CN200987238Y - 一种电路板固定夹具 - Google Patents
一种电路板固定夹具 Download PDFInfo
- Publication number
- CN200987238Y CN200987238Y CN 200620137175 CN200620137175U CN200987238Y CN 200987238 Y CN200987238 Y CN 200987238Y CN 200620137175 CN200620137175 CN 200620137175 CN 200620137175 U CN200620137175 U CN 200620137175U CN 200987238 Y CN200987238 Y CN 200987238Y
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- circuit board
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- 210000002683 foot Anatomy 0.000 claims description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 3
- 229920001342 Bakelite® Polymers 0.000 claims description 2
- 239000004637 bakelite Substances 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000012360 testing method Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200620137175 CN200987238Y (zh) | 2006-09-29 | 2006-09-29 | 一种电路板固定夹具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200620137175 CN200987238Y (zh) | 2006-09-29 | 2006-09-29 | 一种电路板固定夹具 |
Publications (1)
Publication Number | Publication Date |
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CN200987238Y true CN200987238Y (zh) | 2007-12-05 |
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Family Applications (1)
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CN 200620137175 Expired - Fee Related CN200987238Y (zh) | 2006-09-29 | 2006-09-29 | 一种电路板固定夹具 |
Country Status (1)
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CN (1) | CN200987238Y (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101913007A (zh) * | 2010-08-25 | 2010-12-15 | 武汉电信器件有限公司 | 器件软带焊接夹具 |
CN102522355A (zh) * | 2011-12-04 | 2012-06-27 | 华东光电集成器件研究所 | 一种衬底组装装置 |
CN102560380A (zh) * | 2010-12-09 | 2012-07-11 | 北大方正集团有限公司 | 用于载板架的夹具、载板架和基板的固定方法 |
CN103307962A (zh) * | 2013-06-28 | 2013-09-18 | 中国地质大学(武汉) | 平面度自动测量机 |
CN103728550A (zh) * | 2013-12-27 | 2014-04-16 | 昆山迈致治具科技有限公司 | 一种pcb板性能检测治具 |
CN103747634A (zh) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | 一种pcb板隔热限行程热压夹紧治具 |
CN103747632A (zh) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | 一种多转轴pcb板焊接吹风夹紧治具 |
CN103747631A (zh) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | 一种pcb板定位热压治具 |
CN107415715A (zh) * | 2017-07-21 | 2017-12-01 | 重庆新和平自动化有限公司 | 一种电动车增程器防护外壳及其使用方法 |
CN109828427A (zh) * | 2019-02-21 | 2019-05-31 | 苏州佳世达光电有限公司 | 致动模块及包含此致动模块的投影装置 |
-
2006
- 2006-09-29 CN CN 200620137175 patent/CN200987238Y/zh not_active Expired - Fee Related
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101913007A (zh) * | 2010-08-25 | 2010-12-15 | 武汉电信器件有限公司 | 器件软带焊接夹具 |
CN102560380A (zh) * | 2010-12-09 | 2012-07-11 | 北大方正集团有限公司 | 用于载板架的夹具、载板架和基板的固定方法 |
CN102522355A (zh) * | 2011-12-04 | 2012-06-27 | 华东光电集成器件研究所 | 一种衬底组装装置 |
CN103307962A (zh) * | 2013-06-28 | 2013-09-18 | 中国地质大学(武汉) | 平面度自动测量机 |
CN103307962B (zh) * | 2013-06-28 | 2016-01-20 | 中国地质大学(武汉) | 平面度自动测量机 |
CN103728550A (zh) * | 2013-12-27 | 2014-04-16 | 昆山迈致治具科技有限公司 | 一种pcb板性能检测治具 |
CN103747634A (zh) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | 一种pcb板隔热限行程热压夹紧治具 |
CN103747632A (zh) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | 一种多转轴pcb板焊接吹风夹紧治具 |
CN103747631A (zh) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | 一种pcb板定位热压治具 |
CN107415715A (zh) * | 2017-07-21 | 2017-12-01 | 重庆新和平自动化有限公司 | 一种电动车增程器防护外壳及其使用方法 |
CN109828427A (zh) * | 2019-02-21 | 2019-05-31 | 苏州佳世达光电有限公司 | 致动模块及包含此致动模块的投影装置 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN XIN AN IOT TECHNOLOGY CO., LTD. Free format text: FORMER NAME: HUIPU ELECTRONIC(SHENZHEN) CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Fuyong street Shenzhen city Guangdong province 518057 Cen Lu industrial workshops Huipu A second layer, fourth layer fifth layer C, A, B first Patentee after: Xin'an Networking Technology Co.,Ltd. Address before: Baoan District Fuyong street Shenzhen city Guangdong province 518057 Cen Lu industrial workshops Huipu A second layer, fourth layer fifth layer C, A, B first Patentee before: Shenzhen Xin'an Networking Technology Co.,Ltd. |
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CP03 | Change of name, title or address |
Address after: Baoan District Fuyong street Shenzhen city Guangdong province 518057 Cen Lu industrial workshops Huipu A second layer, fourth layer fifth layer C, A, B first Patentee after: Shenzhen Xin'an Networking Technology Co.,Ltd. Address before: 518057 R2-A2, Nanshan District hi tech Zone, Shenzhen, Guangdong Patentee before: Huipu Electronic (Shenzhen) Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071205 Termination date: 20150929 |
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EXPY | Termination of patent right or utility model |