CN1941319A - 用于浅沟槽隔离的双制衬的方法与结构 - Google Patents
用于浅沟槽隔离的双制衬的方法与结构 Download PDFInfo
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- CN1941319A CN1941319A CN200510030312.8A CN200510030312A CN1941319A CN 1941319 A CN1941319 A CN 1941319A CN 200510030312 A CN200510030312 A CN 200510030312A CN 1941319 A CN1941319 A CN 1941319A
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- oxide
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- 238000000034 method Methods 0.000 title claims abstract description 80
- 150000004767 nitrides Chemical class 0.000 claims abstract description 46
- 230000003647 oxidation Effects 0.000 claims abstract description 21
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 21
- 238000013461 design Methods 0.000 claims abstract description 4
- 238000005516 engineering process Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 36
- 238000000059 patterning Methods 0.000 claims description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 23
- 229910052710 silicon Inorganic materials 0.000 claims description 23
- 239000010703 silicon Substances 0.000 claims description 23
- 238000002955 isolation Methods 0.000 claims description 22
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 19
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 16
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 238000005229 chemical vapour deposition Methods 0.000 claims 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 238000005470 impregnation Methods 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 12
- 238000010438 heat treatment Methods 0.000 abstract 3
- 229920002120 photoresistant polymer Polymers 0.000 description 14
- 238000010276 construction Methods 0.000 description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- 238000001020 plasma etching Methods 0.000 description 7
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 244000208734 Pisonia aculeata Species 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000005144 thermotropism Effects 0.000 description 1
- PICXIOQBANWBIZ-UHFFFAOYSA-N zinc;1-oxidopyridine-2-thione Chemical class [Zn+2].[O-]N1C=CC=CC1=S.[O-]N1C=CC=CC1=S PICXIOQBANWBIZ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
Abstract
Description
Claims (20)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100303128A CN100481375C (zh) | 2005-09-29 | 2005-09-29 | 用于浅沟槽隔离的双制衬的方法与结构 |
US11/536,458 US7682929B2 (en) | 2005-09-29 | 2006-09-28 | Method and structure for double lining for shallow trench isolation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100303128A CN100481375C (zh) | 2005-09-29 | 2005-09-29 | 用于浅沟槽隔离的双制衬的方法与结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1941319A true CN1941319A (zh) | 2007-04-04 |
CN100481375C CN100481375C (zh) | 2009-04-22 |
Family
ID=37948647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100303128A Active CN100481375C (zh) | 2005-09-29 | 2005-09-29 | 用于浅沟槽隔离的双制衬的方法与结构 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7682929B2 (zh) |
CN (1) | CN100481375C (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102054872A (zh) * | 2009-11-06 | 2011-05-11 | 英飞凌科技股份有限公司 | 半导体器件及其方法 |
CN102315114A (zh) * | 2010-07-08 | 2012-01-11 | 上海华虹Nec电子有限公司 | 防止选择性外延掩模层底部切口形貌的结构和方法 |
CN102427029A (zh) * | 2011-08-04 | 2012-04-25 | 上海华力微电子有限公司 | 一种用于栅极相关制程及其后续制程监控的测试器件结构的其制备工艺 |
CN103943500A (zh) * | 2013-01-22 | 2014-07-23 | 中芯国际集成电路制造(上海)有限公司 | 鳍式场效应晶体管的制作方法 |
CN104103571A (zh) * | 2013-04-15 | 2014-10-15 | 中芯国际集成电路制造(上海)有限公司 | 浅沟槽隔离结构的形成方法 |
CN108231778A (zh) * | 2016-12-09 | 2018-06-29 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
CN110719889A (zh) * | 2017-04-04 | 2020-01-21 | 凯奥尼克公司 | 用于制造微机电系统的方法 |
US11411009B2 (en) | 2018-04-12 | 2022-08-09 | United Microelectronics Corp. | Semiconductor device and method for fabricating the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101621029B (zh) * | 2008-07-03 | 2011-01-12 | 中芯国际集成电路制造(上海)有限公司 | 有选择的反窄宽度效应的dram单元结构及其生成方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW388100B (en) * | 1997-02-18 | 2000-04-21 | Hitachi Ulsi Eng Corp | Semiconductor deivce and process for producing the same |
CN100559564C (zh) * | 1999-03-03 | 2009-11-11 | 尔必达存储器株式会社 | 半导体集成电路器件及其制造方法 |
US6541382B1 (en) * | 2000-04-17 | 2003-04-01 | Taiwan Semiconductor Manufacturing Company | Lining and corner rounding method for shallow trench isolation |
US7439141B2 (en) * | 2001-12-27 | 2008-10-21 | Spansion, Llc | Shallow trench isolation approach for improved STI corner rounding |
US6677247B2 (en) * | 2002-01-07 | 2004-01-13 | Applied Materials Inc. | Method of increasing the etch selectivity of a contact sidewall to a preclean etchant |
-
2005
- 2005-09-29 CN CNB2005100303128A patent/CN100481375C/zh active Active
-
2006
- 2006-09-28 US US11/536,458 patent/US7682929B2/en active Active
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102054872A (zh) * | 2009-11-06 | 2011-05-11 | 英飞凌科技股份有限公司 | 半导体器件及其方法 |
CN102315114A (zh) * | 2010-07-08 | 2012-01-11 | 上海华虹Nec电子有限公司 | 防止选择性外延掩模层底部切口形貌的结构和方法 |
CN102427029A (zh) * | 2011-08-04 | 2012-04-25 | 上海华力微电子有限公司 | 一种用于栅极相关制程及其后续制程监控的测试器件结构的其制备工艺 |
CN103943500A (zh) * | 2013-01-22 | 2014-07-23 | 中芯国际集成电路制造(上海)有限公司 | 鳍式场效应晶体管的制作方法 |
CN103943500B (zh) * | 2013-01-22 | 2016-08-31 | 中芯国际集成电路制造(上海)有限公司 | 鳍式场效应晶体管的制作方法 |
CN104103571A (zh) * | 2013-04-15 | 2014-10-15 | 中芯国际集成电路制造(上海)有限公司 | 浅沟槽隔离结构的形成方法 |
CN104103571B (zh) * | 2013-04-15 | 2017-06-09 | 中芯国际集成电路制造(上海)有限公司 | 浅沟槽隔离结构的形成方法 |
CN108231778A (zh) * | 2016-12-09 | 2018-06-29 | 联华电子股份有限公司 | 半导体元件及其制作方法 |
CN110719889A (zh) * | 2017-04-04 | 2020-01-21 | 凯奥尼克公司 | 用于制造微机电系统的方法 |
CN110719889B (zh) * | 2017-04-04 | 2024-01-12 | 罗姆股份有限公司 | 用于制造微机电系统的方法 |
US11411009B2 (en) | 2018-04-12 | 2022-08-09 | United Microelectronics Corp. | Semiconductor device and method for fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
US20070087519A1 (en) | 2007-04-19 |
US7682929B2 (en) | 2010-03-23 |
CN100481375C (zh) | 2009-04-22 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111129 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111129 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |