CN1922339B - 冷凝效应最小化的蒸汽沉积源 - Google Patents

冷凝效应最小化的蒸汽沉积源 Download PDF

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Publication number
CN1922339B
CN1922339B CN2005800056114A CN200580005611A CN1922339B CN 1922339 B CN1922339 B CN 1922339B CN 2005800056114 A CN2005800056114 A CN 2005800056114A CN 200580005611 A CN200580005611 A CN 200580005611A CN 1922339 B CN1922339 B CN 1922339B
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China
Prior art keywords
source
container
vessel
heating
opening
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Expired - Lifetime
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CN2005800056114A
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English (en)
Chinese (zh)
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CN1922339A (zh
Inventor
J·M·格雷斯
D·R·弗里曼
J·H·克卢格
N·P·雷登
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Global OLED Technology LLC
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Global OLED Technology LLC
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Publication of CN1922339A publication Critical patent/CN1922339A/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN2005800056114A 2004-02-25 2005-02-11 冷凝效应最小化的蒸汽沉积源 Expired - Lifetime CN1922339B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/786,859 2004-02-25
US10/786,859 US6893939B1 (en) 2004-02-25 2004-02-25 Thermal physical vapor deposition source with minimized internal condensation effects
PCT/US2005/004394 WO2005083145A2 (en) 2004-02-25 2005-02-11 Vapor deposition source with minimized condensation effects

Publications (2)

Publication Number Publication Date
CN1922339A CN1922339A (zh) 2007-02-28
CN1922339B true CN1922339B (zh) 2010-08-25

Family

ID=34574859

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005800056114A Expired - Lifetime CN1922339B (zh) 2004-02-25 2005-02-11 冷凝效应最小化的蒸汽沉积源

Country Status (6)

Country Link
US (1) US6893939B1 (https=)
JP (1) JP4718538B2 (https=)
KR (1) KR101136879B1 (https=)
CN (1) CN1922339B (https=)
TW (1) TWI394854B (https=)
WO (1) WO2005083145A2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
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US7364772B2 (en) * 2004-03-22 2008-04-29 Eastman Kodak Company Method for coating an organic layer onto a substrate in a vacuum chamber
KR101106289B1 (ko) * 2006-08-04 2012-01-18 순천향대학교 산학협력단 증착 공정을 위한 선형 증착 소스
US20080173241A1 (en) * 2006-12-19 2008-07-24 Scott Wayne Priddy Vapor deposition sources and methods
WO2010080109A1 (en) * 2008-12-18 2010-07-15 Veeco Instruments Inc. Vacuum deposition sources having heated effusion orifices
WO2010110871A2 (en) * 2009-03-25 2010-09-30 Veeco Instruments Inc. Deposition of high vapor pressure materials
US20110195187A1 (en) * 2010-02-10 2011-08-11 Apple Inc. Direct liquid vaporization for oleophobic coatings
US8715779B2 (en) 2011-06-24 2014-05-06 Apple Inc. Enhanced glass impact durability through application of thin films
JP2014189807A (ja) * 2013-03-26 2014-10-06 Canon Tokki Corp 蒸発源装置
CN104099570B (zh) * 2013-04-01 2016-10-05 上海和辉光电有限公司 单点线性蒸发源系统
KR102096049B1 (ko) * 2013-05-03 2020-04-02 삼성디스플레이 주식회사 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조 방법 및 유기발광 디스플레이 장치
CN104213077A (zh) * 2013-05-30 2014-12-17 海洋王照明科技股份有限公司 一种用于有机电致发光器件的蒸发设备
WO2018114373A1 (en) * 2016-12-22 2018-06-28 Flisom Ag Linear source for vapor deposition with at least three electrical heating elements
JP7011521B2 (ja) * 2018-04-17 2022-01-26 株式会社アルバック 真空蒸着装置用の蒸着源

