1291854 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種降低電磁千擾之接地裝置，尤指_ 種用以降低印刷電路板之電磁干擾之接地裝置。 9 【先前技術】 電磁干擾（Electro Magnetic Interference，EMI)係目乂 -産業中存在之一大問題，特別是隨著積體電路之頻J 忍來愈高，其内部之傳輸導線、電源或印刷電路 且 而工作頻率之電子元件都會對外發散出電磁波，而j吏 元件受到干擾，影響正常之工作運作’因此從業^十 ^ ^在降低電磁干擾方面之設計。印刷電路板係整個電 防治電礎係佈局開始時就做好 務。卞役之作係建構尚可靠度電子系統之.首要任 接地部分電磁干擾問題均可透過良好之 目桿係卩夂，俏士個良好之接地系統降低電磁干擾之基本 降回路阻抗之電流所産生之雜訊壓 降，惟，有^地層^常能有效降低雜訊壓 •高’ί二生電4,上某些區域之接地回隸抗易偏 上影響引起電磁干擾，-定程度 行改因良是以知之降低電磁干擾之接地裝置進 【發明内容】 裝置7用〗2Γ ’有必要提供一種降低電磁干擾之接地 印刷電路板上之電磁干擾。 板上之電=干二磁:擾之接地裝置，其用於降低印刷電路 於該印刷電路ί上：：擾之接地裝置包括-設置 導電接地°卩、一接地端及一連接件， 5 1291854 與該印刷電路板内之接 連接端、-連接部及-第二:艾該連接件 接細透過該連接部與該第二接^接端，該第一連 端與該接地端電性連接，該；該第—連接 性連接。 運接知與该導電接地部電 μ置一 ’在印刷電路板接地回路阻抗偏高之巴竹 相連之較偏Li Ϊ 直接提供了該區域與該接地端 回路阻抗，進而降低了電磁干擾。、 _之接地 【實施方式】 請參閱第-圖，本發明降低電磁干擾之接地 於广低印刷電路板100(如電腦上之 '置= 電路板100上接地回路阻抗偏高之區域s1291854 IX. Description of the Invention: [Technical Field] The present invention relates to a grounding device for reducing electromagnetic interference, and more particularly to a grounding device for reducing electromagnetic interference of a printed circuit board. 9 [Prior Art] Electromagnetic Interference (EMI) is a major problem in the industry. Especially with the higher frequency of the integrated circuit, the internal transmission wire, power supply or printing The electronic components of the circuit and the operating frequency will emit electromagnetic waves, and the j-components will be disturbed, which will affect the normal working operation. Therefore, the design of the electromagnetic interference is reduced. The printed circuit board is fully operational when the entire electrical control system layout begins. The construction of the servant system is still reliable electronic system. The primary grounding part of the electromagnetic interference problem can be through a good eye system, a good grounding system to reduce the electromagnetic interference caused by the basic circuit impedance The voltage drop, however, has a ^ layer ^ can often effectively reduce the noise pressure • high 'ί 二 生 4 4, the grounding of some areas on the anti-impedance of the upper part of the impact caused by electromagnetic interference, - degree of change Therefore, it is necessary to provide a grounding device for reducing electromagnetic interference. [Inventive content] Device 7 is used to provide electromagnetic interference on a grounded printed circuit board that reduces electromagnetic interference. On-board electricity = dry two-magnetic: disturbing grounding device, which is used to reduce the printed circuit on the printed circuit ί:: the grounding device of the disturbance includes: setting the conductive grounding point, a grounding end and a connecting piece, 5 1291854 And the connecting end of the printed circuit board, the connecting portion, and the second: the connecting member is closely connected to the connecting portion and the second connecting end, and the first connecting end is electrically connected to the ground end , the first connectivity connection. The transmission and the conductive grounding portion are electrically placed. The relatively biased Li Ϊ connected to the high impedance of the ground circuit of the printed circuit board directly provides the impedance of the loop between the region and the ground, thereby reducing electromagnetic interference. Grounding of _ [Embodiment] Please refer to the figure - the grounding of the electromagnetic interference reduction of the present invention on the wide printed circuit board 100 (such as the computer on the 'set = circuit board 100 grounding circuit impedance is high s
