CN1930927B - 构造电子组件的方法 - Google Patents

构造电子组件的方法 Download PDF

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CN1930927B
CN1930927B CN2005800070145A CN200580007014A CN1930927B CN 1930927 B CN1930927 B CN 1930927B CN 2005800070145 A CN2005800070145 A CN 2005800070145A CN 200580007014 A CN200580007014 A CN 200580007014A CN 1930927 B CN1930927 B CN 1930927B
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soldered ball
power
ground connection
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substrate
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T·皮尔逊
D·艾米尔
T·迪肖格
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Abstract

在电子封装的衬底和具有比宽度长的长度的电路板之间形成焊接。该焊接是通过将功率或接地连接焊球放置互相足够彼此接近，以使当回流到电路板时焊球合并，从而形成了较大的焊接来形成的。然而，信号焊球(36c)保持分离。特定的键合焊盘(34a，34b)上的功率或接地焊球(36a，36b)通过一部分可去除焊接掩模(100)互相分离，可去除焊接掩模(100)使焊球在焊球附连到电子封装(12)期间保持球形。然而，在回流到电路板前将它去除，因此在电子封装和电路板之间形成了较大、较长的焊接。

Description

构造电子组件的方法
发明背景 
1).发明领域 
本发明一般涉及电子组件，尤其涉及具有利用焊块固定到印刷电路板的封装衬底的类型的电子组件。 
2).相关技术的讨论 
通常在半导体晶片中和其上制造集成电路，随后将晶片切割为单独的半导体芯片。然后将芯片安装到封装衬底并电连接到其上。之后将封装衬底安装到印刷电路板。 
焊球通常位于封装衬底的表面，而封装衬底与印刷电路板相对。然后将该组合加热并使其冷却以使焊球形成焊块，焊块除将封装衬底电连接到印刷电路板之外，还将封装衬底在结构上固定到印刷电路板。 
可通过印刷电路板和集成电路之间的焊接经由电子封装来提供电子信号。其它焊接经由电子封装向集成电路提供功率和接地。可能发生高电流流过某些焊块，尤其是向集成电路提供功率和接地的那些焊块的情况。这些高电流需要大的导电路径以向集成电路传送所需功率。较大的焊接是满足这种需求的一种方法。然而，需要较小的封装以实现成本和设计目标及提供信号通信所需数量的焊接。本发明允许对功率和接地连接使用较大的焊接，而对信号通信允许较小间距的焊接。 
附图简述 
参考附图作为示例描述了本发明，附图中： 
图1是示出根据本发明的一个实施例的电子组件的元件的横截面侧视图； 
图1A到1C是示出使用可去除焊接掩模来放置电子组件的封装衬底子组件的焊球的横截面侧视图； 
图2是类似于图1将元件放在一起、加热及使其冷却后的视图； 
图3是示出电子组件的印刷电路板的焊块和通孔的布局的平面图； 
图4是示出电子组件的更多元件的侧视图；以及 
图5是根据本发明的另一实施例的印刷电路板的平面图。 
本发明的详细描述 
图1示出互相固定前的电子组件10的元件。电子组件10包括封装衬底子组件12和印刷电路板子组件14。 
印刷电路板子组件14包括印刷电路板16、通孔18、接触焊盘20和第一永久焊接掩模21。 
印刷电路板16包括数层，包括功率平面22、接地平面24和其它层26。功率平面22通过层26中的一层与接地平面24分离。层26中的另一层位于功率平面22之上，并且层26中的又一层位于接地平面24的下表面。因此，功率和接地平面22和24通过层26中的一层互相分离，并且通过层26中的其它层与印刷电路板16的上和下表面隔开。 
通孔18位于印刷电路板16中并且穿过平面22、24和层26从其上表面延伸到其下表面。通孔18包括功率通孔18A、接地通孔18B和信号通孔18C。功率通孔18A具有连接到功率平面22的下端。接地通孔18B具有连接到接地平面24的下端。信号通孔18C与功率和接地平面22和24分离。 
第一永久焊接掩模21形成于印刷电路板16上，并被形成图案以露出接触焊盘20。接触焊盘20包括功率接触焊盘20A、接地接触焊盘20B和信号接触焊盘20C。功率接触焊盘20A具有在从纸的底部到纸的顶部的方向上测量的高度、向纸内测量的宽度及从纸的左到右测量的长度。长度是宽度的倍数。功率接触焊盘20A位于所有的功率通孔18A上。功率通孔18A中的每一个在相应的位置处沿功率接触焊盘20A的长度附连和连接到功率接触焊盘20A。由此，功率通孔18A将功率焊盘20A与功率平面22平行连接。在另一实施例中，在通常称为“八字试块(dogbone)”构造的排列中，通孔可位于接触焊盘外部。 
类似地，接地接触焊盘20B具有高度、宽度和长度，其中长度是宽度的倍数。接地接触焊盘20B位于所有的接地通孔18B上，以使每个接地通孔18B具有在相应的位置处沿其长度连接到接地接触焊盘20B的相应的上端。 
每个信号接触焊盘20C位于并连接到信号通孔16C中相应的一个上。每个信号接触焊盘20C与所有其它接触焊盘20分离。 
封装衬底子组件12包括封装衬底30、通孔32、键合焊盘34、焊球36及第二永久焊接掩模37。 
封装衬底30也是具有接地平面和功率平面的多层衬底。通孔32包括功率通孔32A、接地通孔32B和信号通孔32C。功率通孔32A中的每一个具有连接到封装衬底30中的接地平面的上端，而接地通孔32B中的每一个具有连接到封装衬底30中的接地平面的上端。 
第二永久焊接掩模37形成于封装衬底30上，并且被形成图案以露出键合焊盘34。键合焊盘34包括功率键合焊盘34A、接地键合焊盘34B和信号键合焊盘34C，它们全部位于封装衬底30的下表面。每一功率键合焊盘34A位于功率通孔32A中相应的几个的下端，每一接地键合焊盘34B位于接地通孔32B中相应的几个的下端，而每一信号键合焊盘34C位于相应的信号通孔32C的相应的下端。 
焊球36包括功率焊球36A、接地焊球36B和信号焊球36C。多个功率焊球36A位于功率键合焊盘34A中相应的一个的相应的下表面，多个接地焊球36B位于相应的接地键合焊盘34B的相应的下表面，而每一信号焊球36C位于相应的信号键合焊盘34C的相应的下表面。 
图1A到1C示出如何将焊球36附连到键合焊盘34。 
首先参考图1A，形成可去除焊接掩模100，并对其形成图案以使其位于功率和接地键合焊盘34A和34B的选择区域上。可去除焊接掩模100具有其中所形成的多个开口102。在功率键合焊盘34A上形成多个孤立焊区，在接地键合焊盘34B上形成多个孤立焊区。设置夹具104以夹持焊球36。焊球36中的每一个都位于夹具104中相应的夹持结构106中。然后，夹具104和封装衬底30彼此相向移动，以得焊球36中的每一个被插入到开口102中相应的几个中。 
图1B所示的是翻转后封装衬底子组件与焊球36及夹具104的结合。如图1C所示，接着移除夹具104，焊球由于键合焊盘34上的助焊剂提供的粘性而保留在键合焊盘34上。然后将焊球36加热并使其冷却。当被加热时，焊球34A熔化，而当使它们冷却时再一次凝固，使得它们附连到键合焊盘34。由于单独的孤立焊区形成于例如功率键合焊盘34A上，所以焊球36不会互相回流，从而使焊球36 保持球形。通过将功率焊球36A保持互相分离，焊球能保持其球形及与其它焊球的共面。这提高了将电子封装附连到印刷电路板的处理过程中印刷电路板组件的成品率。相信提高了印刷电路组件的成品率，因为所有的焊球36A、36B和36C互相共面，并且当随后附连到印刷电路板端子时以相同的方式回流。 
例如，通过水或化学清洗工艺将焊接掩模100从电子封装的表面去除，将可去除焊接掩模100从封装衬底30和键合焊盘34去除。一旦去除了可去除焊接掩模100，例如功率焊球36A之间的功率键合焊盘34A部分再一次露出。第二永久焊接掩模保留在封装衬底30上，且不会同可去除焊接掩模100一起被去除。 
将每一功率通孔32A与一个功率键合焊盘34A、一个功率焊球36A和一个功率通孔18A对齐。功率焊球36A的中心点互相间隔约1mm。右边的功率焊球36A的中心点与左边的接地焊球36B的中心点间隔约1.2mm。接地焊球36B的中心点互相间隔约1mm。右边的接地焊球36B的中心点与左边的信号焊球36C的中心点间隔约1.2mm。信号焊球36C的中心点互相间隔约1.2mm。所有的焊球36A、36B和36C有相等的质量和尺寸。因此，由功率焊球36A的联合质量除以功率通孔18A的数量等于接地焊球36B的联合质量除以接地通孔18B的数量，并等于信号焊球36C的联合质量除以信号通孔18C的数量。 
如图2所示，将组件再一次翻转。将封装衬底子组件12降低至印刷电路板子组件14，以使焊球36的下表面接触接触焊盘18A的上表面。所有的功率焊球36A接触功率接触焊盘20A，所有的接地焊球36B接触接地接触焊盘20B，且每个信号焊球36C接触信号接触焊盘20C中相应的一个。 
然后，将封装衬底组件12和印刷电路板子组件14的组合置于回流炉中。将焊球36加热到超过其熔点使它们熔化。当功率焊球36A熔化时，由于它们相对较近的间距和润湿作用而使它们合并，并且当接地焊球36B熔化时，由于它们相对较近的间距和润湿作用而使它们合并。然而，功率焊球36A不与接地焊球36B合并。信号焊球36C还保持互相之间、与接地焊球36B及与功率焊球36A分离。 
然后，将封装衬底组件12和印刷电路板子组件14的组合从回流炉中移出并使其冷却以使熔化的焊球材料再一次凝固。功率焊球36A的凝固材料在图2中被表示为功率焊块40B，接地焊球36B的合并被表示为接地焊块40B，而熔化且回流的信号焊球36C由信号焊块40C来表示。 
功率焊块40A中的每一个都有高度、宽度和长度，且功率焊块40A的宽度和长度对应于功率接触焊盘20A的宽度和长度。类似地，接地焊块40B有高度、宽度和长度，该宽度和长度对应于接地接触焊盘20B的宽度和长度。由此，功率焊块40B具有为宽度倍数的长度，并且接地焊块40B具有为其宽度倍数的长度。 
将功率通孔18A的上端沿其长度通过功率接触焊盘20A连接到功率焊块40A的相应的点上，并且将接地通孔18B的上端在相应的位置处沿其长度连接到接地接触焊盘20B并到接地焊块40B上。因此，将功率焊块40A通过功率通孔18A与功率平面22平行连接，并且将接地焊块40B通过接地通孔18B与接地平面24平行连接。 
合并功率焊球36A及合并接地焊球36B的优点在于它们能位于互相靠近的位置。对其它焊球36C也释放了更多空间。将功率焊球合并在一起的另一个优点在于提高了焊接接缝的电流传递特性。更多的焊料允许以更小的电阻传导更大的电流。 
图3是功率和接地焊块40A和40B的相对定位的更精确的表示。功率和接地焊块40A和40B由矩形表示。信号焊块40C由较大的圆表示。功率、接地和信号通孔18A、18B和18C由较小的圆表示。 
可以看到，功率和接地焊块40A和40B位于互相平行的直线中，它们彼此直接相邻，且相应的接地焊块40B位于两个功率焊块40A之间。因此，一个功率焊块40A的表面面向一个接地焊块40B的相应表面以形成多个电容器。在所示的例子中，有三个功率焊块40A和三个接地焊块40D，从而形成了五个电容器。电容器有助于减小功率或接地信号的电阻和电感时延。所有的功率和接地通孔18A和18B位于没有信号通孔18C的矩形区域上，而所有的信号通孔都位于所有的功率和接地通孔18A和18B所在的矩形区域周围。 
图4示出了电子组件的更多元件。除封装衬底30和印刷电路板16外，电子组件10还包括半导体芯片50。半导体芯片50中含有电子元件的集成电路。半导体芯片50安装在封装衬底30上并电连接到其上。可通过焊块40和封装衬底30提供去往和来自半导体管芯50和印刷电路板16中的集成电路的电子信号。 
图5示出用功率和接地焊块形成电容器的另一种方式。使用了图3的实施例中的相似的参考标号。功率焊块140有多个分支(limb)140A-E。分支140A-D全 部从分支140E开始。提供具有分支150A-E的接地凸块150。分支150A-D从分支150E开始。分支150A-D位于分支140A-D之间，以使分支140与分支150A-D交替。已经发现通过将分支如图5所示地互相“铺开”，能在给定的表面积上形成较大的电容器。 
虽然在附图中描述和示出了某些示例性实施例，但应该理解，这些实施例仅仅是说明性的，而非对本发明的限制，并且，本发明不限于所示和所述的具体结构和安排，因为本领域普通的技术人员可想到各种修改。 

Claims (15)

1. 一种构造电子组件的方法，包括：
在第一衬底的多个导电接触焊盘的至少第一个上部分地形成可去除焊接掩模，所述可去除焊接掩模使所述第一导电接触焊盘的多个焊区曝露；
将多个焊球附连到所述导电接触焊盘上，所述焊球的子集附连到所述相应的焊区；
去除所述可去除焊接掩模；
将所述焊球面向第二衬底的键合焊盘放置；以及
通过加热和随后使所述焊球冷却来回流面向所述键合焊盘的焊球，所述子集的焊球在加热以形成连续的接触及冷却后一起回流。
2. 如权利要求1所述的方法，其特征在于，还包括：
在所述第一衬底上形成限定所述导电接触焊盘的永久焊接掩模，当去除所述可去除焊接掩模时，所述永久焊接掩模保留在衬底上。
3. 如权利要求2所述的方法，其特征在于，所述可去除焊接掩模在将所述焊球面向所述键合焊盘放置之前去除。
4. 一种构造电子组件的方法，包括：
在第一衬底的导电功率接触焊盘上部分地形成可去除焊接掩模，所述焊接掩模使所述导电功率接触焊盘的多个焊区曝露；
将多个功率焊球附连到所述导电功率接触焊盘上，并将多个信号焊球附连到所述第一衬底的导电信号接触焊盘上，所述功率焊球彼此间隔第一距离，而所述信号焊球彼此间隔大于所述第一距离的第二距离；
去除所述可去除焊接掩模；
将所述焊球面向第二衬底的端子放置；
加热所述焊球以使其熔化，所述功率焊球彼此合并，而所述信号焊球保持彼此分离；以及
使所述焊球冷却以使其凝固。
5. 如权利要求4所述的方法，其特征在于，一个功率焊球具有与一个信号焊球相同的质量。
6. 如权利要求4所述的方法，其特征在于，所述焊球包括彼此间隔小于所述第二距离的距离的多个接地焊球，所述接地焊球互相合并。
7. 如权利要求6所述的方法，其特征在于，所述功率和接地焊球形成位置直接相邻的功率和接地焊块，并且具有基本互相平行延伸的长度以具有互相面对的表面来形成电容器。
8. 如权利要求7所述的方法，其特征在于，包括多个互相交替的功率凸块和接地凸块以形成多个电容器。
9. 如权利要求4所述的方法，其特征在于，回流前所述功率焊球比所述信号焊球密集。
10. 如权利要求9所述的方法，其特征在于，一个功率焊球的质量与一个信号焊球的质量基本相等。
11. 一种构造电子组件的方法，包括：
部分地在第一衬底的导电功率接触焊盘上、部分地在导电接地接触焊盘上形成可去除焊接掩模，所述焊接掩模使所述导电功率接触焊盘的多个焊区曝露，且使所述导电接地接触的多个焊区曝露；
将多个功率焊球附连到所述导电功率接触焊盘、将多个接地焊球附连到所述导电接地接触焊盘、以及将多个信号焊球附连到所述第一衬底的导电信号接触焊盘，所述功率焊球和接地焊球互相间隔第一距离，而所述信号焊球互相间隔大于所述第一距离的第二距离；
去除所述可去除焊接掩模；
面向第二衬底的端子放置所述焊球；
加热所述焊球以使其熔化，所述功率焊球互相合并且所述接地焊球互相合并，而所述信号焊球保持互相分离；以及
使所述焊球冷却以使其凝固。
12. 如权利要求11所述的方法，其特征在于，在面向所述第二衬底的端子放置所述焊球之前，去除所述可去除焊接掩模。
13. 如权利要求11所述的方法，其特征在于，一个功率焊球具有与一个信号焊球相同的质量。
14. 如权利要求11所述的方法，其特征在于，所述功率和接地焊球形成位置直接彼此相邻的功率和接地焊块，并且具有基本互相平行延伸的长度以具有互相面对的表面来形成电容器。
15. 如权利要求14所述的方法，其特征在于，包括多个互相交替的功率凸块和接地凸块以形成多个电容器。
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