JP2006185960A - Substrate processing device and its conveyance alignment method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing device capable of improving the accuracy of height position and effectively performing teaching while reducing the processes by visual check and manual labor of a worker at the time of teaching in comparison with the conventional way, and to provide its conveyance alignment method. <P>SOLUTION: The height difference between the mapping sensor 32 of a conveyance mechanism 30 and a substrate conveyance arm 33 and a substrate conveyance arm 34 is detected by an arm position detection sensor 40. Further, the height position of jigs 38 and 39 for Z-axis teaching is detected by the mapping sensor 32. Moreover, the access height to each part of the substrate conveyance arm 33 and the substrate conveyance arm 34 is calculated on the basis of the height position difference between the jigs 38 and 39 for Z-axis teaching, the mapping sensor 32, the substrate conveyance arm 33 and the substrate conveyance arm 34. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus for performing a process such as an etching process or a film forming process on a substrate to be processed such as a semiconductor wafer or a glass substrate for a liquid crystal display device, and a transfer position adjusting method thereof.

  2. Description of the Related Art Conventionally, a substrate processing apparatus that performs processing such as etching processing or film forming processing on a target substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device is known. Such a substrate processing apparatus includes a plurality of vacuum processing chambers (process chambers), a vacuum transfer chamber provided with a transfer mechanism therein, a transfer chamber for transferring a substrate to be processed in the atmosphere, a plurality of sheets Modules such as a placement unit on which a cassette or hoop that can accommodate the substrate to be processed is placed, an alignment mechanism (orienter) that aligns the substrate to be processed by an orientation flat or notch, etc. are connected to efficiently process the substrate. Those configured to process a substrate are known.

In the substrate processing apparatus as described above, since each part is modularized, when these modules are assembled, the positions and heights of the modules include some errors from the design values. . For this reason, in the transport mechanism that transports the substrate to be processed between these modules, it is necessary to perform teaching for storing the height and position of each module serving as a transport site after assembling the apparatus. As a method for performing such teaching, first, rough teaching with rough position accuracy (for example, position accuracy of about ± 2 mm) is performed manually using a dummy substrate, and then teaching with high accuracy using an orienter is performed. A method of performing (for example, position accuracy of about ± 0.2 mm) is known (for example, see Patent Document 1).
JP 2004-174669 A

  In the above-described conventional technique, high-precision teaching can be performed using an orienter regardless of visual observation or the like. However, even in this method, for example, when performing rough teaching, there are processes involving visual and manual operations of workers, and there is a problem that the process requires time and labor. Further, since teaching using an orienter is for the horizontal direction, there is a problem that the positional accuracy of the height (Z axis) cannot be sufficiently secured.

  The present invention has been made in order to solve the above-described problems. Compared with the conventional technique, the number of visual and manual processes of the worker during teaching is reduced, and teaching can be performed efficiently and the height can be increased. It is an object of the present invention to provide a substrate processing apparatus capable of improving the position accuracy of the substrate and a method for aligning the substrate processing apparatus.

  The substrate processing apparatus according to claim 1 is disposed on a transport base, transports a substrate to be processed between predetermined transport sites, and is disposed on the transport base, and the substrate to be processed is in a shelf shape. A mapping sensor for detecting the arrangement state of the substrates to be processed in the substrate to be processed accommodating case, and a Z-axis teaching jig provided at or near the transfer site, and by the mapping sensor, The Z-axis teaching jig is configured to detect the height of the Z-axis teaching jig and perform Z-axis teaching on the transfer portion of the transfer mechanism.

  The substrate processing apparatus according to claim 2 is the substrate processing apparatus according to claim 1, wherein a difference in height between the mapping sensor and a support portion that supports the substrate to be processed of the transport mechanism is detected. A detection sensor is provided.

  A substrate processing apparatus according to a third aspect is the substrate processing apparatus according to the first or second aspect, wherein the Z-axis teaching jig is detachable.

  The substrate processing apparatus according to claim 4 is the substrate processing apparatus according to any one of claims 1 to 3, wherein the mapping sensors are arranged so as to face each other with a gap in the horizontal direction. An element and a light receiving element. When the light emitting element and the light receiving element are moved up and down, the Z axis teaching jig blocks the light between the light emitting element and the light receiving element, thereby increasing the height of the Z axis teaching jig. It is characterized by detecting the thickness.

  Further, the substrate processing apparatus according to claim 5 is the substrate processing apparatus according to any one of claims 1 to 4, wherein the transfer part is configured to vacuum the positioning apparatus and the processing substrate for positioning the processing target substrate. It is a load lock chamber for carrying in and out of the chamber.

