KR20070009601A - 무선 기판형 센서 - Google Patents
무선 기판형 센서 Download PDFInfo
- Publication number
- KR20070009601A KR20070009601A KR1020067020138A KR20067020138A KR20070009601A KR 20070009601 A KR20070009601 A KR 20070009601A KR 1020067020138 A KR1020067020138 A KR 1020067020138A KR 20067020138 A KR20067020138 A KR 20067020138A KR 20070009601 A KR20070009601 A KR 20070009601A
- Authority
- KR
- South Korea
- Prior art keywords
- sensor
- substrate
- housing
- wireless
- pressure
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Studio Devices (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55146004P | 2004-03-09 | 2004-03-09 | |
US60/551,460 | 2004-03-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20070009601A true KR20070009601A (ko) | 2007-01-18 |
Family
ID=34961471
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067020118A KR20070009600A (ko) | 2004-03-09 | 2005-03-09 | 개선된 무선 기판형 센서 |
KR1020067020138A KR20070009601A (ko) | 2004-03-09 | 2005-03-09 | 무선 기판형 센서 |
KR1020067019421A KR20060123646A (ko) | 2004-03-09 | 2005-03-09 | 무선 기판형 센서 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067020118A KR20070009600A (ko) | 2004-03-09 | 2005-03-09 | 개선된 무선 기판형 센서 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067019421A KR20060123646A (ko) | 2004-03-09 | 2005-03-09 | 무선 기판형 센서 |
Country Status (4)
Country | Link |
---|---|
JP (3) | JP2007528558A (ja) |
KR (3) | KR20070009600A (ja) |
CN (3) | CN1930660A (ja) |
WO (3) | WO2005088683A2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8712571B2 (en) * | 2009-08-07 | 2014-04-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for wireless transmission of diagnostic information |
KR102021007B1 (ko) * | 2017-11-06 | 2019-09-11 | 크린팩토메이션 주식회사 | 웨이퍼 내장 용기용 퍼지 선반에서의 퍼지 가스 누설 검사 디바이스 |
CN108601216A (zh) * | 2018-04-28 | 2018-09-28 | 济南浪潮高新科技投资发展有限公司 | 一种pcb及pcb制作方法 |
US20200152494A1 (en) * | 2018-11-14 | 2020-05-14 | Cyberoptics Corporation | Wafer-like sensor |
CN111323076A (zh) * | 2018-12-13 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | 检测装置及工艺腔室检测方法 |
CN110767577A (zh) * | 2019-10-24 | 2020-02-07 | 苏师大半导体材料与设备研究院(邳州)有限公司 | 一种半导体材料附接方法 |
US11353381B1 (en) | 2020-06-09 | 2022-06-07 | Applied Materials, Inc. | Portable disc to measure chemical gas contaminants within semiconductor equipment and clean room |
KR102635383B1 (ko) * | 2020-09-21 | 2024-02-14 | 세메스 주식회사 | 기판 처리 장치 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0738122A (ja) * | 1993-07-20 | 1995-02-07 | Fujikura Ltd | センサ用パッケージ |
JPH0763585A (ja) * | 1993-08-26 | 1995-03-10 | Hokuriku Electric Ind Co Ltd | 環境センサ |
US5444637A (en) * | 1993-09-28 | 1995-08-22 | Advanced Micro Devices, Inc. | Programmable semiconductor wafer for sensing, recording and retrieving fabrication process conditions to which the wafer is exposed |
JPH09184851A (ja) * | 1995-12-28 | 1997-07-15 | Fujikura Ltd | 半導体加速度センサ |
US5798556A (en) * | 1996-03-25 | 1998-08-25 | Motorola, Inc. | Sensor and method of fabrication |
US6244121B1 (en) * | 1998-03-06 | 2001-06-12 | Applied Materials, Inc. | Sensor device for non-intrusive diagnosis of a semiconductor processing system |
JP3968862B2 (ja) * | 1998-03-09 | 2007-08-29 | 株式会社ニコン | 照度計、照度計測方法及び露光装置 |
US6325536B1 (en) * | 1998-07-10 | 2001-12-04 | Sensarray Corporation | Integrated wafer temperature sensors |
JP2000171427A (ja) * | 1998-09-29 | 2000-06-23 | Omron Corp | 試料成分分析システム並びにこのシステムに使用されるセンサチップ及びセンサパック |
NL1017593C2 (nl) * | 2001-03-14 | 2002-09-17 | Asm Int | Inspectiesysteem ten behoeve van procesapparaten voor het behandelen van substraten, alsmede een sensor bestemd voor een dergelijk inspectiesysteem en een werkwijze voor het inspecteren van procesapparaten. |
JP2002299592A (ja) * | 2001-03-29 | 2002-10-11 | Sony Corp | 半導体装置 |
US7289230B2 (en) * | 2002-02-06 | 2007-10-30 | Cyberoptics Semiconductors, Inc. | Wireless substrate-like sensor |
TW200507284A (en) * | 2003-08-05 | 2005-02-16 | Elecvision Inc | Image sensor module and its manufacturing method |
-
2005
- 2005-03-09 CN CNA2005800073548A patent/CN1930660A/zh active Pending
- 2005-03-09 CN CNA2005800073529A patent/CN1930659A/zh active Pending
- 2005-03-09 JP JP2007502904A patent/JP2007528558A/ja active Pending
- 2005-03-09 WO PCT/US2005/007656 patent/WO2005088683A2/en active Application Filing
- 2005-03-09 JP JP2007502906A patent/JP2007528611A/ja not_active Withdrawn
- 2005-03-09 KR KR1020067020118A patent/KR20070009600A/ko not_active Application Discontinuation
- 2005-03-09 WO PCT/US2005/007423 patent/WO2005088682A1/en active Application Filing
- 2005-03-09 KR KR1020067020138A patent/KR20070009601A/ko not_active Application Discontinuation
- 2005-03-09 CN CNB2005800073497A patent/CN100546000C/zh active Active
- 2005-03-09 JP JP2007502939A patent/JP2007528615A/ja active Pending
- 2005-03-09 WO PCT/US2005/007418 patent/WO2005088681A1/en active Application Filing
- 2005-03-09 KR KR1020067019421A patent/KR20060123646A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR20060123646A (ko) | 2006-12-01 |
JP2007528558A (ja) | 2007-10-11 |
CN1930659A (zh) | 2007-03-14 |
KR20070009600A (ko) | 2007-01-18 |
WO2005088682A1 (en) | 2005-09-22 |
CN100546000C (zh) | 2009-09-30 |
JP2007528615A (ja) | 2007-10-11 |
WO2005088683A2 (en) | 2005-09-22 |
CN1930660A (zh) | 2007-03-14 |
WO2005088681A1 (en) | 2005-09-22 |
WO2005088683A3 (en) | 2005-11-17 |
JP2007528611A (ja) | 2007-10-11 |
CN1930658A (zh) | 2007-03-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |