CN1930659A - Wireless substrate-like sensor - Google Patents
Wireless substrate-like sensor Download PDFInfo
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- CN1930659A CN1930659A CNA2005800073529A CN200580007352A CN1930659A CN 1930659 A CN1930659 A CN 1930659A CN A2005800073529 A CNA2005800073529 A CN A2005800073529A CN 200580007352 A CN200580007352 A CN 200580007352A CN 1930659 A CN1930659 A CN 1930659A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
Abstract
In accordance with an aspect of the present invention, a wireless substrate-like sensor (112, 118) is configured to ensure it does not contaminate a semiconductor processing chamber. The sensor (112, 118) is sealed except for one or more apertures (272, 282). In one embodiment, a vent is disposed proximate the apertures. In another embodiment, the aperture is coupled to a pressure equalization member (284) that deforms in response to a differential in pressure between the sensor interior and exterior.
Description
Background technology
Semiconductor processing system is characterised in that extremely clean environment and extremely accurate semiconductor wafer move.The industrial robot system that extensively depends on high precision is come with essential precision, moves substrate such as semiconductor wafer with respect to various treatment benches in semiconductor processing system.
Precision positioning, the aligning and/or parallel of element depended in the reliable and effective operation of this robot system.Wafer orientation minimizes the chance of the wall of the accidental wafer processing process that nuzzles up of wafer accurately.May be required in the accurate wafer orientation on the processing base of process chamber, so that optimize the output of this technology.Between the surface in the semiconductor processing system exactly parallel for guarantee be sent to from robot end's effector that minimum substrate during crystal chip bearing frame, prealignment vacuum cup, loading and unloading transmit pin and/or base with lock chamber (load lock) crane, process chamber slides or mobile be important.When wafer slides on supporter, perhaps can wipe particulate off, cause production loss.Mistake is put or the misalignment assembly, even the fraction of millimeter magnitude also can influence the cooperation of each assembly in the semiconductor processing system, product yield and/or quality is reduced.
In initial manufacturing, this precise positioning must be realized, and this precise positioning must be kept between the operating period in system.Because normal wear perhaps as the process result who safeguards, repairs, changes or replace, can change the assembly location.Therefore, automatically measure and each assembly of compensation semiconductor's treatment system in small relatively change in location be very important.
Past, once attempted providing for example substrate-like sensor of the substrate form of wafer, this transducer can move through semiconductor processing system, so that wirelessly transmit information, substrate slope and the acceleration in the semiconductor system for example.As used herein, " class substrate (substrate-like) " is intended to represent the transducer of substrate form, such as semiconductor wafer, liquid crystal display glass plate or scale plate.Once attempt providing wireless substrate-like sensor, comprised the detector of addition type, and made substrate-like sensor can measure the interior a large amount of internal states of processing environment of semiconductor processing system.Wireless substrate-like sensor can reduce under the situation of destroying internal environment and minimizing interference substrate treatment mechanism and manufacturing process (for example baking, etching, physical vapour deposition (PVD), chemical vapour deposition (CVD), coating, flushing, drying etc.), and each point in entire process equipment is measured.For example, wireless substrate-like sensor does not need to discharge or the vacuum chamber of finding time; Can not cause the pollution more serious to super clean environment than the pollution that is stood during the actual treatment yet.The wireless substrate-like sensor formative factor can be measured treatment situation with the observation uncertainty of minimum.
Owing to transmit wireless substrate-like sensor in the practical semiconductor processing environment, these transducers can the negative effect environment itself not be important.Therefore, this transducer should not allow also not allow gas leakage from shed particles wherein.In addition, can move to each position in the semiconductor processing environment that normal substrate can move in order to ensure this transducer, the size of transducer should be the same with the maximum substrate size at least little, preferably littler than this.At last, in order to ensure the accuracy of measurement of transducer, the weight of transducer can not cause any significant bending (deflection) of treatment facility or the skew of other form.Therefore, this transducer is should relative weight lighter.
Therefore, current existence is to the demand of the wireless substrate-like sensor of cleaning, lightweight and narrow boards design (low profile).
Summary of the invention
According to an aspect of the present invention, dispose a kind of wireless substrate-like sensor and can not pollute semiconductor process chamber to guarantee it.Except one or more openings, seal sensor.In one embodiment, near opening, place ventilating opening.In another embodiment, opening is with the isostasy member of deformation links to each other in response to the pressure differential between sensor internal and the outside.
Description of drawings
Fig. 1 is the diagram of semiconductor wafer processing environment.
Fig. 2 is the top perspective according to the wireless substrate-like sensor of the embodiment of the invention.
Fig. 3 is the upward view according to the wireless substrate-like sensor of the embodiment of the invention.
Fig. 4 is the diagram according to the middle body 120 of the embodiment of the invention.
Fig. 5 is the diagram that is positioned at the image-taking system on the printed circuit board (PCB).
Fig. 6 is according to the embodiment of the invention, is installed in the diagram of the image-taking system in the printed circuit board (PCB).
Fig. 7 shows the perspective view that the CLCC plug-in unit is installed according to the embodiment of the invention, in the groove of printed circuit board (PCB).
Fig. 8 is according to the embodiment of the invention, is installed to the diagram that printed circuit board (PCB) Images is obtained system.
Fig. 9 is according to the embodiment of the invention, has the perspective view of the wireless substrate-like sensor of ventilating opening.
But Figure 10 is according to the embodiment of the invention, has the sectional view of the wireless substrate-like sensor of deformation pressure equalization member.
Embodiment
Fig. 1 is the diagram of semiconductor wafer processing environment, and described environment comprises that chip container 100, robot 102 and schematic representations are the system component station 104 of box-like.Chip container 100 is shown as and comprises three wafers 106,108 and 110 and according to the wireless substrate-like sensor 112 of the embodiment of the invention.As can be seen from Fig. 1, preferably, according to making its formal cause that can in the semiconductor wafer processing environment, move in the mode identical specific implementation transducer 112 usually with wafer itself.Therefore, the embodiment of the invention provides a kind substrate wireless senser, has enough low height so that substrate-like sensor can move through system, just as it is the substrate of wafer for example.For example, think that less than the about height of 9.0mm be acceptable.Preferably, transducer has the weight of 1 to 2 wafer, for example, thinks that the weight between about 125 grams and about 250 grams is acceptable.Think that the spacing distance of about 25mm satisfies most requirements of using; Yet some are used and perhaps require different spacings.As used herein, " spacing " is to the nominal range of target from the bottom of transducer.The diameter of transducer preferably is complementary with one of standard semiconductor wafers diameter, for example 300mm, 200mm or 150mm.
Preferably, transducer 112 is made of material in light weight, dimensionally stable.Preferably, transducer 112 is made of the base material with high rigidity, for example aluminium alloy, aluminium, magnesium and/or pottery.Sensor frame itself can be coated with any suitable coating, comprises aluminium oxide, nickel or pottery, so that improve machinery or chemical attribute.
For substrate-like sensor is measured 3-D migration exactly, for transducer, importantly according to carrying out deformation with the similar mode of actual substrate.Can in following standard, find the size and the characteristic of common wafer: SEMI M-0302, " Specification for PolishedMonocrystaline Silicon Wafers ", Semiconductor Equipment and MaterialsInternational, www.semi.org.About 0.5mm will sink under the gravity of central authorities at himself of the 300mm silicon wafer that edge supports.Difference between the deformation of transducer and the deformation of actual wafer should be much smaller than the accuracy of sensor measurement.In a preferred embodiment, the hardness of substrate-like sensor causes almost identical with actual silicon wafer bending.Therefore, do not need compensation to proofread and correct any crooked difference.Alternatively, compensating factor can be added in the measurement.Similarly, the weight of substrate-like sensor also makes its supporter bending.Substrate-holder is including, but not limited to end-effector, base, transmission pin, support etc.Different supporter bendings is the function of the weight of transducer and substrate, also is the function of the mechanical hardness of substrate-holder.Should perhaps should come compensated bend difference much smaller than the accuracy of sensor measurement equally by transducer with by the difference between the caused supporter bending of substrate by suitable calculating.
In the prior art, the technical staff is by watching after removing the lid of process chamber or by the transparency window in the lid, adjusts aiming at of vacuum conveyor device robot end effector and process chamber base repeatedly.Sometimes, must be at first handling work piece holder or the anchor clamps that placement quite is fit on the base, so that suitable reference mark to be provided.Substrate-like sensor provides a kind of improved, alignment methods that the technical staff assists.Substrate-like sensor provides the image of the object that will aim at, and does not need to remove lid, and is more clear than watching by window.Wireless substrate-like sensor has been saved the plenty of time, and has improved the repeatability of aiming at.
Wireless substrate-like sensor can be simulated photographed images by wireless transmission.
Preferred embodiment uses the machine vision subsystem of class substrate wireless senser to come to send all or part of digital picture that is stored in the memory to external system, is used for showing or analyzing.Display can be positioned near the receiver, perhaps can come the relayed images data to be used for long-range demonstration by data network.In a preferred embodiment, send photographed images, so that communication channel caused by noise image quality decrease minimizes according to the numerical data stream encryption.Can use any one well known data method for simplifying to come compressed digital video, so that the desired data rate is minimized.By only sending the image section that changes with previous image, also can reduce data transfer rate significantly.Substrate-like sensor or display can scribble electronics cross hair (cross hair) or other suitable sign is estimated alignment quality to help the technical staff.
Although the vision ancillary technique is more more convenient than manual methods, the technical staff judges the repeatability and the reproducibility that still can influence aligning.The image that can use the multiple known method that comprises the normalization two-dimensional correlation to come analysis classes substrate wireless senser video camera to be obtained is to measure departing from of pattern and its desired location.Pattern can be the arbitrary portion of the image discerned of training vision system.Pattern can be by system log (SYSLOG).Can describe pattern to system in mathematics ground.The pattern that mathematics ground is described can be fixed during fabrication, perhaps programmes in the time will using.Traditional normalization two-dimensional correlation is for the change sensitivity of pattern diagram picture size.When using simple lens combination, magnification ratio and object distance change pro rata.By zoomed image or reference substance repeatedly, the pattern that can obtain to strengthen departs from measurement performance.Suppose the size or the known magnification ratio of known pattern,, then cause best relevant ratio to represent magnification ratio as when writing down reference pattern.
Between the size of pixel in pixel and the object plane in the known image plane at once, depart from the scaled measurement unit report of the easier explanation of absolute unit of ratio such as pixel for technical staff or mechanical control device.For example, can provide according to millimeter and depart from, make the amount that the operator can be reported system's adjustment simply.Can be manually, by outer computer or preferably in transducer itself, carry out the required calculating that departs from of acquisition standard unit.When transducer extracts required information from image, sent the information of minimum, and brought minimum computation burden for technical staff or peripheral control unit.In this manner, can use objective standard to improve the repeatability and the reproducibility of aligning.Automatically depart from measurement by removing because the variation that technical staff's judgement causes has improved the reproducibility of aiming at.
Between the aligning and alignment epoch of semiconductor processing system, it is important not only correctly placing end-effector (end effector) with respect to second supporting construction, guarantee two substrate support structure parallel to each other also be important.In a preferred embodiment, use the machine vision subsystem of wireless substrate-like sensor to measure two three-dimensional relationship between the substrate-holder.For example, robot end's effector can make wireless substrate-like sensor remain close to delivering position, and by sensor camera the three-dimensional that is positioned at pattern on the relative substrate-holder and carries out six degree of freedom is departed from measurement.One group of six degree of freedom comprises the displacement of x, y and the z axle of azimuth, the angle of pitch, inclination angle and Cartesian coordinate system.Yet, those skilled in the art will recognize that and under the situation that does not depart from spirit and scope of the invention, can use other coordinate system.Measuring parallel and flute card simultaneously departs from and makes technical staff or controller can determine gratifying aligning objectively.When using controller, the aligning that can fully automatically not need the technical staff to interfere.Can incorporate in the predetermined preventative routine maintenance, aiming at automatically with optimization system performance and availability.
Generally speaking, select transducer 112 and it is delivered to reference target 114, carry out the operation of robot system 102 and calibration automatically by order robot 102.In case give an order, robot 102 suitably orders about each and connects to come end-effector 116 under the slide sensor 112, thereby shifts out transducer 112 from container 100.In case shifted out, robot 102 is movable sensor 112 on reference target 114 directly, so that the optical imagery in the transducer 112 obtains the image that system's (not shown in Figure 1) obtains reference target 114.According to the priori of target image, the three-dimensional between measuring transducer and the target 114 departs from.Measure to calculate and to occur in the transducer or externally in the computer.According to the exact position of reference target 114 and towards priori, can analyze the picking error that robot 102 that its three-dimensional departs to determine pickoff sensor 112 is produced.The system that all makes is calculated in inner or outside can compensate any error of being introduced by the pick process of transducer 112.
This information makes transducer 112 can obtain the image of additional object, and described target is the target 116 on the system component 104 for example, so as the exact position of computing system assembly 104 and towards.Repeating this process makes the controller of robot 102 can accurately describe the definite position of all component in the semiconductor processing system.Preferably, this describes the position and the orientation information that produce at least three, be preferably six-freedom degree (x, y, z, azimuth, the angle of pitch, inclination angle).Can by the technology people use delineation information mechanically adjust random component with respect to the position of any six degree of freedom of other assembly and towards.Preferably, the accurate measurement that class substrate wireless senser is provided is used to minimize or reduces because technical staff's the caused changeability of judgement.Preferably, report this positional information to robot that carries out calibration process automatically or system controller.All mechanical adjustment have finally been finished; Substrate-like sensor can be used to measure other alignment error.Can use departing from of six degree of freedom to measure the coordinate of adjusting the point in the memory that is stored in robot and/or system controller.These select including, but not limited to: transmit position select atmosphere substrate (atmospheric substrate) handling machine people when locating when end-effector is positioned at FOUP groove #1 substrate; When end-effector is positioned at the position that FOUP groove #25 substrate transmits atmosphere substrate handling machine people when selecting; When being positioned at substrate prealigner substrate, end-effector transmits position select atmosphere substrate handling machine people when locating; Atmosphere substrate handling machine people's position when end-effector is positioned at exchange substrate transmission and selects the place; Atmosphere substrate handling machine people's position when end-effector is positioned at attached to the reference target place on the framework of atmosphere substrate handling system; Vacuum conveyor device people's position when end-effector is positioned at exchange transmission point place; And when end-effector is positioned at attached to the target place on the framework of vacuum transfer system vacuum conveyor device people's position.
Optional embodiment of the present invention storage and report are measured.In some semiconductor processing systems, real-time radio communication is unpractiaca.The structure of system perhaps can interfere with wireless communications.Perhaps, the radio communication energy can disturb the proper operation of substrate handling system.In these cases, preferably, transducer 112 writes down these values to each target transmission value the time, be used for sending to after a while main frame.Use its image-taking system or other suitable detection device, when transducer 112 recognized that it is no longer mobile, transducer 112 preferably write down time and the value that departs from.After a while, when transducer 112 turned back to its support (holster) (not shown), transducer 112 can be remembered the time and the value of storage again, and these information are sent to main frame.Can by conductivity, light signaling, inductance coupling high or arbitrarily other suitable means realize this transmission.The storage of wireless substrate-like sensor and report operation possibility: the adjustment approval cycle that increases reliability, reduces cost and shorten system.In addition, this has been avoided near the possibility of the smart devices RF energy interference transducer and the support thereof.Storage and report operation can also be used to overcome the temporary transient interruption of real-time radio communication channel.
Fig. 2 is the top perspective view according to the wireless substrate-like sensor 118 of the embodiment of the invention.The different modes that only are to realize weight saving of transducer 118 and transducer 112 shown in Figure 1.Particularly, transducer 112 adopts a large amount of timberings (strut) 118 that master reference part 120 is suspended in the external diameter 122 that can hold the standard wafer size of 300 mm dia wafers for example.On the contrary, transducer 118 adopts a plurality of through holes 124, and through hole 124 has alleviated the weight of transducer 118 equally.Can use the hole of other pattern to realize required weight saving.In addition, can use ribs as shown in Figure 1 separately, perhaps use, to come the optimization framework design at intensity, hardness and weight in conjunction with lightening hole.It is also contemplated that other weight saving design, for example comprise: make operative sensor hollow; And/or fill a part with light material.Operable other weight saving and the attribute that adds strong hardness comprise circular port, spoke, grid, honeycomb etc.Alternatively, for example, can be by forming the hole in the crystal substrates that etches into monocrystalline silicon for example.By removing other assembly that weight that unwanted material saves can be used to provide the more macrocell of more macrocyclic radio operation and/or stronger signal adjustment, other sensing pattern and/or real-time radio communication is provided.
Transducer 112 and transducer 118 all adopt middle section 120.The part of middle body 120 downsides is located immediately on as shown in Figure 3 the inspection opening 126.Inspection opening 126 makes luminaire 128 and image-taking system 120 can obtain the image that is positioned at the target under the transducer 118 when robot 102 movable sensors 118.
Fig. 4 is the diagram according to the part 120 of the embodiment of the invention.Preferably, part 120 comprises circuit board 140, and a large amount of assemblies have been installed on circuit board 140.Particularly, battery 142 preferably is installed on the circuit board 140, and links to each other with digital signal processor (DSP) 144 by power management module 146.Power management module 146 is guaranteed correct voltage level is offered digital signal processor 144.Preferably, power management module 146 is the power management integrated circuits that can indicate from the trade mark that Texas Instrument obtains under the TPS5602.In addition, digital signal processor 144 preferably can indicate the microprocessor under the TM320C6211 from the trade mark that Texas Instrument obtains.Digital signal processor 144 links to each other with memory module 148, and memory module 148 can be the memory of any type.Yet preferably, memory 148 comprises having 16M * module of the Synchronous Dynamic Random Access Memory (SDRAM) of 16 sizes.Module 148 also preferably includes has 256K * flash memory of 8 sizes.Flash memory is useful for the Nonvolatile data other persistent data of storage such as program, calibration data and/or needs.Random access memory is useful for the volatile data storage such as image that obtains or the data relevant with procedure operation.
Preferably, comprise that the lighting module 150 of a plurality of light-emitting diodes (LED) and image-taking system 152 link to each other with digital signal processor 144 by camera control unit 154.Camera control unit 154 is convenient to image acquisition and illumination, and therefore the order according to digital signal processor 144 comes to provide relevant signaling to LED with image-taking system 152.Preferably, image-taking system 152 comprises surface array device, charge-coupled device (CCD) or complementary metal oxide semiconductors (CMOS) (CMOS) image device for example, these devices preferably with focus an image to array on optical system 156 link to each other.Preferably, the image acquisition device can indicate KAC-0310 acquisition down from the trade mark of Kodak.Preferably, digital signal processor 144 also comprises a plurality of I/O port ones 58,160.These ports are serial port preferably, is convenient to the communication between digital signal processor 144 and the miscellaneous equipment.Particularly, serial port 158 links to each other with radio-frequency module 162, makes the data that send by port one 58 link to each other with external equipment by radio-frequency module 162.In a preferred embodiment, radio-frequency module 162 is according to operating from well-known bluetooth standard, bluetooth core specification version 1.1 (February 22 calendar year 2001) that Bluetooth SIG (www.bluetooth.com) obtains.An example of module 162 can indicate WML-C11 and obtain down from the trade mark of Mitsumi.
Fig. 5 is mounted in the diagram of the image-taking system 152 on the circuit board 202.Mark 204 is usually located at the back side of circuit board 202.Clear coat or lens 206 are positioned near the image acquisition equipment 152.The tubular conduit 208 that wherein has lens 214 extends through the hole 210 in the circuit board 212.Preferably, the internal diameter of the external diameter of lens 214 and pipe 208 is threaded, makes lens 214 transfer change figure image focus in pipe 208 inward turnings.One or more LED 216 link to each other with circuit board 212, and provide illumination to be used for image acquisition.The configuration shown in Figure 5 of obtainable material and device causes approximate 8.5 millimeters of integral thickness t on the use market.In must using less than some wireless substrate-likes of 8.5 millimeters groove or other opening by thickness, transducer itself can go wrong.According to one embodiment of present invention, arrange obtainable assembly on these markets, so that the approximate thickness that reduces circuit board of the height of whole sensor (profile) according to the narrow boards design configurations.
Fig. 6 is the diagram according to the embodiment of the invention, the image-taking system 154 that links to each other with circuit board 250.Some assemblies of system shown in Figure 6 with reference to component class shown in Figure 5 seemingly, and similarly same components is numbered.Circuit board 250 is had an opening 252 by adaptive, and the size of opening 252 can be held image-taking system 154.As mentioned above, image-taking system 154 preferably can be from the model KAC-0310 of Kodak's acquisition.This system is set at each side to be had in the 48 pins pottery leadless chip carriers (CLCC) of 12 attachment regions.This is arranged so that image-taking system 154 can be absorbed in the opening 252 the thickness place of circuit board 250 at least.Because typical circuit board thickness is approximately 1 millimeter, this causes having saved 1 millimeter thickness, causes the integral thickness of configuration shown in Figure 6 to be approximately 7.5 millimeters.
Fig. 7 shows image-taking system 154 and wherein has the perspective view of the circuit board 250 of opening 252.As shown in Figure 7, image-taking system 154 comprises a plurality of tie points 254 around its periphery.In order to mesh the point 254 of image-taking system 154, circuit board 250 has a plurality of contact positions 256 that are arranged on around opening 252 inner surfaces, so that the point 254 of connected system 154.Can produce contact position 256 in any suitable mode, these modes including, but not limited to: be in the circuit board 250 in each position of contact position 256 and form etching vias, the break-through circuit board 250 then, in circuit board 250, staying the part of each etching vias, thereby form solder joint.Then, can manually or by machine use welding so that position 256 and point 254 engagements.
Fig. 8 be according to a further embodiment of the invention, the diagram of the image-taking system that is electrically connected with circuit board 260.Replacement directly is provided with between image-taking system 154 and circuit board 260 and electrically contacts, and flexible circuit 262 is set, to electrically contact with image-taking system 154 and circuit board 260.The extremely thin circuit that flexible circuit is normally formed by the one or more conductive paths (trace) between two layers of insulation material.The known .2 millimeter that is as thin as of flexible circuit.In another embodiment, the CMOS chip itself in the image-taking system can be removed and be attached directly on the printed circuit board (PCB), rather than is loaded in its traditional ceramics leadless chip carrier.Yet, in such an embodiment, be difficult to keep the cleaning of the optical surface of imager.In addition, think and increased assembly cost significantly and reduced whole reliability.
According to another embodiment of the invention, wireless substrate-like sensor is provided with improved protection, to avoid polluting the semiconductor wafer processing chamber.This sensor measurement physical attribute and not pollute process chamber be very important.In addition, this transducer must be stable dimensionally.Known sensor material and assembly be shed particles perhaps, can pollute wafer processing chamber.If with the material of wireless substrate-like sensor sealing, between inside and outside, can produce pressure differential may pollute in the isolation sensor.If enough extreme, pressure differential may make frame deformation, perhaps even can cause and break.Especially for lightweight substrate-like sensor framework, owing to wish the overall weight of framework is minimized, framework mechanically is fragile.
Wireless substrate-like sensor has inner space and space outerpace usually.Some transducers are accommodated in the inner space.Sensor frame comprises avoids gas, particulate or molecule to enter or leave sealing of inner space except the ventilating opening by setting for this purpose and specially.At the ventilating opening two ends filter is set, with by gas, still prevents by particulate or molecule, these are difficult to be fit to pass through filter too greatly.Preferably, the outer surface of transducer has or is coated with or deposits chemical inert material, for example: nickel, polyethylene or Merlon.Equally preferably, select the shape and the coating of sensor frame, make that transducer itself is easy to clean.Equally preferably, the external crack that can catch particulate is minimized.
Fig. 9 is the perspective view that has the transducer 118 of sensor frame 270 on it.Sensor frame 270 comprises one or more perforation 272, and these perforation 272 are the unique passages between framework 270 inside and outside.Preferably in framework 270, near perforation 272, place the breather filter (breather filter) of suitable macromolecule weight.Filter 274 shown in broken lines in Fig. 9.Can and be positioned near it filter with the position of through hole 272 and be arranged on any appropriate location on the framework 270.Therefore, as shown in Figure 9, they can be arranged on the top surface,, can be arranged on the side surface if perhaps wish.The fragile filter 274 of through hole 272 protections avoids machinery impaired, and relatively easy the manufacturing.The use of through hole 272 and filter 274 has avoided particulate to leave sensor frame 270, otherwise can pollute semiconductor process chamber.Through hole 272 makes the pressure in the framework 270 equate with indoor pressure, thereby has avoided the distortion of framework 270 or worse result.
Figure 10 is according to a further embodiment of the invention, has a sectional view of the wireless substrate-like sensor 118 of antipollution sensor frame 280.Seal sensor framework 280.But utilize deformation pressure equalization member 284 complete sealed opens 282.Preferably, member 284 is made up of elastomeric material, makes that it can get back to its original-shape when having removed given pressure.Preferably, member 284 comprises bellows 286, but can have can deformation in response to pressure differential any suitable shape.Therefore, member 284 can be balloon, bladder or other suitable configuration arbitrarily.In the present embodiment, because the distortion of member 284, the pressure in the sensor frame 280 equates with the pressure of chamber, does not need to make framework 280 distortion.
Although described the present invention, those skilled in the art will recognize that under the situation that does not break away from the spirit and scope of the present invention, can change in form and details with reference to preferred embodiment.
Claims (7)
1. substrate-like sensor that in the semiconductor processes instrument, uses, described transducer comprises:
Framework with electronic device compartment is except allowing gas the ventilating opening that passes through between electronic device compartment inside and outside, with its sealing; And
The sensing electronic device is positioned at framework, and is applicable to the characteristic of sensing semiconductor processes instrument; And
Filter is positioned near the described ventilating opening, makes all gas that passes through ventilating opening by described filter.
2. transducer according to claim 1, wherein, described framework is configured to standard-sized wafer similar.
3. substrate-like sensor that in the semiconductor processes instrument, uses, described transducer comprises:
Framework has the opening between inside, outside and described inside and the outside; And
The sensing electronic device is positioned at framework, and is applicable to the characteristic of sensing semiconductor processes instrument; And
The isostasy member links to each other with described opening hermetically, and described equalization member is configured to the bending in response to the pressure differential between inside and outside.
4. transducer according to claim 3, wherein, equalization member is a bladder.
5. transducer according to claim 3, wherein, equalization member is a balloon.
6. transducer according to claim 3, wherein, equalization member is a bellows.
7. transducer according to claim 3, wherein, equalization member comprises the part of framework wall.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CNA2005800073529A Pending CN1930659A (en) | 2004-03-09 | 2005-03-09 | Wireless substrate-like sensor |
| CNB2005800073497A Active CN100546000C (en) | 2004-03-09 | 2005-03-09 | Wireless substrate-like sensor |
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| KR (3) | KR20060123646A (en) |