  According to a sixth aspect of the present invention, there is provided a transport position adjusting method for a substrate processing apparatus, wherein the transport mechanism is disposed on a transport base, transports a substrate to be processed between predetermined transport sites, and is disposed on the transport base. A substrate processing apparatus transport alignment method comprising: a mapping sensor for detecting an arrangement state of a substrate to be processed in a substrate processing case for storing a plurality of substrates to be processed in a shelf shape, wherein A Z-axis teaching jig is provided in the vicinity, and the height of the Z-axis teaching jig is detected by the mapping sensor, and the Z-axis teaching is performed on the transfer part of the transfer mechanism. .

  The substrate processing apparatus transport position alignment method according to claim 7 is the substrate processing apparatus transport position alignment method according to claim 6, wherein the mapping sensor and the support mechanism for supporting the substrate to be processed of the transport mechanism are supported. A method of aligning a transfer position of a substrate processing apparatus, further comprising a step of detecting a difference in height from the portion.

  The substrate processing apparatus transport position alignment method according to claim 8 is the substrate processing apparatus transport position alignment method according to claim 6 or 7, wherein the Z-axis teaching jig is configured to be detachable, The Z-axis teaching jig is attached when performing Z-axis teaching, and is removed after the Z-axis teaching is completed.

  According to the present invention, it is possible to reduce the number of steps by visual inspection and manual labor of a worker during teaching as compared with the related art, and it is possible to perform teaching efficiently and improve the positional accuracy of the height. It is possible to provide an apparatus and a method for aligning its transport position.

  Hereinafter, the details of the present invention will be described with reference to the drawings. FIG. 1 shows the overall configuration of a substrate processing apparatus according to an embodiment of the present invention. As shown in the figure, a vacuum transfer chamber 10 is provided in the central portion of the substrate processing apparatus 1, and a plurality of (six in this embodiment) are provided around the vacuum transfer chamber 10. The vacuum processing chambers (process chambers) 11 to 16 are arranged.

  Two load lock chambers 17 are provided on the front side (lower side in the figure) of the vacuum transfer chamber 10, and on the further front side (lower side in the figure) of these load lock chambers 17, a semiconductor wafer in the atmosphere. A transfer chamber 18 for transferring W is provided. Further, on the further front side (lower side in the figure) of the transfer chamber 18, a mounting portion in which a carrier (a hoop or a cassette) as a processing substrate storage case capable of storing a plurality of semiconductor wafers W is arranged. 19 (three in FIG. 1) are provided, and an alignment mechanism 20 for aligning the semiconductor wafer W by an orientation flat or a notch is provided on the side (left side in the figure) of the transfer chamber 18. Yes.

  As shown in FIG. 2, a transfer mechanism 30 for transferring the semiconductor wafer W in the atmosphere is provided in the transfer chamber 18. The transport mechanism 30 is provided on a transport base 31 that is movable along the longitudinal direction of the transport chamber 18 (left-right direction in FIG. 2) and can be moved up and down as indicated by arrows in the figure. ing. As shown in FIG. 3, a mapping sensor 32 is provided on the lower side of the transfer base 31, and two substrate transfer arms 33 and 34 are provided thereon.

  The mapping sensor 32 includes a light emitting element 32a and a light receiving element 32b that are arranged with a gap in the horizontal direction. Then, by blocking the light between them, it is possible to detect the presence of, for example, the presence of the semiconductor wafer W, the height thereof, and the like. During normal substrate processing, the mapping sensor 32 is in a state in which the semiconductor wafer W is accommodated in the carrier 35 (hoop or cassette) placed on the placement unit 19, that is, at which height the semiconductor wafer W is located. It is used for the purpose of detecting how it is housed. In the present embodiment, the mapping sensor 32 is used to teach the height (Z axis) of the conveyance site.

  The alignment mechanism 20 detects a position 36 for holding and rotating the semiconductor wafer W, the position of the peripheral edge of the semiconductor wafer W rotated by the stage 36, and a notch or orientation flat, thereby aligning the position. An optical sensor 37 for performing the above is provided. The alignment mechanism 20 is provided with a Z-axis teaching jig 38. The Z-axis teaching jig 38 is used for teaching the height (Z-axis) of the stage 36 that is a transfer portion by the transfer mechanism 30 and is the same height as the stage 36 or the height of the stage 36. It arrange | positions so that the difference of may become known.

  The Z-axis teaching jig 38 is provided so as to protrude into the transfer chamber 18 from the alignment mechanism 20. As a result, the mapping sensor 32 can freely move the portion of the Z-axis teaching jig 38 in the vertical direction without coming into contact with other structures, and there is a positional deviation greater than ± 2 mm in positional accuracy. Even in the state before the rough teaching, the height of the stage 36 of the alignment mechanism 20 can be detected and the Z-axis teaching can be performed.

