CN1918757A - 汇流条的焊接槽 - Google Patents
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- 238000005476 soldering Methods 0.000 title abstract description 6
- 238000003466 welding Methods 0.000 claims description 34
- 239000004065 semiconductor Substances 0.000 claims description 17
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 10
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Seats For Vehicles (AREA)
- Automotive Seat Belt Assembly (AREA)
- Machines For Laying And Maintaining Railways (AREA)
Abstract
一种汇流条内设置的焊接槽,具有用于引入要焊接的终端引线(40)的孔,终端引线的引入从汇流条(10)的第一表平面实现,焊接从汇流条(10)的第二个、相对的表平面实现。所述孔通过圆锥孔(20)形成,该圆锥孔(20)垂直或近似垂直于汇流条(10)的表平面,其锥角至少是30°。圆锥孔(20)的顶朝向汇流条(10)的第一表平面,圆锥孔(20)终止于圆形孔(21),该圆形孔(21)的直径稍大于终端引线(40)的直径。
Description
技术领域
本发明涉及一种汇流条的焊接槽(soldering nest),它主要应用在包括半导体的功率-电流器件和功率-电流控制系统中。
背景技术
在使用铜或黄铜汇流条传导至少10A电流的功率-电流系统中,半导体器件和连接导线的末端是通过焊接连接到汇流条的。基于缺陷统计和工业废品的检查,发现大多数的缺陷都发生在焊接位置。这些缺陷可以主要被分为两大类:在焊接过程中或作为其结果发生的半导体元件的缺陷,以及由于不良接触而发生在焊接位置的缺陷,后者只有在长期的使用之后才会被注意到。
在准备焊接的时候,为了焊接圆柱形的元件(导线末端或半导体的电极终端引线),在平坦的汇流条上设置了直径大于元件导线直径的圆柱孔。有时候,这些孔通过电镀来处理。然后导线末端在焊接之前被放进孔内。通过放置在汇流条那一侧的电烙铁或其它合适的焊接工具,通常伴随着熔化的焊锡的插入,进行热传导,其中该汇流条的一侧与引入元件的位置相对。
因为汇流条是良好的导热体,而且需要长时间的热传导以通过孔或间隙获得所需的温度,用于适当地熔化焊接材料,这样就遇到了问题。在发生短时间热传导的情况下,沿着合适的大表面不能获得结合,并且当提供一些电连接时,其转移阻抗将会很大。这种情况导致了只有在长期使用的过程中才会显现出来的缺陷,这是因为由较小的连接面积引起的较大的转移阻抗导致了局部发热,这进一步破坏了接触点,并迟早会使缺陷显而易见。如果烙铁放置的时间超过获得合适的温度所必须的时间,半导体的终端引线会受到长时间过热的影响,作为良好的热传导性的结果,半导体将会因为长期高温受到不利影响。最佳状态非常不确定,并取决于许多难以控制的因素。
发明内容
本发明的目的是设置一种焊接槽,它能使汇流条和要焊接的圆柱形元件之间的结合更可靠和更易实现,并且影响半导体的热量也更适度。
为了实现上述目的,已经认识到汇流条内设置的孔应该是圆锥形,而不是圆柱形,另外,孔的宽的一侧应该在汇流条那一侧,该侧与引入圆柱形元件侧相对。锥角至少是30°,适宜地50°-90°,并且在锥顶设置孔,该孔宽松地适合圆柱形元件的直径以允许它易于引入。
根据优选实施例,该孔是短的圆柱形部分,该部分变为加宽的锥。
附图说明
本发明的解决方案将通过实例并结合附图进行进一步的详细讨论,其中:
图1是根据现有技术的焊接接缝的示意性剖面图,以及
图2是根据本发明的设置在汇流条内的焊接槽的剖面图。
具体实施方式
图1示出了传统的解决方案。汇流条1是一种良好的导电和导热材料,如铜、铜合金或银,并包含圆柱形的焊接孔2。半导体器件(未示出)的终端引线4可以宽松地安装到焊接孔2中。半导体终端引线是圆柱形的,并是易于焊接的材料。具有相似直径,但不属于半导体的导线末端可以代替半导体终端引线4被连接到汇流条1。为了更好的示范,图1的尺寸被扩大了:实际上,焊接孔2和终端引线4之间的距离更小。
在某些情况下,终端引线4伸出汇流条1的平面外的末端被切断。为了实施焊接,热烙铁(未示出)接触汇流条的表面,该表面与半导体器件相对,并且在汇流条的平面和烙铁之间放置有焊锡,焊锡熔化并增强沿大面积的热传导。因为汇流条1相对较厚并是良好的导热体,烙铁的热量沿着大的表面快速传播。然而,在表平面的横向上,汇流条1,尤其是面向半导体器件的孔2的一侧,加热相对较晚。加热的速度被以下事实所妨碍:半导体器件使终端引线4变凉,此外,熔化的锡不能沿着终端引线4和孔2之间的狭窄缝隙传导合适的热量。实施焊接操作的技术人员要一直观察汇流条1的外表面,并且一观察到锡的熔化和流动就推断出终端引线4和汇流条1已经很好地结合,并因此移开烙铁,且使用冷却剂来冷却汇流条。这样的焊接可能导致汇流条1和焊接材料以及焊接材料和终端引线4之间的结合只是在孔2最上面的小部分内。这种不足的结合不能确保符合要求的电连接,此外,这种结合的机械强度也不够。电负载可能引起局部发热,这导致结合的进一步恶化以及可能引起更严重的发热。在系统或半导体器件受到机械力或振动的影响的情况下,终端引线4上的机械压力也会削弱焊料。在适当焊接的情况下,孔2的内部就会被焊接材料3填满,焊接材料3在表面张力的作用下具有凹的上表面和凸的下表面。
如果实施焊接的技术人员熟悉上面概述的问题,并使得烙铁保持在适当的位置超过必需的一段时间,则汇流条1的过热可能使未示出的半导体器件过热,因此同样会造成损坏,同样焊接在汇流条1上的孔2附近的器件也会过热。
图2示出了根据本发明的解决方案,在汇流条10内设置了圆锥孔20。要被焊接的半导体器件及其终端引线40从圆锥孔20的窄端接入汇流条10。圆锥孔20朝向半导体器件的末端具有圆形孔21,其具有与孔2相似的直径,并可以和圆锥孔20直接或通过短的圆柱形部分(未示出)连接。圆锥孔20的锥角适宜地在50°-90°之间;它的大小并不严格,但是最少应该是30°。
在实施焊接中,烙铁也是从汇流条10的与半导体器件相对的一侧靠近,但是,在这种情况下,烙铁的下面可以放置更多的熔化焊锡。熔化的焊锡与圆锥孔20的整个圆锥面相接触,并且熔化的焊接材料30立刻充满了圆锥形的空腔。由于在终端引线40和汇流条10中的区域内,以及在圆锥孔20的区域内,具有大的热传导表面,所以汇流条10被迅速加热并达到焊接需要的温度。然而,同时,在窄孔21的区域内,因为包围着孔21的相对冷的汇流条10,以及因为半导体器件的冷却作用,大量热量不能垂直于汇流条10的表平面穿过汇流条。因为烙铁和汇流条10之间需要接触的时间比根据图1的解决方案少很多,在移开烙铁之后,被较少加热的汇流条10冷却焊锡,冷却主要表现在靠近锥顶的一侧。可以通过从焊接侧使用冷却剂来加快冷却速度。
圆锥孔20和焊接材料30的内表面显著地大于圆柱孔2的内表面,大表面整个承担了焊接所需的温度;进一步地,确保了终端引线40沿着它的整个长度的均匀焊接结合。众所周知,此刻焊锡凝固,在相邻表面的区域内可获得所需的温度和无氧化物表面。大的焊接空间也加强了焊锡内出现的助熔剂作用的适当结果。
焊接材料30由于表面张力形成了凸起的顶部表面。
根据如图1所示的现有技术的解决方案和如图2所示的根据本发明的解决方案之间的比较表明,给定同样尺寸,根据本发明,焊接材料30与汇流条10的接触面积是根据现有技术的焊接材料3与汇流条1的接触面积的两倍多。此外,根据本发明的解决方案消除了前面讨论的问题并产生了明显著更有利的结合。
这样,由于上述根据本发明的解决方案,获得了一种快速和高质量的结合,它将汇流条10和终端引线40在大面积上以很小的内部阻抗连接起来。半导体器件上的由热量引起的压力比使用传统的圆柱孔2的解决方案小很多。尤其在涉及大电流和大机械负载的应用中,所获得的高质量的结合提高了短期和长期可靠性。
Claims (3)
1.一种在汇流条内设置的焊接槽,所述汇流条具有用来引入要焊接的终端引线(40)的孔,所述终端引线的引入可以从所述汇流条(10)的第一表平面实现,焊接从所述汇流条(10)的第二个、相对的表平面实现,其特征在于:所述孔由圆锥孔(20)形成,所述圆锥孔(20)垂直或近似垂直于所述汇流条(10)的表平面,并且其锥角至少是30°;所述圆锥孔(20)的顶朝向所述汇流条(10)的所述第一表平面,并且所述圆锥孔(20)终止于圆形孔(21),所述圆形孔(21)的直径稍大于所述终端引线(40)的直径。
2.根据权利要求1的焊接槽,其特征在于所述锥角在50°至90°之间。
3.根据权利要求1的焊接槽,其特征在于所述终端引线(40)是半导体器件的一部分。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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HU0400420A HU225976B1 (en) | 2004-02-16 | 2004-02-16 | Brazing seat for guiding rail |
HUP0400420 | 2004-02-16 |
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CN1918757A true CN1918757A (zh) | 2007-02-21 |
CN100407517C CN100407517C (zh) | 2008-07-30 |
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CN2005800050226A Expired - Fee Related CN100407517C (zh) | 2004-02-16 | 2005-02-16 | 汇流条的焊接槽 |
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US (1) | US8003894B2 (zh) |
EP (1) | EP1721369B1 (zh) |
JP (1) | JP2007522631A (zh) |
CN (1) | CN100407517C (zh) |
AT (1) | ATE391354T1 (zh) |
DE (1) | DE602005005800T2 (zh) |
HK (1) | HK1104684A1 (zh) |
HU (1) | HU225976B1 (zh) |
WO (1) | WO2005078873A1 (zh) |
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CN111183555A (zh) * | 2017-10-24 | 2020-05-19 | 拓自达电线株式会社 | 电线连接结构、电线连接方法、及接线桩 |
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JP3208924U (ja) | 2013-08-30 | 2017-03-02 | ハネウェル・インターナショナル・インコーポレーテッド | 電流測定システムに対する妨害排除 |
US9450391B2 (en) * | 2014-02-17 | 2016-09-20 | Honeywell International Inc. | Optimized current bus |
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US4001490A (en) * | 1974-06-19 | 1977-01-04 | Amp Incorporated | Strip bus bar for terminal posts |
JPS5577882A (en) * | 1978-12-04 | 1980-06-12 | Taiwa Noki Kk | Bulb treating device |
JPS58169996A (ja) * | 1982-03-31 | 1983-10-06 | 富士通株式会社 | 電気的接続装置 |
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JPH0777285B2 (ja) * | 1989-02-03 | 1995-08-16 | 三菱電機株式会社 | 大電流基板装置 |
US5065283A (en) * | 1990-06-12 | 1991-11-12 | Mitsubishi Denki Kabushiki Kaisha | Printed circuit board with busbar interconnections |
JPH0933608A (ja) * | 1995-07-24 | 1997-02-07 | Fujitsu Ltd | 半導体試験用テストカード |
HU9503225D0 (en) * | 1995-11-10 | 1996-01-29 | Battery Technologies Inc | Method for preparing a cylindrical separator a tool usable for the method and a cylindrical cell with the separator |
JP3643656B2 (ja) * | 1996-09-26 | 2005-04-27 | 株式会社バッファロー | Bgaパッケージ用実装基板 |
CN2351844Y (zh) * | 1998-12-29 | 1999-12-01 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
CN2360949Y (zh) * | 1998-12-29 | 2000-01-26 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
JP2001068176A (ja) * | 1999-08-23 | 2001-03-16 | Unisia Jecs Corp | 平板端子とピン端子との接合方法 |
JP2001135906A (ja) * | 1999-11-05 | 2001-05-18 | Yazaki Corp | 配線板の電気部品接続構造 |
JP2004243323A (ja) * | 2003-02-10 | 2004-09-02 | Anden | 電気装置の溶接構造および溶接方法 |
JP2005129498A (ja) * | 2003-10-01 | 2005-05-19 | Shindengen Electric Mfg Co Ltd | バスバーと導電部材との接続方法及び構造 |
-
2004
- 2004-02-16 HU HU0400420A patent/HU225976B1/hu not_active IP Right Cessation
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2005
- 2005-02-16 JP JP2006552700A patent/JP2007522631A/ja active Pending
- 2005-02-16 AT AT05718149T patent/ATE391354T1/de active
- 2005-02-16 DE DE602005005800T patent/DE602005005800T2/de active Active
- 2005-02-16 EP EP05718149A patent/EP1721369B1/en not_active Not-in-force
- 2005-02-16 CN CN2005800050226A patent/CN100407517C/zh not_active Expired - Fee Related
- 2005-02-16 WO PCT/HU2005/000016 patent/WO2005078873A1/en active IP Right Grant
- 2005-02-16 US US10/589,569 patent/US8003894B2/en not_active Expired - Fee Related
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111183555A (zh) * | 2017-10-24 | 2020-05-19 | 拓自达电线株式会社 | 电线连接结构、电线连接方法、及接线桩 |
EP3703187A4 (en) * | 2017-10-24 | 2021-07-21 | Tatsuta Electric Wire & Cable Co., Ltd. | CONNECTING STRUCTURE OF AN ELECTRIC WIRE, CONNECTING METHOD FOR AN ELECTRIC WIRE, AND CLAMP |
CN111183555B (zh) * | 2017-10-24 | 2022-02-11 | 拓自达电线株式会社 | 电线连接结构、电线连接方法、及接线桩 |
US11862918B2 (en) | 2017-10-24 | 2024-01-02 | Tatsuta Electric Wire & Cable Co., Ltd. | Electric wire joining structure, electric wire joining method, and terminal |
Also Published As
Publication number | Publication date |
---|---|
HU0400420D0 (en) | 2004-04-28 |
US20070202716A1 (en) | 2007-08-30 |
HU225976B1 (en) | 2008-02-28 |
HUP0400420A2 (hu) | 2005-07-28 |
DE602005005800T2 (de) | 2009-04-16 |
DE602005005800D1 (de) | 2008-05-15 |
US8003894B2 (en) | 2011-08-23 |
EP1721369B1 (en) | 2008-04-02 |
EP1721369A1 (en) | 2006-11-15 |
CN100407517C (zh) | 2008-07-30 |
HK1104684A1 (en) | 2008-01-18 |
ATE391354T1 (de) | 2008-04-15 |
JP2007522631A (ja) | 2007-08-09 |
WO2005078873A1 (en) | 2005-08-25 |
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