| CN (3) | CN1930660A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101996857A (en) * | 2009-08-07 | 2011-03-30 | 台湾积体电路制造股份有限公司 | Method and apparatus for wireless transmission of diagnostic information |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102021007B1 (en) * | 2017-11-06 | 2019-09-11 | 크린팩토메이션 주식회사 | Device for testing leak of purging gas at purging shelf for wafer container |
| CN108601216A (en) * | 2018-04-28 | 2018-09-28 | 济南浪潮高新科技投资发展有限公司 | A kind of PCB and PCB production methods |
| US20200152494A1 (en) * | 2018-11-14 | 2020-05-14 | Cyberoptics Corporation | Wafer-like sensor |
| CN111323076A (en) * | 2018-12-13 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | Detection device and process chamber detection method |
| CN110767577A (en) * | 2019-10-24 | 2020-02-07 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Semiconductor material attaching method |
| US11353381B1 (en) | 2020-06-09 | 2022-06-07 | Applied Materials, Inc. | Portable disc to measure chemical gas contaminants within semiconductor equipment and clean room |
| KR102635383B1 (en) * | 2020-09-21 | 2024-02-14 | 세메스 주식회사 | Apparatus for treating substrate |
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| JPH0738122A (en) * | 1993-07-20 | 1995-02-07 | Fujikura Ltd | Sensor package |
| JPH0763585A (en) * | 1993-08-26 | 1995-03-10 | Hokuriku Electric Ind Co Ltd | Environment sensor |
| US5444637A (en) * | 1993-09-28 | 1995-08-22 | Advanced Micro Devices, Inc. | Programmable semiconductor wafer for sensing, recording and retrieving fabrication process conditions to which the wafer is exposed |
| JPH09184851A (en) * | 1995-12-28 | 1997-07-15 | Fujikura Ltd | Semiconductor acceleration sensor |
| US5798556A (en) * | 1996-03-25 | 1998-08-25 | Motorola, Inc. | Sensor and method of fabrication |
| US6244121B1 (en) * | 1998-03-06 | 2001-06-12 | Applied Materials, Inc. | Sensor device for non-intrusive diagnosis of a semiconductor processing system |
| JP3968862B2 (en) * | 1998-03-09 | 2007-08-29 | 株式会社ニコン | Illuminance meter, illuminance measurement method and exposure apparatus |
| US6325536B1 (en) * | 1998-07-10 | 2001-12-04 | Sensarray Corporation | Integrated wafer temperature sensors |
| JP2000171427A (en) * | 1998-09-29 | 2000-06-23 | Omron Corp | Sample component analyzing system and sensor chip and sensor pack used therefor |
| NL1017593C2 (en) * | 2001-03-14 | 2002-09-17 | Asm Int | Inspection system for process devices for treating substrates, as well as a sensor intended for such an inspection system and a method for inspecting process devices. |
| JP2002299592A (en) * | 2001-03-29 | 2002-10-11 | Sony Corp | Semiconductor device |
| US7289230B2 (en) * | 2002-02-06 | 2007-10-30 | Cyberoptics Semiconductors, Inc. | Wireless substrate-like sensor |
| TW200507284A (en) * | 2003-08-05 | 2005-02-16 | Elecvision Inc | Image sensor module and its manufacturing method |
-
2005
- 2005-03-09 CN CNA2005800073548A patent/CN1930660A/en active Pending
- 2005-03-09 JP JP2007502939A patent/JP2007528615A/en active Pending
- 2005-03-09 WO PCT/US2005/007656 patent/WO2005088683A2/en active Application Filing
- 2005-03-09 KR KR1020067019421A patent/KR20060123646A/en not_active Application Discontinuation
- 2005-03-09 WO PCT/US2005/007423 patent/WO2005088682A1/en active Application Filing
- 2005-03-09 JP JP2007502906A patent/JP2007528611A/en not_active Withdrawn
- 2005-03-09 CN CNA2005800073529A patent/CN1930659A/en active Pending
- 2005-03-09 WO PCT/US2005/007418 patent/WO2005088681A1/en active Application Filing
- 2005-03-09 CN CNB2005800073497A patent/CN100546000C/en active Active
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101996857A (en) * | 2009-08-07 | 2011-03-30 | 台湾积体电路制造股份有限公司 | Method and apparatus for wireless transmission of diagnostic information |
| CN101996857B (en) * | 2009-08-07 | 2013-05-29 | 台湾积体电路制造股份有限公司 | Method and system for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070009600A (en) | 2007-01-18 |
| JP2007528558A (en) | 2007-10-11 |
| JP2007528615A (en) | 2007-10-11 |
| KR20060123646A (en) | 2006-12-01 |
| WO2005088683A2 (en) | 2005-09-22 |
| JP2007528611A (en) | 2007-10-11 |
| KR20070009601A (en) | 2007-01-18 |
| CN100546000C (en) | 2009-09-30 |
| WO2005088683A3 (en) | 2005-11-17 |
| WO2005088681A1 (en) | 2005-09-22 |
| CN1930658A (en) | 2007-03-14 |
| CN1930660A (en) | 2007-03-14 |
| WO2005088682A1 (en) | 2005-09-22 |
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