  Also, the Z-axis teaching jig 39 for performing the Z-axis teaching as described above is also provided in the two load lock chambers 17 which are the transfer parts where the transfer mechanism 30 transfers the semiconductor wafer W. These Z-axis teaching jigs 39 are provided so as to protrude from the lower part of the entrance portion of the load lock chamber 17, as shown in FIG.

  The reason why the Z-axis teaching jig 39 is configured as described above is that, in the vicinity of the load lock chamber 17, the range of the vertical movement of the mapping sensor 32 is limited, and the extension range of the mapping sensor 32 is the load lock chamber. This is because it has been considered that it does not reach the interior of 17. However, if the range of vertical movement of the mapping sensor 32 can be ensured to some extent in the vicinity of the load lock chamber 17, the Z-axis teaching jig 39 may have the same configuration as the Z-axis teaching jig 38 described above. When the mapping sensor 32 can extend to the inside of the load lock chamber 17, a Z-axis teaching jig 39 may be provided inside the load lock chamber 17. Furthermore, Z-axis teaching jigs having other shapes may be provided at other positions, and the shapes and arrangement positions are not limited to the above-described embodiments.

  These Z-axis teaching jig 38 and Z-axis teaching jig 39 are detachable, and are attached when Z-axis teaching is performed, and are removed when Z-axis teaching is completed. However, if a Z-axis teaching jig can be provided so as not to interfere with normal processing, a fixed configuration may be used.

  Further, as shown in FIG. 2, an arm position detection sensor 40 including a light emitting unit 40 a and a light receiving unit 40 b provided on opposing side wall portions is provided in the transfer chamber 18. Then, the transfer base 31 is stopped at the position of the arm position detection sensor 40, and the transfer base 31 is moved up and down here, thereby the mapping sensor 32 provided on the transfer base 31 and the substrate transfer arm. 33 and the substrate transport arm 34 can detect a difference in height from the substrate support (pick).

  Next, a Z-axis teaching method in the substrate processing apparatus 1 configured as described above will be described with reference to the flowchart of FIG.

  When performing Z-axis teaching, first, the Z-axis teaching jig 38 and the Z-axis teaching jig are placed in a predetermined conveyance part that requires Z-axis teaching, that is, the alignment mechanism 20 and the two load lock chambers 17. The jig 39 is attached (101).

  Next, the transfer base 31 is positioned at the position of the arm position detection sensor 40, and the arm position detection sensor 40 increases the height of the mapping sensor 32 and the substrate support arm (pick) of the substrate transfer arm 33 and the substrate transfer arm 34. A difference in height is detected (102).

  Thereafter, the mapping sensor 32 detects the heights of the Z-axis teaching jig 38 and the Z-axis teaching jig 39 (103).

  Thereafter, the Z-axis teaching jig 38 and the Z-axis teaching jig 39 are removed (104).

  Then, the height of the Z-axis teaching jig 38 and the Z-axis teaching jig 39 detected by the mapping sensor 32, and the mapping sensor 32 detected by the arm position detection sensor 40, the substrate transport arm 33, and the substrate transport arm 34 are detected. The access height of the substrate transfer arm 33 and the substrate transfer arm 34 to each transfer unit is calculated from the difference in height from the substrate support unit (pick) (105). The coordinate value of the access height is stored in the control device 50 shown in FIG. 2 that controls the operation of the transport mechanism 30, and teaching is performed.

  Thus, the Z-axis teaching of the transport mechanism 30 with respect to the alignment mechanism 20 and the two load lock chambers 17 is completed. Note that the dummy wafer storage unit and the mounting unit 19 (not shown) can perform Z-axis teaching using a dummy wafer without using a Z-axis teaching jig, and therefore, a carrier that stores the dummy wafer is disposed at these parts. Then, similarly to the Z-axis teaching described above, the mapping sensor 32 detects the height of the dummy wafer to perform Z-axis teaching.

  When the dummy wafer can be transferred to each part along the predetermined transfer path only by the above Z-axis teaching, the alignment mechanism 20 detects the horizontal deviation of the dummy wafer transferred from each part, thereby Teaching direction. That is, for example, a dummy wafer arranged at a predetermined position in the carrier 35 of the mounting unit 19 is transferred to the alignment mechanism 20 by the transfer mechanism 33, and the horizontal displacement of the dummy wafer is measured. Then, the correction amount of the coordinate value calculated so as to eliminate the positional deviation is taught. Here, if there is a part where the dummy wafer cannot be transferred only by the Z-axis teaching, the horizontal rough teaching is performed only for the part, and then the teaching using the alignment mechanism 20 is performed.

  As a result, it is possible to reduce the steps of visual inspection and manual work of the worker, perform teaching efficiently, and improve the positional accuracy of the height.

