CN202085399U - 屏蔽印刷电路板 - Google Patents
屏蔽印刷电路板 Download PDFInfo
- Publication number
- CN202085399U CN202085399U CN2011201604157U CN201120160415U CN202085399U CN 202085399 U CN202085399 U CN 202085399U CN 2011201604157 U CN2011201604157 U CN 2011201604157U CN 201120160415 U CN201120160415 U CN 201120160415U CN 202085399 U CN202085399 U CN 202085399U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- cement
- strengthening part
- insulating barrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- 239000000463 material Substances 0.000 claims description 24
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- 239000010935 stainless steel Substances 0.000 claims description 11
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
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- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
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- 229910052725 zinc Inorganic materials 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-016554 | 2011-01-28 | ||
JP2011016554A JP5308465B2 (ja) | 2011-01-28 | 2011-01-28 | シールドプリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202085399U true CN202085399U (zh) | 2011-12-21 |
Family
ID=45346011
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110130678.8A Active CN102625564B (zh) | 2011-01-28 | 2011-05-16 | 屏蔽印刷电路板 |
CN2011201604157U Expired - Lifetime CN202085399U (zh) | 2011-01-28 | 2011-05-16 | 屏蔽印刷电路板 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110130678.8A Active CN102625564B (zh) | 2011-01-28 | 2011-05-16 | 屏蔽印刷电路板 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5308465B2 (ja) |
KR (1) | KR101776711B1 (ja) |
CN (2) | CN102625564B (ja) |
TW (1) | TWI501708B (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102625564A (zh) * | 2011-01-28 | 2012-08-01 | 大自达电线股份有限公司 | 屏蔽印刷电路板 |
CN102933024A (zh) * | 2011-08-11 | 2013-02-13 | 大自达电线股份有限公司 | 印刷电路板及印刷电路板的制造方法 |
CN104885578A (zh) * | 2013-02-26 | 2015-09-02 | 大自达电线股份有限公司 | 柔性印制线路板用补强部分、柔性印制线路板及屏蔽印制线路板 |
CN108132113A (zh) * | 2018-01-31 | 2018-06-08 | 北京他山科技有限公司 | 应用多功能层实现电磁屏蔽的传感器、电子皮肤和机器人 |
CN108738226A (zh) * | 2018-05-04 | 2018-11-02 | 华显光电技术(惠州)有限公司 | 柔性电路板结构、背光组件与移动终端 |
CN110461086A (zh) * | 2019-08-30 | 2019-11-15 | 维沃移动通信有限公司 | 一种电路板、电路板制作方法及终端 |
CN111312078A (zh) * | 2020-03-05 | 2020-06-19 | 武汉华星光电半导体显示技术有限公司 | 显示面板及其侧面邦定方法 |
CN114286538A (zh) * | 2020-09-28 | 2022-04-05 | 鹏鼎控股(深圳)股份有限公司 | 具有插接手指的多层线路板及其制作方法 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI613956B (zh) * | 2012-11-19 | 2018-02-01 | Tatsuta Electric Wire & Cable Co Ltd | 層疊膜和遮罩印刷佈線板 |
US9820376B2 (en) * | 2013-05-28 | 2017-11-14 | Tatsuta Electric Wire & Cable Co., Ltd. | Shape-retaining film, and shape-retaining-type flexible circuit board provided with same shape-retaining film |
JP6239884B2 (ja) * | 2013-07-16 | 2017-11-29 | 住友電工プリントサーキット株式会社 | 電子部品及びその製造方法 |
CN103763893B (zh) * | 2014-01-14 | 2016-04-13 | 广州方邦电子股份有限公司 | 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法 |
JP6409760B2 (ja) * | 2014-12-11 | 2018-10-24 | 東洋インキScホールディングス株式会社 | プリント配線板の製造方法 |
JP5861790B1 (ja) * | 2015-02-25 | 2016-02-16 | 東洋インキScホールディングス株式会社 | 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器 |
JP6432439B2 (ja) * | 2015-04-28 | 2018-12-05 | 東芝ライテック株式会社 | 照明装置 |
JP6568436B2 (ja) * | 2015-09-15 | 2019-08-28 | 住友電気工業株式会社 | 電子部品、接着シート及び電子部品の製造方法 |
JP6187568B2 (ja) * | 2015-09-17 | 2017-08-30 | 東洋インキScホールディングス株式会社 | 電磁波シールド用積層体、電磁波シールド積層体、電子機器およびその製造方法 |
JP6194939B2 (ja) * | 2015-09-17 | 2017-09-13 | 東洋インキScホールディングス株式会社 | 電磁波シールド用積層体、電磁波シールド積層体、電子機器およびその製造方法 |
