TWI394854B - 具最小化凝結效應之汽相沈積源 - Google Patents

具最小化凝結效應之汽相沈積源 Download PDF

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Publication number
TWI394854B
TWI394854B TW094105633A TW94105633A TWI394854B TW I394854 B TWI394854 B TW I394854B TW 094105633 A TW094105633 A TW 094105633A TW 94105633 A TW94105633 A TW 94105633A TW I394854 B TWI394854 B TW I394854B
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TW
Taiwan
Prior art keywords
container
source
pores
heating
substrate
Prior art date
Application number
TW094105633A
Other languages
English (en)
Chinese (zh)
Other versions
TW200532037A (en
Inventor
葛瑞斯 傑瑞米Ｍ
弗瑞曼 丹尼斯Ｒ
可魯 賈斯汀Ｈ
瑞登 尼爾Ｐ
Original Assignee
全球Ｏｌｅｄ科技公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 全球Ｏｌｅｄ科技公司 filed Critical 全球Ｏｌｅｄ科技公司
Publication of TW200532037A publication Critical patent/TW200532037A/zh
Application granted granted Critical
Publication of TWI394854B publication Critical patent/TWI394854B/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW094105633A 2004-02-25 2005-02-24 具最小化凝結效應之汽相沈積源 TWI394854B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/786,859 US6893939B1 (en) 2004-02-25 2004-02-25 Thermal physical vapor deposition source with minimized internal condensation effects

Publications (2)

Publication Number Publication Date
TW200532037A TW200532037A (en) 2005-10-01
TWI394854B true TWI394854B (zh) 2013-05-01

Family

ID=34574859

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105633A TWI394854B (zh) 2004-02-25 2005-02-24 具最小化凝結效應之汽相沈積源

Country Status (6)

Country Link
US (1) US6893939B1 (https=)
JP (1) JP4718538B2 (https=)
KR (1) KR101136879B1 (https=)
CN (1) CN1922339B (https=)
TW (1) TWI394854B (https=)
WO (1) WO2005083145A2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7364772B2 (en) * 2004-03-22 2008-04-29 Eastman Kodak Company Method for coating an organic layer onto a substrate in a vacuum chamber
KR101106289B1 (ko) * 2006-08-04 2012-01-18 순천향대학교 산학협력단 증착 공정을 위한 선형 증착 소스
US20080173241A1 (en) * 2006-12-19 2008-07-24 Scott Wayne Priddy Vapor deposition sources and methods
WO2010080109A1 (en) * 2008-12-18 2010-07-15 Veeco Instruments Inc. Vacuum deposition sources having heated effusion orifices
WO2010110871A2 (en) * 2009-03-25 2010-09-30 Veeco Instruments Inc. Deposition of high vapor pressure materials
US20110195187A1 (en) * 2010-02-10 2011-08-11 Apple Inc. Direct liquid vaporization for oleophobic coatings
US8715779B2 (en) 2011-06-24 2014-05-06 Apple Inc. Enhanced glass impact durability through application of thin films
JP2014189807A (ja) * 2013-03-26 2014-10-06 Canon Tokki Corp 蒸発源装置
CN104099570B (zh) * 2013-04-01 2016-10-05 上海和辉光电有限公司 单点线性蒸发源系统
KR102096049B1 (ko) * 2013-05-03 2020-04-02 삼성디스플레이 주식회사 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조 방법 및 유기발광 디스플레이 장치
CN104213077A (zh) * 2013-05-30 2014-12-17 海洋王照明科技股份有限公司 一种用于有机电致发光器件的蒸发设备
WO2018114373A1 (en) * 2016-12-22 2018-06-28 Flisom Ag Linear source for vapor deposition with at least three electrical heating elements
JP7011521B2 (ja) * 2018-04-17 2022-01-26 株式会社アルバック 真空蒸着装置用の蒸着源

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1342808A1 (en) * 2002-03-08 2003-09-10 Eastman Kodak Company Elongated thermal physical vapor deposition source with plural apertures for making an organic light-emitting device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4356429A (en) 1980-07-17 1982-10-26 Eastman Kodak Company Organic electroluminescent cell
US4539507A (en) 1983-03-25 1985-09-03 Eastman Kodak Company Organic electroluminescent devices having improved power conversion efficiencies
EP0134280A1 (de) * 1983-08-29 1985-03-20 idn inventions and development of novelties ag Magazin für Tonaufzeichnungsträger
US4720432A (en) 1987-02-11 1988-01-19 Eastman Kodak Company Electroluminescent device with organic luminescent medium
US4769292A (en) 1987-03-02 1988-09-06 Eastman Kodak Company Electroluminescent device with modified thin film luminescent zone
JPH07118839A (ja) * 1993-10-22 1995-05-09 Mitsubishi Heavy Ind Ltd 金属蒸気発生装置
US5550066A (en) 1994-12-14 1996-08-27 Eastman Kodak Company Method of fabricating a TFT-EL pixel
US5532102A (en) * 1995-03-30 1996-07-02 Xerox Corporation Apparatus and process for preparation of migration imaging members
US6337102B1 (en) 1997-11-17 2002-01-08 The Trustees Of Princeton University Low pressure vapor phase deposition of organic thin films
US6037241A (en) * 1998-02-19 2000-03-14 First Solar, Llc Apparatus and method for depositing a semiconductor material
JPH11246963A (ja) * 1998-03-05 1999-09-14 Nikon Corp 蒸着用ボートとそれを用いて成膜した光学薄膜
US6237529B1 (en) * 2000-03-03 2001-05-29 Eastman Kodak Company Source for thermal physical vapor deposition of organic electroluminescent layers
JP2001279428A (ja) * 2000-03-31 2001-10-10 Matsushita Electric Ind Co Ltd 蒸着ボート
US20030101937A1 (en) * 2001-11-28 2003-06-05 Eastman Kodak Company Thermal physical vapor deposition source for making an organic light-emitting device
CN1444423A (zh) * 2002-03-08 2003-09-24 伊斯曼柯达公司 用于制造有机发光器件的长条形热物理蒸汽淀积源
US6749906B2 (en) * 2002-04-25 2004-06-15 Eastman Kodak Company Thermal physical vapor deposition apparatus with detachable vapor source(s) and method
EP1560468B1 (en) * 2002-07-19 2018-03-21 LG Display Co., Ltd. Source for thermal physical vapor deposition of organic electroluminescent layers
US20040144321A1 (en) * 2003-01-28 2004-07-29 Eastman Kodak Company Method of designing a thermal physical vapor deposition system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1342808A1 (en) * 2002-03-08 2003-09-10 Eastman Kodak Company Elongated thermal physical vapor deposition source with plural apertures for making an organic light-emitting device

Also Published As

Publication number Publication date
JP2007524763A (ja) 2007-08-30
US6893939B1 (en) 2005-05-17
KR20060123578A (ko) 2006-12-01
CN1922339A (zh) 2007-02-28
WO2005083145A2 (en) 2005-09-09
KR101136879B1 (ko) 2012-04-20
CN1922339B (zh) 2010-08-25
JP4718538B2 (ja) 2011-07-06
TW200532037A (en) 2005-10-01
WO2005083145A3 (en) 2006-02-02

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