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5532102A (en) * 1995-03-30 1996-07-02 Xerox Corporation Apparatus and process for preparation of migration imaging members
CN1291241A (zh) * 1998-02-19 2001-04-11 第一阳光有限公司 积淀半导体材料的装置和方法
US6237529B1 (en) * 2000-03-03 2001-05-29 Eastman Kodak Company Source for thermal physical vapor deposition of organic electroluminescent layers
CN1422976A (zh) * 2001-11-28 2003-06-11 伊斯曼柯达公司 用于生产有机发光装置的热物理蒸汽沉积源
CN1444423A (zh) * 2002-03-08 2003-09-24 伊斯曼柯达公司 用于制造有机发光器件的长条形热物理蒸汽淀积源

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US4356429A (en) 1980-07-17 1982-10-26 Eastman Kodak Company Organic electroluminescent cell
US4539507A (en) 1983-03-25 1985-09-03 Eastman Kodak Company Organic electroluminescent devices having improved power conversion efficiencies
EP0134280A1 (de) * 1983-08-29 1985-03-20 idn inventions and development of novelties ag Magazin für Tonaufzeichnungsträger
US4720432A (en) 1987-02-11 1988-01-19 Eastman Kodak Company Electroluminescent device with organic luminescent medium
US4769292A (en) 1987-03-02 1988-09-06 Eastman Kodak Company Electroluminescent device with modified thin film luminescent zone
JPH07118839A (ja) * 1993-10-22 1995-05-09 Mitsubishi Heavy Ind Ltd 金属蒸気発生装置
US5550066A (en) 1994-12-14 1996-08-27 Eastman Kodak Company Method of fabricating a TFT-EL pixel
US6337102B1 (en) 1997-11-17 2002-01-08 The Trustees Of Princeton University Low pressure vapor phase deposition of organic thin films
JPH11246963A (ja) * 1998-03-05 1999-09-14 Nikon Corp 蒸着用ボートとそれを用いて成膜した光学薄膜
JP2001279428A (ja) * 2000-03-31 2001-10-10 Matsushita Electric Ind Co Ltd 蒸着ボート
US20030168013A1 (en) * 2002-03-08 2003-09-11 Eastman Kodak Company Elongated thermal physical vapor deposition source with plural apertures for making an organic light-emitting device
US6749906B2 (en) * 2002-04-25 2004-06-15 Eastman Kodak Company Thermal physical vapor deposition apparatus with detachable vapor source(s) and method
EP1560468B1 (en) * 2002-07-19 2018-03-21 LG Display Co., Ltd. Source for thermal physical vapor deposition of organic electroluminescent layers
US20040144321A1 (en) * 2003-01-28 2004-07-29 Eastman Kodak Company Method of designing a thermal physical vapor deposition system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5532102A (en) * 1995-03-30 1996-07-02 Xerox Corporation Apparatus and process for preparation of migration imaging members
CN1291241A (zh) * 1998-02-19 2001-04-11 第一阳光有限公司 积淀半导体材料的装置和方法
US6237529B1 (en) * 2000-03-03 2001-05-29 Eastman Kodak Company Source for thermal physical vapor deposition of organic electroluminescent layers
CN1422976A (zh) * 2001-11-28 2003-06-11 伊斯曼柯达公司 用于生产有机发光装置的热物理蒸汽沉积源
CN1444423A (zh) * 2002-03-08 2003-09-24 伊斯曼柯达公司 用于制造有机发光器件的长条形热物理蒸汽淀积源

Also Published As

Publication number Publication date
JP2007524763A (ja) 2007-08-30
US6893939B1 (en) 2005-05-17
KR20060123578A (ko) 2006-12-01
CN1922339A (zh) 2007-02-28
WO2005083145A2 (en) 2005-09-09
KR101136879B1 (ko) 2012-04-20
JP4718538B2 (ja) 2011-07-06
TW200532037A (en) 2005-10-01
TWI394854B (zh) 2013-05-01
WO2005083145A3 (en) 2006-02-02

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C06 Publication
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SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: GLOBAL OLED SCIENCE AND TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: EASMAN KODA CO., LTD.

Effective date: 20100421

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: NEW YORK STATE, U.S.A. TO: DELAWARE STATE, U.S.A.

TA01 Transfer of patent application right

Effective date of registration: 20100421

Address after: Delaware, USA

Applicant after: Global OLED Technology LLC

Address before: American New York

Applicant before: Eastman Kodak Co.

C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20100825

CX01 Expiry of patent term