致該區域110之接地回路阻抗偏高之g 降，從而引起電磁干擾。 qdfiM 該降低電磁干擾之接地裝置之較佳實施方 設置於該區域110之適當位置之裸露導電接地部3〇 箔）、一接地端120及一連接件2〇〇，該導電接地部3 ^ 該印刷電路板100内之接地點導通，該印刷電路;·、 過該接地端120可實現對外接地，本實施方式中，， 端120爲一設置於該印刷電路板1〇()上其他區域之 置之接地孔。 ^ § ^ 該連接件200包括一第一連接端21〇、一連接部22〇 及一第二連接端230 ’該第一連接端21 〇透過該連接部220 與該第二連接端230電性連接，該第一連接端21〇、° 部220及第二連接端230均具有良好之導電性。 請一併參閱第二圖，該第一連接端210與該接地端12〇 電性連接，本實施方式中，該第一連接端210透過一螺絲 6 1291854The ground loop impedance of the region 110 is lowered by a high g, causing electromagnetic interference. The preferred embodiment of the grounding device for reducing electromagnetic interference is disposed at a suitable conductive ground portion of the region 110, a grounding electrode 120, and a connecting member 2A. The conductive ground portion 3 The grounding point in the printed circuit board 100 is turned on, and the printed circuit can be grounded through the grounding end 120. In this embodiment, the terminal 120 is disposed on other areas of the printed circuit board 1(). Place the grounding hole. ^ § ^ The connector 200 includes a first connecting end 21 , a connecting portion 22 , and a second connecting end 230 . The first connecting end 21 is electrically connected to the second connecting end 230 . The first connecting end 21, the portion 220 and the second connecting end 230 have good electrical conductivity. As shown in the second figure, the first connecting end 210 is electrically connected to the grounding end 12 ,. In this embodiment, the first connecting end 210 transmits a screw 6 1291854
Sit·該接地端120電性連接，兮笫 窀接地部300電性連接。 二弟〜連接端230與該導 路板100中之非接地點二連接部220與該印刷電 乍絕緣處理，該連接部；2〇丑：大T對該連接部220之外 路板1〇〇之實際情況及診 小及形狀可根據印刷電 之間之位置關係來設計。Λ电妾也部300與該接地端120 由於該導電接地部3 點導通，則該導電接地部電路板100内之接地 上接地回路阻抗偏高之區=目昌於該印刷電路板100 連接件200將該導電接°地3 二個接地端子，透過該 來，這樣就直接提供了該二也 H接$端120連接起 ，地端12_連之較低接地i路n〇與 減小了因該區域1〗〇 抗之口路路後，從而 降，實現了降低印射也回路阻抗偏高而引起之雜訊壓 二見ί卩牛低印刷電路板100之電磁干擾之 。 利申二。Ξ述、’本發明符合發明專利要件，爰依法提出專 凡孰：本幸二上所述者僅為本發明之較佳實施方式，舉 飾ΐί化v皆本發明精神所作之等效修 【圖式簡單說^盍於以下之中請專利範圍内。 第-圖係本發明降低電磁干擾之接地 方式與印刷電路板之分解圖。之車乂仏貫知 弟-圖^發明降低電磁干擾之接地裝置之較 一方式與印刷電路板之組合圖。 、 【主要元件符號說明】 100 110 印刷電路板 區域 接地端 120 1291854 螺絲 130 連接件 200 第一連接端 210 連接部 220 第二連接端 230 導電接地部 300Sit· The grounding end 120 is electrically connected, and the grounding portion 300 is electrically connected. The second-to-be-connected terminal 230 and the non-grounding point two connecting portion 220 in the guiding plate 100 are insulated from the printed circuit, and the connecting portion; 2 ugly: the large T is outside the connecting portion 220 The actual situation and the size and shape of the sputum can be designed according to the positional relationship between the printed electricity. When the grounding end portion 300 is electrically connected to the grounding end 120, the grounding circuit impedance of the grounding circuit in the conductive grounding circuit board 100 is relatively high. 200, the conductive grounding 3 two grounding terminals are transmitted through, so that the second and the H-connected end 120 are directly connected, and the lower grounding i-way of the ground 12_ is reduced and reduced. Because the area 1 〇 〇 之 之 口 , , , , , , , , , , , , , , , , , , , 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 降低 。 。 。 Lishen II. Describing, 'The invention complies with the requirements of the invention patents, and stipulates that the above-mentioned ones are only the preferred embodiments of the present invention, and the decoration ΐ 化 v is the equivalent repair of the spirit of the present invention. It is simple to say that it is within the scope of the patent. The first figure is an exploded view of the grounding method of the electromagnetic interference and the printed circuit board of the present invention. The car is known to the younger brother - Fig. 2 is a combination of a comparison of the manner of the grounding device for reducing electromagnetic interference and the printed circuit board. [Main component symbol description] 100 110 Printed circuit board area Ground terminal 120 1291854 Screw 130 Connector 200 First connection end 210 Connection part 220 Second connection end 230 Conductive grounding part 300