CN203690287U - 一种基于框架采用镀银技术的封装件 - Google Patents
一种基于框架采用镀银技术的封装件 Download PDFInfo
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- CN203690287U CN203690287U CN201320335457.9U CN201320335457U CN203690287U CN 203690287 U CN203690287 U CN 203690287U CN 201320335457 U CN201320335457 U CN 201320335457U CN 203690287 U CN203690287 U CN 203690287U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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CN201320335457.9U CN203690287U (zh) | 2013-06-10 | 2013-06-10 | 一种基于框架采用镀银技术的封装件 |
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CN201320335457.9U CN203690287U (zh) | 2013-06-10 | 2013-06-10 | 一种基于框架采用镀银技术的封装件 |
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CN203690287U true CN203690287U (zh) | 2014-07-02 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103346140A (zh) * | 2013-06-10 | 2013-10-09 | 孙青秀 | 一种基于框架采用镀银技术的封装件及其制作工艺 |
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- 2013-06-10 CN CN201320335457.9U patent/CN203690287U/zh not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103346140A (zh) * | 2013-06-10 | 2013-10-09 | 孙青秀 | 一种基于框架采用镀银技术的封装件及其制作工艺 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: CHINA CHIPPACKING TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SUN QINGXIU Effective date: 20141102 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 710018 XI'AN, SHAANXI PROVINCE TO: 518111 SHENZHEN, GUANGDONG PROVINCE |
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TR01 | Transfer of patent right |
Effective date of registration: 20141102 Address after: Longgang District of Shenzhen City, Guangdong province 518111 Pinghu Street Community Ping Wo Flower New Street No. 165 Building 1 floor 105 Hengshun Factory 1, 2-5 floor Patentee after: China Chippacking Technology Co.,Ltd. Address before: The essence of the door No. 50 Wenjing road 710018 Shaanxi province Weiyang District of Xi'an city 6-2206 room Patentee before: Sun Qingxiu |
|
CX01 | Expiry of patent term |
Granted publication date: 20140702 |
|
CX01 | Expiry of patent term |