FR2862413B1 - Capteur de mesure a liaisons conductrices sans raideur et procede de fabrication - Google Patents
Capteur de mesure a liaisons conductrices sans raideur et procede de fabricationInfo
- Publication number
- FR2862413B1 FR2862413B1 FR0313495A FR0313495A FR2862413B1 FR 2862413 B1 FR2862413 B1 FR 2862413B1 FR 0313495 A FR0313495 A FR 0313495A FR 0313495 A FR0313495 A FR 0313495A FR 2862413 B1 FR2862413 B1 FR 2862413B1
- Authority
- FR
- France
- Prior art keywords
- stiffness
- manufacture
- measuring sensor
- conductive connections
- connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0313495A FR2862413B1 (fr) | 2003-11-18 | 2003-11-18 | Capteur de mesure a liaisons conductrices sans raideur et procede de fabrication |
US10/571,933 US7400514B2 (en) | 2003-11-18 | 2004-10-27 | Non-rigid conductor link measurement sensor and method for the production thereof |
PCT/EP2004/052680 WO2005050227A1 (fr) | 2003-11-18 | 2004-10-27 | Capteur de mesure a liaisons conductrices sans raideur et procede de fabrication |
EP04818818A EP1685411A1 (fr) | 2003-11-18 | 2004-10-27 | Capteur de mesure a liaisons conductrices sans raideur et procede de fabrication |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0313495A FR2862413B1 (fr) | 2003-11-18 | 2003-11-18 | Capteur de mesure a liaisons conductrices sans raideur et procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2862413A1 FR2862413A1 (fr) | 2005-05-20 |
FR2862413B1 true FR2862413B1 (fr) | 2006-02-17 |
Family
ID=34508556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0313495A Expired - Fee Related FR2862413B1 (fr) | 2003-11-18 | 2003-11-18 | Capteur de mesure a liaisons conductrices sans raideur et procede de fabrication |
Country Status (4)
Country | Link |
---|---|
US (1) | US7400514B2 (fr) |
EP (1) | EP1685411A1 (fr) |
FR (1) | FR2862413B1 (fr) |
WO (1) | WO2005050227A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100531543C (zh) * | 2005-09-09 | 2009-08-19 | 鸿富锦精密工业(深圳)有限公司 | 降低电磁干扰的接地装置 |
CN100555752C (zh) * | 2005-09-16 | 2009-10-28 | 鸿富锦精密工业(深圳)有限公司 | 弹性接触装置及使用该弹性接触装置的电子设备 |
CN106881537A (zh) * | 2015-12-15 | 2017-06-23 | 航天科工惯性技术有限公司 | 一种加速度计接线柱与力矩器的装配方法 |
CN210224218U (zh) * | 2019-07-09 | 2020-03-31 | 天佑电器(苏州)有限公司 | 电池包 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4422128A (en) * | 1981-08-06 | 1983-12-20 | General Motors Corporation | Push-on terminal clip and assembly |
US5185042A (en) * | 1991-08-01 | 1993-02-09 | Trw Inc. | Generic solar cell array using a printed circuit substrate |
US5233871A (en) * | 1991-11-01 | 1993-08-10 | Delco Electronics Corporation | Hybrid accelerometer assembly |
DE4240454A1 (de) * | 1992-12-02 | 1994-06-09 | Vdo Schindling | Elektrische Verbindung bei einem Kombinations-Instrument |
DE4343135A1 (de) * | 1993-12-17 | 1995-06-22 | Bosch Gmbh Robert | Drehratensensor |
US5527187A (en) * | 1994-11-17 | 1996-06-18 | Ford Motor Company | Compliant electrical interconnect |
US6507113B1 (en) * | 1999-11-19 | 2003-01-14 | General Electric Company | Electronic interface structures and methods of fabrication |
JP2003198068A (ja) * | 2001-12-27 | 2003-07-11 | Nec Corp | プリント基板、半導体装置、およびプリント基板と部品との電気的接続構造 |
-
2003
- 2003-11-18 FR FR0313495A patent/FR2862413B1/fr not_active Expired - Fee Related
-
2004
- 2004-10-27 US US10/571,933 patent/US7400514B2/en active Active
- 2004-10-27 WO PCT/EP2004/052680 patent/WO2005050227A1/fr not_active Application Discontinuation
- 2004-10-27 EP EP04818818A patent/EP1685411A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2005050227A1 (fr) | 2005-06-02 |
EP1685411A1 (fr) | 2006-08-02 |
FR2862413A1 (fr) | 2005-05-20 |
US7400514B2 (en) | 2008-07-15 |
US20060276063A1 (en) | 2006-12-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 13 |
|
PLFP | Fee payment |
Year of fee payment: 14 |
|
PLFP | Fee payment |
Year of fee payment: 15 |
|
PLFP | Fee payment |
Year of fee payment: 16 |
|
PLFP | Fee payment |
Year of fee payment: 17 |
|
PLFP | Fee payment |
Year of fee payment: 18 |
|
ST | Notification of lapse |
Effective date: 20220705 |