CN1929730A - 降低电磁干扰的接地装置 - Google Patents

降低电磁干扰的接地装置 Download PDF

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CN1929730A
CN1929730A CNA2005100372202A CN200510037220A CN1929730A CN 1929730 A CN1929730 A CN 1929730A CN A2005100372202 A CNA2005100372202 A CN A2005100372202A CN 200510037220 A CN200510037220 A CN 200510037220A CN 1929730 A CN1929730 A CN 1929730A
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electromagnetic interference
link
circuit board
pcb
printed circuit
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CN100531543C (zh
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陈俊宏
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to US11/309,403 priority patent/US7458844B2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种降低电磁干扰的接地装置，其包括一设置于印刷电路板上的导电接地部、一接地端及一连接件，所述导电接地部与印刷电路板内的接地点导通，所述连接件包括一第一连接端、一连接部及一第二连接端，所述第一连接端通过所述连接部与所述第二连接端电性连接，所述第一连接端与所述接地端电性连接，所述第二连接端与所述导电接地部电性连接。该种降低电磁干扰的接地装置可有效降低印刷电路板上的电磁干扰。

Description

降低电磁干扰的接地装置
【技术领域】
本发明涉及一种降低电磁干扰的接地装置，特别涉及一种降低印刷电路板电磁干扰的接地装置。
【背景技术】
电磁干扰(Electro Magnetic Interference，EMI)是目前电子产业中存在的一大问题，特别是随着集成电路的频率越来越高，其内部的传输导线、电源或印刷电路板上具有较高工作频率的电子组件都会对外发散出电磁波，而使得其它组件受到干扰，影响正常的工作运作，因此从业者十分重视在降低电磁干扰上的设计。印刷电路板是整个电子系统正常工作的基础，在印刷电路板布局开始时就做好防治电磁干扰的工作，是建构高可靠度电子系统的首要任务。
印刷电路板的大部分电磁干扰问题均可通过良好的接地来解决，而一个良好的接地系统降低电磁干扰的基本目标是降低流过接地回路阻抗的电流所产生的噪声压降。在印刷电路板上设计接地层通常能有效的降低噪声压降，但是，有些时候由于接地层的过孔过多或其它原因，往往会导致印刷电路板上的某些区域的接地回路阻抗易偏高，从而产生较高的噪声压降，引起电磁干扰，一定程度上影响了其它电路的正常工作。
【发明内容】
鉴于以上内容，有必要提供一种降低电磁干扰的接地装置，用以降低印刷电路板上的电磁干扰。
一种降低电磁干扰的接地装置，其用于降低印刷电路板上的电磁干扰，所述降低电磁干扰的接地装置包括一设置于所述印刷电路板上的导电接地部、一接地端及一连接件，所述导电接地部与所述印刷电路板内的接地点导通，所述连接件包括一第一连接端、一连接部及一第二连接端，所述第一连接端通过所述连接部与所述第二连接端电性连接，所述第一连接端与所述接地端电性连接，所述第二连接端与所述导电接地部电性连接。
在印刷电路板接地回路阻抗偏高的区域设置一导电接地部，并通过所述连接件将该导电接地部直接与所述接地端电性连接，从而直接提供了所述区域与所述接地端相连的较低接地回路阻抗路径，实现了降低所述区域的接地回路阻抗，进而降低了电磁干扰。
【附图说明】
下面参考附图结合具体实施方式对本发明作进一步的说明。
图1为本发明降低电磁干扰的接地装置的较佳实施方式与印刷电路板的分解图。
图2为本发明降低电磁干扰的接地装置的较佳实施方式与印刷电路板的组合图。
【具体实施方式】
请参考图1，本发明降低电磁干扰的接地装置用于降低印刷电路板100(如电脑主板)上的电磁干扰，区域110为印刷电路板100上接地回路阻抗偏高的区域，由于所述区域110的接地层(图未示)的过孔过多或其它原因，导致所述区域110的接地回路阻抗偏高，易产生较高的噪声压降，从而引起电磁干扰。
所述降低电磁干扰的接地装置的较佳实施方式包括一设置于所述区域110的适当位置的裸露导电接地部300(如铜箔)、一接地端120及一连接件200，所述导电接地部300与所述印刷电路板100内的接地点导通，所述印刷电路板100通过所述接地端120可实现对外接地，本实施方式中，所述接地端120为一设置于所述印刷电路板100上其它区域的适当位置的接地孔。
所述连接件200包括一第一连接端210、一连接部220及一第二连接端230，所述第一连接端210通过所述连接部220与所述第二连接端230电性连接，所述第一连接端210、连接部220及第二连接端230均具有良好的导电性。
请共同参考图2，所述第一连接端210与所述接地端120电性连接，本实施方式中，所述第一连接端210通过一螺丝130与所述接地端120电性连接，所述第二连接端230与所述导电接地部300电性连接。为避免所述连接部220与所述印刷电路板100中的非接地点之间短路，可对连接部220的外层作绝缘处理，所述连接部220的大小及形状可根据印刷电路板100的实际情况及所述导电接地部300与所述接地端120之间的位置关系来设计。
由于所述导电接地部300与所述印刷电路板100内的接地点导通，则所述导电接地部300就相当于所述印刷电路板100上接地回路阻抗偏高的区域110的一个接地端子，通过所述连接件200将所述导电接地部300与所述接地端120连接起来，这样就直接提供了所述接地回路阻抗偏高的区域110与所述接地端120相连的较低接地回路阻抗的回路路径，从而减小了因所述区域110的接地回路阻抗偏高而引起的噪声压降，实现了降低印刷电路板100的电磁干扰的目的。

Claims (4)

1.一种降低电磁干扰的接地装置，其用于降低印刷电路板上的电磁干扰，其特征在于：所述降低电磁干扰的接地装置包括一设置于所述印刷电路板上的导电接地部、一接地端及一连接件，所述导电接地部与所述印刷电路板内的接地点导通，所述连接件包括一第一连接端、一连接部及一第二连接端，所述第一连接端通过所述连接部与所述第二连接端电性连接，所述第一连接端与所述接地端电性连接，所述第二连接端与所述导电接地部电性连接。
2.如权利要求1所述的降低电磁干扰的接地装置，其特征在于：所述导电接地部为铜箔。
3.如权利要求2所述的降低电磁干扰的接地装置，其特征在于：所述接地端为一设置于所述印刷电路板上的接地孔，所述第一连接端通过一螺丝与所述接地孔电性连接。
4.如权利要求3所述的降低电磁干扰的接地装置，其特征在于：所述印刷电路板为电脑主板。
CNB2005100372202A 2005-09-09 2005-09-09 降低电磁干扰的接地装置 Expired - Fee Related CN100531543C (zh)

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CNB2005100372202A CN100531543C (zh) 2005-09-09 2005-09-09 降低电磁干扰的接地装置
US11/309,403 US7458844B2 (en) 2005-09-09 2006-08-04 Grounding device for reducing EMI on PCB

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CNB2005100372202A CN100531543C (zh) 2005-09-09 2005-09-09 降低电磁干扰的接地装置

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Publication number Priority date Publication date Assignee Title
US7969158B2 (en) 2008-01-15 2011-06-28 Foxconn Communication Technology Corp. Noise-reduction method for processing a test port
CN102521934A (zh) * 2011-12-14 2012-06-27 福建三元达软件有限公司 一种解决手持式pos终端电磁干扰的方法
CN105636424A (zh) * 2016-03-26 2016-06-01 上海冠瑞医疗设备股份有限公司 一种降低emc的机械结构
CN108832775A (zh) * 2017-05-05 2018-11-16 建准电机工业股份有限公司 马达及用于马达的电磁干扰防护装置
CN111212515A (zh) * 2019-12-28 2020-05-29 惠州Tcl移动通信有限公司 Pcb板及采用该pcb板的终端设备

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Publication number Priority date Publication date Assignee Title
US7969158B2 (en) 2008-01-15 2011-06-28 Foxconn Communication Technology Corp. Noise-reduction method for processing a test port
CN102521934A (zh) * 2011-12-14 2012-06-27 福建三元达软件有限公司 一种解决手持式pos终端电磁干扰的方法
CN105636424A (zh) * 2016-03-26 2016-06-01 上海冠瑞医疗设备股份有限公司 一种降低emc的机械结构
CN108832775A (zh) * 2017-05-05 2018-11-16 建准电机工业股份有限公司 马达及用于马达的电磁干扰防护装置
CN111212515A (zh) * 2019-12-28 2020-05-29 惠州Tcl移动通信有限公司 Pcb板及采用该pcb板的终端设备

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US20070077794A1 (en) 2007-04-05
US7458844B2 (en) 2008-12-02

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