CN1877828A - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN1877828A
CN1877828A CN200510035227.0A CN200510035227A CN1877828A CN 1877828 A CN1877828 A CN 1877828A CN 200510035227 A CN200510035227 A CN 200510035227A CN 1877828 A CN1877828 A CN 1877828A
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heat
heat abstractor
liquid
pedestal
chamber
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CN100499089C (zh
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赖振田
周志勇
温江建
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200510035227.0A priority Critical patent/CN100499089C/zh
Priority to US11/164,282 priority patent/US7240722B2/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029Heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置,包括一与热源接触的基座、一散热片组及一将基座与散热片组连接的热管,其中该基座内形成一可供液体流动的腔室,该基座另设有与腔室相通的一液体入口及一液体出口从而供液体流入、流出腔室。由于液冷散热装置布置灵活,可将热源的热量传递到通风好、安装方便的适当位置通过较大的散热器散发,故本发明散热装置与单一热管散热装置相比,性能有较大提升。

Description

散热装置
【技术领域】
本发明涉及一种散热装置,特别是指一种冷却电子元件的散热装置。
【背景技术】
电子元件(如中央处理器)运行时产生大量热,而使其本身及系统温度升高,继而导致其运行性能的下降。为确保电子元件能正常运行,通常在电子元件上安装散热装置,排出其所产生的大量热量。
目前较常用的是风冷式散热装置,即在中央处理器上覆盖散热片,散热片材料选用铜或铝等热传导性良好的金属,为增加散热面积,散热片往往较多。随着中央处理器发热量的增加,采用的散热片的体积逐渐增大,但受到可利用空间、重量等因素的限制,其散热性能无法获得突破性提高。
另有一种采用热管的散热装置,其原理是利用热管较高的热传导性将中央处理器等热源产生的热量传输到散热片,进而将热量散发。与上述风冷式散热装置相比,散热性能有较大的提升,然而,受到热管成形及结构限制,这种散热装置布置不灵活,热管吸收的热量仍只能在中央处理器周围较近的空间散发,导致中央处理器周围环境温度升高而影响其他元件正常工作。
【发明内容】
以下通过实施例对本发明予以说明。
本发明实施例的散热装置,包括一与热源接触的基座、一散热片组及一将基座与散热片组连接的热管,其中该基座内形成一可供液体流动的腔室,该基座另设有与腔室相通的一液体入口及一液体出口从而供液体流入、流出腔室。
该实施方式与现有技术相比具有如下优点:散热装置采用热管散热与液冷散热两种方式对热源降温,由于液冷散热装置布置灵活,可将热源的热量传递到通风好、安装方便的适当位置通过较大的散热器散发,故本发明散热装置与单纯热管散热装置相比,性能有较大提升。
下面参照附图,结合具体实施例对本发明作进一步的描述。
【附图说明】
图1是本发明散热装置的立体图。
图2是图1的仰视图。
图3是图1中的底板倒置的立体结构图。
图4是图1中的盖板倒置的立体结构图。
图5是本发明散热装置的完整的结构示意图。
【具体实施方式】
本发明散热装置是用来对中央处理器(图未示)等发热电子元件进行散热。
请参阅图1及图2,是本发明散热装置的实施例。该散热装置包括一内部具有腔室的基座2。该散热装置还包括两热管4及一由若干相互平行的堆叠散热片组成的散热片组6。其中,热管4包括一与基座2底板22接触的、且呈扁平状的吸热段42及一穿过上述散热片组6的放热段44。
基座2是由一与热源接触的底板22及一设于该底板22上的盖板24组成。如图3所示,底板22是由导热性能良好的材料如金属铜或铝等制成,其底面间隔设有相互平行的两沟槽222用以容置热管4的吸热段42。底板22的底面及热管4的吸热段42形成一可与热源直接接触的平面。
如图4所示,盖板24上与底板22相接一侧设有一内凹部242,且在盖板24上设有与该内凹部62分别连通的一液体入口244及一液体出口246。将盖板24固定在底板22上,内凹部242则形成基座2内的腔室,而液体入口244及液体出口246可供冷却液体流入、流出腔室。冷却液体如水或其它类似性质的液体通过液体入口244及液体出口246在基座2的腔室内循环流动从而冷却底板22进而冷却与之接触的热源。为提升基座2的散热性能,可将液体入口244设于盖板24中央以便使流入腔室的冷却液体直接与底板22中央部分接触从而将热源产生的热量快速吸收。
图5所示为本发明散热装置与相关元件组合而形成的完整结构:基座2的液体入口244及液体出口246通过管路元件7与液压泵8等动力组件、设于适当空间的散热器9等连接从而组成液体循环回路。液压泵8驱动冷却液体在基座2、散热器9之间循环流动,通过散热器9将使冷却液体在基座2内吸收的热量散失,从而达到对热源降温的目的。
在实际使用时,热源产生的热量一部分被热管4的吸热段42吸收并传导至其放热段44,再通过设于其放热段44上的散热片组6将热量散发;另一部分热量被底板22吸收并传给腔室内的冷却液体,再通过液体的循环流动而将热量带出,从而也达到对热源降温的目的。
由于液冷散热装置布置灵活,可将热源的热量传递到通风好、安装方便的适当位置通过较大的散热器散发,故本发明散热装置与单纯热管散热装置相比,性能有较大提升。
可以理解的,底板与盖板组合形成可供液体流经的腔室,该腔室也可由底板上设置凹入部与设于其上的一盖板组成;热管的吸热段也可以伸入腔室内并与液体接触而吸热。

Claims (10)

1.一种散热装置,包括一与热源接触的基座、一散热片组及一将基座与散热片组连接的热管,其特征在于:该基座内形成一可供液体流动的腔室,该基座另设有与腔室相通的一液体入口及一液体出口从而供液体流入、流出腔室。
2.如权利要求1所述的散热装置,其特征在于:该散热装置还包括一液压泵、一散热器及管路组件,且基座上的液体入口及液体出口通过管路组件与液压泵及散热器连接而组成一液体循环回路。
3.如权利要求1或2所述的散热装置,其特征在于:该基座是由一与热源接触的底板及一设于底板上的盖板组成。
4.如权利要求3所述的散热装置,其特征在于:该盖板具有一内凹部,该内凹部即为上述腔室。
5.如权利要求3所述的散热装置,其特征在于:该底板具有一凹入部,该凹入部即为上述腔室。
6.如权利要求3所述的散热装置,其特征在于:该底板与热源相接的表面设有一沟槽以容置热管的吸热段。
7.如权利要求3所述的散热装置,其特征在于:该液体入口及液体出口设于盖板上。
8.如权利要求7所述的散热装置,其特征在于:该液体入口位于盖板中央。
9.如权利要求1或2所述的散热装置,其特征在于:热管的一段伸入腔室内。
10.如权利要求1或2所述的散热装置,其特征在于:该散热片组包括若干相互平行的堆叠散热片。
CN200510035227.0A 2005-06-08 2005-06-08 散热装置 Expired - Fee Related CN100499089C (zh)

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