孔与所述第一腔室连通。
  5. 根据权利要求2所述的方法，其特征在于：所述弹性元件包括支撑结构和与所述支撑结构连接的弹性膜片，所述支撑结构的一端与所述质量元件连接，另一端与所述壳体的内壁连接，所述弹性膜片围绕所述质量元件设置。
  6. 根据权利要求5所述的方法，其特征在于：所述压力感测装置通过设置在所述支撑结构上的导体与外部电路连接。
  7. 一种振动感测装置，其特征在于：包括：
    壳体，在所述壳体的内部形成腔体；
    压力产生装置，所述压力产生装置包括弹性元件和质量元件，所述弹性元件设置在所述腔体内；所述质量元件通过所述弹性元件悬置在所述腔体内，并能随所述弹性元件一起在所述腔体内移动，所述质量元件和所述弹性元件将所述腔体分隔为密闭的第一腔室和第二腔室；以及
    压力感测装置，所述压力感测装置分别与所述第一腔室和所述第二腔室连通，所述压力感测装置被配置为用于感测所述第一腔室和所述第二腔室之间的压强差。
  8. 根据权利要求7所述的振动感测装置，其特征在于：所述质量元件包括所述压力感测装置，所述压力感测装置与所述弹性元件连接。
  9. 根据权利要求8所述的振动感测装置，其特征在于：所述弹性元件包括位于中部的连接部，围绕连接部设置的弹性部和围绕弹性部设置的边缘部，所述边缘部与所述壳体连接，所述连接部与所述质量元件连接。
  10. 根据权利要求8所述的振动感测装置，其特征在于：所述质量元件还包括基板，所述压力感测装置被固定在所述基板上，所述基板与所述连接部连接，在所述基板上设置有通孔，所述压力感测装置的感测部的一侧暴露于第一腔室，所述感测部的另一侧通过所述通孔与所述第二腔室连 通；或者
    所述压力感测装置的感测部的一侧暴露于第二腔室，所述感测部的另一侧通过所述通孔与所述第一腔室连通。
  11. 根据权利要求8所述的振动感测装置，其特征在于：所述弹性元件包括支撑结构和与所述支撑结构连接的弹性膜片，所述支撑结构的一端与所述质量元件连接，另一端与所述壳体的内壁连接，所述弹性膜片围绕所述质量元件设置。
  12. 根据权利要求11所述的振动感测装置，其特征在于：所述压力感测装置通过设置在所述支撑结构上的导体与外部电路连接。
  13. 根据权利要求10所述的振动感测装置，其特征在于：所述质量元件还包括信号放大器，所述信号放大器被设置在所述基板上，所述信号放大器与所述压力感测装置连接。
  14. 根据权利要求7所述的振动感测装置，其特征在于：所述弹性元件包括弹性膜片或者阻尼胶。
  15. 根据权利要求7所述的振动感测装置，其特征在于：所述壳体包括围绕所述基板设置的侧壁以及与所述基板相对的底部，在所述底部的外侧设置有焊盘，所述焊盘通过埋设在所述侧壁内的导体与所述压力感测装置连接。
  16. 根据权利要求7所述的振动感测装置，其特征在于：还包括环形支撑部，所述环形支撑部设置在所述弹性元件的外周围，并与所述弹性元件连接，所述壳体包括上壳和下壳，所述上壳和所述下壳分别密封连接在所述环形支撑部的相对的两侧，所述上壳与所述质量元件之间形成所述第一腔室，所述下壳与所述质量元件之间形成所述第二腔室。
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CN111031424B (zh) * 2019-12-06 2021-11-16 潍坊歌尔微电子有限公司 振动感测装置、耳机以及电子设备
WO2023283966A1 (zh) * 2021-07-16 2023-01-19 深圳市韶音科技有限公司 传感装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101426163A (zh) * 2007-10-29 2009-05-06 雅马哈株式会社 振动传感器及其制造方法
US20180058915A1 (en) * 2016-08-26 2018-03-01 Sonion Nederland B.V. Vibration sensor with low-frequency roll-off response curve
CN208386931U (zh) * 2018-06-29 2019-01-15 歌尔股份有限公司 振动传感器和音频设备
CN208434106U (zh) * 2018-08-01 2019-01-25 歌尔科技有限公司 一种用于振动传感器的振动组件及振动传感器
CN109916502A (zh) * 2018-04-30 2019-06-21 索尼昂荷兰有限公司 振动传感器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1764328B (zh) * 2004-10-18 2010-12-15 财团法人工业技术研究院 动态压力感测装置
JP2007178133A (ja) * 2005-12-27 2007-07-12 Yamaha Corp 圧力センサモジュール、その製造方法、及び、半導体装置
US7607355B2 (en) * 2007-02-16 2009-10-27 Yamaha Corporation Semiconductor device
US20090175477A1 (en) * 2007-08-20 2009-07-09 Yamaha Corporation Vibration transducer
JP2009089100A (ja) * 2007-09-28 2009-04-23 Yamaha Corp 振動トランスデューサ
JP2017112479A (ja) * 2015-12-16 2017-06-22 株式会社オーディオテクニカ コンタクトマイクロホン
CN108513241B (zh) * 2018-06-29 2024-04-19 潍坊歌尔微电子有限公司 振动传感器和音频设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101426163A (zh) * 2007-10-29 2009-05-06 雅马哈株式会社 振动传感器及其制造方法
US20180058915A1 (en) * 2016-08-26 2018-03-01 Sonion Nederland B.V. Vibration sensor with low-frequency roll-off response curve
CN109916502A (zh) * 2018-04-30 2019-06-21 索尼昂荷兰有限公司 振动传感器
CN208386931U (zh) * 2018-06-29 2019-01-15 歌尔股份有限公司 振动传感器和音频设备
CN208434106U (zh) * 2018-08-01 2019-01-25 歌尔科技有限公司 一种用于振动传感器的振动组件及振动传感器

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