CN1942304A - 用于设备处理系统的高温高强度可着色材料 - Google Patents

用于设备处理系统的高温高强度可着色材料 Download PDF

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Publication number
CN1942304A
CN1942304A CNA2003801054992A CN200380105499A CN1942304A CN 1942304 A CN1942304 A CN 1942304A CN A2003801054992 A CNA2003801054992 A CN A2003801054992A CN 200380105499 A CN200380105499 A CN 200380105499A CN 1942304 A CN1942304 A CN 1942304A
Authority
CN
China
Prior art keywords
goods
metal oxide
carrier
pallet
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2003801054992A
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English (en)
Chinese (zh)
Inventor
C·W·埃西兰德
R·布查
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of CN1942304A publication Critical patent/CN1942304A/zh
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H01L21/6733Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333Trays for chips
    • H01L21/67336Trays for chips characterized by a material, a roughness, a coating or the like
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/13Hollow or container type article [e.g., tube, vase, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/13Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352Polymer or resin containing [i.e., natural or synthetic]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wrappers (AREA)
  • Laminated Bodies (AREA)
  • Elimination Of Static Electricity (AREA)
CNA2003801054992A 2002-10-09 2003-10-09 用于设备处理系统的高温高强度可着色材料 Pending CN1942304A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41715002P 2002-10-09 2002-10-09
US60/417,150 2002-10-09

Publications (1)

Publication Number Publication Date
CN1942304A true CN1942304A (zh) 2007-04-04

Family

ID=32093973

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2003801054992A Pending CN1942304A (zh) 2002-10-09 2003-10-09 用于设备处理系统的高温高强度可着色材料

Country Status (8)

Country Link
US (3) US20040126522A1 (de)
EP (1) EP1556209A4 (de)
JP (1) JP2006507994A (de)
KR (1) KR20050050122A (de)
CN (1) CN1942304A (de)
AU (1) AU2003279239A1 (de)
TW (1) TWI290118B (de)
WO (1) WO2004033103A2 (de)

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WO2007149783A1 (en) * 2006-06-20 2007-12-27 Polyone Corporation Thermally conductive polymer compounds containing zinc sulfide and thermal carbon black
US7476339B2 (en) * 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
JP4458077B2 (ja) * 2006-08-21 2010-04-28 ヤマハ株式会社 検査用チップソケット
US20090054553A1 (en) * 2007-08-20 2009-02-26 General Electric Company High dielectric constant thermoplastic composition, methods of manufacture thereof and articles comprising the same
DE202009001817U1 (de) * 2009-01-31 2009-06-04 Roth & Rau Ag Substratträger zur Halterung einer Vielzahl von Solarzellenwafern
JP5706439B2 (ja) 2009-12-11 2015-04-22 カーゲーテー・グラフィート・テヒノロギー・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング 基板支持体
WO2012170075A1 (en) * 2011-06-06 2012-12-13 Rataul Balbir Training ensurance method and system for computer directed assembly and manufacturing
KR20170100353A (ko) * 2016-02-25 2017-09-04 (주)코스탯아이앤씨 반도체 수납 트레이 및 반도체 수납 트레이용 커버
KR101935284B1 (ko) 2017-01-13 2019-01-04 (주)드림에이스텍 고분자 합성수지 소재를 이용한 개선된 반도체 제조용 보트 및 그 제작방법
CN110246790B (zh) * 2018-03-07 2023-11-24 美国莱迪思半导体公司 芯片托盘及其制造方法
US20200395234A1 (en) * 2019-06-12 2020-12-17 Intel Corporation Multi-component trays for transporting integrated circuit dice

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Also Published As

Publication number Publication date
TWI290118B (en) 2007-11-21
US20070178259A1 (en) 2007-08-02
EP1556209A4 (de) 2009-07-01
EP1556209A2 (de) 2005-07-27
TW200415084A (en) 2004-08-16
US20070190276A1 (en) 2007-08-16
US20040126522A1 (en) 2004-07-01
AU2003279239A1 (en) 2004-05-04
WO2004033103A3 (en) 2005-02-24
WO2004033103B1 (en) 2005-05-06
WO2004033103A9 (en) 2004-11-25
WO2004033103A2 (en) 2004-04-22
KR20050050122A (ko) 2005-05-27
AU2003279239A8 (en) 2004-05-04
JP2006507994A (ja) 2006-03-09

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication