CN1930659A - 改进的无线类基片传感器 - Google Patents

改进的无线类基片传感器 Download PDF

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Publication number
CN1930659A
CN1930659A CNA2005800073529A CN200580007352A CN1930659A CN 1930659 A CN1930659 A CN 1930659A CN A2005800073529 A CNA2005800073529 A CN A2005800073529A CN 200580007352 A CN200580007352 A CN 200580007352A CN 1930659 A CN1930659 A CN 1930659A
Authority
CN
China
Prior art keywords
sensor
substrate
transducer
framework
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005800073529A
Other languages
English (en)
Chinese (zh)
Inventor
克雷格·C·拉姆齐
德尔克·H·加德纳
杰弗里·K·拉萨恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cyberoptics Corp
Original Assignee
Cyberoptics Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyberoptics Semiconductor Inc filed Critical Cyberoptics Semiconductor Inc
Publication of CN1930659A publication Critical patent/CN1930659A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Studio Devices (AREA)
  • Measuring Fluid Pressure (AREA)
CNA2005800073529A 2004-03-09 2005-03-09 改进的无线类基片传感器 Pending CN1930659A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US55146004P 2004-03-09 2004-03-09
US60/551,460 2004-03-09

Publications (1)

Publication Number Publication Date
CN1930659A true CN1930659A (zh) 2007-03-14

Family

ID=34961471

Family Applications (3)

Application Number Title Priority Date Filing Date
CNA2005800073529A Pending CN1930659A (zh) 2004-03-09 2005-03-09 改进的无线类基片传感器
CNA2005800073548A Pending CN1930660A (zh) 2004-03-09 2005-03-09 改进的无线类基片传感器
CNB2005800073497A Active CN100546000C (zh) 2004-03-09 2005-03-09 无线类基片传感器

Family Applications After (2)

Application Number Title Priority Date Filing Date
CNA2005800073548A Pending CN1930660A (zh) 2004-03-09 2005-03-09 改进的无线类基片传感器
CNB2005800073497A Active CN100546000C (zh) 2004-03-09 2005-03-09 无线类基片传感器

Country Status (4)

Country Link
JP (3) JP2007528615A (ja)
KR (3) KR20070009601A (ja)
CN (3) CN1930659A (ja)
WO (3) WO2005088682A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101996857A (zh) * 2009-08-07 2011-03-30 台湾积体电路制造股份有限公司 制造半导体装置的系统及方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102021007B1 (ko) * 2017-11-06 2019-09-11 크린팩토메이션 주식회사 웨이퍼 내장 용기용 퍼지 선반에서의 퍼지 가스 누설 검사 디바이스
CN108601216A (zh) * 2018-04-28 2018-09-28 济南浪潮高新科技投资发展有限公司 一种pcb及pcb制作方法
US12074044B2 (en) * 2018-11-14 2024-08-27 Cyberoptics Corporation Wafer-like sensor
CN111323076A (zh) * 2018-12-13 2020-06-23 夏泰鑫半导体(青岛)有限公司 检测装置及工艺腔室检测方法
CN110767577A (zh) * 2019-10-24 2020-02-07 苏师大半导体材料与设备研究院(邳州)有限公司 一种半导体材料附接方法
US11353381B1 (en) * 2020-06-09 2022-06-07 Applied Materials, Inc. Portable disc to measure chemical gas contaminants within semiconductor equipment and clean room
KR102635383B1 (ko) * 2020-09-21 2024-02-14 세메스 주식회사 기판 처리 장치
KR102532567B1 (ko) * 2020-12-31 2023-05-16 세메스 주식회사 기판형 센서, 및 약액의 탄착점 및 타력 측정 방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0738122A (ja) * 1993-07-20 1995-02-07 Fujikura Ltd センサ用パッケージ
JPH0763585A (ja) * 1993-08-26 1995-03-10 Hokuriku Electric Ind Co Ltd 環境センサ
US5444637A (en) * 1993-09-28 1995-08-22 Advanced Micro Devices, Inc. Programmable semiconductor wafer for sensing, recording and retrieving fabrication process conditions to which the wafer is exposed
JPH09184851A (ja) * 1995-12-28 1997-07-15 Fujikura Ltd 半導体加速度センサ
US5798556A (en) * 1996-03-25 1998-08-25 Motorola, Inc. Sensor and method of fabrication
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
JP3968862B2 (ja) * 1998-03-09 2007-08-29 株式会社ニコン 照度計、照度計測方法及び露光装置
US6325536B1 (en) * 1998-07-10 2001-12-04 Sensarray Corporation Integrated wafer temperature sensors
JP2000171427A (ja) * 1998-09-29 2000-06-23 Omron Corp 試料成分分析システム並びにこのシステムに使用されるセンサチップ及びセンサパック
NL1017593C2 (nl) * 2001-03-14 2002-09-17 Asm Int Inspectiesysteem ten behoeve van procesapparaten voor het behandelen van substraten, alsmede een sensor bestemd voor een dergelijk inspectiesysteem en een werkwijze voor het inspecteren van procesapparaten.
JP2002299592A (ja) * 2001-03-29 2002-10-11 Sony Corp 半導体装置
US7289230B2 (en) * 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
TW200507284A (en) * 2003-08-05 2005-02-16 Elecvision Inc Image sensor module and its manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101996857A (zh) * 2009-08-07 2011-03-30 台湾积体电路制造股份有限公司 制造半导体装置的系统及方法
CN101996857B (zh) * 2009-08-07 2013-05-29 台湾积体电路制造股份有限公司 制造半导体装置的系统及方法

Also Published As

Publication number Publication date
JP2007528558A (ja) 2007-10-11
WO2005088681A1 (en) 2005-09-22
CN1930660A (zh) 2007-03-14
CN100546000C (zh) 2009-09-30
CN1930658A (zh) 2007-03-14
KR20060123646A (ko) 2006-12-01
JP2007528611A (ja) 2007-10-11
KR20070009600A (ko) 2007-01-18
JP2007528615A (ja) 2007-10-11
KR20070009601A (ko) 2007-01-18
WO2005088683A3 (en) 2005-11-17
WO2005088682A1 (en) 2005-09-22
WO2005088683A2 (en) 2005-09-22

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Effective date of abandoning: 20070314

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