  Next, the substrate processing operation in the substrate processing apparatus 1 of the present embodiment having the above-described configuration will be described. When the cassette or the hoop is placed on the placement unit 19, the semiconductor wafer W is taken out from the cassette or the hoop by a transfer mechanism (not shown) provided in the transfer chamber 18 and transferred to the alignment mechanism 20 for alignment. And placed in the load lock chamber 17.

  The semiconductor wafer W is transferred from the load lock chamber 17 to each of the vacuum processing chambers 11 to 16 by a transfer mechanism (not shown) provided in the vacuum transfer chamber 10 and subjected to predetermined processing. Further, the processed semiconductor wafer W is transferred from each of the vacuum processing chambers 11 to 16 by this transfer mechanism and is placed in the load lock chamber 17.

  As described above, the processed semiconductor wafer W arranged in the load lock chamber 17 is thereafter taken out from the load lock chamber 17 by the transfer mechanism in the transfer chamber 18 and mounted on the mounting portion 19. In a cassette or hoop.

  When performing the substrate processing as described above, the transfer mechanism 30 in the transfer chamber 18 is conventionally used between the cassette or hoop placed on the placement unit 19, the alignment mechanism 20, the load lock chamber 17, and the like. The semiconductor wafer W can be transferred with a higher positional accuracy than that of the semiconductor wafer W.

The figure which shows the whole schematic structure of the substrate processing apparatus in one Embodiment of this invention. FIG. 2 is a cross-sectional view showing the main configuration of the substrate processing apparatus of FIG. 1. The longitudinal cross-sectional view which shows the principal part structure of the substrate processing apparatus of FIG. The perspective view which shows the principal part structure of the substrate processing apparatus of FIG. The flowchart for demonstrating the conveyance position alignment method in one Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Substrate processing apparatus, 10 ... Vacuum transfer chamber, 11-16 ... Vacuum processing chamber, 17 ... Load lock chamber, 18 ... Transfer chamber, 19 ... Mounting part, 20 ... Positioning mechanism, 30... Transport mechanism, 31... Transport base, 32... Mapping sensor, 33 and 34 .. substrate transport arm, 35. Axis teaching jig, 40 ... arm position detection sensor, 50 ... control device.

Claims (8)

A transport mechanism disposed on a transport base and transporting the substrate to be processed between predetermined transport sites;
A mapping sensor that is arranged on the transfer base and detects the arrangement state of the substrates to be processed in a substrate-receiving case that accommodates a plurality of substrates to be processed in a shelf shape;
Comprising a Z-axis teaching jig provided at or near the transfer site;
A substrate processing apparatus configured to detect the height of the Z-axis teaching jig by the mapping sensor and perform Z-axis teaching on the transfer part of the transfer mechanism. The substrate processing apparatus according to claim 1,
A substrate processing apparatus, comprising: a detection sensor that detects a difference in height between the mapping sensor and a support portion that supports a substrate to be processed of the transport mechanism. The substrate processing apparatus according to claim 1, wherein:
A substrate processing apparatus, wherein the Z-axis teaching jig is detachable. The substrate processing apparatus according to any one of claims 1 to 3,
The mapping sensor includes a light emitting element and a light receiving element arranged to face each other with a gap in the horizontal direction, and when the light emitting element and the light receiving element are moved up and down, the light between them is A substrate processing apparatus, wherein the height of the Z-axis teaching jig is detected by blocking the Z-axis teaching jig. The substrate processing apparatus according to any one of claims 1 to 4,
The substrate processing apparatus, wherein the transfer part is a positioning device for positioning a substrate to be processed and a load lock chamber for carrying the substrate to and from the vacuum chamber. A transport mechanism disposed on a transport base and transporting the substrate to be processed between predetermined transport sites;
A method of aligning a substrate processing apparatus, comprising: a mapping sensor disposed on the transfer base and detecting a disposition state of the substrate to be processed in a substrate-receiving case for storing a plurality of substrates to be processed in a shelf shape. There,
A Z-axis teaching jig is provided at or near the transfer part, and the height of the Z-axis teaching jig is detected by the mapping sensor to teach the Z-axis to the transfer part of the transfer mechanism. A method for aligning a transfer position of a substrate processing apparatus. It is a conveyance position alignment method of the substrate processing apparatus of Claim 6, Comprising:
A transport position alignment method for a substrate processing apparatus, further comprising a step of detecting a difference in height between the mapping sensor and a support portion that supports a substrate to be processed of the transport mechanism. It is a conveyance position alignment method of the substrate processing apparatus of Claim 6 or 7,
The Z-axis teaching jig is configured to be detachable, and the Z-axis teaching jig is attached when performing Z-axis teaching, and is removed after the Z-axis teaching is completed. Method.

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