KR20190115020A (ko) * | 2017-02-13 | 2019-10-10 | 타츠타 전선 주식회사 | 프린트 배선판 |
CN109892020B (zh) * | 2017-02-13 | 2022-03-04 | 拓自达电线株式会社 | 接地构件、屏蔽印制线路板及屏蔽印制线路板的制造方法 |
JP6946437B2 (ja) * | 2017-08-09 | 2021-10-06 | タツタ電線株式会社 | 接続用フィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 |
JP6566008B2 (ja) * | 2017-11-24 | 2019-08-28 | 東洋インキScホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
CN110691497B (zh) * | 2018-07-06 | 2024-04-23 | 广州方邦电子股份有限公司 | 电磁屏蔽膜、线路板及电磁屏蔽膜的制备方法 |
TWI771595B (zh) * | 2018-10-29 | 2022-07-21 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜、屏蔽印刷配線板之製造方法、及屏蔽印刷配線板 |
TWI782213B (zh) * | 2018-10-29 | 2022-11-01 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜、屏蔽印刷配線板之製造方法、及屏蔽印刷配線板 |
JP7254904B2 (ja) | 2019-03-19 | 2023-04-10 | タツタ電線株式会社 | シールドプリント配線板、シールドプリント配線板の製造方法、及び、接続部材 |
TW202214050A (zh) * | 2020-09-18 | 2022-04-01 | 日商拓自達電線股份有限公司 | 附接地構件之屏蔽印刷配線板及接地構件 |
CN114325543B (zh) * | 2021-11-23 | 2024-03-22 | 国能朔黄铁路发展有限责任公司 | 电流互感器异常监测装置和控制方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002116455A (ja) * | 2000-08-01 | 2002-04-19 | Kyodo Printing Co Ltd | 液晶表示装置、液晶表示装置の電極基材及び液晶表示装置の製造方法 |
TW516352B (en) * | 2001-07-06 | 2003-01-01 | Advanced Semiconductor Eng | Manufacturing method for printed circuit board |
JP4843979B2 (ja) * | 2004-03-30 | 2011-12-21 | 住友ベークライト株式会社 | 回路基板 |
JP2009302327A (ja) * | 2008-06-13 | 2009-12-24 | Sharp Corp | 配線部材の接続構造およびそれを備えた太陽電池モジュールならびにその製造方法 |
JP5150534B2 (ja) * | 2009-03-06 | 2013-02-20 | 信越ポリマー株式会社 | カバーレイフィルム、その製造方法およびフレキシブルプリント配線板 |
JP5308465B2 (ja) * | 2011-01-28 | 2013-10-09 | タツタ電線株式会社 | シールドプリント配線板 |
-
2011
- 2011-01-28 JP JP2011016554A patent/JP5308465B2/ja active Active
- 2011-04-15 TW TW100113141A patent/TWI501708B/zh active
- 2011-05-12 KR KR1020110044562A patent/KR101776711B1/ko active IP Right Grant
- 2011-05-16 CN CN201110130678.8A patent/CN102625564B/zh active Active
- 2011-05-16 CN CN2011201604157U patent/CN202085399U/zh not_active Expired - Lifetime
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102625564A (zh) * | 2011-01-28 | 2012-08-01 | 大自达电线股份有限公司 | 屏蔽印刷电路板 |
CN102625564B (zh) * | 2011-01-28 | 2016-05-04 | 大自达电线股份有限公司 | 屏蔽印刷电路板 |
CN102933024A (zh) * | 2011-08-11 | 2013-02-13 | 大自达电线股份有限公司 | 印刷电路板及印刷电路板的制造方法 |
CN102933024B (zh) * | 2011-08-11 | 2017-06-16 | 大自达电线股份有限公司 | 印刷电路板及印刷电路板的制造方法 |
CN104885578A (zh) * | 2013-02-26 | 2015-09-02 | 大自达电线股份有限公司 | 柔性印制线路板用补强部分、柔性印制线路板及屏蔽印制线路板 |
CN104885578B (zh) * | 2013-02-26 | 2018-05-04 | 大自达电线股份有限公司 | 柔性印制线路板用补强部分、柔性印制线路板及屏蔽印制线路板 |
CN108132113A (zh) * | 2018-01-31 | 2018-06-08 | 北京他山科技有限公司 | 应用多功能层实现电磁屏蔽的传感器、电子皮肤和机器人 |
CN108738226A (zh) * | 2018-05-04 | 2018-11-02 | 华显光电技术(惠州)有限公司 | 柔性电路板结构、背光组件与移动终端 |
CN108738226B (zh) * | 2018-05-04 | 2020-11-13 | 华显光电技术(惠州)有限公司 | 柔性电路板结构、背光组件与移动终端 |
CN110461086A (zh) * | 2019-08-30 | 2019-11-15 | 维沃移动通信有限公司 | 一种电路板、电路板制作方法及终端 |
CN111312078A (zh) * | 2020-03-05 | 2020-06-19 | 武汉华星光电半导体显示技术有限公司 | 显示面板及其侧面邦定方法 |
CN114286538A (zh) * | 2020-09-28 | 2022-04-05 | 鹏鼎控股(深圳)股份有限公司 | 具有插接手指的多层线路板及其制作方法 |
CN114286538B (zh) * | 2020-09-28 | 2024-03-15 | 鹏鼎控股(深圳)股份有限公司 | 具有插接手指的多层线路板及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102625564B (zh) | 2016-05-04 |
CN102625564A (zh) | 2012-08-01 |
JP2012156457A (ja) | 2012-08-16 |
JP5308465B2 (ja) | 2013-10-09 |
TWI501708B (zh) | 2015-09-21 |
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TW201233262A (en) | 2012-08-01 |
KR20120087753A (ko) | 2012-08-07 |
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